CN100466895C - Radiating structure - Google Patents
Radiating structure Download PDFInfo
- Publication number
- CN100466895C CN100466895C CNB2005101319405A CN200510131940A CN100466895C CN 100466895 C CN100466895 C CN 100466895C CN B2005101319405 A CNB2005101319405 A CN B2005101319405A CN 200510131940 A CN200510131940 A CN 200510131940A CN 100466895 C CN100466895 C CN 100466895C
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- China
- Prior art keywords
- radiator
- heat
- circuit board
- radiator structure
- heater element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention comprises a heat-sink berried at the inner part of the circuit board; heat conductor berried at the inner part of the circuit board and electrically connected to the electrical connection pad and the heat-sink for transmitting the heat from the heating element on the electrical connection pad to the heat-sink which will radiate the heat from the heating element.
Description
Technical field
The invention relates to a kind of radiator structure, particularly about a kind of radiator structure that is applied in the circuit board.
Background technology
Along with the develop rapidly of electronic product, the user is when proposing requirements at the higher level to function, and is also more and more stronger to the demand of portability, for example notebook computer, mobile phone, personal digital assistant (Personal Digital Assistant; PDA) etc.In order to meet the development trend of electronic product microminiaturization, it is microminiaturized that the package dimension of above-mentioned each electronic product inner member also is tending towards, particularly processing speed heat dissipation problem very fast or the surface encapsulation element (for example central processing unit, power supply apparatus etc.) that heating is bigger becomes particularly important on the circuit board, if the heat that produces in the time of these elements can not being moved in time transmits dissipation, can make element arrive reliability of products, the result who causes life of product to shorten even damage because of the cumulative effect of heat.About the heat radiation research of elements on circuit board, existing so far many technology are open already and well-known.
Fig. 1 is the organigram that the heater element 10 on the available circuit plate 1 passes through heat dissipation element 11 passive heat radiations.As shown in the figure, heat dissipation element 11 is directly to connect to put on heater element 10, and the utilization thermal convection principle makes the heat of this heater element 10 be transmitted to this heat dissipation element 11, and makes heat dissipation by the thermal natural convection of this heat dissipation element 11 and outside air.This radiating mode is the technology of often using in the various power crystal, for the bigger heater element of caloric value, only adopts by the mode of passive heat dissipation element heat radiation and far can not satisfy the demand.In addition, above-mentioned heat dissipation element 11 needs to make in addition and the collocation fastener is assembled fixing, therefore need cost extra manufacturing cost and assembly cost, moreover on heater element 10, set up heat dissipation element 11 with certain altitude, can cause the thickness of product to increase relatively, can't satisfy the development trend of electronic product microminiaturization.
Fig. 2 is the heater element 20 on the available circuit plate 2 carries out active heat removal by the air cooling mode a organigram.As shown in the figure, it is to set up heat dissipation element 21 on heater element 20, and on heat dissipation element 21, add a fan 22, provide active convection current air by fan 22, the convection current of quickening heat dissipation element 21 and outside air makes heat dissipation, though the prior art can improve the radiating efficiency of heater element, has also significantly increased the thickness and the volume of product far and away, therefore be difficult to be applied in heater elements all on the circuit board, particularly Wei Xinghua product can't use especially.In addition, when setting up overweight heat dissipation element 21 with fan 22 on heater element 20, must assemble fixingly by the fastener of bigger bond strength, so easier because installation is improper to cause the damage of heater elements 20 such as chip for example.
Therefore, the disadvantages that provides a kind of radiator structure can avoid prior art has become the problem that needs to be resolved hurrily at present.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of radiator structure, is applied in a surface and has in the circuit board of heater element, the heat that produces when this heater element of dissipation moves effectively.
Another object of the present invention is to provide a kind of radiator structure, be applied in a surface and have in the circuit board of heater element, can prolong the useful life of this heater element and promote the reliability of this heater element.
A further object of the present invention is to provide a kind of radiator structure simple, with low cost of making.
For reaching above-mentioned and other purpose, the invention provides a kind of radiator structure, be applied in the surface and have for connecing in the circuit board of the electric connection pad of putting at least one heater element, this radiator structure comprises at least: radiator is embedded in this circuit board inside; And heat conductor, be embedded in this circuit board inside and connect this electric connection pad and this radiator, be transmitted to this radiator with connecing the heat of putting heater element on this electric connection pad, by the heat of this heater element generation of this radiator dissipation.
Above-mentioned this heat conductor also can be through to this circuit board bottom surface, and simultaneously, this heat conductor can comprise that also one is arranged on this circuit board bottom surface and is connected to the bottom radiator of this heat conductor.Above-mentioned this radiator is to be made by the material with high-termal conductivity, and optional usefulness is the Copper Foil of copper coating for example.
This heat conductor can be the thermal conductivity through hole that is connected in this electric connection pad, and this thermal conductivity through hole can be plated-through-hole (Plated Through Hole; PTH), or by the Heat Conduction Material of filling in the perforation constitute.In addition, this electric connection pad can be provided in a side of the weld pad (SolderPad) of this circuit board surface.This circuit board is to adopt the laminated type circuit board.
The heat that produces when radiator structure of the present invention utilizes heat conductor that heater element is moved is transmitted to radiator, by this radiator with large surface area heat effectively is delivered to the external world, can not set up outside heat dissipation element.In addition, radiator of the present invention and heat conductor can form in circuit board process simultaneously, therefore make simple, with low cost, assembly working that must be extra not, have better heat radiating effect simultaneously, can avoid available technology adopting extra price higher and the heat dissipation element of making complexity and/or disadvantages that fan dispels the heat and causes of increasing on heater element.In addition, radiator structure of the present invention can effectively reduce the size of product, meets the development trend of electronic product microminiaturization.
Description of drawings
Fig. 1 is the organigram of available circuit plate heater element by the passive heat radiation of heat dissipation element;
Fig. 2 is the organigram of available circuit plate heater element by air cooling mode active heat removal;
Fig. 3 is embodiment 1 schematic diagram of radiator structure of the present invention;
Fig. 4 is embodiment 2 schematic diagrames of radiator structure of the present invention;
Fig. 5 is embodiment 3 schematic diagrames of radiator structure of the present invention; And
Fig. 6 is embodiment 4 schematic diagrames of radiator structure of the present invention.
Embodiment
Embodiment 1
Shown in Figure 3 is embodiment 1 schematic diagram of radiator structure of the present invention, and this radiator structure is applied in the surface to have for connecing in the circuit board 4 of the electric connection pad 40 of putting at least one heater element 41, and this radiator structure comprises radiator 30 and heat conductor 31 at least.This radiator 30 is embedded in this circuit board 4 inside, this heat conductor 31 is embedded in these circuit board 4 inside and connects this electric connection pad 40 and this radiator 30, be transmitted to this radiator 30 with connecing the heat of putting heater element 41 on this electric connection pad 40, by the heat of these radiator 30 dissipation heater elements 41 generations.
The circuit board 4 that the present invention uses can for example be the laminated type circuit board of multilayer, its surface forms a plurality of electric connection pads 40 (for example weld pad (Solder Pad)) in response to circuit layout, be used to connect and put required electronic component, radiator structure provided by the invention is then to apply near for example power supply apparatus, central processing unit (CPU) and various heater element, because the circuit board 4 and the heater element of putting that connects all are prior aries, give unnecessary details its function no longer in detail at this.
This heat conductor 31 is to be connected to this radiator 30 by this electric connection pad 40 respectively, and in the present embodiment, this heat conductor 31 is plated-through-hole (Plated Through Hole; PTH), have thermal conduction characteristic, in other embodiments, this heat conductor also can constitute by fill Heat Conduction Material in the perforation that runs through this electric connection pad 40, is not to exceed with the plated-through-hole form of accompanying drawing.
Because the corresponding material that connects the pad connection gasket 40 of putting this heater element 41 is generally copper, itself has good thermal conduction characteristic, can conduct by the heat that this electric connection pad 40 respectively will connect the heater element of putting on it 41 to this heat conductor 31 respectively, and by this heat conductor heat is conducted to this radiator 30, by these radiator 30 dissipation heats.This radiator 30 is except can be by circuit board 4 dissipate heat, also can utilize other not connect the electric connection pad 40 of putting heater element 41 and heat conductor 31 (not marking) as heat dissipation path.
Have the radiator 30 of large surface area by this, heat is delivered to extraneous design effectively, can not set up the purpose that outside heat dissipation element is realized heat radiation, can effectively reduce the size of product, meet the development trend of electronic product microminiaturization.In addition, radiator 30 of the present invention and heat conductor 31 can form in circuit board 4 processing procedures simultaneously, therefore make simple, with low cost, and assembly working that need not be extra, have better heat radiating effect simultaneously, thereby can avoid available technology adopting extra price higher and the heat dissipation element of making complexity and/or disadvantages that fan dispels the heat and causes of increasing on heater element.
See also Fig. 4, it is embodiment 2 schematic diagrames of radiator structure of the present invention, this radiator structure is to be applied in the surface to have for connecing in the circuit board 4 of the electric connection pad 40 of putting at least one heater element 41 similarly to Example 1, and this radiator structure also comprises radiator 30 and heat conductor 31 at least.The difference of present embodiment 2 and embodiment 1, be to be that respectively this heat conductor 31 is except being connected to this radiator 30 by this electric connection pad 40, also extend through the bottom surface of circuit board 4, so this radiator 30 can further conduct heat to the external world by this heat conductor 31 respectively.Adapted to general circuit plate 4 and be arranged on the design that all abuts in casing one side in the electronic installation, conducted the casing that the heat that can further be transmitted to electronic installation by these circuit board 4 bottom surfaces.
Embodiment 3
Fig. 5 is embodiment 3 schematic diagrames of radiator structure of the present invention, this radiator structure is to be applied in the surface to have for connecing in the circuit board 4 of the electric connection pad 40 of putting at least one heater element 41 similarly to Example 2, and this radiator structure comprises radiator 30 and heat conductor 31 at least.Present embodiment 3 is to be with the difference of embodiment 2, and respectively this heat conductor 31 extends through outside circuit board 4 bottom surfaces, also connects a bottom radiator 30 ' that is positioned at circuit board 4 bottom surfaces.So this radiator 30 can further conduct heat to extraneous bottom radiator 30 ' by this heat conductor 31 respectively, promotes radiating efficiency more.
Embodiment 4
Fig. 6 is embodiment 4 schematic diagrames of radiator structure of the present invention, as shown in the figure, for further strengthening the radiating effect of product, also can set up a heat dissipation element 45 at the bottom radiator 30 ' of foregoing circuit plate 4 bottom surfaces, and set up a heat dissipation element 45 at the end face of this heater element 41, because the structure of heat dissipation element 45 is not improvement of the present invention, so will not give unnecessary details its structural design.The effect of setting up this heat dissipation element 45 in the present embodiment 4 is same as the prior art, because heat conductor of the present invention 31 and radiator 30,30 ' design have been arranged, can effectively and quickly heat be transmitted to the external world rapidly, therefore the quantity of its required use heat dissipation element 45 can reduce significantly, not be used in each heater element 41 heat dissipation element 45 all is set, only need on the heater element 41 of the high heat of specific generation, heat dissipation element 45 be set and get final product.
Compared with prior art, the heat that produces when radiator structure of the present invention utilizes heat conductor that heater element is moved conducts to radiator, by this radiator the heat that the heater element operation is produced effectively is delivered to the external world, so can set up outside heat dissipation element with large surface area.In addition, radiator and heat conductor can form in circuit board process simultaneously among the present invention, make simple, and it is with low cost, have better heat radiating effect simultaneously, thereby avoided available technology adopting extra price higher and the heat dissipation element of making complexity and/or disadvantages that fan dispels the heat and causes of increasing on heater element, in addition, radiator structure of the present invention can effectively reduce the size of product, has met the development trend of electronic product microminiaturization.
Claims (9)
1. a radiator structure is applied in the surface and has for connecing in the laminated type circuit board of the electric connection pad of putting at least one heater element, it is characterized in that this radiator structure comprises at least:
Radiator is embedded in this laminated type circuit board inside; And
Heat conductor is embedded in this laminated type circuit board inside and connects this electric connection pad and this radiator, is transmitted to this radiator with connecing the heat of putting heater element on this electric connection pad, by the heat of this heater element generation of this radiator dissipation.
2. radiator structure as claimed in claim 1 is characterized in that, this heat conductor also extends through this laminated type circuit board bottom surface.
3. radiator structure as claimed in claim 2 is characterized in that, this radiator structure comprises that also one is arranged on this laminated type circuit board bottom surface and is connected to the bottom radiator of this heat conductor.
4. radiator structure as claimed in claim 1 is characterized in that, this heat conductor is the thermal conductivity through hole that is connected in this electric connection pad.
5. radiator structure as claimed in claim 4 is characterized in that, this thermal conductivity through hole is a plated-through-hole.
6. radiator structure as claimed in claim 4 is characterized in that, this thermal conductivity through hole is constituted by filling Heat Conduction Material in the perforation.
7. radiator structure as claimed in claim 1 is characterized in that, this radiator is a Copper Foil.
8. radiator structure as claimed in claim 7 is characterized in that, this Copper Foil is a copper coating.
9. radiator structure as claimed in claim 1 is characterized in that this electric connection pad is provided in a side of the weld pad of this laminated type circuit board surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101319405A CN100466895C (en) | 2005-12-15 | 2005-12-15 | Radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101319405A CN100466895C (en) | 2005-12-15 | 2005-12-15 | Radiating structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1984551A CN1984551A (en) | 2007-06-20 |
| CN100466895C true CN100466895C (en) | 2009-03-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101319405A Expired - Fee Related CN100466895C (en) | 2005-12-15 | 2005-12-15 | Radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100466895C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3618583A4 (en) * | 2017-04-25 | 2021-01-20 | KYOCERA Corporation | Electronic element mounting substrate, electronic device, and electronic module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020163781A1 (en) * | 2001-05-01 | 2002-11-07 | Ericsson Inc. | Integrated cooling of a printed circuit board structure |
| CN2603595Y (en) * | 2003-01-29 | 2004-02-11 | 博大科技股份有限公司 | Heat conduction structure for circuit board |
| CN1612668A (en) * | 2003-10-27 | 2005-05-04 | 技嘉科技股份有限公司 | High-radiating multi-layer circuit board |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| WO2005088190A1 (en) * | 2004-03-10 | 2005-09-22 | Truck-Lite Co., Inc. | Interior lamp |
-
2005
- 2005-12-15 CN CNB2005101319405A patent/CN100466895C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020163781A1 (en) * | 2001-05-01 | 2002-11-07 | Ericsson Inc. | Integrated cooling of a printed circuit board structure |
| CN2603595Y (en) * | 2003-01-29 | 2004-02-11 | 博大科技股份有限公司 | Heat conduction structure for circuit board |
| CN1612668A (en) * | 2003-10-27 | 2005-05-04 | 技嘉科技股份有限公司 | High-radiating multi-layer circuit board |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| WO2005088190A1 (en) * | 2004-03-10 | 2005-09-22 | Truck-Lite Co., Inc. | Interior lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1984551A (en) | 2007-06-20 |
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Granted publication date: 20090304 Termination date: 20121215 |