CN108449862A - Mobile terminal - Google Patents
Mobile terminal Download PDFInfo
- Publication number
- CN108449862A CN108449862A CN201810241270.XA CN201810241270A CN108449862A CN 108449862 A CN108449862 A CN 108449862A CN 201810241270 A CN201810241270 A CN 201810241270A CN 108449862 A CN108449862 A CN 108449862A
- Authority
- CN
- China
- Prior art keywords
- chip
- heat
- cooling mechanism
- mobile terminal
- conduction material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Abstract
The invention discloses a kind of mobile terminals, including：Circuit board is provided with multiple heat emission holes, the first surface and second surface of multiple heat emission hole connection circuit plates on circuit board；First chip, on the first surface, when the first chip operation, generates heat for installation；First cooling mechanism, installation on the first surface, the heat transfer of the first chip to the first cooling mechanism, the heat transfer of the first cooling mechanism to the outside of the first cooling mechanism；Second cooling mechanism, on a second surface, the heat of the first chip is transmitted to the second cooling mechanism by multiple heat emission holes for installation, the heat transfer of the second radiator structure to the outside of the second cooling mechanism.According to the technique and scheme of the present invention, the radiating efficiency for generating heat to chip can be promoted, is avoided because of the excessively high influence chip normal work of temperature, to influence usage experience of the user to mobile terminal.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of mobile terminals.
Background technology
With the development of mobile terminal, the core number of the CPU (central processing unit) used is more and more.It is transported in mobile terminal
When row big game or broadcasting HD video, the calorific value of the chips such as CPU is increasing, and the chips such as CPU calorific value one greatly will
The performance of CPU is seriously affected, and then affects usage experience of the user to mobile terminal.
The heat dissipation of the mobile terminals such as mobile phone and tablet computer used at present is radiated primarily directed to complete machine, to ensure table
Face Wen Sheng does not influence human body experience, and complete machine radiates mainly by free convection, and free convection is relatively inefficient, causes CPU's
Amount of heat can not shed the short time, and to affect the performance of CPU, heat dissipation effect is also not all roses.
Invention content
It is a primary object of the present invention to propose a kind of mobile terminal, it is intended to promote the heat dissipation effect of euthermic chip.
To achieve the above object, the present invention provides a kind of mobile terminals, including：Circuit board is arranged on the circuit board
There are multiple heat emission holes, the multiple heat emission hole to be connected to the first surface and second surface of the circuit board；First chip, is mounted on
On the first surface, when first chip operation, generates heat；First cooling mechanism is installed on the first surface,
The heat transfer of first chip is to first cooling mechanism, the heat transfer of first cooling mechanism to described first
The outside of cooling mechanism；Second cooling mechanism is mounted on the second surface, and the heat of first chip passes through described more
A heat emission hole is transmitted to second cooling mechanism, the heat transfer of second radiator structure to second cooling mechanism
It is external.
Optionally, mobile terminal above-mentioned, first chip cover at least one of the multiple heat emission hole.
Optionally, mobile terminal above-mentioned, first cooling mechanism include：First screening cover is mounted on described first
On surface, and cover first chip；First Heat Conduction Material is mounted in first screening cover, first heat conduction material
Material contacts first chip and first screening cover, the heat of first chip are transferred to through first Heat Conduction Material
First screening cover.
Optionally, mobile terminal above-mentioned, first Heat Conduction Material is filled in first screening cover, and coats institute
State the first chip.
Optionally, mobile terminal above-mentioned, second cooling mechanism include：Secondary shielding lid is mounted on described second
On surface；Second Heat Conduction Material is mounted in the secondary shielding lid, and second Heat Conduction Material covers the multiple heat emission hole
It is at least one, and contacted with the secondary shielding lid, the heat of first chip is transferred to described through the heat emission hole
Two Heat Conduction Materials, the heat transfer of second Heat Conduction Material to the secondary shielding lid
Optionally, mobile terminal above-mentioned further includes：Second chip is mounted on the second surface, is located at described the
Within two screening covers, second Heat Conduction Material contacts second chip, and the heat that when second chip operation generates is low
The heat generated when first chip operation, the heat of second chip are transferred to described through second Heat Conduction Material
Secondary shielding lid.
Optionally, mobile terminal above-mentioned, second Heat Conduction Material fill the secondary shielding lid, and coat described the
Two chips.
Optionally, mobile terminal above-mentioned is provided with thermal conductive surface on one or more surfaces of first chip, described
Thermal conductive surface is by the heat transfer of first chip to first chip exterior.
According to above technical scheme, it is known that mobile terminal of the invention has at least the following advantages：
According to the technique and scheme of the present invention, the heat that the first chip on circuit board generates, can not only utilize and first
First cooling mechanism of the chip on same surface radiates, and can also be transmitted to circuit board by the heat emission hole on circuit board
Another surface is radiated using the second cooling mechanism on another surface, while utilizing the heat dissipation on two surfaces of circuit board
Mechanism radiates, and can promote the radiating efficiency for generating heat to the first chip, prevent the temperature of the first chip excessively high, avoid
Because temperature the first chip of excessively high influence works normally, to influence usage experience of the user to mobile terminal.
Description of the drawings
Fig. 1 is the schematic internal view according to the mobile terminal of one embodiment of the present of invention；
Fig. 2 is the schematic internal view according to the mobile terminal of one embodiment of the present of invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
In subsequent description, using for indicating that the suffix of such as " module ", " component " or " unit " of element is only
The explanation for being conducive to the present invention, itself does not have a distinctive meaning.Therefore, " module ", " component " or " unit " can mix
Ground uses.
Mobile terminal can be implemented in a variety of manners.For example, mobile terminal described in the present invention may include such as
Mobile phone, tablet computer, laptop, palm PC, personal digital assistant (PersonalDigital Assistant,
PDA), portable media player (Portable Media Player, PMP), navigation device, wearable device, intelligent hand
The mobile terminals such as ring, pedometer.
It will be illustrated by taking mobile terminal as an example in subsequent descriptions, it will be appreciated by those skilled in the art that in addition to special
Except element for moving purpose, construction according to the embodiment of the present invention can also apply to the terminal of fixed type.
As shown in Figure 1, a kind of mobile terminal is provided in one embodiment of the present of invention, including：
Circuit board 110 is provided with multiple heat emission holes 111 on circuit board 110,111 connection circuit plate 110 of multiple heat emission holes
First surface 112 and second surface 113.
In the present embodiment, circuit board 110 is usually PCB (printed circuit board), and including but not limited to mobile phone etc. is mobile eventually
Mainboard in end can also be other circuit boards outside mainboard；In the present embodiment, to the shape of heat emission hole 111, quantity, big
Small to be not limited, various types of heat emission holes 111 are suitable for the technical solution of the present embodiment；In the present embodiment, right
The region that heat emission hole 111 is distributed on circuit board 110 is not limited, specifically, can be with 120 position of the first chip
Centered on certain area be arranged heat emission hole 111, ensure the first chip 120 generate heat passed out as early as possible from heat emission hole 111
It goes.
First chip 120, installation on the first surface 112 generate heat when first chip 120 works
In the present embodiment, the type of the first chip 120 is not limited, usual first chip 120 be calorific value compared with
Big chip, for example, CPU, PM (power management module), charging IC (integrated circuit) etc. high power consumptions chip.
First cooling mechanism 130 is mounted on first surface 112, the heat transfer of the first chip 120 to the first heat dissipation machine
Structure 130, the heat transfer of the first cooling mechanism 130 to the outside of the first cooling mechanism 130.
In the present embodiment, the type of the first cooling mechanism 130 is not limited, for example, the first cooling mechanism can be with
It is fugitive hot material or structure.In the present embodiment, the first cooling mechanism 130 and the first chip 120 are located at same surface, mainly
Heat dissipation for handling the first chip 120.
Second cooling mechanism 140 is mounted on second surface 113, and the heat of the first chip 120 passes through multiple heat emission holes
111 are transmitted to the second cooling mechanism 140, the heat transfer of the second radiator structure 140 to the outside of the second cooling mechanism 140.
In the present embodiment, the type of the second cooling mechanism 140 is not limited, for example, the second cooling mechanism can be with
It is fugitive hot material or structure.In the present embodiment, the second cooling mechanism 140 and the first chip 120 are located at different surfaces, usually
In the case of, the second cooling mechanism 140 is for handling the heat dissipation being arranged in the component of second surface 113.In the present embodiment, lead to
The heat emission hole 111 being arranged on oversampling circuit plate 110, the heat that the first chip 120 generates are transmitted to circuit board by heat emission hole 111
110 other side, heat are transmitted to outside by the second cooling mechanism 140 being arranged on second surface 113, it is seen that the first core
The heat that piece 120 generates carries out radiating treatment by the first cooling mechanism 130, the second cooling mechanism 140, can speed up heat biography
It passs, the first chip 120 is avoided to influence performance due to poor heat radiation.
As shown in Fig. 2, a kind of mobile terminal is provided in one embodiment of the present of invention, including：
Circuit board 210 is provided with multiple heat emission holes 211 on circuit board 210,211 connection circuit plate 210 of multiple heat emission holes
First surface 212 and second surface 213.
First chip 220, installation on the first surface 212, the first chip 220 generate heat, the first chip 220 when working
Cover at least one of multiple heat emission holes 211.
In the present embodiment, the first chip 220 covers at least one of multiple heat emission holes 211, is conducive to the first chip
220 heats generated are quickly transmitted to the other side of circuit board 210.
First cooling mechanism, including：First screening cover 230 is mounted on first surface 212, and covers the first chip
220；First Heat Conduction Material 240 is mounted in the first screening cover 230, and the first Heat Conduction Material 240 contacts the first chip 220 and the
The heat of one screening cover 230, the first chip 220 is transferred to the first screening cover 230 through the first Heat Conduction Material 240.
In the present embodiment, the material of the first screening cover 230 is not limited, can specifically uses copper alloy, also may be used
To use the easy heat-conductings such as foreign white copper, copper alloy, stainless steel, graphite flake can also be set on the first screening cover 230, enhance it
The capacity of heat transmission.In the present embodiment, the material of the first Heat Conduction Material 240 is not limited, specifically can use thermally conductive gel,
The high thermal conductivity materials such as heat conductive silica gel, phase-transition material.In the present embodiment, the first screening cover 230 plays the first chip of shielding
While 220 signal function, the function of realizing the heat dissipation of the first chip 220 is also acted.
Second cooling mechanism includes：Secondary shielding lid 250 is mounted on second surface 213；Second Heat Conduction Material 260, peace
In secondary shielding lid 250, the second Heat Conduction Material 260 covers at least one of multiple heat emission holes 211, and with secondary shielding lid
250 contacts, the heat of the first chip 220 are transferred to the second Heat Conduction Material 260, the heat of the second Heat Conduction Material 260 through heat emission hole 211
Amount is transferred to secondary shielding lid 250.
Second chip 270 is mounted on second surface 213, is located within secondary shielding lid 250, the second Heat Conduction Material 260
The second chip 270 is contacted, the heat that the second chip 270 generates when working is less than the heat generated when the work of the first chip 220, the
The heat of two chips 220 is transferred to secondary shielding lid 250 through the second Heat Conduction Material 260.
In the present embodiment, the type of the second chip 270 is not limited, usual second chip 270 be calorific value compared with
Small chip, such as inductance, capacitance etc..
In the present embodiment, the material of secondary shielding lid 250 is not limited, can specifically uses copper alloy, also may be used
To use the easy heat-conductings such as foreign white copper, copper alloy, stainless steel, graphite flake can also be set on secondary shielding lid 250, enhance it
The capacity of heat transmission.In the present embodiment, the material of the second Heat Conduction Material 260 is not limited, specifically can use thermally conductive gel,
The high thermal conductivity materials such as heat conductive silica gel, phase-transition material.In the present embodiment, secondary shielding lid 250 plays the second chip of shielding
While 270 signal function, the function of realizing the first chip 220 and the heat dissipation of the second chip 270 is also acted.
According in the technical solution of the present embodiment a specific example, the thermally conductive pathways of CPU are as follows in mobile phone：CPU
A fever part is transmitted to the first screening cover above CPU by the first heat-conducting interface material above CPU, above CPU
Graphite flake on first screening cover and the first screening cover is rapidly heat away；Another part of CPU fevers passes through the bottoms CPU
Layers of copper on heat emission hole and mainboard is scattered on mainboard rapidly, then passes through second Heat Conduction Material at the mainboard back side to secondary shielding
Lid, the graphite flake that secondary shielding lid and secondary shielding cover, can be very fast by testing and verifying this scheme rapidly heat away
Reduction CPU Wen Sheng, handset capability is obviously improved, to promote the satisfaction of client.
In another embodiment of the present invention, there is also provided a kind of mobile terminals, compared to embodiment above-mentioned, this implementation
In the mobile terminal of example：
(1) first Heat Conduction Material 240 is filled in the first screening cover 230, and coats the first chip 220.
In the present embodiment, the surrounding for CPU etc. being generated the chip of high heat also fills the Heat Conduction Materials such as thermally conductive gel, does
To the carry out heat conduction in all directions from CPU, heat transfer efficiency can be further promoted.
(2) second Heat Conduction Materials 260 are filled in secondary shielding lid 250, and coat the second chip 270.
In the present embodiment, the surrounding for inductance etc. being generated chip low in calories also fills the Heat Conduction Materials such as thermally conductive gel,
Accomplish the carry out heat conduction in all directions from inductance, is also beneficial to promote the heat transfer efficiency for the chip for generating CPU etc. high heat.
It is provided with thermal conductive surface on one or more surfaces of (3) first chips 220, thermal conductive surface is by the warm of the first chip 220
Amount is transmitted to the first chip exterior.
In the present embodiment, by taking CPU as an example, there are CPU multiple surfaces, usual CPU only to connect on the lower surface of circuit board
It is provided with thermal conductive surface made of Heat Conduction Material, and in order to increase the thermal conductivity of CPU, it can be also provided in the other surfaces of CPU
Thermal conductive surface, to the heat derives for quickly generating CPU.
According to the technical solution of the present embodiment, the chip that can be directed to the generation high heat such as CPU carries out comprehensive heat conduction,
In the case where not influencing mobile terminal complete machine structure, heat dissipation and the performance of the chips such as CPU are significantly improved.According to the present embodiment
Technical solution, can effectively improve the chips temperature such as CPU in mobile terminal and rise excessively high problem, can improve electronic product dissipate
Heat level and customer experience.
It should be noted that herein, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that process, method, article or device including a series of elements include not only those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including this
There is also other identical elements in the process of element, method, article or device.
The embodiments of the present invention are for illustration only, can not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on this understanding, technical scheme of the present invention substantially in other words does the prior art
Going out the part of contribution can be expressed in the form of software products, which is stored in a storage medium
In (such as ROM/RAM, magnetic disc, CD), including some instructions are used so that a station terminal (can be mobile phone, computer, service
Device, air conditioner or network equipment etc.) execute method described in each embodiment of the present invention.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited in above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form, all of these belong to the protection of the present invention.
Claims (8)
1. a kind of mobile terminal, which is characterized in that including：
Circuit board is provided with multiple heat emission holes on the circuit board, and the multiple heat emission hole is connected to the first table of the circuit board
Face and second surface；
First chip, on the first surface, when first chip operation, generates heat for installation；
First cooling mechanism, installation on the first surface, the heat transfer of first chip to the first heat dissipation machine
Structure, the heat transfer of first cooling mechanism to the outside of first cooling mechanism；
Second cooling mechanism is mounted on the second surface, and the heat of first chip is passed by the multiple heat emission hole
It is delivered to second cooling mechanism, the heat transfer of second radiator structure to the outside of second cooling mechanism.
2. the mobile terminal according to claim, which is characterized in that
First chip covers at least one of the multiple heat emission hole.
3. mobile terminal according to claim 1, which is characterized in that first cooling mechanism includes：
First screening cover, installation on the first surface, and cover first chip；
First Heat Conduction Material is mounted in first screening cover, and first Heat Conduction Material contacts first chip and institute
The first screening cover is stated, the heat of first chip is transferred to first screening cover through first Heat Conduction Material.
4. mobile terminal according to claim 3, which is characterized in that
First Heat Conduction Material is filled in first screening cover, and coats first chip.
5. mobile terminal according to claim 1, which is characterized in that second cooling mechanism includes：
Secondary shielding lid is mounted on the second surface；
Second Heat Conduction Material is mounted in the secondary shielding lid, and second Heat Conduction Material covers the multiple heat emission hole
It is at least one, and contacted with the secondary shielding lid, the heat of first chip is transferred to described second through the heat emission hole
Heat Conduction Material, the heat transfer of second Heat Conduction Material to the secondary shielding lid.
6. mobile terminal according to claim 5, which is characterized in that further include：
Second chip is mounted on the second surface, is located within the secondary shielding lid, the second Heat Conduction Material contact
Second chip, the heat that when second chip operation generates are less than the heat generated when first chip operation, institute
The heat for stating the second chip is transferred to the secondary shielding lid through second Heat Conduction Material.
7. mobile terminal according to claim 5, which is characterized in that
Second Heat Conduction Material fills the secondary shielding lid, and coats second chip.
8. mobile terminal according to any one of claim 1 to 7, which is characterized in that
It is provided with thermal conductive surface on one or more surfaces of first chip, the thermal conductive surface is by the heat of first chip
It is transmitted to first chip exterior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810241270.XA CN108449862A (en) | 2018-03-22 | 2018-03-22 | Mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810241270.XA CN108449862A (en) | 2018-03-22 | 2018-03-22 | Mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108449862A true CN108449862A (en) | 2018-08-24 |
Family
ID=63196134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810241270.XA Pending CN108449862A (en) | 2018-03-22 | 2018-03-22 | Mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108449862A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062148A (en) * | 2019-05-28 | 2019-07-26 | 深圳市趣创科技有限公司 | Camera cooling stand, the mobile phone and its heat dissipating method of the cooling stand containing camera |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10033352A1 (en) * | 2000-07-08 | 2002-01-17 | Bosch Gmbh Robert | Method of manufacturing electronic module or subassembly, has second conductor path connected via thermally plated-through regions to first conductor path |
| CN104333971A (en) * | 2014-10-14 | 2015-02-04 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
| CN105611812A (en) * | 2016-03-11 | 2016-05-25 | 广东欧珀移动通信有限公司 | Mobile terminal |
| KR20170078406A (en) * | 2015-12-29 | 2017-07-07 | 주식회사 디케이이 | Radiating durable printed circuit board and method for manufacturing the same |
-
2018
- 2018-03-22 CN CN201810241270.XA patent/CN108449862A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10033352A1 (en) * | 2000-07-08 | 2002-01-17 | Bosch Gmbh Robert | Method of manufacturing electronic module or subassembly, has second conductor path connected via thermally plated-through regions to first conductor path |
| CN104333971A (en) * | 2014-10-14 | 2015-02-04 | 深圳市华星光电技术有限公司 | Printed circuit board and display device |
| KR20170078406A (en) * | 2015-12-29 | 2017-07-07 | 주식회사 디케이이 | Radiating durable printed circuit board and method for manufacturing the same |
| CN105611812A (en) * | 2016-03-11 | 2016-05-25 | 广东欧珀移动通信有限公司 | Mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062148A (en) * | 2019-05-28 | 2019-07-26 | 深圳市趣创科技有限公司 | Camera cooling stand, the mobile phone and its heat dissipating method of the cooling stand containing camera |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180824 |
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| RJ01 | Rejection of invention patent application after publication |