CN106413348B - A kind of terminal - Google Patents
A kind of terminal Download PDFInfo
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- CN106413348B CN106413348B CN201610934293.XA CN201610934293A CN106413348B CN 106413348 B CN106413348 B CN 106413348B CN 201610934293 A CN201610934293 A CN 201610934293A CN 106413348 B CN106413348 B CN 106413348B
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- heat
- mainboard
- terminal
- center
- conducting layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of terminal, including center, mainboard, at least one side of the mainboard is provided with heat-conducting layer, and the heat-conducting layer contacts with each other with center；The heat that terminal generates is generally primarily focused on mainboard, because being provided with more processing chip and various circuits on mainboard, when terminal operating, the heat generated on its mainboard can be transferred on center by the way that the heat-conducting layer conduction of mainboard side is arranged in, and center is directly contacted with outside air, the terminal external world is transferred to so as to pass to the heat on mainboard well, reduce the temperature of terminal inner mainboard, it ensure that the normal operation of terminal, avoid that there is a situation where burn mainboard since temperature is excessively high, be conducive to that terminal is made to play more preferably process performance, improve user experience.
Description
Technical field
The present invention relates to electronic technology fields, more specifically to a kind of terminal.
Background technique
With electronic technology development, in order to be preferably bonded the use of user, terminal device increasingly tend to it is intelligent and
Miniaturization.For example, the smart phone from original portable phone till now, not only function becomes more powerful, and reaction is more
Add sensitive, while volume becomes more compact, and user is facilitated to carry, and has won the welcome of users.But with end
End equipment is intelligent, more powerful processing chip will be configured, it can be appreciated that more powerful faster processing chip is being run
In the process, the heat generated must be bigger, and chip temperature is lasting excessively high, if not can be carried out rapid cooling, chip performance
It will have a greatly reduced quality, and be unfavorable for user's use, therefore the heat dissipation of terminal is a urgent problem to be solved.And the trend minimized,
It is very narrow to the space for chip heat radiator, lead to be difficult in terminal that good radiator even cannot be arranged,
To radiate well to the chip on terminal interior circuit board, the process performance that chip reaches best is limited, is affected
User experience.
Summary of the invention
The technical problem to be solved in the present invention is that the difficult or heat dissipation effect that radiates in the small space of terminal is paid no attention to
Think, limit electronic component performance, influences user experience.For the technical problem, a kind of terminal is provided.
In order to solve the above technical problems, the present invention provides a kind of terminal, the terminal includes:
Including center, mainboard, at least one side of the mainboard is provided with heat-conducting layer, the heat-conducting layer and the center
It contacts with each other, the heat on the mainboard is passed to by the heat-conducting layer and is transferred on the center, and is passed by the center
It is extraneous to lead the terminal.
Further, the heat-conducting layer is metal layer.
Further, it is coated between the heat-conducting layer and the mainboard side for enhancing the heat-conducting layer and the master
The heat-conducting glue layer of plate side contact effect.
Further, the fixed form between the mainboard and the center includes that pressing is fixed, screw is fixed, bonding is consolidated
At least one of determine, be welded and fixed.
Further, the material of the center is the hard material either metal material that thermal conductivity is greater than preset threshold.
Further, the terminal further includes heat-conducting piece, one end of the heat-conducting piece and the mainboard front and/or the back side
Heat source be in contact, the other end of the heat-conducting piece is in contact with the center.
Further, the material of the heat-conducting piece is the nonmetallic materials that metal or thermal conductivity are greater than air.
Further, the heat source is electronic component or the shielding case for being electromagnetically shielded to electronic component.
Further, the heat-conducting piece is covered on the heat source surface, and the heat-conducting piece contacted with the heat source one
The groove being mutually matched with the heat source shape, size is provided on face.
Further, the region coating that the heat-conducting piece is contacted with the heat source has heat-conducting glue layer.
Beneficial effect
The present invention provides a kind of terminal, including center, mainboard, at least one side of the mainboard is provided with heat-conducting layer,
The heat-conducting layer contacts with each other with center.The heat that terminal generates is generally primarily focused on mainboard, because being provided on mainboard
More processing chip and various circuits, therefore, when terminal operating, the temperature on mainboard can be relatively high, in this implementation
In the scheme that example provides, due to being provided with heat-conducting layer at least one side of mainboard, and heat-conducting layer is contacted with center, institute
With, the heat that mainboard generates can be conducted by heat-conducting layer to be transferred on center, and center is directly contacted with outside air, from
And the heat on mainboard can be passed to well and be transferred to the terminal external world, the temperature of terminal inner mainboard is reduced, ensure that
The normal operation of terminal avoids since temperature is excessively high there is a situation where burning mainboard, is conducive to locate terminal performance more preferably
Rationality energy improves user experience.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
The structural schematic diagram of Fig. 1 each embodiment one optional mobile terminal to realize the present invention；
Fig. 2 is the structural schematic diagram for the terminal that first embodiment of the invention provides；
Fig. 3 is the cross-sectional structure schematic diagram of another terminal shown in Fig. 2 along the direction A-B；
Fig. 4 is the cross-sectional structure schematic diagram of another terminal shown in Fig. 2 along the direction A-B；
Fig. 5 is the terminal schematic perspective view with heat-conducting piece that first embodiment of the invention provides；
Fig. 6 is the terminal structure schematic diagram with heat-conducting piece that first embodiment of the invention provides；
Fig. 7 is a kind of structural schematic diagram for terminal that second embodiment of the invention provides；
Fig. 8 is the cross-sectional structure schematic diagram for the terminal that second embodiment of the invention provides.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
The mobile terminal of each embodiment of the present invention is realized in description with reference to the drawings.In subsequent description, use
For indicate element such as " module ", " component " or " unit " suffix only for being conducive to explanation of the invention, itself
There is no specific meanings.Therefore, " module " can be used mixedly with " component ".
Mobile terminal can be implemented in a variety of manners.For example, terminal described in the present invention may include such as moving
Phone, smart phone, laptop, digit broadcasting receiver, PDA (personal digital assistant), PAD (tablet computer), PMP
The mobile terminal of (portable media player), navigation device etc. and such as number TV, desktop computer etc. are consolidated
Determine terminal.Hereinafter it is assumed that terminal is mobile terminal.However, it will be understood by those skilled in the art that in addition to being used in particular for moving
Except the element of purpose, the construction of embodiment according to the present invention can also apply to the terminal of fixed type.
The structural schematic diagram of Fig. 1 each embodiment one optional mobile terminal to realize the present invention.
Mobile terminal 100 may include wireless communication unit 110, A/V (audio/video) input unit 120, user's input
Unit 130, sensing unit 140, output unit 150, memory 160, interface unit 170, controller 180 and power supply unit 190
Etc..Fig. 1 shows the mobile terminal with various assemblies, it should be understood that being not required for implementing all groups shown
Part.More or fewer components can alternatively be implemented.
It is described in detail below by way of specific embodiment.
First embodiment
More electronic component and connection circuit are typically provided on the circuit board of existing terminal, this is also circuit board temperature
Higher reason, and higher temperature environment has a great impact to the electronic component on circuit board, including limits electronics member
The performance of part, in some instances it may even be possible to the phenomenon that burning circuit board occur, to solve the above-mentioned problems, the embodiment of the present invention provides a kind of end
End, referring to figure 2., Fig. 2 are the terminal structure schematic diagram that first embodiment of the invention provides.
Wherein the terminal 20 includes: mainboard 21, center 22 and the heat-conducting layer 23 being arranged on 21 side of mainboard, wherein
The another side of heat-conducting layer 23 and center 22 contact with each other (be not shown for the ease of checking, in Fig. 2 heat-conducting layer 23 and mainboard 21, in
Frame 22 contacts with each other), the heat on mainboard 21 can be passed through well and be set by the heat dissipation characteristics based on heat-conducting layer 23 Yu center 22
The heat-conducting layer 23 in its side is set, and is passed to and is transferred to center 22 to be dispersed into terminal 20 extraneous.Inside to terminal 20
Mainboard 21 carries out good heat dissipation, helps to be maintained in a good temperature environment inside terminal 20, to be conducive to circuit
The normal table of the electronic component and each circuit that are arranged on plate 21 works.
In the present embodiment, heat-conducting layer 23 be arranged between 21 side of mainboard and center 22, and with 21 side of mainboard and center
22 connect, to play the effect to radiate to mainboard 21.It should be understood that heat-conducting layer 23, which can be, is coated in master
The thermal sheet to contact with each other with 21 side of mainboard, therefore, the heat-conducting layer of this programme also can be set in the heat-conducting layer of 21 side of plate
21 can be very good in the small space being arranged between 21 side of mainboard and center 22, thus will not inside occupied terminal 20 compared with
The space in terminal 20 is rationally utilized in big space, realizes to the good heat dissipation of mainboard 21, is conducive to the electronics on mainboard 21
Element and each circuit stability are rapidly run.
It should be understood that the heat-conducting layer 23 of 21 side of mainboard is set or thermal sheet can be metal, such as copper,
Aluminium, gold, silver, iron, alloy are also possible to the higher nonmetallic materials of thermal conductivity, such as graphite etc..
The heat-conducting layer 23 that 21 side of mainboard is arranged in can be arranged one week, for example, working as mainboard along 21 side of mainboard
21 be cuboid when, heat-conducting layer 23 can be arranged in four sides of mainboard 21.The shape of heat-conducting layer 23 can be with mainboard 21
Side is fully mated, heat-conducting layer 23 can also be shaped to and be cooperated with 21 side view part of mainboard.Art technology
Personnel, can also be in multiple sides of mainboard 21 it will also be understood that heat-conducting layer 23 can be set on a side of mainboard 21
Or whole side settings.The shape of setting can flexibly be set according to the actual situation, such as can be set to 21 side of mainboard
Shape is fully mated or part cooperates.
In the present embodiment, the heat conduction on mainboard 21 is transferred on the center 22 of terminal 20 by heat-conducting layer 23, in order to make
Heat dissipation effect is more preferable, and center 22 can use the higher material of thermal conductivity, is conducive to rapidly radiate.Because center is usual
Should have an effect of curable type shatter-resistant, center can use the higher hard material of thermal conductivity or metal material, for example, can be with
Using copper, aluminium, alloy etc..To which heat conduction can be relatively easily transferred on center 22 by heat-conducting layer 23.
It should be understood that please referring to figure in order to which preferably the heat conduction on heat-conducting layer 23 is transferred on center 22
3, Fig. 3 be another terminal shown in Fig. 2 along the direction A-B cross-sectional structure schematic diagram, can also heat-conducting layer 23 with
Coating heat dissipation glue-line 24 between center 22, the heat dissipation glue-line 24 include but is not limited to heat conductive silica gel, heat-conducting silicone grease etc..Make to lead
It is preferably connected between thermosphere 23 and center 22, and since heat dissipation glue-line 24 has good heating conduction, this
Be conducive to quickly conduct the heat on heat-conducting layer 23 and be transferred on center 22, center 22 with external environment because can directly connect
Touching, such center 22 can be dissipated the heat to the air directly, realize heat dissipation.
Equally, for that can also be please referred in such a way that glue-line is radiated in coating between 21 side of mainboard and heat-conducting layer 23
Fig. 4, Fig. 4 are the cross-sectional structure schematic diagram of another terminal shown in Fig. 2 along the direction A-B.21 side of mainboard with lead
Coating heat dissipation glue-line 25 between thermosphere 23, this, which is conducive to rapidly conduct the heat on mainboard 21, is transferred on heat-conducting layer 23,
Heat conduction is transferred on center 22 by heat-conducting layer 23 again, and is dispersed into air, is reduced inside terminal 20, it is especially main
Temperature on plate 21.
In the present embodiment, center 22 including but not limited to presses fixation with being fixedly connected for mainboard 21, screw is fixed, is bonded
It fixes, be welded and fixed.Such as when being fixedly connected using screw, disassembly is more convenient simple, is conducive to subsequently Measuring error.
In the present embodiment, in order to preferably radiate to mainboard 21, heat-conducting piece 26 can also be set in terminal 20, asked
Referring to Fig. 5, Fig. 5 is the terminal schematic perspective view with heat-conducting piece that first embodiment of the invention provides.The terminal 20
It further include the heat-conducting piece 26 being arranged on mainboard 21 at heat source, one end of heat-conducting piece 26 is in contact with the heat source, and the other end
It is in contact with center 22.Since heat-conducting piece 26 directly can be contacted directly with the heat source for generating heat on mainboard 21, it can be with
Highly desirable the heat at heat source is rapidly conducted and is transferred on center 22, and is distributed heat by center 22.
It should be understood that the heat source can be the electronic component on 20 mainboard 21 of terminal, it is also possible to for electricity
The shielding case that subcomponent is electromagnetically shielded.It will be appreciated by those skilled in the art that in the electronic component being arranged on mainboard 21
Part electronic component at runtime, since its process or data to be treated are very huge, generate heat
It is larger, it is unfavorable for it again while generating larger heat and plays more preferably performance, usually all can seriously reduces it and handle operation
Speed, thus phenomena such as making terminal outlet Caton blank screen.For example, CPU (the Central being arranged on mainboard 21
Processing Unit, central processing unit), GPU (Graphics Processing Unit, graphics processor) be all terminal
20 heat production rich and influential family, its general surface temperature may reach 60 to 80 degrees Celsius, if seriously affected without radiating treatment
It is worked normally.By setting heat-conducting piece 20, directly (heat source, such as CPU, GPU, shielding case) is contacted therewith, by heat therein
Quickly conduction is transferred to center 22 and distributes, therefore necessary.
In the present embodiment, heat-conducting piece 26 can be using metal material, such as copper, aluminium, gold, silver, iron, alloy etc., can also be with
It is the higher nonmetallic materials of thermal conductivity, such as graphite etc..To enable heat-conducting piece 26 rapidly to carry out heat conduction transfer,
It should be understood that the area contacted with heat source is bigger in order to keep the heat-conducting effect of heat-conducting piece 26 more preferable, it can be by heat-conducting piece
The groove that 26 settings are mutually matched with heat source shape, size.Fig. 6 is please referred to, Fig. 6 has for what first embodiment of the invention provided
The structural schematic diagram of the terminal of heat-conducting piece.It should be understood that the groove in heat-conducting piece 26 can be set to all wrap heat source
It wraps up in or portion envelops, portion envelops for example can be to contact with heat source upper surface, all package for example can be by heat source
Upper surface is all contacted with side, can flexible setting according to the actual situation.
It should be understood that mainboard 21 may be single sided board in terminal 20, it is also possible to dual platen, when being for dual platen,
Heat-conducting piece 26 in the present embodiment also can be set on the another side of mainboard 21, electronic component to the setting on another side or
Person's circuit radiates.In order to make the better heat-radiation effect of heat-conducting piece 26, heat dissipation can be coated between heat-conducting piece 26 and heat source
Glue-line, the heat dissipation glue-line include but is not limited to heat conductive silica gel, heat-conducting silicone grease.It should be appreciated that in heat-conducting piece 26 and center 22
Contact surface between equally can using coating radiate glue-line by the way of, for the heat on heat-conducting piece 26 to be conducted more quickly
It is transferred on center 22 and distributes.
The embodiment of the present invention provides a kind of terminal, and including mainboard 21, center 22 and the thermally conductive of 21 side of mainboard is arranged in
Layer 23 is compared fever in terminal 20 by the way that heat-conducting layer 23 is arranged in the smaller space between 21 side of mainboard and center 22
The heat of serious mainboard 21 can effectively by heat-conducting layer 23 conduction be transferred on center 22, without occupied terminal 20 compared with
Big space, at the same time it can also between 21 side of mainboard and heat-conducting layer 23 coating heat dissipation glue-line 25 and/or heat-conducting layer 23 with
Coated with thermally conductive glue city 24 between center 22, using heat-conducting glue layer thermal conductivity can more preferably by the heat on mainboard 21 it is fast and effective
Ground conduction is transferred in external environment, and heat-conducting piece 26, a Duan Yure of heat-conducting piece 26 is arranged on 20 inner heat source surface of terminal
Source directly contacts, and the other end is in contact with center 22, and the heat of heat source surface is directly transferred to center through the conduction of heat-conducting piece 26
22 radiate, and are able to maintain in a normal temperature environment, are conducive on mainboard 21 inside terminal 20 to ensure that
The normal operation of each electronic component and circuit, the case where avoiding " hot " phenomenon caused by terminal 20 overheats and burn mainboard 21
Occur, is conducive to improve user experience.
Second embodiment
Referring to Fig. 7, Fig. 7 is a kind of structural schematic diagram for terminal that second embodiment of the invention provides.
Terminal 70 described in the present embodiment include: mainboard 71, center 72 with, heat-conducting layer 73 and setting heat-conducting layer 73 with
Heat-conducting glue layer 74 between mainboard 71, wherein the another side of heat-conducting layer 73 and center 72 contact with each other (for the ease of checking, Fig. 7
In be not shown heat-conducting layer 73 and center 72 contacts with each other).In order to better understand the present invention, heat-conducting layer 73 and 72 phase mutual connection of center
Schematic cross-section after touching please refers to Fig. 8.
In the present embodiment, heat-conducting layer 73 is aluminium flake, and center 72 is aluminium frame, because aluminium has good thermal diffusivity, can be incited somebody to action
Heat on mainboard 71 passes through the heat-conducting layer 73 that its side is arranged in well, and passes to and be transferred to center 72 and be dispersed into terminal 70
It is extraneous.So as to carrying out good heat dissipation to 70 inside mainboard 71 of terminal, help to be maintained inside terminal 70 one it is good
In temperature environment, to be conducive to the normal table work of the electronic component being arranged on circuit board 71 and each circuit.
The heat-conducting layer 71 of this programme is aluminium flake, thinner thickness, and flexible good, therefore can be very good to be arranged in mainboard 71
In small space between side and center 72, without the 70 biggish space in inside of occupied terminal, terminal 70 is rationally utilized
Interior space is realized to the good heat dissipation of mainboard 71, is conducive to electronic component on mainboard 71 and each circuit stability rapidly
Operation.
In the present embodiment, heat-conducting layer 73 can be arranged one week along 71 side of mainboard, for example, when mainboard 71 is cuboid
When, heat-conducting layer 73 can be arranged in four sides of mainboard 71.The shape of heat-conducting layer 73 can match completely with 71 side of mainboard
It closes, heat-conducting layer 73 can also be shaped to and be cooperated with 71 side view part of mainboard.Those skilled in the art should also be as
Understand, heat-conducting layer 73 can be set on a side of mainboard 71, can also be in the multiple sides or whole sides of mainboard 71
Face setting.The shape of setting can flexibly be set according to the actual situation, such as be can be set to 71 side view of mainboard and matched completely
It closes or part cooperates.
In the present embodiment, the heat conduction on mainboard 71 is transferred on center 72 by heat-conducting layer 73, and what center 72 used
It is aluminium frame, can rapidly radiates.It should be understood that in order to preferably radiate, 71 side of mainboard and heat-conducting layer
It, please continue to refer to Fig. 7, can also be applied between 71 side of mainboard and heat-conducting layer 73 in such a way that glue-line is radiated in coating between 73
Heat-conducting silicone grease 74 is covered, this, which is conducive to rapidly conduct the heat on mainboard 71, is transferred on heat-conducting layer 73, then passes through heat-conducting layer
73 are transferred to heat conduction on center 72, and are dispersed into air, reduce inside terminal 70, the temperature especially on mainboard 71
Degree.
The embodiment of the present invention provide it is a kind of including mainboard 71, center 72 and the heat-conducting layer 73 that 71 side of mainboard is arranged in,
Wherein, center 72 is aluminium frame, and heat-conducting layer 73 is aluminium flake, and the coated with thermally conductive silicone grease 74 between 71 side of mainboard and heat-conducting layer 73.
The heat on mainboard 71 is quickly conducted by heat-conducting silicone grease 74 and is transferred on heat-conducting layer 73, heat-conducting layer 73 connects with center 72
Touching, therefore heat can be conducted and is transferred on center 72 by heat-conducting layer 73, and is dispersed into outside air, to ensure that terminal
It is able to maintain inside 70 in a normal temperature environment, is conducive to the normal fortune of each electronic component and circuit on mainboard 71
Row avoids the case where terminal 70 overheats caused " hot " phenomenon and burns mainboard 71 generation, is conducive to improve user experience.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can be realized by means of software and necessary general hardware platform, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on this understanding, technical solution of the present invention substantially in other words does the prior art
The part contributed out can be embodied in the form of software products, which is stored in a storage medium
In (such as ROM/RAM, magnetic disk, CD), including some instructions are used so that a terminal device (can be mobile phone, computer, clothes
Business device, air conditioner or the network equipment etc.) execute method described in each embodiment of the present invention.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form, all of these belong to the protection of the present invention.
Claims (10)
1. a kind of terminal, which is characterized in that including center, mainboard, at least one side of the mainboard is provided with heat-conducting layer, institute
Heat-conducting layer is stated to be set on mainboard side；The heat-conducting layer contacts with each other with the center, and the heat on the mainboard passes through institute
It states heat-conducting layer conduction to be transferred on the center, and the terminal external world is transmitted to by the center；The heat-conducting layer and master
Plate side and center connect.
2. terminal as described in claim 1, which is characterized in that the heat-conducting layer is metal layer.
3. terminal as described in claim 1, which is characterized in that be coated with and be used between the heat-conducting layer and the mainboard side
Enhance the heat-conducting glue layer of the heat-conducting layer Yu the mainboard side face contact effect.
4. terminal as described in claim 1, which is characterized in that the fixed form between the mainboard and the center includes pressure
Fixed, screw is closed at least one of to fix, be adhesively fixed, be welded and fixed.
5. terminal as described in claim 1, which is characterized in that the material of the center is that thermal conductivity is greater than the hard of preset threshold
Material either metal material.
6. terminal as described in any one in claim 1-5, which is characterized in that it further include heat-conducting piece, one end of the heat-conducting piece
It is in contact with the heat source in the mainboard front and/or the back side, the other end of the heat-conducting piece is in contact with the center.
7. terminal as claimed in claim 6, which is characterized in that the material of the heat-conducting piece is that metal or thermal conductivity are greater than sky
The nonmetallic materials of gas.
8. terminal as claimed in claim 6, which is characterized in that the heat source be electronic component or for electronic component into
The shielding case of row electromagnetic shielding.
9. terminal as claimed in claim 8, which is characterized in that the heat-conducting piece is covered on the heat source surface, and described leads
The groove being mutually matched with the heat source shape, size is provided in the one side that warmware is contacted with the heat source.
10. terminal as claimed in claim 6, which is characterized in that the region coating that the heat-conducting piece is contacted with the heat source has
Heat-conducting glue layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610934293.XA CN106413348B (en) | 2016-10-31 | 2016-10-31 | A kind of terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610934293.XA CN106413348B (en) | 2016-10-31 | 2016-10-31 | A kind of terminal |
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| Publication Number | Publication Date |
|---|---|
| CN106413348A CN106413348A (en) | 2017-02-15 |
| CN106413348B true CN106413348B (en) | 2019-05-17 |
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| CN201610934293.XA Active CN106413348B (en) | 2016-10-31 | 2016-10-31 | A kind of terminal |
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| CN106993396A (en) * | 2017-05-16 | 2017-07-28 | 奇酷互联网络科技（深圳）有限公司 | A kind of anti-shielding construction of mobile phone and cell phone mainboard |
| CN107592763A (en) * | 2017-09-29 | 2018-01-16 | 深圳传音制造有限公司 | A kind of heat insulation structural, mobile terminal and heat-insulating method |
| CN110830625B (en) * | 2019-11-14 | 2021-03-26 | 华勤技术股份有限公司 | Shell and mobile terminal comprising same |
| CN113498296A (en) * | 2020-03-20 | 2021-10-12 | 上海禾赛科技有限公司 | Circuit structure with heat conducting device and heat dissipation method and manufacturing method thereof |
| CN111479452A (en) * | 2020-05-11 | 2020-07-31 | 珠海格力电器股份有限公司 | Electric appliance box and air conditioner that radiating efficiency is high |
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