TWM626519U - Structure of temperature-homogenizing and heat-dissipating device - Google Patents

Abstract

The present invention provides a structure of a temperature-equalizing and heat-dissipating device, wherein a heating element is disposed on one of the substrates, a heat-conducting sheet is correspondingly disposed above one of the heating elements, and a heat-conducting component is correspondingly disposed on one of the heat-conducting sheets above, and the thermally conductive component includes an outer casing and a thermally conductive casing, the outer casing is arranged above one of the thermally conductive sheets, the thermally conductive casing is arranged on the inner side of one of the outer casings, and an inner side of the thermally conductive casing is provided with a The heat dissipation fluid is used to flow in the inner side of the heat conduction shell, so that the heat of the heating element is rapidly conducted, and then a first heat dissipation member and a limiting groove are sleeved on the outer shell, and the first heat dissipation member further Conduct the heat of the thermally conductive component.

Description

The structure of the temperature uniform heat dissipation device

This creation is about the structure of a heat-dissipating device, especially a heat-dissipating device that utilizes the inner fluid to dissipate heat.

With the development of science and technology, the computer hardware has been developed in the direction of high speed and high frequency, so as to improve the operation efficiency of the computer. When the computer hardware operates in a high speed and high frequency environment for a long time, it will generate relatively high temperature. In order to cope with the high-speed operation of the processor, the operating temperature of the memory is also getting higher and higher. The continuously rising temperature will inevitably affect the performance of the memory, and even cause the memory to be damaged.

Due to the popularity of e-sports and the trend of many computers being modified, many users or manufacturers of e-sports computers will replace the chassis of the e-sports computer with a see-through chassis, and this modding trend has gradually become popular. , The internal components of the gaming computer, such as: CPU, graphics card, memory, will have better performance than ordinary personal computers, so relatively more heat energy is generated, but too much heat energy will reduce the performance of electronic components, so People will install heat sinks on these electronic components. In the gaming industry, heat dissipation components installed in electronic components not only require excellent heat dissipation efficiency, but also the appearance design of the heat dissipation components is the highlight of the comparison between gaming devices.

With the evolution of the times, industrial production sites or transportation facilities gradually use Internet of Things (IoT) devices. When they are used in harsh and special environments, intelligent edge computing and 5G communication development terminal devices, more equipment is required. The included solid-state hard disk and memory must have low power consumption and a small size design, so that the equipment can perform high-speed data processing and computing without stopping for a long time in the most limited space. The transmission performance and stability of solid-state drives and memory are a major challenge in the industry.

The conventional heat-generating electronic components include a circuit board and a plurality of heat-generating components disposed on the surface of the circuit board, such as volatile memory components, and are inserted into a computer system through a connection interface. Due to the demand of the aforementioned gaming products, the operating frequency of related electronic components is gradually developing to a higher frequency, which enables the electronic components to have higher data transmission rates and higher power consumption, which makes the electronic components more likely to accumulate heat; The working temperature is getting higher and higher. When the temperature exceeds the allowable temperature, the performance of electronic components will be significantly reduced, and the error rate of the module to maintain data or calculation will also increase, resulting in the instability of the computer system.

Due to the needs of consumers, electronic components need to achieve rapid and uniform heat dissipation. Therefore, the industry has designed shells and boards to accelerate heat dissipation, and attached them to the memory with heat dissipation adhesives to improve the heat dissipation efficiency of electronic components.

In view of the above-mentioned problems of the prior art, the present invention provides a structure of a temperature-equalizing heat dissipation device, which utilizes a heat-conducting sheet to be correspondingly disposed above a heating element of a substrate, and a heat-conducting element is correspondingly disposed above the heat-conducting sheet, and the heat-conducting element includes an outer casing and a heat-dissipating element. The heat-conducting shell is provided with a heat-dissipating fluid inside the heat-conducting shell, and the heat of the heat-conducting component is further conducted by the first heat-dissipating element, and the heat-generating element is rapidly cooled by the heat-conducting sheet, the heat-conducting element and the first heat-dissipating element.

One purpose of the present invention is to provide a structure of a temperature-equalizing and heat-dissipating device, which uses a heat-conducting sheet to be correspondingly disposed above the heating element of the substrate to be dissipated, and a heat-conducting component including an outer casing is disposed above the heat-conducting sheet, and the inner side of the outer casing is disposed The heat-conducting shell, the heat-dissipating fluid is arranged inside the heat-conducting shell, and the heat-dissipating fluid is used to flow inside the heat-conducting shell, so that the heat of the heating element is conducted to the heat-conducting component, and then the heat of the heat-conducting component is further conducted by the first heat-dissipating element, so that the heat of the heating element is evenly distributed , Fast conduction, providing a heat dissipation device that can conduct heat evenly.

In order to achieve the above-mentioned objects and effects, the present invention provides a structure of a temperature uniform heat dissipation device, a structure of a temperature uniform heat dissipation device, which includes: a substrate, a heat conduction sheet, a heat conduction component and a first heat dissipation member, A heating element is arranged above one of the substrates, and the heat-conducting sheet is correspondingly arranged above one of the heating elements. The heat-conducting component includes an outer casing and a heat-conducting casing. The outer casing is arranged above one of the heat-conducting sheets. The casing is arranged on the inner side of the outer casing, and a heat dissipation fluid is arranged on the inner side of the heat conduction casing. The heat conduction casing is provided with a plurality of columns, and the columns respectively penetrate the heat conduction casing. A limiting slot is arranged under one of the first heat sinks in the heat-conducting shell and between the columns, and the outer shell is embedded in one of the limiting slots; using this structure, uniform conduction is provided. Heat dissipation device.

In an embodiment of the present invention, the thermally conductive sheet is made of silicone.

In an embodiment of the present invention, the pillars are copper pipes.

In one embodiment of the present invention, a thermally conductive paste is further included, the thermally conductive paste is disposed between the outer casing of the thermally conductive component and the first heat sink, and the thermally conductive paste is disposed inside one of the limiting grooves.

In one embodiment of the present invention, the heat dissipation system is water.

In an embodiment of the present invention, a heat dissipation fin is disposed above one of the first heat dissipation members.

In an embodiment of the present invention, the material of the first heat dissipation member and the heat dissipation fin is selected from one of iron, copper, aluminum and tin, or any combination of these materials.

In one embodiment of the present invention, a first thermally conductive adhesive member is further included, which is disposed between the outer casing of the thermally conductive component and the first heat dissipation member.

In an embodiment of the present invention, a second heat dissipation member is further included, which is disposed under one of the substrates.

In an embodiment of the present invention, a second thermally conductive adhesive member is further included, which is disposed between the substrate and the second heat dissipation member.

In an embodiment of the present invention, the substrate and the heating element are a solid state hard disk.

In an embodiment of the present invention, the substrate and the heating element are a memory.

In order to enable your reviewers to have a further understanding and understanding of the features of this creation and the effects achieved, I would like to provide examples and accompanying descriptions, which are as follows:

In view of the above-mentioned problems of the prior art, the present invention is to dispose a heat-conducting sheet, a heat-conducting component and a first heat-dissipating member on one of the substrates including a heating element correspondingly disposed above one of the heating elements to conduct uniform heat conduction. , the heat-conducting assembly includes a heat-conducting shell disposed on an inner side of an outer shell, a heat-dissipating fluid is disposed inside one of the heat-conducting shells, and the heat-conducting assembly is then disposed in a limiting groove sleeve of the first heat sink, using The heat-dissipating fluid flows on the inner side of the heat-conducting housing, which further makes the heat of the heating element conduct evenly and quickly.

Please refer to FIG. 1 , which is a schematic exploded view of the structure of the embodiment of the invention. As shown in the figure, in this embodiment, it is a structure 1 of a temperature uniformity heat dissipation device, which includes a substrate 10 , a thermal conductive sheet 20 , A thermally conductive component 30 and a first heat sink 40 .

Referring to FIG. 1 and FIG. 2 again, FIG. 2 is a schematic diagram of the assembly of the thermally conductive component of the embodiment of the invention. As shown in the figure, in this embodiment, a heating element 12 is disposed above one of the substrates 10 . The substrate 10 and the heating element 12 are circuit boards and chips thereof, such as circuit boards of solid-state hard disks or memory, but this embodiment is not limited to this. and the thermally conductive sheet 20 covers an outer edge of the heating element 12 so that the thermally conductive sheet 20 contacts the heating element 12. In the embodiment of the plurality of heating elements 12, the thermally conductive sheet 20 can be filled correspondingly The heat-conducting component 30 includes an outer casing 32 and a heat-conducting casing 34, respectively. The outer casing 32 is disposed above one of the heat-conducting sheets 20 at a position corresponding to the heat-conducting sheet 20, so that the heat-conducting sheet 20 The outer casing 32 is in contact with the thermally conductive sheet 20 , the thermally conductive casing 34 is disposed on an inner side of the outer casing 32 and is in contact with the outer casing 32 , and a cooling fluid A (not shown in the figure) is arranged on the inner side of the thermally conductive casing 34 ), a limiting groove 42 is arranged under one of the first heat sink 40, and the outer casing 32 is embedded in one of the inner sides of the limiting groove 42, so that the outer casing 32 is fixed on the inner side of one of the limiting grooves 42, so that the The heat-conducting component 30 and the first heat-dissipating member 40 are engaged with each other to prevent the heat-conducting component 30 and the first heat-dissipating member 40 from moving arbitrarily.

Continuing from the above, in this embodiment, the thermally conductive sheet 20 is a silicone rubber, and further is a thermally conductive silicone rubber (Thermal Pad), which is a solid material in the thermal interface material TIM (Thermal Interface Material), which is usually applied in sheet-like construction. , the main function is to fill the micro-voids and uneven holes on the surface generated when the two materials are joined or contacted, and further reduce the resistance of heat transfer.

Continuing from the above, in this embodiment, a heat dissipation fin 44 is further disposed above one of the first heat dissipation members 40 , which is used to increase the surface area in contact with the air to enhance the heat dissipation efficiency of the first heat dissipation member 40 . The heat dissipation fins 44 can be plate-shaped heat dissipation fins, columnar heat dissipation fins or annular heat dissipation fins, which are not limited in this embodiment; in this embodiment, the heat dissipation fins 44 and the first heat dissipation member 40 are The metal material, further the material of the heat dissipation fin 44 and the first heat dissipation member 40 is selected from one of iron, copper, aluminum and tin, or any combination of these materials, which is not limited in this embodiment.

Continuing the above, in this embodiment, a second heat dissipation member 60 is further included. The second heat dissipation member 60 is disposed under one of the substrates 10 , and the second heat dissipation member 60 and the first heat dissipation member 40 are engaged with each other. In order to sandwich the substrate 10 , the thermally conductive sheet 20 and the thermally conductive component 30 , the second heat dissipation member 60 and the first heat dissipation member 40 are used to protect the inner elements and prevent the elements from being worn.

Please refer to FIG. 3, which is a schematic structural diagram of a thermally conductive component according to an embodiment of the invention. As shown in the figure, in this embodiment, the thermally conductive housing 34 of the thermally conductive component 30 is provided with a plurality of pillars 36. These pillars The parts 36 penetrate through the upper and lower sides of the heat-conducting shell 34 respectively, and the heat dissipation fluid A is disposed on the inner side of the heat-conducting shell 34 and between the column parts 36; in this embodiment, the outer shell 32 absorbs the heat of the heat-conducting sheet 20 and conducts part of the heat to the heat-conducting shell 34, the columns 36 are used to increase the surface area in contact with the heat-dissipating fluid A, and the heat-conducting shell 34 absorbs the heat conducted by the outer shell 32. When hot, the heat dissipation fluid A flows between the columns 36 , so that the heat is uniformly conducted to the whole of the heat-conducting shell 34 .

Continuing from the above, in this embodiment, the columns 36 are copper pipes, which are used to rapidly conduct the thermal energy of the heat-conducting shell 34; the heat-dissipating fluid A is water, and the heat-conducting shell 34 is filled with the heat-conducting shell 34 After the fluid A is dissipated, the opening is sealed with a metal shell, but this embodiment is not limited to this.

Please refer to FIG. 4 , which is a schematic diagram of other components of the embodiment of the invention. As shown in the figure, in this embodiment, a thermally conductive paste 50 is further included, and the thermally conductive paste 50 is disposed on the outer casing 32 of the thermally conductive component 30 . and the first heat sink 40 , and the thermal paste 50 is disposed on an inner side of the limiting groove 42 , and the thermal paste 50 is used to fill the gap between the outer casing 32 of the thermally conductive component 30 and the limiting groove 42 , and increase the thermal conduction efficiency; in this embodiment, the thermally conductive paste 50 includes a polymer liquid matrix and filler, and the matrix material is such as silicone resin, polyurethane, acrylate polymer, hot melt adhesive or pressure-sensitive adhesive , filler materials such as alumina, boron nitride or zinc oxide.

Please refer to Fig. 5 and Fig. 6. Fig. 5 is a schematic exploded view of the structure of another embodiment of the invention. The example further discloses another embodiment of the structure 1 of the temperature equalization and heat dissipation device, which includes the connection of the substrate 10 , the thermally conductive sheet 20 , the thermally conductive component 30 , the first heat dissipation member 40 and the second heat dissipation member 60 The relationship is the same as that in the above-mentioned embodiment, so it will not be repeated.

Continuing from the above, the present embodiment further includes a first thermally conductive adhesive member 70 and a second thermally conductive adhesive member 80 . The first thermally conductive adhesive member 70 is disposed on the outer casing 32 of the thermally conductive component 30 and the first heat dissipation member 40 . The second thermally conductive adhesive member 80 is disposed between the substrate 10 and the second heat dissipation member 60 , the first thermally conductive adhesive member 70 and the second thermally conductive adhesive member 80 can further the substrate 10 and the thermally conductive sheet 20 and the heat-conducting component 30 are fixed between the first heat-dissipating member 40 and the second heat-dissipating member 60, and the heat-conducting material is used to increase the efficiency of heat conduction.

Continuing from the above, in this embodiment, the first thermally conductive adhesive member 70 and the second thermally conductive adhesive member 80 are a thermally conductive double-sided adhesive (or heat-dissipating double-sided adhesive), which is a common material such as polymer mixed thermally conductive ceramics Powder and adhesive, and coated on the upper and lower sides of glass fiber, it has the characteristics of high thermal conductivity and insulation, and has a certain flexibility.

To sum up, the present invention provides a structure of a temperature-equalizing and heat-dissipating device, which uses a heat-conducting sheet to be correspondingly disposed above the heating element of the substrate to be dissipated, and is combined with a heat-conducting component including an outer casing to be disposed above the heat-conducting sheet for heat conduction, wherein A heat-conducting shell is arranged inside the outer shell of the heat-conducting component, and a heat-dissipating fluid is arranged inside the heat-conducting shell. The heat-dissipating fluid is used to flow inside the heat-conducting shell, so that the heat of the heating element passes through the heat-conducting sheet and is quickly conducted to the heat-conducting component, so that the heat of the heating element is uniform. , Fast conduction, and then use the first heat sink to further dissipate the heat of the thermally conductive component quickly, providing a heat sink that can evenly conduct heat energy and quickly dissipate heat. When the value is higher, the performance of electronic components will be significantly reduced, and the error rate of the module to maintain data or operation will also increase, resulting in the problem of instability of the computer system.

Therefore, this creation is indeed novel, progressive and available for industrial use, and it should meet the requirements for patent application in my country's patent law.

However, the above description is only an embodiment of the present creation, and is not intended to limit the scope of implementation of the present creation. Therefore, all equivalent changes and modifications made in accordance with the shape, structure, characteristics and spirit described in the patent scope of the present creation, All should be included in the scope of the patent application for this creation.

1: The structure of the uniform temperature cooling device 10: Substrate 12: Heating element 20: Thermal conductive sheet 30: Thermal components 32: Outer shell 34: Thermally conductive shell 36: Column pieces 40: The first heat sink 42: Limit slot 44: cooling fins 50: thermal paste 60: Second heat sink 70: The first thermally conductive adhesive 80: The second thermally conductive adhesive A: Cooling fluid

Figure 1: It is a schematic diagram of the structure explosion of the embodiment of this creation; Figure 2: It is a schematic diagram of the assembly of the thermally conductive component of the embodiment of the creation; Figure 3: It is a schematic structural diagram of a thermally conductive component of an embodiment of the creation; Figure 4: It is a schematic diagram of other components of the embodiment of this creation; Figure 5: It is a schematic diagram of the structure explosion of another embodiment of the present creation; and Figure 6: It is a schematic diagram of the assembly of a thermally conductive component according to another embodiment of the present invention.

1: The structure of the uniform temperature cooling device

10: Substrate

12: Heating element

20: Thermal conductive sheet

30: Thermal components

32: Outer shell

34: Thermally conductive shell

40: The first heat sink

42: Limit slot

44: cooling fins

60: Second heat sink

Claims (12)

A structure of a temperature uniform heat dissipation device, comprising: a substrate, a heating element is arranged on one of the substrates; a heat-conducting sheet correspondingly disposed above one of the heating elements, and the heat-conducting sheet covers an outer edge of the heating element; A heat-conducting assembly includes an outer casing and a heat-conducting casing, the outer casing is disposed above one of the heat-conducting sheets, the outer casing encloses the heat-conducting casing, and a heat-dissipating fluid is arranged inside one of the heat-conducting casings, the The heat-conducting casing is provided with a plurality of columns, the columns respectively penetrate the heat-conducting casing, and the heat dissipation fluid is disposed in the heat-conducting casing and between the columns; and A first heat sink is provided with a limiting groove below, and the outer casing is embedded in an inner side of the limiting groove. The structure of the temperature equalization heat dissipation device as claimed in claim 1, wherein the thermally conductive sheet is a silicone rubber. The structure of the temperature-equalizing and heat-dissipating device according to claim 1, wherein the columns are copper pipes. The structure of the temperature-equalizing and heat-dissipating device according to claim 1, further comprises a heat-conducting paste, the heat-conducting paste is disposed between the outer casing of the heat-conducting component and the first heat-dissipating member, and the heat-conducting paste is disposed at the limit position inside one of the slots. The structure of the temperature equalization heat dissipation device according to claim 1, wherein the heat dissipation fluid system is water. The structure of the temperature equalization heat dissipation device according to claim 1, wherein a heat dissipation fin is disposed above one of the first heat dissipation members. The structure of the temperature equalization heat dissipation device according to claim 6, wherein the material of the first heat dissipation member and the heat dissipation fin is selected from one of iron, copper, aluminum and tin, or any combination of these materials. The structure of the temperature-equalizing heat-dissipating device according to claim 1, further comprises a first heat-conducting adhesive member disposed between the outer casing of the heat-conducting component and the first heat-dissipating member. The structure of the temperature equalization heat dissipation device according to claim 1 further includes a second heat dissipation member disposed under one of the substrates. The structure of the temperature-equalizing heat-dissipating device as claimed in claim 9 further includes a second thermally conductive adhesive member disposed between the substrate and the second heat-dissipating member. According to the structure of the temperature uniformity heat dissipation device according to claim 1, the substrate and the heating element are a solid state hard disk. According to the structure of the temperature uniform heat dissipation device according to claim 1, the substrate and the heating element are a memory.

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