TWM644665U - Heat dissipating structure - Google Patents

Abstract

This creation provides a heat dissipation structure, which is arranged above one of the memory components, and the heat dissipation structure includes a first heat conduction element and a heat exchange component, and the first heat conduction element is disposed above one of the memory elements , the heat exchange assembly includes a heat pipe, a heat exchange element and a heat dissipation fin, the heat pipe is arranged above one of the first heat conduction elements, the heat pipe extends upward to form a protrusion, and the heat exchange element is arranged On the top of the first heat conducting element, the heat exchanging element is sleeved above one of the heat conducting pipes, the heat dissipation fin is arranged on the protruding part of the heat conducting pipe, and the heat dissipating fin is located on one of the heat exchanging elements Above; use this structure to dissipate heat from the memory components.

Description

The structure of heat dissipation

This creation is about a heat dissipation structure, especially a heat dissipation structure including heat pipes and fins.

With the development of science and technology, today's computer hardware has been developed in the direction of high speed and high frequency, so as to improve the operating efficiency of the computer. Computer hardware operates in a high speed and high frequency environment for a long time, and relatively high temperature will be generated. In order for the memory to cooperate with the high-speed calculation of the processor, the operating temperature of the corresponding electronic components is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the electronic components, and even cause the memory to be damaged.

Due to the popularity of e-sports and the popular trend of many computers being modified, many users or manufacturers of e-sports computers will replace the casings of e-sports computers with see-through casings, and this modification trend is gradually prevailing , The internal components of the gaming computer, such as: CPU, graphics card, memory, will have better performance than ordinary personal computers, so relatively more heat will be generated.

It is known that electronic components that generate heat, such as CPU, display card, and memory, are arranged on a circuit board and plugged into a computer system through a connection interface. Due to the demand of the above-mentioned gaming products, the operating frequency of related electronic components is gradually increasing to high frequency, which makes the electronic components have higher data transmission rate and higher power consumption, which makes the electronic components easier to accumulate heat; when the electronic components The working temperature is getting higher and higher. When the temperature exceeds the allowable value, the performance of the electronic components will be significantly reduced. At the same time, the error rate of the module to maintain data or calculation will increase, resulting in the instability of the computer system. The excessive heat will reduce the electronic components. Therefore, people will install radiators on these electronic components; and in the above-mentioned e-sports industry, the heat dissipation components installed in electronic components not only need excellent heat dissipation efficiency, but also the appearance design of the heat dissipation components is the comparison between e-sports equipment Main event.

With the evolution of the times, when the size of the casing (housing that houses the cooling elements) shrinks, the cooling equipment is often required to further reduce the size, so that the equipment can still be used for a long time without stopping in the most limited space. High-speed data processing and computing, however, due to the trend of self-assembled computers and servers, etc., if combined with the need to reduce heat dissipation equipment and replace heat dissipation and heat conduction components by yourself, it will be a major challenge for the industry.

In view of the problems of the above-mentioned conventional technologies, this invention provides a heat dissipation structure, which is to use the heat conduction element and the heat exchange component to be arranged above the memory component correspondingly, and to use the heat conduction element, the heat pipe contained in the heat exchange component, the heat exchange element and The heat dissipation fins correspond to conduction of the heat energy emitted by the memory components, so as to improve the heat dissipation efficiency of the memory components.

One purpose of this creation is to provide a heat dissipation structure, which uses heat conduction parts and heat exchange components to be arranged above the memory components correspondingly, the heat conduction parts conduct the heat energy emitted by the memory components, and the heat exchange components include heat pipes, heat exchangers The components and the heat dissipation fins correspond to conduct the heat energy emitted by the memory components, and use this structure to provide heat dissipation for the memory components.

In order to achieve the above-mentioned purposes and effects, the invention provides a heat dissipation structure, which is arranged on one of the memory components, and the memory component includes a substrate and a plurality of memory elements, and the memory elements are arranged on the substrate Above one of the memory elements, the heat dissipation structure includes a first heat conduction element and a heat exchange assembly, the first heat conduction element is arranged above one of the memory elements, and the heat exchange assembly includes: a heat conduction pipe, which is arranged Above one of the first heat-conducting elements, the heat-conducting pipe extends upwards to form a protruding part, a heat-exchanging element, which is arranged above the first heat-conducting element, and the heat-exchanging element is sheathed on one of the heat-conducting pipes On the top, a heat dissipation fin is arranged on the protruding part of the heat pipe, and the heat dissipation fin is located above one of the heat exchanging elements; this structure provides heat dissipation for the memory component and improves the heat dissipation efficiency of the memory component.

In an embodiment of the present invention, one side of the heat dissipation fin is provided with an accommodating groove.

In one embodiment of the present invention, a fan is further included, which is arranged inside one of the accommodating slots.

In an embodiment of the present invention, the fan is electrically connected to a commercial power through a connection port.

In an embodiment of the invention, a first fixing member is further included, and the first fixing member passes through one side of the cooling fin and one side of the fan.

In one embodiment of the present invention, a second heat conducting element is further included, which is disposed under one of the substrates.

In an embodiment of the present invention, a fixing frame is further included, which is disposed under one of the second heat conducting elements.

In an embodiment of the present invention, a limiting portion extends upward from the fixing frame, and the limiting portion and the fixing frame cover the memory component, the second heat conducting element and the first heat conducting element.

In an embodiment of the invention, a second fixing piece is further included, and the second fixing piece passes through one side of the limiting portion and one side of the heat exchange element.

In one embodiment of the present invention, the memory component is a solid state drive (PCIe M.2 SSD).

In order to enable your review committee to have a further understanding and understanding of the characteristics of this creation and the achieved effects, I would like to provide examples and accompanying explanations, as follows:

In view of the problems of the above-mentioned prior art, this invention is a heat dissipation structure, which is arranged on one of the memory components. The heat dissipation structure includes a first heat conduction element and a heat exchange element. Above one of the memory elements, the heat exchange assembly includes a heat pipe, a heat exchange element and a heat dissipation fin, the heat pipe is arranged above one of the first heat conduction elements, and the heat pipe extends upward to form a a protruding part, the heat exchanging element is disposed above the first heat conducting element, the heat exchanging element is sleeved above one of the heat conducting pipes, the heat dissipation fin is disposed on the protruding part of the heat conducting pipe, the heat dissipating fin The fins are located above one of the heat exchanging elements, and this structure solves the problem of difficult heat dissipation of the memory element in the prior art.

Please refer to Fig. 1, which is a structural schematic diagram of an embodiment of this creation, as shown in the figure, in this embodiment, it is a heat dissipation structure 1, and the heat dissipation structure 1 is arranged on one of a memory component 2 Above, the memory component 2 includes a substrate 3 and a plurality of memory elements 4, and these memory elements 4 are arranged on one of the substrates 3, and the heat dissipation structure 1 includes a first heat conducting member 10 and a heat exchange element 20 .

Referring again to FIG. 1 and FIG. 2, FIG. 2 is a schematic front view of an embodiment of the invention. In this embodiment, the first heat conducting member 10 is arranged above one of the memory elements 4 , to conduct the heat energy of these memory elements 4, the heat exchange assembly 20 includes a heat pipe 22, a heat exchange element 24 and a heat dissipation fin 26, the heat pipe 22 is arranged on one of the first heat conduction elements 10 , the heat pipe 22 extends upward to form a protrusion 222, the heat exchange element 24 is arranged above the first heat conduction element 10, and the heat exchange element 24 is sleeved on one of the heat pipe 22, the heat dissipation The fins 26 are disposed on the protruding portion 222 of the heat pipe 22 , and the heat dissipation fins 26 are located above one of the heat exchanging elements 24 .

Continuing the above, in this embodiment, the heat pipe 22 and the heat exchange element 24 are in contact with the top of the first heat conduction element 10 at the same time, and a part of the heat conduction pipe 22 is arranged on one of the heat exchange elements 24 Inside, the heat energy of the heat exchange element 24 is conducted to the heat pipe 22 .

Continuing the above, in this embodiment, the heat pipe 22 extends upwards to form the protruding portion 222, and the cooling fins 26 of the heat exchange component 20 are sleeved on the protruding portion 222, so that the cooling fins 26 are fixed on the protruding portion 222. A part of the heat pipe 22 , the heat pipe 22 conducts heat energy to the heat dissipation fins 26 , and the heat dissipation fins 26 are in contact with a fluid (such as air) for heat exchange.

In one embodiment, the heat dissipation fins 26 of the heat exchange component 20 are a plurality of thin sheets, but this embodiment is not limited thereto.

In one embodiment, the heat exchanging element 24 of the heat exchanging element 20 can be cut with corresponding grooves to increase the surface area and improve the heat dissipation efficiency, but this embodiment is not limited here.

In one embodiment, the memory component 2 is a solid-state drive (SSD), such as a solid-state drive (PCIe M.2 SSD), and the substrate 3 is a circuit board of the solid-state drive. The memory element 4 is a memory of a solid-state hard disk, but this embodiment is not limited here.

In one embodiment, the first heat conduction element 10 is heat conduction silicone or heat conduction paste, but this embodiment is not limited thereto.

Referring to Fig. 3 again, it is a schematic diagram of the fan structure of an embodiment of the invention. As shown in the figure, this embodiment is based on the structure of the above-mentioned embodiment. In this embodiment, the cooling fins of the heat exchange component 20 One side of the sheet 26 is provided with an accommodating groove 262, further comprising a fan 30, the fan 30 is arranged on an inner side of the accommodating groove 262, that is, the fan 30 is embedded in the accommodating groove of the cooling fin 26 262 , and the fan 30 is fixed on the cooling fins 26 .

Continuing from the above, in this embodiment, when the fan 30 is running, the fan 30 makes the surrounding fluid (such as air) flow through the heat dissipation fins 26 to improve the heat dissipation efficiency of the heat exchange component 20 .

Continuing the above, in one embodiment, the fan 30 is electrically connected to a mains power (not shown) through a connecting port 32, the mains power can be provided by the main board, and the connecting port 32 is electrically connected to the main board, but this embodiment is not this limit.

Continuing the above, in one embodiment, the connection port 32 is a connection port (port), also known as a communication port, a port, or a protocol port (protocol port), which is a service established by software in a computer network. A computer operating system acts as a communication endpoint, and each communication port is associated with the host's IP address and communication protocol, including power transmission.

Please refer to Fig. 4, which is a schematic diagram of the structure of the fixing frame of an embodiment of the invention. As shown in the figure, this embodiment is based on the above-mentioned first embodiment. In this embodiment, a second heat conducting member 40 is further included. And a fixing frame 50 , the second heat conducting element 40 is disposed under the substrate 3 to conduct the heat energy of the substrate 3 , and the fixing frame 50 is disposed under the second heat conducting element 40 .

Continuing the above, in this embodiment, the fixing frame 50 extends upwards with a limiting portion 52 , the limiting portion 52 and the fixing frame 50 cover the memory component 2 , the second heat conducting element 40 and the first heat conducting element 10 , the limiting portion 52 prevents the memory component 2 , the second heat conducting element 40 and the first heat conducting element 10 from moving arbitrarily.

Continuing from the above, in this embodiment, the fan 30 can also be provided correspondingly, and its structure is the same as that of the above embodiment in which the fan 30 is provided, so it will not be repeated here.

In one embodiment, the fixing frame 50 can be correspondingly arranged on the motherboard to fix the memory component 2 , the second heat conduction element 40 , the first heat conduction element 10 and the heat exchange component 20 to avoid the memory component 2 , The second heat conduction element 40 , the first heat conduction element 10 and the heat exchange assembly 20 move arbitrarily and are damaged.

In one embodiment, the second heat conduction element 40 is heat conduction silicone or heat conduction paste, but this embodiment is not limited thereto.

Please refer to Fig. 5, which is a structural schematic diagram of the fixing part of one embodiment of the present creation. As shown in the figure, in this embodiment, a first fixing part F1 is further included, and the first fixing part F1 is passed through One side of the heat dissipation fin 26 of the heat exchange component 20 and one side of the fan 30 are used to fix the fan 30 to the accommodating groove 262 of the heat dissipation fin 26 to prevent the fan 30 from falling.

Continuing the above, in this embodiment, a second fixing piece F2 is further included, and the second fixing piece F2 passes through one side of the limiting portion 52 of the fixing frame 50 and one side of the heat exchange element 24, so that the The fixing frame 50 and the heat exchanging assembly 20 are mutually fixed to prevent the fixing frame 50 from moving arbitrarily and preventing the heat exchanging assembly 20 from falling.

To sum up, this creation provides a heat dissipation structure, which uses the heat conduction element and the heat exchange component to be arranged above the memory component correspondingly, and the heat conduction element, the heat pipe included in the heat exchange element, the heat exchange element, and the heat dissipation fins correspond to each other. The thermal energy emitted by the memory components is conducted to improve the heat dissipation efficiency of the memory components and solve the problem of heat dissipation difficulties of the conventional memory components, and this creation uses a compact heat exchange component to further reduce the volume and solve the problem that the traditional memory components need to reduce the heat dissipation equipment question.

Therefore, this creation is indeed novel, progressive, and can be used in industry. It should meet the patent application requirements of our country's patent law.

However, the above is only an embodiment of this creation, and it is not used to limit the scope of implementation of this creation. Therefore, all equal changes and modifications based on the shape, structure, characteristics and spirit described in the patent scope of this creation, All should be included in the scope of the patent application for this creation.

1: The structure of heat dissipation 2: memory components 3: Substrate 4: memory element 10: The first thermal conductor 20: Heat exchange components 22: heat pipe 222: protruding part 24: heat exchange parts 26: cooling fins 262: storage tank 30: fan 32: port 40: Second heat conducting member 50: fixed frame 52: limit part F1: the first fixed piece F2: The second fixing piece

Figure 1: It is a structural schematic diagram of an embodiment of this creation; Figure 2: It is a schematic front view of the structure of one embodiment of this creation; Figure 3: It is a schematic diagram of the fan structure of one embodiment of the invention; Figure 4: It is a structural schematic diagram of the fixing frame of one embodiment of this creation; and Fig. 5: It is a structural schematic diagram of the fixing part of one embodiment of this creation.

1: The structure of heat dissipation

2: memory components

3: Substrate

4: memory element

10: The first thermal conductor

20: Heat exchange components

22: heat pipe

222: protruding part

24: heat exchange parts

26: cooling fins

Claims (10)

A heat dissipation structure, which is arranged on one of a memory component, the memory component includes a substrate and a plurality of memory elements, and the memory elements are arranged on one of the substrates, the heat dissipation structure includes: a first heat conducting element, which is disposed above one of the memory elements; and A heat exchange assembly comprising: a heat pipe, which is arranged above one of the first heat conduction elements, and the heat pipe extends upward to form a protrusion; a heat exchange element, which is arranged on the top of the first heat conduction element, and the heat exchange element is sleeved on the top of one of the heat pipes; and A radiating fin is arranged on the protruding part of the heat pipe, and the radiating fin is located above one of the heat exchanging elements. The structure for heat dissipation according to claim 1, wherein one side of the heat dissipation fin is provided with an accommodating groove. The heat dissipation structure as described in Claim 2 further includes a fan disposed inside one of the accommodating slots. The heat dissipation structure as described in Claim 3, wherein the fan is electrically connected to a commercial power supply through a connecting port. The heat dissipation structure as described in Claim 3 further includes a first fixing member, and the first fixing member passes through one side of the heat dissipation fin and one side of the fan. The heat dissipation structure according to claim 1 further includes a second heat conducting element disposed under one of the substrates. The heat dissipation structure as described in Claim 6 further includes a fixing frame disposed under one of the second heat conducting members. The heat dissipation structure according to claim 7, wherein the fixing frame extends upwards with a limiting portion, and the limiting portion and the fixing frame cover the memory component, the second heat conducting element and the first heat conducting element. The heat dissipation structure as described in Claim 8 further includes a second fixing piece, and the second fixing piece passes through one side of the limiting portion and one side of the heat exchange element. The heat dissipation structure according to claim 1, wherein the memory component is a solid-state hard disk (PCIe M.2 SSD).

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