TWM644665U - Heat dissipating structure - Google Patents
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims description 13
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- 238000004891 communication Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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Abstract
本創作提供一種散熱之結構,其係設置於一記憶組件之一上方,該散熱之結構包含一第一導熱件以及一熱交換組件,該第一導熱件設置於該些個記憶元件之一上方,該熱交換組件包含一導熱管、一熱交換件以及一散熱鰭片,該導熱管設置於該第一導熱件之一上方,該導熱管向上延伸形成一凸出部,該熱交換件設置於該第一導熱件之該上方,該熱交換件套設於該導熱管之一上方,該散熱鰭片設置於該導熱管之該凸出部,該散熱鰭片位於該熱交換件之一上方;利用此結構供記憶組件散熱。This creation provides a heat dissipation structure, which is arranged above one of the memory components, and the heat dissipation structure includes a first heat conduction element and a heat exchange component, and the first heat conduction element is disposed above one of the memory elements , the heat exchange assembly includes a heat pipe, a heat exchange element and a heat dissipation fin, the heat pipe is arranged above one of the first heat conduction elements, the heat pipe extends upward to form a protrusion, and the heat exchange element is arranged On the top of the first heat conducting element, the heat exchanging element is sleeved above one of the heat conducting pipes, the heat dissipation fin is arranged on the protruding part of the heat conducting pipe, and the heat dissipating fin is located on one of the heat exchanging elements Above; use this structure to dissipate heat from the memory components.
Description
本創作是關於一種散熱之結構,尤其係指一種包含導熱管以及鰭片之散熱結構。This creation is about a heat dissipation structure, especially a heat dissipation structure including heat pipes and fins.
隨著科技的發展,現今電腦硬體已朝向高速、高頻的方向發展,藉以提升電腦的運作效率,電腦硬體長時間在高速、高頻的環境下運作,相對的會產生高溫。記憶體為了配合處理器高速度的運算,相對的電子元件的工作溫度也越來越高,持續上升的溫度勢必影響電子元件的效能,甚至會導致記憶體損毀。With the development of science and technology, today's computer hardware has been developed in the direction of high speed and high frequency, so as to improve the operating efficiency of the computer. Computer hardware operates in a high speed and high frequency environment for a long time, and relatively high temperature will be generated. In order for the memory to cooperate with the high-speed calculation of the processor, the operating temperature of the corresponding electronic components is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the electronic components, and even cause the memory to be damaged.
由於電競風氣興盛以及不少電腦被改裝的流行趨勢,許多的電競電腦的使用者或廠商會將電競電腦的機殼改換為可透視的機殼,而此一改裝風氣亦逐漸地盛行,電競電腦的內部零組件,例如:CPU、顯示卡、記憶體,會較一般個人電腦具較佳之效能,因而相對性產生較多的熱能。Due to the popularity of e-sports and the popular trend of many computers being modified, many users or manufacturers of e-sports computers will replace the casings of e-sports computers with see-through casings, and this modification trend is gradually prevailing , The internal components of the gaming computer, such as: CPU, graphics card, memory, will have better performance than ordinary personal computers, so relatively more heat will be generated.
習知發熱之電子元件,例如:CPU、顯示卡、記憶體,設置於電路板並以連接介面插設至電腦系統。因前述電競產品的需求,相關電子元件之工作頻率逐漸往高頻化發展,使電子元件有更高的資料傳輸速率及更高的電量消耗,導致電子元件更容易積熱;當電子元件的工作溫度越來越高,超過容許的溫度值時,電子元件的效能會明顯降低,同時也增加了模組保持資料或運算的錯誤率,導致電腦系統不穩定,由於過多的熱能會降低電子元件的效能,因此人們會在這些電子元件安裝散熱器;而上述電競產業中,安裝在電子元件的散熱元件不只需要出色的散熱效率,散熱元件之外觀設計更是電競設備之間互相比較的重頭戲。It is known that electronic components that generate heat, such as CPU, display card, and memory, are arranged on a circuit board and plugged into a computer system through a connection interface. Due to the demand of the above-mentioned gaming products, the operating frequency of related electronic components is gradually increasing to high frequency, which makes the electronic components have higher data transmission rate and higher power consumption, which makes the electronic components easier to accumulate heat; when the electronic components The working temperature is getting higher and higher. When the temperature exceeds the allowable value, the performance of the electronic components will be significantly reduced. At the same time, the error rate of the module to maintain data or calculation will increase, resulting in the instability of the computer system. The excessive heat will reduce the electronic components. Therefore, people will install radiators on these electronic components; and in the above-mentioned e-sports industry, the heat dissipation components installed in electronic components not only need excellent heat dissipation efficiency, but also the appearance design of the heat dissipation components is the comparison between e-sports equipment Main event.
又隨著時代演進,機殼(容置需散熱元件之外殼)體積縮小之情況下,散熱設備多被要求進一步縮小體積,使設備可以在最有限的空間下,仍能進行長時間不停機的高速資料處理及運算,然而又因自行組裝電腦、伺服器等風氣逐漸盛行,若結合縮小散熱設備及可自行更換散熱、導熱元件之需求,將是產業界的一大挑戰。With the evolution of the times, when the size of the casing (housing that houses the cooling elements) shrinks, the cooling equipment is often required to further reduce the size, so that the equipment can still be used for a long time without stopping in the most limited space. High-speed data processing and computing, however, due to the trend of self-assembled computers and servers, etc., if combined with the need to reduce heat dissipation equipment and replace heat dissipation and heat conduction components by yourself, it will be a major challenge for the industry.
有鑑於上述習知技術之問題,本創作提供一種散熱之結構,其係利用導熱件以及熱交換組件對應設置於記憶組件之上方,以導熱件、熱交換組件包含之導熱管、熱交換件以及散熱鰭片對應傳導記憶組件所發出之熱能,使記憶組件之散熱效率提升。In view of the problems of the above-mentioned conventional technologies, this invention provides a heat dissipation structure, which is to use the heat conduction element and the heat exchange component to be arranged above the memory component correspondingly, and to use the heat conduction element, the heat pipe contained in the heat exchange component, the heat exchange element and The heat dissipation fins correspond to conduction of the heat energy emitted by the memory components, so as to improve the heat dissipation efficiency of the memory components.
本創作之一目的在於提供一種散熱之結構,其係利用導熱件以及熱交換組件對應設置於記憶組件之上方,導熱件傳導記憶組件所發出之熱能,且熱交換組件包含之導熱管、熱交換件以及散熱鰭片對應傳導記憶組件所發出之熱能,並以此結構供記憶組件散熱之功效。One purpose of this creation is to provide a heat dissipation structure, which uses heat conduction parts and heat exchange components to be arranged above the memory components correspondingly, the heat conduction parts conduct the heat energy emitted by the memory components, and the heat exchange components include heat pipes, heat exchangers The components and the heat dissipation fins correspond to conduct the heat energy emitted by the memory components, and use this structure to provide heat dissipation for the memory components.
為達到上述所指稱之各目的與功效,本創作提供一種散熱之結構,其設置於一記憶組件之一上方,該記憶組件包含一基板以及複數個記憶元件,該些個記憶元件設置於該基板之一上方,該散熱之結構包含一第一導熱件以及一熱交換組件,該第一導熱件設置於該些個記憶元件之一上方,該熱交換組件,其包含:一導熱管,其設置於該第一導熱件之一上方,該導熱管向上延伸形成一凸出部,一熱交換件,其設置於該第一導熱件之該上方,該熱交換件套設於該導熱管之一上方,一散熱鰭片,其設置於該導熱管之該凸出部,該散熱鰭片位於該熱交換件之一上方;以此結構供記憶組件散熱,提升記憶組件之散熱效率。In order to achieve the above-mentioned purposes and effects, the invention provides a heat dissipation structure, which is arranged on one of the memory components, and the memory component includes a substrate and a plurality of memory elements, and the memory elements are arranged on the substrate Above one of the memory elements, the heat dissipation structure includes a first heat conduction element and a heat exchange assembly, the first heat conduction element is arranged above one of the memory elements, and the heat exchange assembly includes: a heat conduction pipe, which is arranged Above one of the first heat-conducting elements, the heat-conducting pipe extends upwards to form a protruding part, a heat-exchanging element, which is arranged above the first heat-conducting element, and the heat-exchanging element is sheathed on one of the heat-conducting pipes On the top, a heat dissipation fin is arranged on the protruding part of the heat pipe, and the heat dissipation fin is located above one of the heat exchanging elements; this structure provides heat dissipation for the memory component and improves the heat dissipation efficiency of the memory component.
本創作之一實施例中,其中該散熱鰭片之一側設置一容置槽。In an embodiment of the present invention, one side of the heat dissipation fin is provided with an accommodating groove.
本創作之一實施例中,更包含一風扇,其設置於該容置槽之一內側。In one embodiment of the present invention, a fan is further included, which is arranged inside one of the accommodating slots.
本創作之一實施例中,其中該風扇以一連接埠電性連接一市電。In an embodiment of the present invention, the fan is electrically connected to a commercial power through a connection port.
本創作之一實施例中,更包含一第一固定件,該第一固定件穿設該散熱鰭片之一側以及該風扇之一側。In an embodiment of the invention, a first fixing member is further included, and the first fixing member passes through one side of the cooling fin and one side of the fan.
本創作之一實施例中,更包含一第二導熱件,其設置於該基板之一下方。In one embodiment of the present invention, a second heat conducting element is further included, which is disposed under one of the substrates.
本創作之一實施例中,更包含一固定架,其設置於該第二導熱件之一下方。In an embodiment of the present invention, a fixing frame is further included, which is disposed under one of the second heat conducting elements.
本創作之一實施例中,其中該固定架向上延伸一限位部,該限位部與該固定架包覆該記憶組件、該第二導熱件以及該第一導熱件。In an embodiment of the present invention, a limiting portion extends upward from the fixing frame, and the limiting portion and the fixing frame cover the memory component, the second heat conducting element and the first heat conducting element.
本創作之一實施例中,更包含一第二固定件,該第二固定件穿設該限位部之一側以及該熱交換件之一側。In an embodiment of the invention, a second fixing piece is further included, and the second fixing piece passes through one side of the limiting portion and one side of the heat exchange element.
本創作之一實施例中,其中該記憶組件係一固態硬碟(PCIe M.2 SSD)。In one embodiment of the present invention, the memory component is a solid state drive (PCIe M.2 SSD).
為使 貴審查委員對本創作之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以實施例及配合說明,說明如後:In order to enable your review committee to have a further understanding and understanding of the characteristics of this creation and the achieved effects, I would like to provide examples and accompanying explanations, as follows:
有鑑於上述習知技術之問題,本創作係一種散熱之結構,其係設置於一記憶組件之一上方,該散熱之結構包含一第一導熱件以及一熱交換組件,該第一導熱件設置於該些個記憶元件之一上方,該熱交換組件包含一導熱管、一熱交換件以及一散熱鰭片,該導熱管設置於該第一導熱件之一上方,該導熱管向上延伸形成一凸出部,該熱交換件設置於該第一導熱件之該上方,該熱交換件套設於該導熱管之一上方,該散熱鰭片設置於該導熱管之該凸出部,該散熱鰭片位於該熱交換件之一上方,以此結構解決習知技術記憶元件散熱困難之問題。In view of the problems of the above-mentioned prior art, this invention is a heat dissipation structure, which is arranged on one of the memory components. The heat dissipation structure includes a first heat conduction element and a heat exchange element. Above one of the memory elements, the heat exchange assembly includes a heat pipe, a heat exchange element and a heat dissipation fin, the heat pipe is arranged above one of the first heat conduction elements, and the heat pipe extends upward to form a a protruding part, the heat exchanging element is disposed above the first heat conducting element, the heat exchanging element is sleeved above one of the heat conducting pipes, the heat dissipation fin is disposed on the protruding part of the heat conducting pipe, the heat dissipating fin The fins are located above one of the heat exchanging elements, and this structure solves the problem of difficult heat dissipation of the memory element in the prior art.
請參閱第1圖,其為本創作之一實施例之結構示意圖,如圖所示,於本實施例中,其係一種散熱之結構1,該散熱之結構1設置於一記憶組件2之一上方,該記憶組件2包含一基板3以及複數個記憶元件4,該些個記憶元件4設置於該基板3之一上方,該散熱之結構1包含一第一導熱件10以及一熱交換組件20。Please refer to Fig. 1, which is a structural schematic diagram of an embodiment of this creation, as shown in the figure, in this embodiment, it is a
再次參閱第1圖以及參閱第2圖,第2圖為本創作之一實施例之結構前視示意圖,於本實施例中,該第一導熱件10設置於該些個記憶元件4之一上方,以傳導該些個記憶元件4之熱能,該熱交換組件20包含一導熱管22、一熱交換件24以及一散熱鰭片26,該導熱管22設置於該第一導熱件10之一上方,該導熱管22向上延伸形成一凸出部222,該熱交換件24設置於該第一導熱件10之該上方,且該熱交換件24套設於該導熱管22之一上方,該散熱鰭片26設置於該導熱管22之該凸出部222,該散熱鰭片26位於該熱交換件24之一上方。Referring again to FIG. 1 and FIG. 2, FIG. 2 is a schematic front view of an embodiment of the invention. In this embodiment, the first
接續上述,於本實施例中,該導熱管22與該熱交換件24同時抵接於該第一導熱件10之該上方,該導熱管22之一部份設置於該熱交換件24之一內側,使該熱交換件24之熱能傳導至該導熱管22。Continuing the above, in this embodiment, the
接續上述,於本實施例中,該導熱管22向上延伸成該凸出部222,該熱交換組件20之該散熱鰭片26套設於該凸出部222,使該散熱鰭片26固定於該導熱管22之一部份,該導熱管22傳導熱能至該散熱鰭片26,該散熱鰭片26與流體(如空氣)接觸,並進行熱交換。Continuing the above, in this embodiment, the
於一實施例中,該熱交換組件20之該散熱鰭片26係複數個薄片,但本實施例不在此限制。In one embodiment, the heat dissipation fins 26 of the
於一實施例中,該熱交換組件20之該熱交換件24可對應切設凹槽,以增加表面積,提升散熱效率,但本實施例不在此限制。In one embodiment, the
於一實施例中,該記憶組件2係一固態硬碟(Solid-state drive,SSD),例如固態硬碟(PCIe M.2 SSD),該基板3係固態硬碟之電路板,該些個記憶元件4係固態硬碟之記憶體,但本實施例不在此限制。In one embodiment, the
於一實施例中,該第一導熱件10係導熱矽膠或導熱膏,但本實施例不在此限制。In one embodiment, the first
再次參閱第3圖,其為本創作之一實施例之風扇結構示意圖,如圖所示,本實施例係基於上述實施例之結構,於本實施例中,該熱交換組件20之該散熱鰭片26之一側設置一容置槽262,更包含一風扇30,該風扇30設置於該容置槽262之一內側,即係該風扇30嵌設於該散熱鰭片26之該容置槽262內,且該風扇30固定於該散熱鰭片26。Referring to Fig. 3 again, it is a schematic diagram of the fan structure of an embodiment of the invention. As shown in the figure, this embodiment is based on the structure of the above-mentioned embodiment. In this embodiment, the cooling fins of the
接續上述,於本實施例中,該風扇30運轉時,該風扇30使周圍之流體(如空氣)於該散熱鰭片26流動,以提升該熱交換組件20之散熱效率。Continuing from the above, in this embodiment, when the
接續上述,於一實施例中,該風扇30以一連接埠32電性連接一市電(圖未示),該市電可由主機板提供,該連接埠32電性連接主機板,但本實施例不在此限制。Continuing the above, in one embodiment, the
接續上述,於一實施例中,該連接埠32係連接埠(port),又稱為通訊埠、端口、協定埠(protocol port),其於電腦網路中是一種經由軟體建立的服務,在一個電腦作業系統中扮演通訊的端點(endpoint),每個通訊埠都會與主機的IP位址及通訊協定關聯,其中包含電源傳輸。Continuing the above, in one embodiment, the
請參閱第4圖,其為本創作之一實施例之固定架結構示意圖,如圖所示,本實施例係基於上述第一實施例,於本實施例中,更包含一第二導熱件40以及一固定架50,該第二導熱件40設置於該基板3之一下方,以傳導該基板3之熱能,該固定架50設置於該第二導熱件40之一下方。Please refer to Fig. 4, which is a schematic diagram of the structure of the fixing frame of an embodiment of the invention. As shown in the figure, this embodiment is based on the above-mentioned first embodiment. In this embodiment, a second
接續上述,於本實施例中,該固定架50向上延伸一限位部52,該限位部52與該固定架50包覆該記憶組件2、該第二導熱件40以及該第一導熱件10,該限位部52防止該記憶組件2、該第二導熱件40以及該第一導熱件10任意移動。Continuing the above, in this embodiment, the
接續上述,於本實施例中,也可對應設置該風扇30,其結構於上述設置該風扇30之實施例相同,固不再贅述。Continuing from the above, in this embodiment, the
於一實施例中,該固定架50可對應設置於主機板,以固定該記憶組件2、該第二導熱件40、該第一導熱件10以及該熱交換組件20,避免該記憶組件2、該第二導熱件40、該第一導熱件10以及該熱交換組件20任意移動而損壞。In one embodiment, the
於一實施例中,該第二導熱件40係導熱矽膠或導熱膏,但本實施例不在此限制。In one embodiment, the second
請參閱第5圖,其為本創作之一實施例之固定件結構示意圖,如圖所示,於本實施例中,更包含一第一固定件F1,該第一固定件F1穿設於該熱交換組件20該散熱鰭片26之一側以及該風扇30之一側,使該風扇30固定於該散熱鰭片26之該容置槽262,避免該風扇30掉落。Please refer to Fig. 5, which is a structural schematic diagram of the fixing part of one embodiment of the present creation. As shown in the figure, in this embodiment, a first fixing part F1 is further included, and the first fixing part F1 is passed through One side of the
接續上述,於本實施例中,更包含一第二固定件F2,該第二固定件F2穿設該固定架50該限位部52之一側以及該熱交換件24之一側,使該固定架50與該熱交換組件20互相固定,避免該固定架50任意移動,以及避免該熱交換組件20掉落。Continuing the above, in this embodiment, a second fixing piece F2 is further included, and the second fixing piece F2 passes through one side of the
綜上所述,本創作提供一種散熱之結構,其係利用導熱件以及熱交換組件對應設置於記憶組件之上方,以導熱件、熱交換組件包含之導熱管、熱交換件以及散熱鰭片對應傳導記憶組件所發出之熱能,使記憶組件之散熱效率提升,解決習知記憶元件散熱困難之問題,且本創作以結構緊湊之熱交換組件進一步縮小體積,解決習知記憶元件需縮小散熱設備之問題。To sum up, this creation provides a heat dissipation structure, which uses the heat conduction element and the heat exchange component to be arranged above the memory component correspondingly, and the heat conduction element, the heat pipe included in the heat exchange element, the heat exchange element, and the heat dissipation fins correspond to each other. The thermal energy emitted by the memory components is conducted to improve the heat dissipation efficiency of the memory components and solve the problem of heat dissipation difficulties of the conventional memory components, and this creation uses a compact heat exchange component to further reduce the volume and solve the problem that the traditional memory components need to reduce the heat dissipation equipment question.
故本創作實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出創作專利申請,祈 鈞局早日賜准專利,至感為禱。Therefore, this creation is indeed novel, progressive, and can be used in industry. It should meet the patent application requirements of our country's patent law.
惟以上所述者,僅為本創作一實施例而已,並非用來限定本創作實施之範圍,故舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本創作之申請專利範圍內。However, the above is only an embodiment of this creation, and it is not used to limit the scope of implementation of this creation. Therefore, all equal changes and modifications based on the shape, structure, characteristics and spirit described in the patent scope of this creation, All should be included in the scope of the patent application for this creation.
1:散熱之結構 2:記憶組件 3:基板 4:記憶元件 10:第一導熱件 20:熱交換組件 22:導熱管 222:凸出部 24:熱交換件 26:散熱鰭片 262:容置槽 30:風扇 32:連接埠 40:第二導熱件 50:固定架 52:限位部 F1:第一固定件 F2:第二固定件 1: The structure of heat dissipation 2: memory components 3: Substrate 4: memory element 10: The first thermal conductor 20: Heat exchange components 22: heat pipe 222: protruding part 24: heat exchange parts 26: cooling fins 262: storage tank 30: fan 32: port 40: Second heat conducting member 50: fixed frame 52: limit part F1: the first fixed piece F2: The second fixing piece
第1圖:其為本創作之一實施例之結構示意圖; 第2圖:其為本創作之一實施例之結構前視示意圖; 第3圖:其為本創作之一實施例之風扇結構示意圖; 第4圖:其為本創作之一實施例之固定架結構示意圖;以及 第5圖:其為本創作之一實施例之固定件結構示意圖。 Figure 1: It is a structural schematic diagram of an embodiment of this creation; Figure 2: It is a schematic front view of the structure of one embodiment of this creation; Figure 3: It is a schematic diagram of the fan structure of one embodiment of the invention; Figure 4: It is a structural schematic diagram of the fixing frame of one embodiment of this creation; and Fig. 5: It is a structural schematic diagram of the fixing part of one embodiment of this creation.
1:散熱之結構 1: The structure of heat dissipation
2:記憶組件 2: memory components
3:基板 3: Substrate
4:記憶元件 4: memory element
10:第一導熱件 10: The first thermal conductor
20:熱交換組件 20: Heat exchange components
22:導熱管 22: heat pipe
222:凸出部 222: protruding part
24:熱交換件 24: heat exchange parts
26:散熱鰭片 26: cooling fins
Claims (10)
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TW112204980U TWM644665U (en) | 2023-05-19 | 2023-05-19 | Heat dissipating structure |
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