CN220041068U - Heat dissipation structure - Google Patents

Abstract

The utility model provides a heat dissipation structure, which is disposed above a storage component. The heat dissipation structure includes a first heat conduction member and a heat exchange member. The first heat conduction member is disposed on one of the storage components. Above, the heat exchanger is disposed above the first thermal conductor. An accommodating groove and a first fin portion are provided on one side of the heat exchanger. The first fin portion is annularly disposed in the accommodating groove. An outer edge; this structure is used for heat dissipation of the storage component.

Description

Heat dissipation structure

Technical field

The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure including a heat pipe and a fin.

Background technique

With the development of science and technology, computer hardware has been developing towards high speed and high frequency in order to improve the operating efficiency of computers. When computer hardware operates in a high speed and high frequency environment for a long time, it will generate relatively high temperatures. In order to cope with the high-speed operation of the processor, the working temperature of the electronic components of the memory is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the electronic components and even cause the memory to be damaged.

Due to the rise of e-sports and the popular trend of many computers being modified, many e-sports computer users or manufacturers will replace the cases of e-sports computers with see-through cases, and this modification trend has gradually become popular. The internal components of a gaming computer, such as the CPU, graphics card, and memory, have better performance than ordinary personal computers and therefore generate relatively more heat energy.

It is known that heat-generating electronic components, such as CPUs, display adapters, and memories, are installed on circuit boards and plugged into computer systems through connection interfaces. Due to the aforementioned demand for e-sports products, the operating frequencies of related electronic components are gradually developing towards higher frequencies, resulting in higher data transmission rates and higher power consumption of electronic components, which makes electronic components more likely to accumulate heat; when electronic components The operating temperature is getting higher and higher. When it exceeds the allowable temperature value, the performance of electronic components will be significantly reduced. It also increases the error rate of the module to retain data or perform calculations, causing the computer system to be unstable. Excessive heat energy will degrade the electronic components. efficiency, so people will install radiators on these electronic components; and in the above-mentioned e-sports industry, the heat dissipation components installed on electronic components not only require excellent heat dissipation efficiency, but also the appearance design of the heat dissipation components is a key factor for comparison between e-sports equipment. The highlight.

And with the evolution of the times, when the size of the chassis (the casing that houses the components that need to be cooled) shrinks, the heat dissipation equipment is often required to further reduce the size, so that the equipment can still operate for a long time without stopping in the most limited space. High-speed data processing and computing, however, as the trend of self-assembled computers and servers gradually becomes more popular, combined with the need for smaller heat dissipation equipment and self-replaceable heat dissipation and heat conduction components, it will be a major challenge for the industry.

In view of the above-mentioned problems of the conventional technology, the present invention provides a heat dissipation structure, which utilizes heat conductive members and heat exchange members to be disposed above the storage assembly. The heat energy emitted is dissipated by fins, thereby improving the heat dissipation efficiency of the storage component.

Utility model content

An object of the present utility model is to provide a heat dissipation structure, which utilizes thermal conductive members and heat exchange members correspondingly disposed above the storage component. The thermal conductive member conducts the heat energy emitted by the storage component, and the heat exchange member conducts the heat energy emitted by the storage component correspondingly. The heat energy is dissipated with fins, and this structure provides heat dissipation for the storage components.

In order to achieve the above-mentioned purposes and effects, the present invention provides a heat dissipation structure, which is disposed above a storage component. The storage component includes a substrate and a plurality of storage elements. The storage elements are disposed on Above the substrate, the heat dissipation structure includes a first thermal conductor and a heat exchanger. The first thermal conductor is disposed above the storage elements. The heat exchanger is disposed on the first thermal conductor. Above, a receiving groove and a first fin part are provided on one side of the heat exchanger. The first fin part is annularly provided on an outer edge of the receiving groove; this structure allows the storage component to dissipate heat and improve Thermal efficiency of storage components.

In one embodiment of the present invention, a second fin portion is provided on the other side of the heat exchange member.

In one embodiment of the present invention, a fan is further included, which is disposed on an inner side of the accommodating groove.

In one embodiment of the present invention, the fan is electrically connected to a mains power through a port.

In one embodiment of the present invention, a first fixing member is further included, and the first fixing member passes through one side of the heat exchange member and one side of the fan.

In an embodiment of the present invention, a second thermal conductive member is further included, which is disposed below the substrate.

In an embodiment of the present invention, a fixing bracket is further included, which is disposed below the second heat conductive member.

In one embodiment of the present invention, a limiting portion extends upward from the fixed frame, and the limiting portion and the fixed frame cover the storage component, the second thermal conductive member and the first thermal conductive member.

In one embodiment of the present invention, a second fixing member is further included, and the second fixing member passes through one side of the limiting portion and the side of the heat exchange member.

In one embodiment of the present invention, the storage component is a solid state drive (PCIe M.2SSD).

Description of the drawings

Figure 1: It is a schematic structural diagram of an embodiment of the present utility model;

Figure 2: It is a schematic structural front view of an embodiment of the present utility model;

Figure 3: This is a schematic structural diagram of a fan according to an embodiment of the present utility model;

Figure 4: This is a schematic structural diagram of a fixing frame according to an embodiment of the present utility model; and

Figure 5: This is a schematic structural diagram of a fixing member according to an embodiment of the present invention.

[Picture number comparison instructions]

1 Heat dissipation structure

2 storage components

3 substrate

4 storage elements

10 The first thermal conductor

20 heat exchange parts

202 storage tank

22 First fin part

24 Second fin part

30 fans

Port 32

40 Second thermal conductor

50 fixed bracket

52 Limiting part

F1 first fixing piece

F2 second fixing piece

Detailed ways

In order to have a further understanding of the structural features and effects of the present utility model, preferred embodiments and detailed descriptions are provided as follows:

In view of the above-mentioned problems of the conventional technology, the present invention is a heat dissipation structure, which is arranged above a storage component. The heat dissipation structure includes a first heat conduction member and a heat exchange member. The first heat conduction member The heat exchanger is disposed above the storage elements. The heat exchanger is disposed above the first thermal conductor. A receiving groove and a first fin portion are provided on one side of the heat exchanger. The first fin The piece is annularly arranged on an outer edge of the accommodating groove. This structure solves the problem of difficulty in heat dissipation of storage elements in the conventional technology.

Please refer to Figure 1, which is a schematic structural diagram of an embodiment of the present invention. As shown in the figure, in this embodiment, it is a heat dissipation structure 1. The heat dissipation structure 1 is disposed on a storage component 2. On one side, the storage component 2 includes a substrate 3 and a plurality of storage elements 4. The storage elements 4 are disposed above the substrate 3. The heat dissipation structure 1 includes a first thermal conductive member 10 and a heat exchange member. 20.

Referring again to FIG. 1 and FIG. 2 , FIG. 2 is a schematic structural front view of an embodiment of the present utility model. In this embodiment, the first thermal conductive member 10 is disposed above the storage elements 4 to To conduct the thermal energy of the storage elements 4, the heat exchange member 20 is disposed above the first heat conduction member 10, and a receiving groove 202 and a first fin portion 22 are provided on one side of the heat exchange member 20. And the first fin portion 22 is annularly disposed on an outer edge of the accommodating groove 202 .

Continuing from the above, in this embodiment, a plurality of slots are cut on the side of the heat exchange member 20 so that the first fin portion 22 is formed on the side of the heat exchange member 20 and the first fin portion 22 is The receiving groove 202 is then cut inward.

Continuing from the above, in this embodiment, the heat pipe 22 extends upward to form the protruding portion 222 , and the first fin portion 22 of the heat exchange member 20 contacts the fluid (such as air) and performs heat exchange.

In one embodiment, the first fin portion 22 of the heat exchange member 20 is a plurality of sheets, but this embodiment is not limited thereto.

In one embodiment, the heat exchange member 20 can be provided with corresponding grooves to increase the surface area and improve the heat dissipation efficiency, but this embodiment is not limited to this.

In one embodiment, the storage component 2 is a solid-state drive (SSD), such as a solid-state drive (PCIe M.2SSD), the substrate 3 is a circuit board of the solid-state drive, and the storage elements 4 are The memory of the solid state drive, but this embodiment is not limited to this.

In one embodiment, the first thermally conductive member 10 is thermally conductive silica gel or thermally conductive paste, but this embodiment is not limited thereto.

Please refer to Figure 3, which is a schematic structural diagram of a fan according to an embodiment of the present invention. As shown in the figure, this embodiment is based on the structure of the above embodiment. In this embodiment, it further includes a fan 30. The fan 30 is On an inner side of the accommodating groove 202 , the fan 30 is embedded in the first fin part 22 and the accommodating groove 202 , and the fan 30 is fixed to the first fin part 22 .

Continuing from the above, in this embodiment, when the fan 30 is running, the fan 30 causes the surrounding fluid (such as air) to flow in the first fin portion 22 to improve the heat dissipation efficiency of the heat exchange member 20 .

Continuing from the above, in one embodiment, the fan 30 is electrically connected to a mains power supply (not shown) through a port 32. The mains power supply can be provided by the motherboard. The port 32 is electrically connected to the mainboard, but this embodiment is not limited thereto. .

Continuing from the above, in one embodiment, the port 32 is a port, also known as a communication port, a communication port, a connection port, and a protocol port, which is a service established through software in a computer network. , plays the role of communication endpoint in a computer operating system. Each communication port is associated with the host's IP address and communication protocol, including power transmission.

Referring again to FIGS. 1 to 3 , as shown in the figures, in this embodiment, a second fin portion 24 is provided on the other side of the heat exchange member 20 . The second fin portion 24 can correspondingly increase the heat exchange rate. The surface area of the heat exchange member 20 is increased to improve the heat dissipation efficiency of the heat exchange member 20 .

In one embodiment, the first fin portion 22 of the heat exchange member 20 is a plurality of sheets, but this embodiment is not limited thereto.

Please refer to Figure 4, which is a schematic structural diagram of a fixed frame according to an embodiment of the present invention. As shown in the figure, this embodiment is based on the above-mentioned first embodiment. In this embodiment, it further includes a second heat conductive member 40 and A fixing bracket 50 is provided below the second heat conducting member 40 to conduct heat energy of the substrate 3 . The fixing bracket 50 is arranged below the second heat conducting member 40 .

Continuing from the above, in this embodiment, the fixing bracket 50 extends upward with a limiting portion 52 , and the limiting portion 52 and the fixing bracket 50 cover the storage component 2 , the second thermal conductive member 40 and the first thermal conductive member 10. The limiting portion 52 prevents the storage component 2, the second heat conducting member 40 and the first heat conducting member 10 from moving arbitrarily.

Continuing from the above, in this embodiment, the fan 30 can also be provided correspondingly. Its structure is the same as the above-mentioned embodiment in which the fan 30 is provided, and will not be described again.

In one embodiment, the fixing bracket 50 can be disposed correspondingly to the motherboard to fix the storage component 2, the second thermal conductive member 40, the first thermal conductive member 10 and the heat exchange member 20 to prevent the storage component 2, the The second heat conducting member 40 , the first heat conducting member 10 and the heat exchange member 20 are damaged due to any movement.

In one embodiment, the second thermally conductive member 40 is thermally conductive silicone or thermally conductive paste, but this embodiment is not limited thereto.

Please refer to Figure 5, which is a schematic structural diagram of a fastener according to an embodiment of the present invention. As shown in the figure, in this embodiment, a first fastener F1 is further included, and the first fastener F1 is inserted through the One side of the first fin portion 22 of the heat exchange member 20 and one side of the fan 30 fix the fan 30 to the accommodating groove 202 of the heat exchange member 20 to prevent the fan 30 from falling.

Continuing from the above, in this embodiment, a second fixing member F2 is further included. The second fixing member F2 passes through one side of the limiting portion 52 of the fixing frame 50 and one side of the heat exchange member 20, so that The fixing frame 50 and the heat exchange member 20 are fixed to each other to prevent the fixing frame 50 from moving arbitrarily and the heat exchange member 20 from falling.

To sum up, the present utility model provides a heat dissipation structure, which utilizes heat conductors and heat exchange members to be disposed above the storage assembly, and the heat conductors, heat exchange members, and heat dissipation fins included in the heat exchange members conduct the storage accordingly. The heat energy emitted by the components improves the heat dissipation efficiency of the storage components and solves the problem of difficulty in heat dissipation of conventional storage components. Furthermore, the utility model further reduces the size of the conventional storage components by using compact heat exchange components to solve the problem of requiring smaller heat dissipation equipment for conventional storage components. .

The above are only preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Equal changes and modifications can be made in accordance with the shape, structure, features and spirit described in the claims of the present utility model. , should be included in the scope of the claims of the present utility model.

Claims (10)

1. A heat dissipation structure, characterized in that it is arranged above a storage component. The storage component includes a substrate and a plurality of storage elements. The storage elements are arranged above the substrate. The heat dissipation The structure contains: a first thermal conductive member disposed above the storage elements; and A heat exchange member is arranged above the first heat conductive member. A receiving groove and a first fin portion are provided on one side of the heat exchange member. The first fin portion is annularly provided in the receiving groove. an outer edge of. 2. The heat dissipation structure of claim 1, wherein a second fin portion is provided on the other side of the heat exchange member. 3. The heat dissipation structure of claim 1, further comprising a fan disposed on an inner side of the accommodating groove. 4. The heat dissipation structure of claim 3, wherein the fan is electrically connected to a commercial power supply through a port. 5. The heat dissipation structure of claim 4, further comprising a first fixing component that passes through one side of the heat exchanger and one side of the fan. 6. The heat dissipation structure of claim 1, further comprising a second heat conductive member disposed below the substrate. 7. The heat dissipation structure as claimed in claim 6, further comprising a fixing bracket disposed below the second heat conducting member. 8. The heat dissipation structure according to claim 7, wherein the fixing frame extends upward with a limiting portion, and the limiting portion and the fixing frame cover the storage component, the second heat conductive member and the third heat-conducting member. A thermal conductor. 9. The heat dissipation structure as claimed in claim 8, further comprising a second fixing member, the second fixing member passing through one side of the limiting portion and the side of the heat exchange member. 10. The heat dissipation structure of claim 1, wherein the storage component is a solid state drive.