CN220041068U - Heat dissipation structure - Google Patents
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- CN220041068U CN220041068U CN202321228404.7U CN202321228404U CN220041068U CN 220041068 U CN220041068 U CN 220041068U CN 202321228404 U CN202321228404 U CN 202321228404U CN 220041068 U CN220041068 U CN 220041068U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 44
- 239000002470 thermal conductor Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 5
- 230000015654 memory Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
本实用新型提供一种散热的结构,其设置于一存储组件的一上方,该散热的结构包含一第一导热件以及一热交换件,该第一导热件设置于该些个存储元件的一上方,该热交换件设置于该第一导热件的该上方,该热交换件的一侧设置一容置槽以及一第一鳍片部,该第一鳍片部环形设置于该容置槽的一外缘;利用此结构供存储组件散热。
The utility model provides a heat dissipation structure, which is disposed above a storage component. The heat dissipation structure includes a first heat conduction member and a heat exchange member. The first heat conduction member is disposed on one of the storage components. Above, the heat exchanger is disposed above the first thermal conductor. An accommodating groove and a first fin portion are provided on one side of the heat exchanger. The first fin portion is annularly disposed in the accommodating groove. An outer edge; this structure is used for heat dissipation of the storage component.
Description
技术领域Technical field
本实用新型是关于一种散热的结构,尤其指一种包含导热管以及鳍片的散热结构。The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure including a heat pipe and a fin.
背景技术Background technique
随着科技的发展,现今计算机硬件已朝向高速、高频的方向发展,借以提升计算机的运作效率,计算机硬件长时间在高速、高频的环境下运作,相对的会产生高温。内存为了配合处理器高速度的运算,相对的电子元件的工作温度也越来越高,持续上升的温度势必影响电子元件的效能,甚至会导致内存损毁。With the development of science and technology, computer hardware has been developing towards high speed and high frequency in order to improve the operating efficiency of computers. When computer hardware operates in a high speed and high frequency environment for a long time, it will generate relatively high temperatures. In order to cope with the high-speed operation of the processor, the working temperature of the electronic components of the memory is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the electronic components and even cause the memory to be damaged.
由于电竞风气兴盛以及不少计算机被改装的流行趋势,许多的电竞计算机的用户或厂商会将电竞计算机的机壳改换为可透视的机壳,而此一改装风气亦逐渐地盛行,电竞计算机的内部零组件,例如:CPU、显示适配器、内存,会较一般个人计算机具较佳的效能,因而相对性产生较多的热能。Due to the rise of e-sports and the popular trend of many computers being modified, many e-sports computer users or manufacturers will replace the cases of e-sports computers with see-through cases, and this modification trend has gradually become popular. The internal components of a gaming computer, such as the CPU, graphics card, and memory, have better performance than ordinary personal computers and therefore generate relatively more heat energy.
习知发热的电子元件,例如:CPU、显示适配器、内存,设置于电路板并以连接接口插设至计算机系统。因前述电竞产品的需求,相关电子元件的工作频率逐渐往高频化发展,使电子元件有更高的数据传输速率及更高的电量消耗,导致电子元件更容易积热;当电子元件的工作温度越来越高,超过容许的温度值时,电子元件的效能会明显降低,同时也增加了模块保持数据或运算的错误率,导致计算机系统不稳定,由于过多的热能会降低电子元件的效能,因此人们会在这些电子元件安装散热器;而上述电竞产业中,安装在电子元件的散热元件不只需要出色的散热效率,散热元件的外观设计更是电竞设备之间互相比较的重头戏。It is known that heat-generating electronic components, such as CPUs, display adapters, and memories, are installed on circuit boards and plugged into computer systems through connection interfaces. Due to the aforementioned demand for e-sports products, the operating frequencies of related electronic components are gradually developing towards higher frequencies, resulting in higher data transmission rates and higher power consumption of electronic components, which makes electronic components more likely to accumulate heat; when electronic components The operating temperature is getting higher and higher. When it exceeds the allowable temperature value, the performance of electronic components will be significantly reduced. It also increases the error rate of the module to retain data or perform calculations, causing the computer system to be unstable. Excessive heat energy will degrade the electronic components. efficiency, so people will install radiators on these electronic components; and in the above-mentioned e-sports industry, the heat dissipation components installed on electronic components not only require excellent heat dissipation efficiency, but also the appearance design of the heat dissipation components is a key factor for comparison between e-sports equipment. The highlight.
又随着时代演进,机壳(容置需散热元件的外壳)体积缩小的情况下,散热设备多被要求进一步缩小体积,使设备可以在最有限的空间下,仍能进行长时间不停机的高速数据处理及运算,然而又因自行组装计算机、服务器等风气逐渐盛行,若结合缩小散热设备及可自行更换散热、导热元件的需求,将是产业界的一大挑战。And with the evolution of the times, when the size of the chassis (the casing that houses the components that need to be cooled) shrinks, the heat dissipation equipment is often required to further reduce the size, so that the equipment can still operate for a long time without stopping in the most limited space. High-speed data processing and computing, however, as the trend of self-assembled computers and servers gradually becomes more popular, combined with the need for smaller heat dissipation equipment and self-replaceable heat dissipation and heat conduction components, it will be a major challenge for the industry.
有鉴于上述习知技术的问题,本实用新型提供一种散热的结构,其利用导热件以及热交换件对应设置于存储组件的上方,以导热件以及热交换件,热交换件对应传导存储组件所发出的热能,并以鳍片对应散热,使存储组件的散热效率提升。In view of the above-mentioned problems of the conventional technology, the present invention provides a heat dissipation structure, which utilizes heat conductive members and heat exchange members to be disposed above the storage assembly. The heat energy emitted is dissipated by fins, thereby improving the heat dissipation efficiency of the storage component.
实用新型内容Utility model content
本实用新型的一目的在于提供一种散热的结构,其利用导热件以及热交换件对应设置于存储组件的上方,导热件传导存储组件所发出的热能,热交换件对应传导存储组件所发出的热能,并以鳍片对应散热,以此结构供存储组件散热的功效。An object of the present utility model is to provide a heat dissipation structure, which utilizes thermal conductive members and heat exchange members correspondingly disposed above the storage component. The thermal conductive member conducts the heat energy emitted by the storage component, and the heat exchange member conducts the heat energy emitted by the storage component correspondingly. The heat energy is dissipated with fins, and this structure provides heat dissipation for the storage components.
为达到上述所指称的各目的与功效,本实用新型提供一种散热的结构,其设置于一存储组件的一上方,该存储组件包含一基板以及多个存储元件,该些个存储元件设置于该基板的一上方,该散热的结构包含一第一导热件以及一热交换件,该第一导热件设置于该些个存储元件的一上方,该热交换件设置于该第一导热件的该上方,该热交换件的一侧设置一容置槽以及一第一鳍片部,该第一鳍片部环形设置于该容置槽的一外缘;以此结构供存储组件散热,提升存储组件的散热效率。In order to achieve the above-mentioned purposes and effects, the present invention provides a heat dissipation structure, which is disposed above a storage component. The storage component includes a substrate and a plurality of storage elements. The storage elements are disposed on Above the substrate, the heat dissipation structure includes a first thermal conductor and a heat exchanger. The first thermal conductor is disposed above the storage elements. The heat exchanger is disposed on the first thermal conductor. Above, a receiving groove and a first fin part are provided on one side of the heat exchanger. The first fin part is annularly provided on an outer edge of the receiving groove; this structure allows the storage component to dissipate heat and improve Thermal efficiency of storage components.
本实用新型的一实施例中,其中该热交换件的另一侧设置一第二鳍片部。In one embodiment of the present invention, a second fin portion is provided on the other side of the heat exchange member.
本实用新型的一实施例中,更包含一风扇,其设置于该容置槽的一内侧。In one embodiment of the present invention, a fan is further included, which is disposed on an inner side of the accommodating groove.
本实用新型的一实施例中,其中该风扇以一端口电性连接一市电。In one embodiment of the present invention, the fan is electrically connected to a mains power through a port.
本实用新型的一实施例中,更包含一第一固定件,该第一固定件穿设该热交换件的一侧以及该风扇的一侧。In one embodiment of the present invention, a first fixing member is further included, and the first fixing member passes through one side of the heat exchange member and one side of the fan.
本实用新型的一实施例中,更包含一第二导热件,其设置于该基板的一下方。In an embodiment of the present invention, a second thermal conductive member is further included, which is disposed below the substrate.
本实用新型的一实施例中,更包含一固定架,其设置于该第二导热件的一下方。In an embodiment of the present invention, a fixing bracket is further included, which is disposed below the second heat conductive member.
本实用新型的一实施例中,其中该固定架向上延伸一限位部,该限位部与该固定架包覆该存储组件、该第二导热件以及该第一导热件。In one embodiment of the present invention, a limiting portion extends upward from the fixed frame, and the limiting portion and the fixed frame cover the storage component, the second thermal conductive member and the first thermal conductive member.
本实用新型的一实施例中,更包含一第二固定件,该第二固定件穿设该限位部的一侧以及该热交换件的该侧。In one embodiment of the present invention, a second fixing member is further included, and the second fixing member passes through one side of the limiting portion and the side of the heat exchange member.
本实用新型的一实施例中,其中该存储组件为一固态硬盘(PCIe M.2SSD)。In one embodiment of the present invention, the storage component is a solid state drive (PCIe M.2SSD).
附图说明Description of the drawings
图1:其为本实用新型的一实施例的结构示意图;Figure 1: It is a schematic structural diagram of an embodiment of the present utility model;
图2:其为本实用新型的一实施例的结构前视示意图;Figure 2: It is a schematic structural front view of an embodiment of the present utility model;
图3:其为本实用新型的一实施例的风扇结构示意图;Figure 3: This is a schematic structural diagram of a fan according to an embodiment of the present utility model;
图4:其为本实用新型的一实施例的固定架结构示意图;以及Figure 4: This is a schematic structural diagram of a fixing frame according to an embodiment of the present utility model; and
图5:其为本实用新型的一实施例的固定件结构示意图。Figure 5: This is a schematic structural diagram of a fixing member according to an embodiment of the present invention.
【图号对照说明】[Picture number comparison instructions]
1 散热的结构1 Heat dissipation structure
2 存储组件2 storage components
3 基板3 substrate
4 存储元件4 storage elements
10 第一导热件10 The first thermal conductor
20 热交换件20 heat exchange parts
202 容置槽202 storage tank
22 第一鳍片部22 First fin part
24 第二鳍片部24 Second fin part
30 风扇30 fans
32 端口Port 32
40 第二导热件40 Second thermal conductor
50 固定架50 fixed bracket
52 限位部52 Limiting part
F1 第一固定件F1 first fixing piece
F2 第二固定件F2 second fixing piece
具体实施方式Detailed ways
为了使本实用新型的结构特征及所达成的功效有更进一步的了解与认识,特用较佳的实施例及配合详细的说明,说明如下:In order to have a further understanding of the structural features and effects of the present utility model, preferred embodiments and detailed descriptions are provided as follows:
有鉴于上述习知技术的问题,本实用新型为一种散热的结构,其设置于一存储组件的一上方,该散热的结构包含一第一导热件以及一热交换件,该第一导热件设置于该些个存储元件的一上方,该热交换件设置于该第一导热件的该上方,该热交换件的一侧设置一容置槽以及一第一鳍片部,该第一鳍片部环形设置于该容置槽的一外缘,以此结构解决习知技术存储元件散热困难的问题。In view of the above-mentioned problems of the conventional technology, the present invention is a heat dissipation structure, which is arranged above a storage component. The heat dissipation structure includes a first heat conduction member and a heat exchange member. The first heat conduction member The heat exchanger is disposed above the storage elements. The heat exchanger is disposed above the first thermal conductor. A receiving groove and a first fin portion are provided on one side of the heat exchanger. The first fin The piece is annularly arranged on an outer edge of the accommodating groove. This structure solves the problem of difficulty in heat dissipation of storage elements in the conventional technology.
请参阅图1,其为本实用新型的一实施例的结构示意图,如图所示,于本实施例中,其为一种散热的结构1,该散热的结构1设置于一存储组件2的一上方,该存储组件2包含一基板3以及多个存储元件4,该些个存储元件4设置于该基板3的一上方,该散热的结构1包含一第一导热件10以及一热交换件20。Please refer to Figure 1, which is a schematic structural diagram of an embodiment of the present invention. As shown in the figure, in this embodiment, it is a heat dissipation structure 1. The heat dissipation structure 1 is disposed on a storage component 2. On one side, the storage component 2 includes a substrate 3 and a plurality of storage elements 4. The storage elements 4 are disposed above the substrate 3. The heat dissipation structure 1 includes a first thermal conductive member 10 and a heat exchange member. 20.
再次参阅图1以及参阅图2,图2为本实用新型的一实施例的结构前视示意图,于本实施例中,该第一导热件10设置于该些个存储元件4的一上方,以传导该些个存储元件4的热能,该热交换件20设置于该第一导热件10的该上方,该热交换件20的一侧设置一容置槽202以及一第一鳍片部22,且该第一鳍片部22环形设置于该容置槽202的一外缘。Referring again to FIG. 1 and FIG. 2 , FIG. 2 is a schematic structural front view of an embodiment of the present utility model. In this embodiment, the first thermal conductive member 10 is disposed above the storage elements 4 to To conduct the thermal energy of the storage elements 4, the heat exchange member 20 is disposed above the first heat conduction member 10, and a receiving groove 202 and a first fin portion 22 are provided on one side of the heat exchange member 20. And the first fin portion 22 is annularly disposed on an outer edge of the accommodating groove 202 .
接续上述,于本实施例中,该热交换件20的该侧切设多个切槽,使该热交换件20的该侧形成该第一鳍片部22,并于该第一鳍片部22再向内切设该容置槽202。Continuing from the above, in this embodiment, a plurality of slots are cut on the side of the heat exchange member 20 so that the first fin portion 22 is formed on the side of the heat exchange member 20 and the first fin portion 22 is The receiving groove 202 is then cut inward.
接续上述,于本实施例中,该导热管22向上延伸成该凸出部222,该热交换件20的该第一鳍片部22与流体(如空气)接触,并进行热交换。Continuing from the above, in this embodiment, the heat pipe 22 extends upward to form the protruding portion 222 , and the first fin portion 22 of the heat exchange member 20 contacts the fluid (such as air) and performs heat exchange.
于一实施例中,该热交换件20的该第一鳍片部22为多个薄片,但本实施例不在此限制。In one embodiment, the first fin portion 22 of the heat exchange member 20 is a plurality of sheets, but this embodiment is not limited thereto.
于一实施例中,该热交换件20可对应切设凹槽,以增加表面积,提升散热效率,但本实施例不在此限制。In one embodiment, the heat exchange member 20 can be provided with corresponding grooves to increase the surface area and improve the heat dissipation efficiency, but this embodiment is not limited to this.
于一实施例中,该存储组件2为一固态硬盘(Solid-state drive,SSD),例如固态硬盘(PCIe M.2SSD),该基板3为固态硬盘的电路板,该些个存储元件4为固态硬盘的内存,但本实施例不在此限制。In one embodiment, the storage component 2 is a solid-state drive (SSD), such as a solid-state drive (PCIe M.2SSD), the substrate 3 is a circuit board of the solid-state drive, and the storage elements 4 are The memory of the solid state drive, but this embodiment is not limited to this.
于一实施例中,该第一导热件10为导热硅胶或导热膏,但本实施例不在此限制。In one embodiment, the first thermally conductive member 10 is thermally conductive silica gel or thermally conductive paste, but this embodiment is not limited thereto.
请参阅图3,其为本实用新型的一实施例的风扇结构示意图,如图所示,本实施例基于上述实施例的结构,于本实施例中,更包含一风扇30,该风扇30设置于该容置槽202的一内侧,即该风扇30嵌设于该第一鳍片部22与该容置槽202内,且该风扇30固定于该第一鳍片部22。Please refer to Figure 3, which is a schematic structural diagram of a fan according to an embodiment of the present invention. As shown in the figure, this embodiment is based on the structure of the above embodiment. In this embodiment, it further includes a fan 30. The fan 30 is On an inner side of the accommodating groove 202 , the fan 30 is embedded in the first fin part 22 and the accommodating groove 202 , and the fan 30 is fixed to the first fin part 22 .
接续上述,于本实施例中,该风扇30运转时,该风扇30使周围的流体(如空气)于该第一鳍片部22流动,以提升该热交换件20的散热效率。Continuing from the above, in this embodiment, when the fan 30 is running, the fan 30 causes the surrounding fluid (such as air) to flow in the first fin portion 22 to improve the heat dissipation efficiency of the heat exchange member 20 .
接续上述,于一实施例中,该风扇30以一端口32电性连接一市电(图未示),该市电可由主板提供,该端口32电性连接主板,但本实施例不在此限制。Continuing from the above, in one embodiment, the fan 30 is electrically connected to a mains power supply (not shown) through a port 32. The mains power supply can be provided by the motherboard. The port 32 is electrically connected to the mainboard, but this embodiment is not limited thereto. .
接续上述,于一实施例中,该端口32为端口(port),又称为通讯埠、通讯端口、连接埠、协议埠(protocol port),其于计算机网络中是一种经由软件建立的服务,在一个计算机操作系统中扮演通讯的端点(endpoint),每个通讯端口都会与主机的IP地址及通讯协议关联,其中包含电源传输。Continuing from the above, in one embodiment, the port 32 is a port, also known as a communication port, a communication port, a connection port, and a protocol port, which is a service established through software in a computer network. , plays the role of communication endpoint in a computer operating system. Each communication port is associated with the host's IP address and communication protocol, including power transmission.
再次参阅图1至图3,如图所示,于本实施例中,该热交换件20的另一侧设置一第二鳍片部24,该第二鳍片部24可对应增加该热交换件20的表面积,以提升该热交换件20的散热效率。Referring again to FIGS. 1 to 3 , as shown in the figures, in this embodiment, a second fin portion 24 is provided on the other side of the heat exchange member 20 . The second fin portion 24 can correspondingly increase the heat exchange rate. The surface area of the heat exchange member 20 is increased to improve the heat dissipation efficiency of the heat exchange member 20 .
于一实施例中,该热交换件20的该第一鳍片部22为多个薄片,但本实施例不在此限制。In one embodiment, the first fin portion 22 of the heat exchange member 20 is a plurality of sheets, but this embodiment is not limited thereto.
请参阅图4,其为本实用新型的一实施例的固定架结构示意图,如图所示,本实施例基于上述第一实施例,于本实施例中,更包含一第二导热件40以及一固定架50,该第二导热件40设置于该基板3的一下方,以传导该基板3的热能,该固定架50设置于该第二导热件40的一下方。Please refer to Figure 4, which is a schematic structural diagram of a fixed frame according to an embodiment of the present invention. As shown in the figure, this embodiment is based on the above-mentioned first embodiment. In this embodiment, it further includes a second heat conductive member 40 and A fixing bracket 50 is provided below the second heat conducting member 40 to conduct heat energy of the substrate 3 . The fixing bracket 50 is arranged below the second heat conducting member 40 .
接续上述,于本实施例中,该固定架50向上延伸一限位部52,该限位部52与该固定架50包覆该存储组件2、该第二导热件40以及该第一导热件10,该限位部52防止该存储组件2、该第二导热件40以及该第一导热件10任意移动。Continuing from the above, in this embodiment, the fixing bracket 50 extends upward with a limiting portion 52 , and the limiting portion 52 and the fixing bracket 50 cover the storage component 2 , the second thermal conductive member 40 and the first thermal conductive member 10. The limiting portion 52 prevents the storage component 2, the second heat conducting member 40 and the first heat conducting member 10 from moving arbitrarily.
接续上述,于本实施例中,也可对应设置该风扇30,其结构于上述设置该风扇30的实施例相同,固不再赘述。Continuing from the above, in this embodiment, the fan 30 can also be provided correspondingly. Its structure is the same as the above-mentioned embodiment in which the fan 30 is provided, and will not be described again.
于一实施例中,该固定架50可对应设置于主板,以固定该存储组件2、该第二导热件40、该第一导热件10以及该热交换件20,避免该存储组件2、该第二导热件40、该第一导热件10以及该热交换件20任意移动而损坏。In one embodiment, the fixing bracket 50 can be disposed correspondingly to the motherboard to fix the storage component 2, the second thermal conductive member 40, the first thermal conductive member 10 and the heat exchange member 20 to prevent the storage component 2, the The second heat conducting member 40 , the first heat conducting member 10 and the heat exchange member 20 are damaged due to any movement.
于一实施例中,该第二导热件40为导热硅胶或导热膏,但本实施例不在此限制。In one embodiment, the second thermally conductive member 40 is thermally conductive silicone or thermally conductive paste, but this embodiment is not limited thereto.
请参阅图5,其为本实用新型的一实施例的固定件结构示意图,如图所示,于本实施例中,更包含一第一固定件F1,该第一固定件F1穿设于该热交换件20的该第一鳍片部22的一侧以及该风扇30的一侧,使该风扇30固定于该热交换件20的该容置槽202,避免该风扇30掉落。Please refer to Figure 5, which is a schematic structural diagram of a fastener according to an embodiment of the present invention. As shown in the figure, in this embodiment, a first fastener F1 is further included, and the first fastener F1 is inserted through the One side of the first fin portion 22 of the heat exchange member 20 and one side of the fan 30 fix the fan 30 to the accommodating groove 202 of the heat exchange member 20 to prevent the fan 30 from falling.
接续上述,于本实施例中,更包含一第二固定件F2,该第二固定件F2穿设该固定架50的该限位部52的一侧以及该热交换件20的一侧,使该固定架50与该热交换件20互相固定,避免该固定架50任意移动,以及避免该热交换件20掉落。Continuing from the above, in this embodiment, a second fixing member F2 is further included. The second fixing member F2 passes through one side of the limiting portion 52 of the fixing frame 50 and one side of the heat exchange member 20, so that The fixing frame 50 and the heat exchange member 20 are fixed to each other to prevent the fixing frame 50 from moving arbitrarily and the heat exchange member 20 from falling.
综上所述,本实用新型提供一种散热的结构,其利用导热件以及热交换件对应设置于存储组件的上方,以导热件、热交换件以及热交换件包含的散热鳍片对应传导存储组件所发出的热能,使存储组件的散热效率提升,解决习知存储元件散热困难的问题,且本实用新型以结构紧凑的热交换件进一步缩小体积,解决习知存储元件需缩小散热设备的问题。To sum up, the present utility model provides a heat dissipation structure, which utilizes heat conductors and heat exchange members to be disposed above the storage assembly, and the heat conductors, heat exchange members, and heat dissipation fins included in the heat exchange members conduct the storage accordingly. The heat energy emitted by the components improves the heat dissipation efficiency of the storage components and solves the problem of difficulty in heat dissipation of conventional storage components. Furthermore, the utility model further reduces the size of the conventional storage components by using compact heat exchange components to solve the problem of requiring smaller heat dissipation equipment for conventional storage components. .
上文仅为本实用新型的较佳实施例而已,并非用来限定本实用新型实施的范围,凡依本实用新型权利要求范围所述的形状、构造、特征及精神所为的均等变化与修饰,均应包括于本实用新型的权利要求范围内。The above are only preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Equal changes and modifications can be made in accordance with the shape, structure, features and spirit described in the claims of the present utility model. , should be included in the scope of the claims of the present utility model.
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