CN220041068U

CN220041068U - Heat dissipation structure

Info

Publication number: CN220041068U
Application number: CN202321228404.7U
Authority: CN
Inventors: 马迅嘉; 庄子贤; 张锦峰
Original assignee: Team Group Co ltd
Current assignee: Team Group Co ltd
Priority date: 2023-05-19
Filing date: 2023-05-19
Publication date: 2023-11-17
Anticipated expiration: 2033-05-19

Abstract

The utility model provides a heat dissipation structure which is arranged above a storage component, wherein the heat dissipation structure comprises a first heat conduction piece and a heat exchange piece, the first heat conduction piece is arranged above one of the storage components, the heat exchange piece is arranged above the first heat conduction piece, one side of the heat exchange piece is provided with a containing groove and a first fin part, and the first fin part is annularly arranged at the outer edge of the containing groove; the structure is utilized for heat dissipation of the storage component.

Description

Heat dissipation structure

Technical Field

The present utility model relates to a heat dissipating structure, and more particularly to a heat dissipating structure including heat pipes and fins.

Background

With the development of technology, computer hardware has been developed in the high-speed and high-frequency direction, so as to improve the operation efficiency of the computer, and the computer hardware operates in a high-speed and high-frequency environment for a long time and relatively generates high temperature. In order to match with the high-speed operation of the processor, the working temperature of the electronic element is higher and higher, and the continuously rising temperature can affect the performance of the electronic element, and even lead to the memory damage.

Because of the popularity of electronic bidding and the trend of modifying a plurality of computers, many users or manufacturers of electronic bidding computers change the housing of the electronic bidding computer into a perspective housing, and the modified popularity of electronic bidding is also gradually increased, and internal components of the electronic bidding computer are as follows: the CPU, display adapter and memory are better than those of a common personal computer, so that relatively more heat energy is generated.

Conventional heat-generating electronic components, such as: the CPU, the display adapter and the memory are arranged on the circuit board and are inserted into the computer system through the connection interface. Due to the requirement of the electronic contest product, the working frequency of the related electronic element gradually develops to high frequency, so that the electronic element has higher data transmission rate and higher electric quantity consumption, and the electronic element is easier to accumulate heat; when the working temperature of the electronic components is higher and exceeds the allowable temperature value, the efficiency of the electronic components is obviously reduced, and meanwhile, the error rate of the module for maintaining data or operation is increased, so that the computer system is unstable, and the efficiency of the electronic components is reduced due to excessive heat energy, so that people can install a radiator on the electronic components; in the electronic bidding industry, the heat dissipation device installed on the electronic device not only needs excellent heat dissipation efficiency, but also has a design similar to that of electronic bidding devices.

With the evolution of the era, the heat dissipation device is required to be further reduced in size under the condition that the size of the casing (the casing for accommodating the heat dissipation element) is reduced, so that the device can still perform high-speed data processing and operation without stopping for a long time in the most limited space, but the self-assembled computer, server and other air is gradually popular, and the heat dissipation device is a challenge in industry if the heat dissipation device is reduced and the heat dissipation and heat conduction element can be automatically replaced.

In view of the above-mentioned problems of the prior art, the present utility model provides a heat dissipation structure, which uses a heat conducting member and a heat exchanging member to be disposed above a storage assembly, wherein the heat conducting member and the heat exchanging member are used to conduct heat energy emitted by the storage assembly, and the heat exchanging member is used to dissipate heat correspondingly by fins, so as to improve the heat dissipation efficiency of the storage assembly.

Disclosure of Invention

The utility model provides a heat dissipation structure, which is characterized in that a heat conduction piece and a heat exchange piece are correspondingly arranged above a storage component, the heat conduction piece conducts heat energy emitted by the storage component, the heat exchange piece correspondingly conducts heat energy emitted by the storage component, and fins correspondingly dissipate heat, so that the heat dissipation structure has the heat dissipation effect of the storage component.

In order to achieve the above-mentioned objects and effects, the present utility model provides a heat dissipation structure, which is disposed above a storage component, wherein the storage component comprises a substrate and a plurality of storage elements, the storage elements are disposed above the substrate, the heat dissipation structure comprises a first heat-conducting member and a heat-exchanging member, the first heat-conducting member is disposed above the storage elements, the heat-exchanging member is disposed above the first heat-conducting member, a receiving groove and a first fin portion are disposed at one side of the heat-exchanging member, and the first fin portion is annularly disposed at an outer edge of the receiving groove; the structure is used for cooling the storage component, and the cooling efficiency of the storage component is improved.

In an embodiment of the utility model, a second fin portion is disposed at the other side of the heat exchange member.

In an embodiment of the utility model, the fan is further disposed at an inner side of the accommodating groove.

In an embodiment of the utility model, the fan is electrically connected to a commercial power through a port.

In an embodiment of the utility model, the fan further includes a first fixing member, and the first fixing member penetrates through one side of the heat exchange member and one side of the fan.

In an embodiment of the utility model, the second heat conducting member is disposed below the substrate.

In an embodiment of the utility model, the heat conducting device further includes a fixing frame disposed below the second heat conducting member.

In an embodiment of the utility model, the fixing frame extends upwards to form a limiting portion, and the limiting portion and the fixing frame cover the storage component, the second heat conducting piece and the first heat conducting piece.

In an embodiment of the utility model, the heat exchanger further includes a second fixing member, and the second fixing member penetrates through one side of the limiting portion and the side of the heat exchange member.

In an embodiment of the utility model, the storage device is a solid state disk (PCIe m.2ssd).

Drawings

Fig. 1: which is a schematic structural diagram of an embodiment of the present utility model;

fig. 2: a schematic structural front view of an embodiment of the present utility model;

fig. 3: a fan structure according to an embodiment of the utility model is shown;

fig. 4: the fixing frame is a schematic structural diagram of a fixing frame according to an embodiment of the utility model; and

fig. 5: which is a schematic structural view of a fixing member according to an embodiment of the present utility model.

[ figure number control description ]

1. Heat dissipation structure

2. Storage assembly

3. Substrate board

4. Memory element

10. First heat conduction piece

20. Heat exchange element

202. Accommodating groove

22. First fin portion

24. Second fin portion

30. Fan with fan body

32. Port (port)

40. Second heat conduction piece

50. Fixing frame

52. Limiting part

F1 First fixing piece

F2 Second fixing piece

Detailed Description

For a further understanding and appreciation of the structural features and advantages achieved by the present utility model, the following description is provided with reference to the preferred embodiments and in connection with the accompanying detailed description:

in view of the above-mentioned problems of the prior art, the present utility model is a heat dissipation structure disposed above a storage component, the heat dissipation structure comprises a first heat conducting member and a heat exchanging member, the first heat conducting member is disposed above the storage components, the heat exchanging member is disposed above the first heat conducting member, a receiving groove and a first fin portion are disposed at one side of the heat exchanging member, and the first fin portion is annularly disposed at an outer edge of the receiving groove, so as to solve the problem of difficulty in heat dissipation of the storage components of the prior art.

Please refer to fig. 1, which is a schematic diagram of an embodiment of the present utility model, in the present embodiment, a heat dissipating structure 1 is shown, the heat dissipating structure 1 is disposed above a storage component 2, the storage component 2 includes a substrate 3 and a plurality of storage elements 4, the storage elements 4 are disposed above the substrate 3, and the heat dissipating structure 1 includes a first heat conducting member 10 and a heat exchanging member 20.

Referring to fig. 1 and fig. 2 again, fig. 2 is a schematic front view of a structure of an embodiment of the utility model, in this embodiment, the first heat conducting member 10 is disposed above one of the storage elements 4 to conduct heat energy of the storage elements 4, the heat exchanging member 20 is disposed above the first heat conducting member 10, a receiving groove 202 and a first fin portion 22 are disposed on one side of the heat exchanging member 20, and the first fin portion 22 is disposed on an outer edge of the receiving groove 202 in a ring shape.

In this embodiment, the side of the heat exchanging member 20 is cut with a plurality of slots, so that the side of the heat exchanging member 20 forms the first fin portion 22, and the accommodating groove 202 is further cut inward in the first fin portion 22.

Continuing to the above, in the present embodiment, the heat conducting tube 22 extends upward to form the protruding portion 222, and the first fin portion 22 of the heat exchanging element 20 contacts with the fluid (e.g. air) and exchanges heat.

In one embodiment, the first fin portion 22 of the heat exchanging element 20 is a plurality of sheets, but the present embodiment is not limited thereto.

In an embodiment, the heat exchange member 20 may be cut with grooves to increase the surface area and improve the heat dissipation efficiency, but the embodiment is not limited thereto.

In an embodiment, the storage device 2 is a Solid-state drive (SSD), such as a PCIe m.2ssd, the substrate 3 is a circuit board of the SSD, and the storage elements 4 are memories of the SSD, but the embodiment is not limited thereto.

In an embodiment, the first heat conductive member 10 is a heat conductive silica gel or a heat conductive paste, but the embodiment is not limited thereto.

Please refer to fig. 3, which is a schematic diagram of a fan structure according to an embodiment of the present utility model, wherein the fan structure according to the embodiment further includes a fan 30, the fan 30 is disposed inside the accommodating groove 202, i.e. the fan 30 is embedded in the first fin portion 22 and the accommodating groove 202, and the fan 30 is fixed on the first fin portion 22.

In this embodiment, when the fan 30 is operated, the fan 30 makes the surrounding fluid (such as air) flow in the first fin portion 22, so as to improve the heat dissipation efficiency of the heat exchange member 20.

In one embodiment, the fan 30 is electrically connected to a utility power (not shown) through a port 32, the utility power can be provided by the motherboard, and the port 32 is electrically connected to the motherboard, but the embodiment is not limited thereto.

In one embodiment, the ports 32 are ports (ports), also called communication ports, connection ports, protocol ports, which are a service established by software in a computer network, and act as endpoints of communication in a computer operating system, each of which is associated with an IP address and a communication protocol of a host, including power transmission.

Referring to fig. 1 to 3 again, as shown in the drawings, in the present embodiment, a second fin portion 24 is disposed on the other side of the heat exchange member 20, and the second fin portion 24 can correspondingly increase the surface area of the heat exchange member 20 to improve the heat dissipation efficiency of the heat exchange member 20.

Referring to fig. 4, a schematic structural diagram of a fixing frame according to an embodiment of the present utility model is shown, and the present embodiment is based on the first embodiment, and further includes a second heat conducting member 40 and a fixing frame 50, wherein the second heat conducting member 40 is disposed below the substrate 3 to conduct heat energy of the substrate 3, and the fixing frame 50 is disposed below the second heat conducting member 40.

In this embodiment, the fixing frame 50 extends upward to form a limiting portion 52, and the limiting portion 52 and the fixing frame 50 cover the storage assembly 2, the second heat conductive member 40 and the first heat conductive member 10, and the limiting portion 52 prevents the storage assembly 2, the second heat conductive member 40 and the first heat conductive member 10 from moving arbitrarily.

In this embodiment, the fan 30 may be correspondingly disposed, and the structure thereof is the same as that of the embodiment in which the fan 30 is disposed, which is not described herein.

In an embodiment, the fixing frame 50 may be correspondingly disposed on the motherboard to fix the storage component 2, the second heat-conducting member 40, the first heat-conducting member 10 and the heat-exchanging member 20, so as to avoid damage caused by any movement of the storage component 2, the second heat-conducting member 40, the first heat-conducting member 10 and the heat-exchanging member 20.

In an embodiment, the second heat conductive member 40 is a heat conductive silica gel or a heat conductive paste, but the embodiment is not limited thereto.

Please refer to fig. 5, which is a schematic diagram of a fixing member according to an embodiment of the present utility model, in the present embodiment, a first fixing member F1 is further included, and the first fixing member F1 is disposed through one side of the first fin portion 22 of the heat exchange member 20 and one side of the fan 30, so that the fan 30 is fixed to the accommodating groove 202 of the heat exchange member 20, and the fan 30 is prevented from falling off.

In this embodiment, the second fixing member F2 is further included, and the second fixing member F2 is inserted through one side of the limiting portion 52 of the fixing frame 50 and one side of the heat exchange member 20, so that the fixing frame 50 and the heat exchange member 20 are mutually fixed, preventing the fixing frame 50 from moving randomly and preventing the heat exchange member 20 from falling off.

In summary, the present utility model provides a heat dissipation structure, which uses a heat conducting member and a heat exchanging member disposed above a storage component, so that heat energy emitted by the storage component is correspondingly conducted by the heat conducting member, the heat exchanging member and heat dissipation fins included in the heat exchanging member, thereby improving heat dissipation efficiency of the storage component, solving the problem of difficult heat dissipation of the conventional storage component.

The foregoing description of the preferred embodiments of the present utility model is not intended to limit the scope of the utility model, but rather to cover all equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the present utility model as defined in the appended claims.

Claims

1. A heat dissipation structure, characterized in that it is arranged above a storage component. The storage component includes a substrate and a plurality of storage elements. The storage elements are arranged above the substrate. The heat dissipation The structure contains:

a first thermal conductive member disposed above the storage elements; and

A heat exchange member is arranged above the first heat conductive member. A receiving groove and a first fin portion are provided on one side of the heat exchange member. The first fin portion is annularly provided in the receiving groove. an outer edge of.

2. The heat dissipation structure of claim 1, wherein a second fin portion is provided on the other side of the heat exchange member.

3. The heat dissipation structure of claim 1, further comprising a fan disposed on an inner side of the accommodating groove.

4. The heat dissipation structure of claim 3, wherein the fan is electrically connected to a commercial power supply through a port.

5. The heat dissipation structure of claim 4, further comprising a first fixing component that passes through one side of the heat exchanger and one side of the fan.

6. The heat dissipation structure of claim 1, further comprising a second heat conductive member disposed below the substrate.

7. The heat dissipation structure as claimed in claim 6, further comprising a fixing bracket disposed below the second heat conducting member.

8. The heat dissipation structure according to claim 7, wherein the fixing frame extends upward with a limiting portion, and the limiting portion and the fixing frame cover the storage component, the second heat conductive member and the third heat-conducting member. A thermal conductor.

9. The heat dissipation structure as claimed in claim 8, further comprising a second fixing member, the second fixing member passing through one side of the limiting portion and the side of the heat exchange member.

10. The heat dissipation structure of claim 1, wherein the storage component is a solid state drive.