CN216210879U - Radiator capable of being used as computer case - Google Patents
Radiator capable of being used as computer case Download PDFInfo
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- CN216210879U CN216210879U CN202122335801.1U CN202122335801U CN216210879U CN 216210879 U CN216210879 U CN 216210879U CN 202122335801 U CN202122335801 U CN 202122335801U CN 216210879 U CN216210879 U CN 216210879U
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Abstract
The utility model discloses a radiator capable of being used as a computer case, which relates to the technical field of radiators and comprises at least one radiating case wall and a plurality of enclosure case walls, wherein a fin group is formed on the outer side of the radiating case wall, and the radiating case wall and the enclosure case walls are mutually fixed and enclosed to form a hexahedron; the mainboard of the computer is arranged in a hexahedron formed by enclosing the heat dissipation box walls and the enclosure box walls, and the heating components on the mainboard of the computer can conduct heat with at least one surface of the heat dissipation box wall. The utility model mainly solves the problem of how to provide a radiator to make a computer obtain better heat dissipation performance while being miniaturized; the radiator capable of being used as the computer case not only has the function of a radiator, but also can be used as the computer case, so that the computer can obtain better heat radiation performance while being miniaturized.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a radiator capable of being used as a computer case.
Background
With the development of industrial automation technology, the motion steps and precision of automation equipment and the motion control of a single motion step are greatly improved, the requirements of the automation equipment are difficult to meet by a traditional Programmable Logic Controller (PLC) or an industrial control mainboard carrying a Microcontroller (MCU), and industrial personal computers are increasingly carried on the automation equipment.
At present, home and office environments tend to be reduced, and personal computers such as home computers and office computers also tend to be miniaturized.
The industrial personal computer and the personal computer are still required to be ensured to have higher computing performance while being miniaturized, so that Central Processing Units (CPUs) of the industrial personal computer and the personal computer still generate a large amount of heat; meanwhile, the miniaturized cabinet cannot accommodate a heat pipe type radiator or a water cooling radiator with a large volume.
In summary, it is an urgent need to provide a heat sink that can achieve better heat dissipation performance while miniaturizing a computer.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a radiator capable of being used as a computer case, which enables a computer to be miniaturized and still obtain better radiating performance.
In order to achieve the purpose, the utility model provides the following technical scheme: a radiator capable of being used as a computer case comprises at least one radiating case wall and a plurality of enclosure case walls, wherein a fin group is formed on the outer side of the radiating case wall, and the radiating case wall and the enclosure case walls are mutually fixed and enclosed to form a hexahedron; the mainboard of the computer is accommodated in the hexahedron formed by the enclosing of the heat dissipation box walls and the enclosure box walls, and the heating components on the mainboard of the computer can conduct heat with at least one surface of the heat dissipation box walls.
In the technical scheme, the heat dissipation box wall is provided with at least two surfaces, the two surfaces of the heat dissipation box wall are mutually and vertically fixed, and the contact surface between the two surfaces of the heat dissipation box wall can conduct heat.
In the above technical solution, the heat sink capable of being used as a computer case further comprises a heat pipe; the inner sides of the two mutually vertical heat dissipation box walls are respectively provided with a heat pipe caulking groove, and the heat pipe caulking grooves on the two heat dissipation box walls are mutually communicated; the heat pipes are respectively embedded into the heat pipe embedding grooves of the two sides of the heat dissipation box wall, so that the two sides of the heat dissipation box wall can conduct heat through the heat pipes.
In the above technical solution, the heat pipe caulking groove includes a linear portion extending along a long side direction of the heat dissipation tank wall and a bent portion extending along a short side direction of the heat dissipation tank wall, and the linear portion and the bent portion are communicated with each other; the bent parts of the heat pipe caulking grooves on the two sides of the heat dissipation box wall are mutually communicated.
In the above technical solution, the opening of the heat pipe caulking groove is narrowed to form a barb to hook the heat pipe tightly.
In the technical scheme, the radiator capable of being used as the computer case further comprises a heat conducting seat, wherein the heat conducting seat is fixed on the wall of the heat radiating case and can conduct heat with the wall of the heat radiating case; the mainboard of the computer is fixed on the wall of the heat dissipation box, and the heating component on the mainboard of the computer is in contact with the heat conduction seat and can conduct heat with the heat conduction seat.
In the above technical scheme, the enclosure wall is provided with an interface through hole for the interface on the mainboard of the computer to penetrate out.
Compared with the prior art, the utility model has the beneficial effects that: the heat radiator can be used as a computer case, the heat radiating case wall and the enclosure case wall are mutually fixed and enclosed to form a hexahedron which can be used as a case; the outer side of the heat dissipation box wall forms a fin group, and a heating component on the mainboard of the computer can conduct heat with at least one heat dissipation box wall; when the radiator can be used as a radiator of a computer case, heat generated by heating components on a mainboard of a computer can be quickly conducted to the radiating case wall and is radiated to the air by the fin group of the radiating case wall, and the radiating effect is good; the radiator capable of being used as the computer case not only has the function of a radiator, but also can be used as the computer case, so that the computer can obtain better heat radiation performance while being miniaturized.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a perspective view of the present invention in another direction.
Fig. 3 is an exploded view of the present invention.
FIG. 4 is a schematic view of the assembly relationship between the heat pipe and the heat conducting base and the wall of the heat dissipating box.
FIG. 5 is a cross-sectional view of the heat sink wall of the present invention taken along the radial direction of the heat pipe caulking groove.
Fig. 6 is a partially enlarged view of a in fig. 5.
The reference signs are: 1. the wall of the heat dissipation box; 11. a set of fins; 12. a heat pipe caulking groove; 121. a straight portion; 122. a bending section; 123. a barb; 2. the wall of the enclosure box; 21. an interface through hole; 3. a heat pipe; 4. a heat conducting seat.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A heat radiator capable of being used as a computer case is used for accommodating a mainboard of a computer and radiating heat of heating components on the mainboard.
The computer is in the form of an industrial personal computer or a personal computer, a Central Processing Unit (CPU) and a memory are loaded on a mainboard, and a hard disk of the computer is connected with the mainboard through a lead with a connector.
Referring to fig. 1-4, the heat sink capable of being used as a computer case includes at least one heat sink wall 1 and a plurality of enclosure walls 2, wherein the outer side of the heat sink wall 1 forms a fin set 11, and the heat sink wall 1 and the enclosure walls 2 are fixed to each other and enclosed to form a hexahedron. Specifically, the heat dissipation box wall 1 is made of aluminum alloy, a flat-plate-shaped body of the heat dissipation box wall 1 is formed in an aluminum extrusion molding or machining mode, a fin group 11 which is vertically arranged is formed on the outer side of the heat dissipation box wall 1, the fin group 11 comprises a plurality of fins, and a gap is formed between every two adjacent fins; the enclosure wall 2 is made of aluminum alloy or stainless steel, the body of the enclosure wall 2 is flat, and further, the enclosure wall 2 is provided with an interface through hole 21 for allowing an interface on a mainboard of the computer to penetrate out, wherein the interface through hole 21 is provided with different shapes and corresponding numbers according to the type and number of the interfaces on the mainboard of the computer; after the heat dissipation box wall 1 is locally heated, heat is quickly and uniformly conducted to the body of the whole heat dissipation box wall 1 and the fin group 11, and the heat dissipation box can be used as a radiator; the heat dissipation box wall 1 and the enclosure box wall 2 are six in total, and the six heat dissipation box walls 1 and the enclosure box wall 2 are mutually fixed through screws, so that a hexahedron is enclosed and can be used as a case.
The mainboard of the computer is accommodated in the hexahedron surrounded by the heat dissipation box wall 1 and the enclosure box wall 2, and the heating component on the mainboard of the computer can generate heat conduction with at least one surface of the heat dissipation box wall 1; specifically, the heat radiator capable of being used as the computer case further comprises a heat conducting seat 4, wherein the heat conducting seat 4 is a solid aluminum alloy or copper plate, the heat conducting seat 4 is fixed on the wall 1 of the heat radiating case and can conduct heat with the wall 1 of the heat radiating case, in the embodiment, the heat conducting seat 4 is fixed on the wall 1 of the heat radiating case through a screw, one surface of the heat conducting seat 4 is tightly attached to the inner side of the wall 1 of the heat radiating case, and heat conducting silicone grease is coated between the heat conducting seat 4 and the wall 1 of the heat radiating case, so that the heat conducting seat 4 can conduct heat with the wall 1 of the heat radiating case; in the embodiment, a plurality of fixing columns with axial threaded holes are formed on the heat dissipation box wall 1 on one surface provided with the heat conduction seat 4, and screws penetrate through the mainboard and are locked into the threaded holes of the fixing columns, so that the mainboard is fixed on the heat dissipation box wall 1; the heating component on the mainboard of the computer contacts with the heat conducting seat 4 and can generate heat conduction with the heat conducting seat 4, particularly, for miniaturized industrial personal computers and personal computers, the heating component on the mainboard of the computer is usually a central processing unit, the central processing unit on the mainboard of the computer is aligned with the heat conducting seat 4, after the assembly in the above way, the central processing unit contacts with the heat conducting seat 4, and heat conducting silicone grease is coated between the central processing unit and the heat conducting seat 4, so that the central processing unit can generate heat conduction with the heat conducting seat 4.
Furthermore, the heat dissipation box walls 1 are provided with at least two surfaces, the two heat dissipation box walls 1 are mutually and vertically fixed, and the contact surfaces between the two heat dissipation box walls 1 can generate heat conduction; specifically, the fin group 11 of one side of the heat dissipation box wall 1 extends to the long edge of the side of the heat dissipation box wall 1 along the short edge of the side of the heat dissipation box wall 1, the side of the heat dissipation box wall 1 is erected at the inner side of the other side of the heat dissipation box wall 1, the fin group 11 of the side of the heat dissipation box wall 1 is in contact with the inner side of the other side of the heat dissipation box wall 1, the two sides of the heat dissipation box walls 1 are fixed with each other through screws, and at the moment, the contact surface between the two sides of the heat dissipation box walls 1 can conduct heat; the two-sided radiating box wall 1 capable of conducting heat is arranged, so that the radiating box wall 1 on one side absorbing heat from a heating component on a mainboard of a computer can further conduct the absorbed heat to the radiating box wall 1 on the other side, and the radiating effect is enhanced.
Further, the radiator capable of being used as the computer case also comprises a heat pipe 3, in the embodiment, the heat pipe 3 is provided with a copper outer wall, and a condensing agent is filled in the heat pipe 3; the inner sides of the two mutually vertical radiating tank walls 1 are respectively provided with heat pipe caulking grooves 12, and the heat pipe caulking grooves 12 on the two radiating tank walls 1 are mutually communicated; the heat pipes 3 are respectively embedded in the heat pipe embedding grooves 12 of the two-side heat dissipation box walls 1, so that the two-side heat dissipation box walls 1 can conduct heat through the heat pipes 3. More specifically, the heat pipe caulking groove 12 includes a straight portion 121 extending along the long side direction of the heat dissipation tank wall 1 and a bent portion 122 extending along the short side direction of the heat dissipation tank wall 1, the straight portion 121 and the bent portion 122 are communicated with each other; the bent portions 122 of the heat pipe caulking grooves 12 on the two heat dissipation tank walls 1 are mutually communicated. The heat pipe 3 is bent to match the bending part 122 and the straight part 121 of the heat pipe caulking groove 12 on the two sides of the heat dissipation box wall 1, so that the heat pipe 3 can be respectively embedded into the heat pipe caulking grooves 12 on the two sides of the heat dissipation box wall 1; after the assembly is finished, the two sides of the radiating tank walls 1 can conduct heat through the heat pipes 3, so that the radiating tank wall 1 on one side absorbing heat from a heating part on a mainboard of a computer can further conduct the absorbed heat to the radiating tank wall 1 on the other side, and the radiating effect is enhanced; in this embodiment, the heat conducting seat 4 covers the heat pipe 3.
Referring to fig. 5 and 6, further, the opening of the heat pipe caulking groove 12 is narrowed to form a barb 123, that is, the opening width of the heat pipe caulking groove 12 is smaller than the diameter of the heat pipe caulking groove 12, so as to hook the heat pipe 3.
In the embodiment, the radiator capable of being used as the computer case is provided with three radiating case walls 1 and three enclosure case walls 2; during assembly, the two sides of the heat dissipation box walls 1 are fixed vertically by using screws, so that the fin group 11 of one side of the heat dissipation box wall 1 positioned at the edge is contacted with the inner side of the other side of the heat dissipation box wall 1; then, the heat pipe 3 is placed in the heat pipe caulking groove 12, the heat pipe 3 is deformed in a mode that the heat pipe 3 is rolled by a roller or the heat pipe 3 is flapped by a punching machine, so that the heat pipe is embedded in the heat pipe caulking groove 12, the outer wall of the heat pipe 3 is tightly attached to the inner wall of the heat pipe caulking groove 12, at the moment, the barb 123 can hook the heat pipe 3 due to the fact that the opening of the heat pipe caulking groove 12 is narrowed to form the barb 123, and the heat pipe 3 is prevented from being dislocated; then, heat-conducting silicone grease is coated on the heat-radiating tank wall 1 and the heat pipe 3, and the heat-conducting seat 4 is fixed on the heat-radiating tank wall 1 through screws, so that the heat-conducting seat 4 covers the heat pipe 3, at the moment, one surface of the heat-conducting seat 4 is tightly attached to the inner side of the heat-radiating tank wall 1, and the heat-conducting silicone grease can improve the heat conduction performance between the heat-conducting seat 4 and the heat-radiating tank wall 1; and (3) taking the assembly body as a basis, and fixing the remaining one-side radiating box wall 1 and the three-side enclosure box wall 2 in sequence through screws to finish assembly.
When the computer mainboard is installed, the heat dissipation box wall 1/enclosure box wall 2 opposite to the heat conduction seat 4 is detached, a screw is used for penetrating through the computer mainboard and then is locked into a fixing column of the heat dissipation box wall 1 on the side provided with the heat conduction seat 4, a central processing unit on the computer mainboard is aligned with the heat conduction seat 4, after the computer mainboard is assembled in the above mode, the central processing unit is in contact with the heat conduction seat 4, and heat conduction silicone grease is coated between the central processing unit and the heat conduction seat 4, so that the central processing unit can generate heat conduction with the heat conduction seat 4; and finally, assembling the heat dissipation box wall 1/the enclosure box wall 2 on the surface opposite to the heat conduction seat 4 back, and finishing the assembly of the computer.
The radiator capable of being used as the computer case has the advantages that the radiating case wall 1 and the enclosure case wall 2 are mutually fixed and enclosed to form a hexahedron which can be used as the case; a fin group 11 is formed on the outer side of the heat dissipation box wall 1, and a heating component on a mainboard of the computer can generate heat conduction with at least one heat dissipation box wall 1; when the radiator can be used as a radiator of a computer case, heat generated by heating components on a mainboard of a computer can be quickly conducted to the radiating case wall 1 and is radiated to the air by the fin group 11 of the radiating case wall 1, and the radiating effect is good; the radiator capable of being used as the computer case not only has the function of a radiator, but also can be used as the computer case, so that the computer can obtain better heat radiation performance while being miniaturized.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A radiator capable of being used as a computer case is characterized by comprising at least one radiating case wall and a plurality of enclosure walls, wherein a fin group is formed on the outer side of the radiating case wall, and the radiating case wall and the enclosure walls are fixed with each other and are enclosed to form a hexahedron;
the mainboard of the computer is accommodated in the hexahedron formed by the enclosing of the heat dissipation box walls and the enclosure box walls, and the heating components on the mainboard of the computer can conduct heat with at least one surface of the heat dissipation box walls.
2. A heat sink usable as a computer case according to claim 1, wherein: the heat dissipation box wall is provided with at least two surfaces, the two surfaces are mutually and vertically fixed, and the contact surface between the two surfaces of the heat dissipation box wall can conduct heat.
3. A heat sink usable as a computer case according to claim 2, wherein: also includes a heat pipe;
the inner sides of the two mutually vertical heat dissipation box walls are respectively provided with a heat pipe caulking groove, and the heat pipe caulking grooves on the two heat dissipation box walls are mutually communicated;
the heat pipes are respectively embedded into the heat pipe embedding grooves of the two sides of the heat dissipation box wall, so that the two sides of the heat dissipation box wall can conduct heat through the heat pipes.
4. A heat sink usable as a computer case according to claim 3, wherein: the heat pipe caulking groove comprises a straight line part extending along the long side direction of the heat dissipation box wall and a bent part extending along the short side direction of the heat dissipation box wall, and the straight line part is communicated with the bent part;
the bent parts of the heat pipe caulking grooves on the two sides of the heat dissipation box wall are mutually communicated.
5. A heat sink usable as a computer case according to claim 3 or 4, wherein: the opening of the heat pipe caulking groove is narrowed to form a barb to hook the heat pipe tightly.
6. A heat sink usable as a computer case according to claim 1, wherein: the heat-conducting seat is fixed on the wall of the heat-radiating box and can conduct heat with the wall of the heat-radiating box;
the mainboard of the computer is fixed on the wall of the heat dissipation box, and the heating component on the mainboard of the computer is in contact with the heat conduction seat and can conduct heat with the heat conduction seat.
7. A heat sink usable as a computer case according to claim 1, wherein: the enclosure wall is provided with an interface through hole for the interface on the mainboard of the computer to penetrate out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122335801.1U CN216210879U (en) | 2021-09-26 | 2021-09-26 | Radiator capable of being used as computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122335801.1U CN216210879U (en) | 2021-09-26 | 2021-09-26 | Radiator capable of being used as computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216210879U true CN216210879U (en) | 2022-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122335801.1U Active CN216210879U (en) | 2021-09-26 | 2021-09-26 | Radiator capable of being used as computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216210879U (en) |
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2021
- 2021-09-26 CN CN202122335801.1U patent/CN216210879U/en active Active
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