CN218004070U

CN218004070U - Water cooling device for cooling double heat sources

Info

Publication number: CN218004070U
Application number: CN202222164789.7U
Authority: CN
Inventors: 马迅嘉; 庄子贤
Original assignee: Team Group Co ltd
Current assignee: Team Group Co ltd
Priority date: 2022-08-10
Filing date: 2022-08-17
Publication date: 2022-12-09
Anticipated expiration: 2032-08-17
Also published as: TW202407278A; CN117631786A

Abstract

The utility model provides a water cooling plant for cooling off two heat sources, it is a heat dissipation fin pipe intercommunication first circulating pump of a radiator unit, this first circulating pump communicates a first heat exchange assembly with a first pipeline again, this first heat exchange assembly corresponds the butt and cools off a first heat source, this first heat exchange assembly communicates a second heat exchange assembly with a second pipeline, this first heat exchange assembly corresponds the butt and cools off a second heat source, this second heat exchange assembly communicates this first circulating pump with a third pipeline again, and utilize this heat dissipation fin pipe cooling cycle in this a fluid that is used for cooling off the water cooling plant of two heat sources, with two heat sources of this device simultaneous cooling, further reduce the occupation space of device.

Description

Water cooling device for cooling double heat sources

Technical Field

The present invention relates to a water cooling device for cooling two heat sources, and more particularly to a heat dissipation structure for quickly mounting and dismounting an electronic component.

Background

With the development of technology, computer hardware is developed toward high speed and high frequency, so as to improve the operating efficiency of the computer. In order to cooperate with the high-speed operation of the processor, the operating temperature of the electronic device is higher and higher, and the continuously rising temperature will affect the performance of the electronic device, even cause the memory to be damaged.

Due to the prosperity of electronic games and the popular trend that computers are modified, many users or manufacturers of electronic games will change the housing of the electronic games into a transparent housing, and the modified electronic games are gradually prevalent, and the internal components of the electronic games, such as: the CPU, display adapter and memory have better efficiency than the general personal computer, so that more heat energy is relatively generated.

Conventional heat-generating electronic components, for example: CPU, display adapter, memory, set up in the circuit board and insert and establish to the computer system with the connection interface. Due to the demand of the electronic competition products, the working frequency of the related electronic components gradually develops towards high frequency, so that the electronic components have higher data transmission rate and higher electric quantity consumption, and are easier to accumulate heat; when the operating temperature of the electronic device is higher and exceeds the allowable temperature value, the performance of the electronic device is significantly reduced, and the error rate of data or operation held by the module is increased, which causes instability of the computer system.

In order to achieve faster heat dissipation, water-cooled heat dissipation devices are gradually introduced in the industry to overcome the problem that the operating temperature of electronic components is higher and higher, but because the size of a housing (housing for accommodating the heat dissipation device) is reduced, the heat dissipation device is required to be further reduced in size, so that the device can still perform long-time uninterrupted high-speed data processing and operation in the most limited space, however, a water-cooled heat dissipation device is a heat sink corresponding to a heat-generating electronic component, and if a plurality of electronic components need to be dissipated, a plurality of spaces need to be occupied, and a plurality of heat sinks consume more energy, and under the trend of reduced housing size, a water-cooled device capable of cooling more than one heat source is urgently needed in the industry.

In view of the above-mentioned problems of the prior art, the present invention provides a water cooling device for cooling two heat sources, which uses two heat exchange assemblies to respectively and correspondingly cool two heat sources, and uses a heat dissipation assembly to correspondingly dissipate the heat of the fluid flowing through the two heat exchange assemblies, so as to simultaneously cool the two heat sources, thereby further reducing the occupied space of the device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a water cooling plant for cooling off two heat sources, it is with single radiator unit, two heat exchange assemblies of intercommunication, two heat exchange assemblies correspond two heat sources of cooling individually, utilize two heat sources of this device simultaneous cooling, further reduce the occupation space of device, and two heat exchange assemblies communicate each other to a fluid that another heat exchange assembly of flow through is received to one of them heat exchange assembly, reduces water cooling plant's energy resource consumption.

In order to achieve the above-mentioned objects and effects, the present invention provides a water cooling device for cooling a dual heat source, which is used for cooling a first heat source and a second heat source, the water cooling device for cooling a dual heat source comprises a heat dissipation assembly, a first pipeline, a first heat exchange assembly, a second pipeline, a second heat exchange assembly and a third pipeline, the heat dissipation assembly comprises a frame, a heat dissipation fin tube and a first circulation pump, the heat dissipation fin tube is disposed at an inner side of the frame, the first circulation pump is connected to two ends of the heat dissipation fin tube, one end of the first pipeline is connected to the first circulation pump, the first heat exchange assembly comprises a second circulation pump and a first heat conduction member, the second circulation pump is connected to the other end of the first pipeline, the first heat conduction member is disposed below the second circulation pump, the first heat conduction member is connected to the first heat source, one end of the second pipeline is communicated with the second circulating pump, the second heat exchange assembly comprises an accommodating groove and a second heat-conducting piece, the accommodating groove is communicated with the other end of the second pipeline, the second heat-conducting piece is arranged below the accommodating groove and correspondingly abutted against the second heat source, one end of the third pipeline is communicated with the accommodating groove, the other end of the third pipeline is communicated with the first circulating pump, a fluid is arranged on one inner side of the heat-radiating fin pipe, the first circulating pump correspondingly conveys the fluid to the third pipeline, the fluid flows to the accommodating groove after passing through the third pipeline, the fluid flows to the second pipeline after passing through the accommodating groove, the fluid flows to the second circulating pump after passing through the second pipeline, the fluid flows to the first pipeline after passing through the second circulating pump, and the fluid flows to the first circulating pump and the heat-radiating fin pipe after passing through the first pipeline, the first heat source generates heat energy and conducts the heat energy to the first heat conducting piece, then the heat energy is conducted to the second circulating pump through the first heat conducting piece, the second heat source generates heat energy and conducts the heat energy to the second heat conducting piece, and then the heat energy is conducted to the accommodating groove through the second heat conducting piece; the structure is utilized to provide a water cooling structure which can cool two heat sources simultaneously.

In an embodiment of the present invention, the first heat source is a Central Processing Unit (CPU).

In an embodiment of the present invention, the second heat source is a Solid State Disk (SSD).

The utility model discloses an in one embodiment, wherein one side of this first circulating pump sets up a first water inlet and a first delivery port, and this first water inlet intercommunication this heat dissipation fin pipe's one end, the other end of this heat dissipation fin pipe of this first delivery port intercommunication, this fluid get into this heat dissipation fin pipe by this first water inlet, and this fluid flows to this first circulating pump by this first delivery port behind this heat dissipation fin pipe.

The utility model discloses an in one embodiment, wherein the opposite side of this first circulating pump sets up a second water inlet and a second delivery port, this end of this first pipeline of this second water inlet intercommunication, this other end of this third pipeline of this second delivery port intercommunication, this fluid get into this first circulating pump by this second water inlet behind this first pipeline, this fluid gets into this third pipeline by this second delivery port.

In an embodiment of the present invention, the heat dissipation assembly further includes a fan, and the fan is disposed on one side of the frame corresponding to the heat dissipation fin tube.

In an embodiment of the present invention, a gas enters one side of the fan, flows to the inner side of the frame after entering the fan, and passes through an outer side of the heat dissipation fin tube, and flows out of the frame after passing through the outer side of the heat dissipation fin tube.

In an embodiment of the present invention, the first pipeline, the second pipeline and the third pipeline are respectively a flexible pipeline.

In an embodiment of the present invention, the second heat exchanging assembly further includes a fixing frame disposed below the second heat conducting member, and the fixing frame and the second heat conducting member clamp the second heat source.

In an embodiment of the present invention, the temperature of the first heat source is greater than or equal to the temperature of the second heat source.

Drawings

FIG. 1: which is a schematic structural explosion diagram of an embodiment of the present invention;

fig. 2A to 2B: which is a schematic view of a fluid flow path according to an embodiment of the present invention; and

FIG. 3: it is an embodiment of the present invention of a fan structure and an actuation diagram thereof.

[ COMPARATIVE EXAMPLES OF DRAWINGS ]

1. Water cooling device for cooling double heat sources

2. First heat source

3. Second heat source

10. Heat radiation assembly

12. Frame structure

14. Heat radiation fin tube

16. First circulating pump

161. First water inlet

162. A first water outlet

163. Second water inlet

164. The second water outlet

18. Fan (Ref. TM. Fan)

20. First pipeline

30. First heat exchange assembly

32. Second circulating pump

34. First heat conducting member

40. The second pipeline

50. Second heat exchange assembly

52. Containing groove

54. Second heat conducting member

56. Fixing frame

60. Third pipeline

A gas

F fluid

Detailed Description

In order to further understand and appreciate the structural features and functions of the present invention, preferred embodiments and associated detailed descriptions are described as follows:

in view of the above problems of the conventional techniques, the present invention provides a heat dissipation device, wherein a first circulation pump of the heat dissipation device is connected to a second circulation pump of a first heat exchange device through a first pipe, the first heat exchange device correspondingly cools a first heat source, the second circulation pump of the first heat exchange device is connected to a receiving tank of a second heat exchange device through a second pipe, the first heat exchange device correspondingly cools a second heat source, the receiving tank of the second heat exchange device is connected to the first circulation pump through a third pipe, and a heat dissipation fin tube of the heat dissipation device is used to cool a fluid flowing through the devices, thereby solving the problem that the conventional techniques occupy multiple spaces if multiple electronic components need to be dissipated.

Referring to fig. 1, which is a schematic diagram illustrating an explosion structure of an embodiment of the present invention, as shown in the drawing, the embodiment is a water cooling apparatus 1 for cooling a dual heat source, which is used for cooling a first heat source 2 and a second heat source 3, and the water cooling apparatus 1 for cooling the dual heat source includes a heat dissipation assembly 10, a first pipeline 20, a first heat exchange assembly 30, a second pipeline 40, a second heat exchange assembly 50, and a third pipeline 60.

Referring to fig. 1 again, in the present embodiment, as shown in the drawing, the heat dissipation assembly 10 includes a frame 12, a heat dissipation fin tube 14 and a first circulation pump 16, the heat dissipation fin tube 14 is disposed at an inner side of the frame 12, wherein the first circulation pump 16 is communicated with two ends of the heat dissipation fin tube 14, one end of the first pipeline 20 is communicated with the first circulation pump 16, the first heat exchange assembly 30 includes a second circulation pump 32 and a first heat conduction member 34, the second circulation pump 32 is communicated with the other end of the first pipeline 20, wherein the first heat conduction member 34 is disposed below the second circulation pump 32, and the first heat conduction member 34 is abutted against the first heat source 2, in the present embodiment, the first heat conduction member 34 is abutted against an upper side of the first heat source 2, but not limited thereto; one end of the second pipe 40 is connected to the second circulation pump 32, the second heat exchange assembly 50 includes a receiving groove 52 and a second heat conducting element 54, the receiving groove 52 is connected to the other end of the second pipe 40, the second heat conducting element 54 is disposed below the receiving groove 52, wherein the second heat conducting element 54 is correspondingly abutted against the second heat source 3, in the embodiment, the second heat conducting element 54 is abutted against an upper portion of the second heat source 3, but not limited thereto; one end of the third pipeline 60 is connected to the containing groove 52, and the other end of the third pipeline 60 is connected to the first circulating pump 16, thereby completing a circulating channel.

In the embodiment, the first heat source 2 is a Central Processing Unit (CPU) including a fixing frame of the CPU, and the first heat exchanging assembly 30 exchanges heat with the first heat source 2 to reduce the temperature of the first heat source 2.

In the embodiment, the second heat source 3 is a Solid State Disk (SSD), such as a pci SSD, and the second heat exchanging assembly 50 exchanges heat with the second heat source 3 to reduce the temperature of the second heat source 3.

Continuing from the above, in the present embodiment, the heat dissipation fins 14 are an example, but the present embodiment is not limited thereto, and a plurality of heat dissipation fins 14 may also be disposed inside the frame 12 to further improve the heat efficiency.

In the present embodiment, the first pipeline 20, the second pipeline 40 and the third pipeline 60 are respectively a flexible pipeline, for example, pipes made of plastic or silicone material, so as to adapt to different enclosure environments, and the first heat exchange assembly 30 and the second heat exchange assembly 50 can be correspondingly abutted against the first heat source 2 and the second heat source 3 in different planes and angles.

Referring to fig. 1 and fig. 2A to 2B again, fig. 2A to 2B are schematic diagrams of a fluid flow path according to an embodiment of the present invention, as shown in the drawings, in the present embodiment, a fluid F is disposed inside the heat dissipating fin 14 of the heat dissipating assembly 10, so that the fluid F flows inside the heat dissipating fin 14 to cool the heat dissipating fin, the first circulating pump 16 correspondingly conveys the fluid F to an inside of the third pipeline 60, the fluid F flows through the third pipeline 60 to an inside of the accommodating groove 52 of the second heat exchanging assembly 50, the fluid F circulates inside the accommodating groove 52, the fluid F flows through the accommodating groove 52 to an inside of the second pipeline 40, the fluid F flows through the accommodating groove 52 to an inside of the second circulating pump 32 of the first heat exchanging assembly 30, the fluid F flows through the second circulating pump 32 to an inside of the first pipeline 20, the fluid F flows through the first pipeline 20 to the first circulating pump 16 of the heat dissipating assembly 10, and the fluid F flows through the first circulating pump 16 to cool the heat dissipating fin 14 again.

In the following, in the embodiment, the fluid F is cooling liquid or water, and the embodiment is not limited thereto.

In the embodiment, the first heat source 2 generates heat energy, and the heat energy is conducted to the first heat conducting member 34 of the first heat exchanging assembly 30, and then conducted to the second circulating pump 32 through the first heat conducting member 34, and meanwhile, the fluid F flows inside the second circulating pump 32, and absorbs the heat energy conducted to the second circulating pump 32, so as to further reduce the temperature of the first heat source 2.

In the present embodiment, the second heat source 3 generates heat energy, and the heat energy is conducted to the second heat conducting member 54 of the second heat exchanging assembly 50, and then conducted to the accommodating groove 52 by the second heat conducting member 34, and meanwhile, the fluid F flows inside the accommodating groove 52, and absorbs the heat energy conducted to the accommodating groove 52, so as to further reduce the temperature of the second heat source 3.

In the present embodiment, the first heat conducting element 34 may be integrally formed with the housing of the second circulating pump 32, and the material of the first heat conducting element 34 may be metal, silica gel, or graphene, which is not limited herein.

In the present embodiment, the second heat conducting element 54 may be integrally formed with the housing of the accommodating groove 52, and the material of the second heat conducting element 54 may be metal, silicon gel, or graphene, which is not limited herein.

In the present embodiment, the temperature of the first heat source 2 is greater than or equal to the temperature of the second heat source 3, so that the fluid F is preferentially delivered to the second heat exchange assembly 50 to correspondingly cool the second heat source 3 after being cooled by the heat dissipation fin 14 of the heat dissipation assembly 10, and then the fluid F flowing through the second heat exchange assembly 50 is delivered to the first heat exchange assembly 50 to correspondingly cool the first heat source 2 with a higher temperature, so as to circulate the cooling fluid and reduce energy consumption.

In the present embodiment, the second heat exchanging assembly 50 further includes a fixing frame 56, the fixing frame 56 is disposed below the second heat conducting member 54, and the fixing frame 56 and the second heat conducting member 54 sandwich the second heat source 3, so that the second heat conducting member 54 is in close contact with the second heat source 3, the heat dissipation efficiency is improved, and the second heat source 3 is prevented from being loosened.

Referring to fig. 1 to fig. 2B again, as shown in the figure, in the present embodiment, a first water inlet 161 and a first water outlet 162 are disposed at one side of the first circulating pump 16, the first water inlet 161 is communicated with one end of the heat dissipating fin tube 14, the first water outlet 162 is communicated with the other end of the heat dissipating fin tube 14, the fluid F enters the heat dissipating fin tube from the first water inlet 161, and the fluid F flows to the inner side of the first circulating pump 16 from the first water outlet 162 after passing through the heat dissipating fin tube 14.

In this embodiment, a second water inlet 163 and a second water outlet 164 are disposed on the other side of the first circulation pump 16, the second water inlet 163 is connected to the end of the first pipeline 20, the second water outlet 164 is connected to the other end of the third pipeline 60, the fluid F passes through the first pipeline 20 and then enters the first circulation pump 16 through the second water inlet 163, and the fluid F enters the third pipeline 60 through the second water outlet 164.

Please refer to fig. 3, which is a fan structure and an operation diagram thereof according to an embodiment of the present invention, as shown in the figure, the heat dissipation assembly 10 further includes a fan 18 according to the above embodiment, the fan 18 is disposed on one side of the frame 12 corresponding to the heat dissipation fin 14, in this embodiment, the fan 18 is fixed on the side of the frame 12 by a screw, but the embodiment is not limited thereto.

Continuing from the above, in this embodiment, after the gas a enters one side of the fan 18, the gas a flows to the inner side of the frame 12 and exchanges heat with the heat dissipating fin tube 14 through an outer side of the heat dissipating fin tube 14, so that the fluid F (shown in fig. 2B) inside the heat dissipating fin tube 14 is cooled, and after the gas a passes through the outer side of the heat dissipating fin tube 14, the gas a flows out of the frame 12.

In the following, in the embodiment, the gas a is air, and the embodiment is not limited thereto.

To sum up, the utility model provides a water cooling plant for cooling two heat sources, it is with single radiator unit, communicate two heat exchange assemblies, two heat exchange assemblies correspond two heat sources of cooling individually, utilize two heat sources of this device simultaneous cooling, further reduce the occupation space of device, and two heat exchange assemblies communicate each other, receive the fluid that flows through another heat exchange assembly with one of them heat exchange assembly, with the higher heat source of cooling demand, receive the coolant liquid of the lower heat source of cooling demand, when further reducing the volume, reduce whole water cooling plant's energy consumption, solve to know that water cooling plant corresponds a electronic component that generates heat for a radiator, if need dispel the heat a plurality of electronic components, must occupy the problem in a plurality of spaces, and solve to know water cooling plant, must use the problem that a plurality of radiators will consume more energy.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the scope of the invention, which is defined by the appended claims.

Claims

1. A water cooling device for cooling a dual heat source, the water cooling device for cooling a first heat source and a second heat source, the water cooling device for cooling the dual heat source comprising:

the heat dissipation assembly comprises a frame, a heat dissipation fin tube and a first circulating pump, wherein the heat dissipation fin tube is arranged on one inner side of the frame, and the first circulating pump is communicated with two ends of the heat dissipation fin tube;

one end of the first pipeline is communicated with the first circulating pump;

the first heat exchange assembly comprises a second circulating pump and a first heat conducting piece, the second circulating pump is communicated with the other end of the first pipeline, the first heat conducting piece is arranged below the second circulating pump, and the first heat conducting piece is correspondingly abutted against the first heat source;

one end of the second pipeline is communicated with the second circulating pump;

the second heat exchange assembly comprises an accommodating groove and a second heat conducting piece, the accommodating groove is communicated with the other end of the second pipeline, the second heat conducting piece is arranged below the accommodating groove, and the second heat conducting piece is correspondingly abutted against the second heat source; and

one end of the third pipeline is communicated with the containing groove, and the other end of the third pipeline is communicated with the first circulating pump;

the fluid is arranged on one inner side of the heat dissipation fin tube, the first circulating pump correspondingly conveys the fluid to the third pipeline, the fluid flows to the accommodating groove after passing through the third pipeline, the fluid flows to the second pipeline after passing through the accommodating groove, the fluid flows to the second circulating pump after passing through the second pipeline, the fluid flows to the first pipeline after passing through the second circulating pump, and the fluid flows to the first circulating pump and the heat dissipation fin tube after passing through the first pipeline;

the first heat source generates heat energy and conducts the heat energy to the first heat conducting piece, then the heat energy is conducted to the second circulating pump through the first heat conducting piece, the second heat source generates heat energy and conducts the heat energy to the second heat conducting piece, and then the heat energy is conducted to the accommodating groove through the second heat conducting piece.

2. The water cooling apparatus as claimed in claim 1, wherein the first heat source is a CPU.

3. The water cooling apparatus as claimed in claim 1, wherein the second heat source is a Solid State Disk (SSD).

4. The water cooling apparatus as claimed in claim 1, wherein a first water inlet and a first water outlet are disposed at one side of the first circulating pump, the first water inlet is connected to one end of the heat dissipating fin tube, the first water outlet is connected to the other end of the heat dissipating fin tube, the fluid enters the heat dissipating fin tube through the first water inlet, and the fluid flows to the first circulating pump through the heat dissipating fin tube and then flows from the first water outlet.

5. The water cooling apparatus as claimed in claim 4, wherein a second water inlet and a second water outlet are disposed on the other side of the first circulating pump, the second water inlet is connected to the end of the first pipeline, the second water outlet is connected to the other end of the third pipeline, the fluid passes through the first pipeline and enters the first circulating pump through the second water inlet, and the fluid enters the third pipeline through the second water outlet.

6. The water cooling apparatus as claimed in claim 1, wherein the heat sink further comprises a fan disposed at one side of the frame corresponding to the heat dissipating fins.

7. The water cooling apparatus as claimed in claim 6, wherein a gas enters one side of the fan, the gas flows into the inner side of the frame and passes through an outer side of the heat dissipating fin tube, and the gas flows out of the frame after passing through the outer side of the heat dissipating fin tube.

8. The water cooling apparatus as claimed in claim 1, wherein the first pipe, the second pipe and the third pipe are each a flexible pipe.

9. The water cooling apparatus as claimed in claim 1, wherein the second heat exchanging element further comprises a fixing frame disposed below the second heat conducting element, and the fixing frame and the second heat conducting element sandwich the second heat source.

10. The water cooling apparatus as claimed in claim 1, wherein the temperature of the first heat source is equal to or higher than the temperature of the second heat source.