CN209928369U - Mainboard heat dissipation structure for computer - Google Patents
Mainboard heat dissipation structure for computer Download PDFInfo
- Publication number
- CN209928369U CN209928369U CN201921047805.6U CN201921047805U CN209928369U CN 209928369 U CN209928369 U CN 209928369U CN 201921047805 U CN201921047805 U CN 201921047805U CN 209928369 U CN209928369 U CN 209928369U
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- CN
- China
- Prior art keywords
- heat dissipation
- mainboard body
- mainboard
- computer
- support column
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- Expired - Fee Related
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Abstract
The utility model discloses a mainboard heat radiation structure for computer, including mainboard body, mount pad and support column, the fixed connection support column in mount pad both sides upper end, threaded hole one has been seted up on the support column upper end, mainboard body and support column junction set up threaded hole two, mainboard body lower extreme is installed the radiating seat, and has been seted up threaded hole three on the mainboard body, radiating seat lower extreme connection fin, fin cartridge water pipe, water piping connection storage water tank, and the storage water tank leads to pipe intercommunication micro water pump, the radiator fan is installed to the mount pad upper end, in the utility model, utilize fixing bolt one to fix mainboard body and mount pad, fixing bolt two fixes mainboard body and radiating seat, and simple to operate, fin, radiator fan and the cooperation of radiating silica gel piece are favorable to the heat dissipation of mainboard body, and water pipe, storage water tank and micro water pump can realize the hydrologic cycle, the heat dissipation performance of the heat dissipation structure is improved.
Description
Technical Field
The utility model relates to a computer technology field specifically is a mainboard heat radiation structure for computer.
Background
The computer case mainboard is also called a mainboard, a system board or a motherboard; it is divided into two types, namely a commercial mainboard and an industrial mainboard. It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a key and board control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.
When the computer mainboard works, a large amount of heat can be generated, the internal temperature of the computer case is overhigh, and the mainboard can be damaged after long-term use. Accordingly, those skilled in the art have provided a heat dissipating structure for a motherboard of a computer to solve the problems set forth in the background art.
Disclosure of Invention
An object of the utility model is to provide a mainboard heat radiation structure for computer to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a mainboard heat radiation structure for computer, includes mainboard body, mount pad and support column, mount pad both sides upper end fixed connection support column, support column upper end screw hole one, mainboard body and support column junction screw hole two, the radiating seat is installed to mainboard body lower extreme, and sets up screw hole three on the mainboard body, the radiating fin is connected to the radiating seat lower extreme, fin cartridge water pipe, and the water piping connection storage water tank, and the storage water tank leads to pipe intercommunication micro water pump, radiator fan is installed to the mount pad upper end, and radiator fan bilateral symmetry installs the bracing piece, and bracing piece fixed connection mount pad.
As a further aspect of the present invention: the main board body is fixed with the support column through a first fixing bolt.
As a further aspect of the present invention: the main board body and the heat dissipation seat are fixed through a second fixing bolt.
As a further aspect of the present invention: and a heat dissipation silica gel sheet is arranged between the heat dissipation seat and the mainboard body and is adhered to the heat dissipation seat.
As a further aspect of the present invention: the water pipe is arranged in a snake shape at the inner part of the radiating fin.
As a further aspect of the present invention: the fixed plate is installed to storage water tank lower extreme, and has seted up the fixed orifices on the fixed plate.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses in, it is fixed with mainboard body and mount pad to utilize fixing bolt one, and fixing bolt two is fixed mainboard body and radiating seat, simple to operate, and fin, radiator fan and the cooperation of heat dissipation silica gel piece are favorable to the heat dissipation of mainboard body, and hydrologic cycle can be realized to water pipe, storage water tank and miniature pump, improves the thermal diffusivity of this heat dissipation structure.
Drawings
Fig. 1 is a schematic structural diagram of a motherboard heat dissipation structure for a computer.
Fig. 2 is a schematic structural diagram of a heat sink in a motherboard heat dissipation structure for a computer.
Fig. 3 is a schematic structural diagram of a water storage tank in a motherboard heat dissipation structure for a computer.
In the figure: 1-a main board body, 2-a mounting seat, 3-a support column, 4-a threaded hole I, 5-a threaded hole II, 6-a fixing bolt I, 7-a radiating seat, 8-a radiating fin, 9-a threaded hole III, 10-a fixing bolt II, 11-a support rod, 12-a radiating fan, 13-a water pipe, 14-a water storage tank, 15-a micro water pump, 16-a fixing plate, 17-a fixing hole and 18-a radiating silica gel sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-3, in the embodiment of the present invention, a mainboard heat dissipation structure for computer, includes mainboard body 1, mount pad 2 and support column 3, mount pad 2 both sides upper end fixed connection support column 3, support column 3 upper end set up threaded hole one 4, mainboard body 1 and support column 3 junction set up threaded hole two 5, radiating pad 7 is installed to 1 lower extreme of mainboard body, and sets up threaded hole three 9 on the mainboard body 1, radiating pad 8 is connected to 7 lower extreme of radiating pad, 8 cartridge water pipes 13 of radiating pad, and water pipe 13 connects storage water tank 14, and storage water tank 14 leads to 13 intercommunication micro water pump 15, radiator fan 12 is installed to 2 upper ends of mount pad, and radiator fan 12 both sides symmetry installs bracing piece 11, and bracing piece 11 fixed connection mount pad 2.
The main board body 1 and the support column 3 are fixed through a first fixing bolt 6.
The main board body 1 and the heat dissipation seat 7 are fixed through a second fixing bolt 10.
A heat dissipation silicone sheet 18 is arranged between the heat dissipation seat 7 and the main board body 1, and the heat dissipation silicone sheet 18 is adhered to the heat dissipation seat 7.
The water tubes 13 are arranged in a serpentine shape at the inside of the fins 8.
The fixing plate 16 is installed at the lower end of the water storage tank 14, and a fixing hole 17 is formed in the fixing plate 16.
The utility model discloses a theory of operation is:
the utility model discloses in, utilize fixing bolt 6 fixed with mainboard body 1 and mount pad 2, fixing bolt two 10 is fixed with mainboard body 1 and radiating seat 7, simple to operate, and fin 8, radiator fan 12 and the 18 cooperation of heat dissipation silica gel piece are favorable to mainboard body 1's heat dissipation, and water pipe 13, storage water tank 14 and micro-water pump 15 can realize hydrologic cycle, improve this heat dissipation structure's thermal diffusivity.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A mainboard heat dissipation structure for a computer comprises a mainboard body (1), a mounting seat (2) and supporting columns (3), and is characterized in that the upper ends of the two sides of the mounting seat (2) are fixedly connected with the supporting columns (3), the upper ends of the supporting columns (3) are provided with first threaded holes (4), the joints of the mainboard body (1) and the supporting columns (3) are provided with second threaded holes (5), the lower end of the mainboard body (1) is provided with a heat dissipation seat (7), the mainboard body (1) is provided with third threaded holes (9), the lower end of the heat dissipation seat (7) is connected with heat dissipation fins (8), the heat dissipation fins (8) are inserted into water pipes (13), the water pipes (13) are connected with a water storage tank (14), the water storage tank (14) is communicated with a micro water pump (15) through the water pipes (13), the upper ends of the mounting seat (2) are provided with heat dissipation, and the supporting rod (11) is fixedly connected with the mounting seat (2).
2. The heat dissipation structure for a motherboard of a computer as claimed in claim 1, wherein the motherboard body (1) and the supporting column (3) are fixed by a first fixing bolt (6).
3. The heat dissipation structure for a motherboard of a computer as claimed in claim 1, wherein the motherboard body (1) and the heat dissipation seat (7) are fixed by a second fixing bolt (10).
4. The motherboard heat dissipation structure for a computer according to claim 1, wherein a heat dissipation silicone sheet (18) is disposed between the heat dissipation seat (7) and the motherboard body (1), and the heat dissipation silicone sheet (18) is adhered to the heat dissipation seat (7).
5. A heat dissipating structure for a main board of a computer according to claim 1, wherein the water pipe (13) is arranged in a serpentine shape at an inside of the heat dissipating fin (8).
6. The main board heat dissipation structure for a computer according to claim 1, wherein a fixing plate (16) is installed at a lower end of the water storage tank (14), and a fixing hole (17) is formed in the fixing plate (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921047805.6U CN209928369U (en) | 2019-07-05 | 2019-07-05 | Mainboard heat dissipation structure for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921047805.6U CN209928369U (en) | 2019-07-05 | 2019-07-05 | Mainboard heat dissipation structure for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209928369U true CN209928369U (en) | 2020-01-10 |
Family
ID=69093576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921047805.6U Expired - Fee Related CN209928369U (en) | 2019-07-05 | 2019-07-05 | Mainboard heat dissipation structure for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209928369U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315197A (en) * | 2020-04-02 | 2020-06-19 | 深圳市龙航科技有限公司 | Vehicle-mounted navigator with heat radiation structure |
-
2019
- 2019-07-05 CN CN201921047805.6U patent/CN209928369U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315197A (en) * | 2020-04-02 | 2020-06-19 | 深圳市龙航科技有限公司 | Vehicle-mounted navigator with heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200110 Termination date: 20200705 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |