CN216901552U

CN216901552U - Cooling and noise reducing host

Info

Publication number: CN216901552U
Application number: CN202220725111.9U
Authority: CN
Inventors: 李剑锋
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2022-07-05
Anticipated expiration: 2032-03-30

Abstract

The utility model relates to a cooling and noise reducing host, which belongs to the technical field of computer heat dissipation and comprises a case, a CPU, a first heat dissipation unit, a second heat dissipation unit and a heat conducting piece, wherein the case comprises a case body and a heat conducting piece; the CPU is arranged in the case, and the first heat dissipation unit is in contact with the CPU; the first heat dissipation unit internally comprises a first mounting piece for mounting and fixing the first heat dissipation unit; the second heat dissipation unit is in contact with the case; the second heat dissipation unit comprises a second mounting piece for mounting and fixing the second heat dissipation unit; the heat conducting piece connects the first heat dissipation unit with the second heat dissipation unit. The CPU is heated and transferred to the case to dissipate heat in a direct contact heat transfer mode, so that the heat dissipation effect is guaranteed, the heat dissipation effect is different from the traditional air cooling heat dissipation effect, and the noise reduction effect is achieved.

Description

Cooling and noise reducing host

Technical Field

The utility model belongs to the technical field of hard disk heat dissipation, and particularly relates to a cooling and noise reduction host.

Background

At present, the cooling method of the CPU is generally realized by hardware such as a fan, a radiator and the like, noise is inevitably generated when the fan works, and the attention and mood of a user are influenced in a quiet office environment.

Therefore, how to provide a CPU heat sink device that solves the above technical problems is an urgent technical problem to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a cooling and noise reduction host machine, aiming at solving the problem of noise in the existing cooling mode of a CPU.

The utility model is realized by the following technical scheme:

a cooling and noise reducing host comprises a case, a CPU, a first heat dissipation unit, a second heat dissipation unit and a heat conduction piece;

the CPU is arranged in the case, and the first heat dissipation unit is in contact with the CPU; the first heat dissipation unit internally comprises a first mounting piece for mounting and fixing the first heat dissipation unit;

the second heat dissipation unit is in contact with the case; the second heat dissipation unit comprises a second installation part for installing and fixing the second heat dissipation unit;

the heat conducting piece connects the first heat dissipation unit and the second heat dissipation unit.

In this CPU heat abstractor's course of operation, the heat that CPU sent transmits to first radiating element with the mode of direct contact heat transfer, first radiating element rethread heat conduction piece transmits the heat that CPU sent to second radiating element, the second radiating element transmits above-mentioned heat to quick-witted case with the mode of direct contact heat transfer again, quick-witted case diffuses the heat to external space again, whole quick-witted case structure all participates in radiating in-process this moment, when making the radiating effect obtain the guarantee, be different from traditional forced air cooling heat dissipation, the noise that the fan rotation sent has been avoided, the effect of noise reduction has been played, user's environmental comfort level has been improved.

In a further improvement of the present invention, the first heat dissipation unit includes a first heat distribution plate and a first heat transfer member, one side surface of the first heat distribution plate contacts with a surface of the CPU, the first heat transfer member is disposed on the other side surface of the first heat distribution plate, and the first heat transfer member is connected to one end of the heat transfer member. The first heat homogenizing plate ensures the contact area with the CPU, absorbs the heat of the CPU in time and transmits the heat to the first heat transfer piece; the first heat transfer member transfers heat to the heat conductive member.

In a further development of the utility model, the first mounting element is connected to the first hotplate. So as to realize the contact stability of the first heat distributing plate and the CPU.

The utility model is further improved, two first mounting parts are arranged and are in strip plate shapes; the two first installation parts are symmetrically distributed on two sides of the first uniform heating plate. And ensuring the sufficient contact stability of the first uniform heating plate and the CPU.

In a further improvement of the present invention, the second heat dissipation unit includes a second heat distribution plate and a second heat transfer element, one side surface of the second heat distribution plate contacts with the inner wall of the casing, the second heat transfer element is disposed on the other side surface of the second heat distribution plate, and the second heat transfer element is connected to the other end of the heat transfer element. The second heat-homogenizing plate ensures the contact area with the case, and timely absorbs the heat transferred from the heat-conducting element to the second heat-transferring element and transfers the heat to the case.

In a further development of the utility model, the second mounting element is connected to the second hotplate. So as to realize the contact stability of the second heat-homogenizing plate and the case.

The utility model further improves the structure that the number of the second mounting parts is two, and the two second mounting parts are symmetrically distributed on two sides of the second uniform heating plate; the second installed part comprises two installed claws, the two installed claws in the same second installed part are arranged at intervals, and extension lines of the two installed claws are in a cross shape. Because the inner wall of the case has more available space, the contact area is increased to be more beneficial to heat dissipation while the connection with the case is stable through the mounting claws.

In a further improvement of the utility model, the first heat homogenizing plate and the second heat homogenizing plate are made of copper. To improve the heat conduction effect.

In a further improvement of the present invention, the first heat transfer member, the second heat transfer member and the heat conductive member are heat pipes. The quick heat transfer is realized.

In a further improvement of the present invention, the first heat dissipating unit and/or the second heat dissipating unit are further provided with heat dissipating fins. The efficiency of heat absorption is increased through the radiating fins, and preparation conditions are provided for conducting heat outwards.

According to the technical scheme, the utility model has the beneficial effects that: 1. in this CPU heat abstractor's course of operation, the heat that CPU sent transmits to first radiating element with the mode of direct contact heat transfer, first radiating element rethread heat conduction piece transmits the heat that CPU sent to second radiating element, the second radiating element transmits above-mentioned heat to quick-witted case with the mode of direct contact heat transfer again, quick-witted case diffuses the heat to external space again, whole quick-witted case structure all participates in radiating in-process this moment, when making the radiating effect obtain the guarantee, be different from traditional forced air cooling heat dissipation, the noise that the fan rotation sent has been avoided, the effect of noise reduction has been played, user's environmental comfort level has been improved. 2. The first mounting piece and the second mounting piece are used for respectively realizing connection and fixation of the first heat dissipation unit and the second heat dissipation unit corresponding to the CPU and the case, so that stability of a heat dissipation process is guaranteed.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the present invention.

Fig. 2 is a bottom view of the first heat dissipation unit according to the embodiment of the present invention.

Fig. 3 is a top view of a first heat dissipation unit according to an embodiment of the utility model.

Fig. 4 is a top view of a second heat dissipation unit according to an embodiment of the utility model.

In the drawings: 01. CPU 02, a case 10, a first heat dissipation unit 20, a second heat dissipation unit 30, a heat conduction member 101, a first heat uniforming plate 102, a first mounting member 103, a first heat transfer member 201, a second heat uniforming plate 202, a second mounting member 203, and a second heat transfer member.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the present embodiment, and it is apparent that the embodiments described below are only a part of embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.

As shown in the drawings, a cooling and noise reducing host comprises a case 02, a CPU01, a first heat dissipation unit 10, a second heat dissipation unit 20 and a heat conduction member 30;

the CPU01 is disposed in the chassis 02, and the first heat dissipation unit 10 is in contact with the CPU 01; the first heat dissipating unit 10 includes a first mounting member 102 mounted and fixed to the first heat dissipating unit 10.

The first heat dissipation unit 10 includes a first heat-uniforming plate 101 and a first heat transfer member 103, one side surface of the first heat-uniforming plate 101 is in contact with a surface of the CPU01, the first heat transfer member 103 is disposed on the other side surface of the first heat-uniforming plate 101, and the first heat transfer member 103 is connected to one end of the heat conductive member 30. The first heat-homogenizing plate 101 ensures the contact area with the CPU01, absorbs the heat of the CPU01 in time and transmits the heat to the first heat-transferring piece 103; the first heat transfer member 103 transfers heat to the heat conductive member 30.

The first mounting member 102 is connected to the first soaking plate 101. To achieve contact stability of the first heat uniforming plate 101 with the CPU 01. Two first mounting pieces 102 are arranged and are in a strip plate shape; two first mounting pieces 102 are symmetrically distributed on two sides of the first heat homogenizing plate 101. Ensuring sufficient contact stability of the first soaking plate 101 with the CPU 01.

The second heat dissipation unit 20 is in contact with the chassis 02; the second heat dissipating unit 20 includes a second mounting member 202 mounted and fixed to the second heat dissipating unit 20.

The second heat dissipation unit 20 includes a second heat-distributing plate 201 and a second heat transfer member 203, one side surface of the second heat-distributing plate 201 contacts with the inner wall of the case 02, the second heat transfer member 203 is disposed on the other side surface of the second heat-distributing plate 201, and the second heat transfer member 203 is connected with the other end of the heat conduction member 30. The second heat-homogenizing plate 201 ensures a contact area with the cabinet 02, absorbs heat transferred from the heat-conducting member 30 to the second heat-transferring member 203 in time, and transfers the heat to the cabinet 02.

The second mounting member 202 is connected to the second soaking plate 201. So as to realize the contact stability of the second heat uniforming plate 201 and the cabinet 02. Two second mounting pieces 202 are arranged, and the two second mounting pieces 202 are symmetrically distributed on two sides of the second uniform heating plate 201; the second mounting part 202 comprises two mounting claws, the two mounting claws in the same second mounting part 202 are arranged at intervals, and extension lines of the two mounting claws are in a cross shape. Because the inner wall of machine case 02 has more usable space, when realizing to be connected firmly with machine case 02 through the erection claw, the area of contact of increase more does benefit to the heat dissipation.

The first heat homogenizing plate 101 and the second heat homogenizing plate 201 are both made of copper. To improve the heat conduction effect.

In this embodiment, the heat dissipation units are uniformly heat-distributing plates, each heat-distributing plate is a metal contact plate, and the front surface and the back surface of each heat-conducting plate are both used as heat-conducting surfaces, so that smooth heat dissipation is ensured, and the contact area is increased; the heat radiating unit also adopts a heat transfer element which can be fixed on the uniform heat plate in a welding mode, and the heat transfer element 3030 is connected with the two heat transfer elements to play a role in transferring heat between the uniform heat plates.

The heat dissipating unit adopts a mounting member as a fixing structure, the mounting member can be fixedly connected with the heat spreader plate by welding, the mounting member is fixed to the corresponding structure by a fastening member such as a screw, the first mounting member 102 is fixed to the CPU01, and is actually fixed to a circuit board, such as a motherboard, carried by the CPU 01; the second mounting member 202 is fixed to the housing 02.

The heat conductive member 30 connects the first heat transfer member 103 with the second heat transfer member 203.

The first heat transfer member 103, the second heat transfer member 203 and the heat conduction member 30 are heat pipes. The quick heat transfer is realized.

The heat pipe is a heat transfer element which transfers heat by means of the phase change of working liquid in the heat pipe, the first heat transfer element 103, the second heat transfer element 203 and the heat conduction element 30 can be a complete heat pipe, at the moment, the first end of the heat pipe is connected with the first heat-distributing plate 101 corresponding to the CPU01, the second end of the heat pipe is connected with the second heat-distributing plate 201 corresponding to the case 02, and the heat dissipation guided to the case 02 by the CPU01 is realized through the first heat-distributing plate 101, the heat pipe and the second heat-distributing plate 201.

The first heat dissipation unit 10 and/or the second heat dissipation unit 20 are further provided with heat dissipation fins. The efficiency of heat absorption is increased through the radiating fins, and preparation conditions are provided for conducting heat outwards.

It should also be understood that the present embodiment is applicable to a case where the first heat dissipating unit 10 is provided with heat dissipating fins, or the second heat dissipating unit 20 is provided with heat dissipating fins, or both the first heat dissipating unit 10 and the second heat dissipating unit 20 are provided with heat dissipating fins.

In this embodiment, the heat of the CPU01 is transferred to the top of the housing of the chassis 02 through a heat pipe, so that the metal parts of the entire chassis 02 can participate in heat dissipation;

the number and size of the heat pipes can be determined according to the TDP parameter ("Thermal Design Power" abbreviation, meaning "heat dissipation Design Power" is a parameter of the CPU01, and is used as a reference for designing the heat sink) of the CPU01, and if the material of the housing 02 is aluminum, or a certain number of fins are designed on the top and back, the heat dissipation effect is better.

It should be noted that the front panel of the housing 02 is made of plastic, so that the heat generated by the metal part does not affect the operation comfort of the user on the front panel.

The CPU01 heat sink is suitable for the heat dissipation condition of the CPU01, and the CPU01 may be specifically referred to as a CPU01 suitable for a PC. The current way of cooling the CPU01 on a PC (personal computer) is generally realized by hardware such as a fan and a radiator, and the work of the fan inevitably generates noise, which affects the attention and mood of a user in a quiet office environment; the heat dissipation device of the CPU01 in the embodiment changes the heat dissipation mode, so that the heat dissipation requirement on the CPU01 is met, the system use and hardware operation are not influenced, the noise can be reduced, the effect of 0 noise can be achieved, and a more comfortable use environment is provided for a PC user.

According to the cooling and noise reducing host, in the working process of the CPU heat dissipation device, heat emitted by a CPU is transferred to the first heat dissipation unit in a direct contact heat transfer mode, the first heat dissipation unit transfers the heat emitted by the CPU to the second heat dissipation unit through the heat conduction piece, the second heat dissipation unit transfers the heat to the case in a direct contact heat transfer mode, the case diffuses the heat to the external space, and at the moment, the whole case structure participates in the heat dissipation process, so that the heat dissipation effect is guaranteed, the cooling and noise reducing host is different from the traditional air cooling heat dissipation, noise emitted by rotation of a fan is avoided, the noise reducing effect is achieved, and the environmental comfort of a user is improved. The first mounting piece and the second mounting piece are used for respectively realizing connection and fixation of the first heat dissipation unit and the second heat dissipation unit corresponding to the CPU and the case, so that stability of a heat dissipation process is guaranteed.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The terms "upper", "lower", "outside", "inside" and the like in the description and claims of the present invention and the above drawings are used for distinguishing relative positions if any, and are not necessarily given qualitatively. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling and noise reducing host is characterized by comprising a case (02), a CPU (01), a first heat dissipation unit (10), a second heat dissipation unit (20) and a heat conducting piece (30);

the CPU (01) is arranged in the case (02), and the first heat dissipation unit (10) is in contact with the CPU (01); the first heat dissipation unit (10) internally comprises a first mounting piece (102) for mounting and fixing the first heat dissipation unit (10);

the second heat dissipation unit (20) is in contact with the case (02); the second heat dissipation unit (20) internally comprises a second mounting piece (202) for mounting and fixing the second heat dissipation unit (20);

the heat-conducting member (30) connects the first heat-dissipating unit (10) and the second heat-dissipating unit (20).

2. The cooling and noise reducing main machine according to claim 1, wherein the first heat dissipation unit (10) comprises a first heat distribution plate (101) and a first heat transfer member (103), one side surface of the first heat distribution plate (101) is in contact with the surface of the CPU (01), the first heat transfer member (103) is disposed on the other side surface of the first heat distribution plate (101), and the first heat transfer member (103) is connected with one end of the heat transfer member (30).

3. A cooling and noise reducing main unit according to claim 2, wherein the first mounting member (102) is connected to the first heat homogenizing plate (101).

4. The cooling and noise reducing main machine according to claim 3, wherein two first mounting pieces (102) are provided, and are both in the shape of a strip plate; the two first mounting pieces (102) are symmetrically distributed on two sides of the first heat homogenizing plate (101).

5. A cooling and noise reducing main unit according to claim 2, wherein the second heat dissipation unit (20) comprises a second heat distribution plate (201) and a second heat transfer element (203), one side surface of the second heat distribution plate (201) is in contact with the inner wall of the case (02), the second heat transfer element (203) is disposed on the other side surface of the second heat distribution plate (201), and the second heat transfer element (203) is connected to the other end of the heat transfer element (30).

6. A cooling and noise reducing main machine according to claim 5, wherein the second mounting member (202) is connected with the second heat homogenizing plate (201).

7. A cooling and noise reducing main machine according to claim 6, wherein there are two second mounting pieces (202), and the two second mounting pieces (202) are symmetrically distributed on two sides of the second heat homogenizing plate (201); the second mounting part (202) comprises two mounting claws, the two mounting claws in the same second mounting part (202) are arranged at intervals, and extension lines of the two mounting claws are crossed.

8. A cooling and noise reducing main machine according to claim 5, wherein the first heat homogenizing plate (101) and the second heat homogenizing plate (201) are both made of copper.

9. A cooling and noise reducing main machine according to claim 8, wherein the first heat transfer member (103), the second heat transfer member (203) and the heat conduction member (30) are all heat pipes.

10. The cooling and noise reducing main machine according to any one of claims 1 to 9, wherein the first heat dissipating unit (10) and/or the second heat dissipating unit (20) are further provided with heat dissipating fins.