CN220773539U - Heat radiation structure for computer - Google Patents

Abstract

The utility model relates to the technical field of radiators and discloses a heat radiation structure for a computer, which comprises a plurality of heat conduction copper pipes, wherein the outer walls of the heat conduction copper pipes are fixedly connected with a plurality of heat radiation fins, the upper side and the lower side of each heat radiation fin are provided with connecting pieces, the connecting pieces are fixed on the heat conduction copper pipes, the connecting pieces on adjacent heat conduction copper pipes are connected together through bolts, and the lower parts of the heat conduction copper pipes are fixedly provided with heat conduction plate assemblies. The spliced heat-conducting copper pipe structure can be used by freely combining different numbers of heat-conducting copper pipes according to the heat dissipation requirement of a computer chip, is more flexible in use compared with an integrated heat dissipation structure, improves the structural universality, only needs to replace the corresponding damaged heat-conducting copper pipe when the heat-conducting structure is damaged, does not need the whole replacement, reduces the maintenance cost, and is more convenient to clean in the later period.

Description

Heat radiation structure for computer

Technical Field

The utility model belongs to the technical field of radiators, and particularly relates to a radiating structure for a computer.

Background

Computers are very popular office equipment in the current society, generally, the computers are composed of a case and a display, more electronic components are combined in the case, the higher the requirements of people on high-speed processing of big data and complexity of data processing are, the higher the functional requirements of a CPU processor are, the more the heating value is increased, the higher the temperature of a CPU, a display card or other devices is, the lower the frequency of the CPU and the display card is automatically reduced, the performance is reduced, and the serious problem is that the dead halt, automatic restarting and even burning occur. Good heat dissipation of the CPU is particularly important.

The computer CPU heat sink as disclosed in the publication number CN216848683U is mainly characterized in that: the heat-conducting tube comprises a base, a heat-conducting tube, a heat-radiating fin group, a CPU and a fan, wherein the base is fixed with the bottom of the heat-conducting tube, the heat-radiating fin group is positioned on the tube of the heat-conducting tube, the fan is fixed on the side face of the heat-radiating fin group, a fan frame is arranged on the side face of the fan, the fan frame comprises a fixing seat, a plurality of connecting plates and a plurality of annular plates are fixed on one side of the fixing seat, and a circular plate is integrally formed in the middle of each connecting plate.

In use, the applicant found that: above-mentioned computer radiator is integrated into one piece structure, can't freely adjust different heat dissipation copper pipe quantity according to the heat dissipation demand of computer chip, uses nimble commonality not good, just needs whole change when damaging simultaneously, and equipment maintenance cost is high, and inside difficult clearance of monolithic structure when the clearance of radiator, in order to solve the problem that above-mentioned proposes, proposes a heat radiation structure for computer.

Disclosure of Invention

The utility model aims at: in order to solve the above-mentioned problem, a heat dissipation structure for a computer is provided.

The technical scheme adopted by the utility model is as follows: the utility model provides a heat radiation structure for computer, includes a plurality of heat conduction copper pipes, the outer wall fixedly connected with of heat conduction copper pipe a plurality of fin, both sides are provided with the connecting piece about the fin, the connecting piece is fixed on the heat conduction copper pipe, adjacent on the heat conduction copper pipe the connecting piece passes through bolted connection together, the lower part fixed mounting of heat conduction copper pipe has the heat conduction board subassembly.

In a preferred embodiment, the heat conducting copper pipe is of a U-shaped structure.

In a preferred embodiment, the connection member is fixedly mounted with a heat radiation fan by bolts.

In a preferred embodiment, the heat conducting plate assembly comprises an upper guide plate and a lower guide plate, the heat conducting copper pipe is arranged between the upper guide plate and the lower guide plate, and a heat conducting contact plate is arranged at the bottom of the lower guide plate.

In a preferred embodiment, the bottom of the upper guide plate is provided with a plurality of arc-shaped grooves I.

In a preferred embodiment, the bottom of the lower guide plate is provided with a plurality of arc-shaped grooves II.

In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:

1. according to the utility model, the spliced heat conduction copper pipe structure can be used by freely combining different numbers of heat conduction copper pipes according to the heat dissipation requirement of the computer chip, compared with the integrated heat dissipation structure, the spliced structure is more flexible to use, the structure universality is improved, when the heat conduction structure is damaged, only the corresponding damaged heat conduction copper pipe is needed to be replaced, the whole replacement is not needed, the maintenance cost can be reduced, the later detachable maintenance is realized, and the radiator can be cleaned more conveniently.

Drawings

FIG. 1 is a schematic diagram of a three-dimensional structure of the present utility model;

FIG. 2 is a schematic diagram of the front view of the present utility model;

FIG. 3 is a schematic perspective view of the connection structure on the heat conducting copper pipe in the utility model;

FIG. 4 is a schematic view showing the three-dimensional structure of the upper guide plate of the present utility model;

FIG. 5 is a schematic view showing a perspective structure of a lower guide plate in the present utility model.

The marks in the figure: 1-heat conduction copper pipe, 2-radiating fin, 3-connecting piece, 4-heat conduction plate subassembly, 5-radiator fan, 6-upper baffle, 7-lower baffle, 8-heat conduction touch panel, 9-arc recess I, 10-arc recess II.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described in the following in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

A heat dissipation structure for a computer according to an embodiment of the present utility model will be described in detail with reference to fig. 1 to 5.

Examples:

the embodiment of the utility model provides a heat radiation structure for a computer, which is shown by referring to figures 1, 2 and 3, and comprises a plurality of heat conduction copper pipes 1, wherein the outer walls of the heat conduction copper pipes 1 are fixedly connected with a plurality of heat radiation fins 2, the upper side and the lower side of each heat radiation fin 2 are provided with connecting pieces 3, the connecting pieces 3 are fixed on the heat conduction copper pipes 1, the connecting pieces 3 on adjacent heat conduction copper pipes 1 are connected together through bolts, the lower parts of the heat conduction copper pipes 1 are fixedly provided with heat conduction plate assemblies 4, the heat conduction plate assemblies 4 are utilized to conduct heat in a fitting contact manner with a computer chip, then heat is transferred to the heat conduction copper pipes 1, and then the heat radiation area of the heat conduction copper pipes 1 is enlarged through the heat radiation fins 2, so that rapid heat radiation is realized;

the heat conduction copper pipes 1 in the structure are combined together through the connecting piece 3, so that a multi-pipe heat dissipation mechanism is formed, the structure can be used for freely combining different numbers of heat conduction copper pipes 1 according to the heat dissipation requirement of a computer chip, compared with the heat dissipation structure in an integrated mode, the heat conduction copper pipes 1 are assembled to be more flexible in use, when the heat conduction structure is damaged, only the corresponding damaged heat conduction copper pipes 1 are required to be replaced, the whole replacement is not required, the maintenance cost can be reduced, the later-stage detachable maintenance is realized, and the radiator can be cleaned more conveniently.

Referring to fig. 3, the heat conduction copper pipe 1 has a U-shaped structure.

Referring to fig. 1 and 2, the connection member 3 is fixedly mounted with a heat radiation fan 5 by bolts, and this structure accelerates the flow of air by the heat radiation fan 5, so that the heat radiation fins 2 can be rapidly guided out.

Referring to fig. 1 and 2, the heat conduction plate assembly 4 includes an upper guide plate 6 and a lower guide plate 7, the heat conduction copper tube 1 is disposed between the upper guide plate 6 and the lower guide plate 7, a heat conduction contact plate 8 is disposed at the bottom of the lower guide plate 7, the heat conduction copper tube 1 is clamped by the upper guide plate 6 and the lower guide plate 7, and the heat conduction copper tube 1 is in contact with the heat conduction plate assembly 4, and the heat conduction contact plate 8 is in contact with the computer chip.

Referring to fig. 4 and 5, a plurality of arc grooves one 9 are formed in the bottom of the upper guide plate 6, the arc grooves one 9 are used for adapting to the radian of the outer wall of the heat conduction copper pipe 1, so that the upper guide plate 6 is tightly attached to the heat conduction copper pipe 1, a plurality of arc grooves two 10 are formed in the bottom of the lower guide plate 7, the arc grooves two 10 are used for adapting to the radian of the outer wall of the heat conduction copper pipe 1, and therefore the lower guide plate 7 is tightly attached to the heat conduction copper pipe 1.

The implementation principle of the heat dissipation structure for the computer in the embodiment of the application is as follows: when the heat dissipation device is used, according to the heat dissipation requirement of a computer chip, a person connects a required number of heat conduction copper pipes 1 together through a connecting piece 3, then connects a heat dissipation fan 5 with the connecting piece 3, then selects a proper upper guide plate 6 and a proper lower guide plate 7 according to the number of the heat conduction copper pipes 1, then clamps the heat conduction copper pipes 1 by utilizing the upper guide plate 6 and the lower guide plate 7, thereby connecting a heat conduction plate assembly 4 with the heat conduction copper pipes 1, then attaching and contacting a heat conduction contact plate 8 of the lower guide plate 7 with the computer chip, attaching and contacting the heat conduction plate assembly 4 with the computer chip at the moment for heat conduction, then transferring heat to the heat conduction copper pipes 1, and expanding the heat dissipation area of the heat conduction copper pipes 1 through the heat dissipation fins 2, thereby realizing rapid heat dissipation.

It should be noted that: the structure is applied to heat dissipation of a computer.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (6)

1. The utility model provides a heat radiation structure for computer, includes a plurality of heat conduction copper pipe (1), its characterized in that: the heat conduction copper pipe is characterized in that a plurality of radiating fins (2) are fixedly connected to the outer wall of the heat conduction copper pipe (1), connecting pieces (3) are arranged on the upper side and the lower side of each radiating fin (2), each connecting piece (3) is fixed on the corresponding heat conduction copper pipe (1), the connecting pieces (3) on the adjacent heat conduction copper pipes (1) are connected together through bolts, and a heat conduction plate assembly (4) is fixedly arranged on the lower portion of each heat conduction copper pipe (1).

2. A heat dissipating structure for a computer as set forth in claim 1, wherein: the heat conduction copper pipe (1) is of a U-shaped structure.

3. A heat dissipating structure for a computer as set forth in claim 1, wherein: the connecting piece (3) is fixedly provided with a cooling fan (5) through bolts.

4. A heat dissipating structure for a computer as set forth in claim 1, wherein: the heat conduction plate assembly (4) comprises an upper guide plate (6) and a lower guide plate (7), the heat conduction copper pipe (1) is arranged between the upper guide plate (6) and the lower guide plate (7), and a heat conduction contact plate (8) is arranged at the bottom of the lower guide plate (7).

5. The heat dissipation structure for a computer as recited in claim 4, wherein: the bottom of the upper guide plate (6) is provided with a plurality of arc grooves I (9).

6. The heat dissipation structure for a computer as recited in claim 4, wherein: the bottom of the lower guide plate (7) is provided with a plurality of arc-shaped grooves II (10).