CN216700449U - Circuit board for digital product - Google Patents
Circuit board for digital product Download PDFInfo
- Publication number
- CN216700449U CN216700449U CN202220114522.4U CN202220114522U CN216700449U CN 216700449 U CN216700449 U CN 216700449U CN 202220114522 U CN202220114522 U CN 202220114522U CN 216700449 U CN216700449 U CN 216700449U
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- groove
- mounting groove
- heat dissipation
- heat
- circuit board
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Abstract
The utility model discloses a circuit board for a digital product, which comprises a structure main body, wherein the structure main body comprises a circuit main board, an installation angle groove, an overhead pad, an installation screw hole, an installation screw, an interface installation groove and an interface connection sheet, an internal groove structure is arranged in the structure main body, the internal groove structure comprises a heat dissipation plate installation groove, an upper element installation groove, a lower element installation groove and a heat conduction groove, a heat dissipation structure is arranged in the internal groove structure, the heat dissipation structure comprises a heat dissipation main board, a heat conduction plate and a heat dissipation sheet, the installation angle groove is arranged at the four corners of the circuit main board, the overhead pad is fixedly welded and installed below the installation angle groove, and the installation screw hole is arranged at the bottom of the installation angle groove and the overhead pad in an inserting manner. According to the circuit board for the digital product, the design of the double-sided circuit main board provides a larger operation area by the surface area of the wired circuit main board, and the circuit board has stronger performance and a certain autonomous heat dissipation function.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a circuit board for a digital product.
Background
The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, and is an essential core component in the existing electronic products;
patent numbers: CN214070235U discloses "a circuit board", which improves the heat dissipation uniformity and speed of the circuit board, and avoids affecting the structure and physical properties of the circuit board ", but its heat conducting structure occupies a certain surface area of the circuit board for soldering the circuit and electronic components, and the exposed heat dissipation structure needs to be bypassed when designing the circuit, thus increasing the difficulty of designing the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a circuit board for a digital product, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a circuit board for digital product, includes the structure main part, the structure main part includes circuit mainboard, installation angle groove, built on stilts pad foot, installation screw, interface mounting groove and interface connection piece, the inside internal groove structure of having seted up of structure main part, internal groove constructs including heating panel mounting groove, last component mounting groove, lower component mounting groove and heat derivation groove, install heat radiation structure in the internal groove structure, heat radiation structure includes heat dissipation mainboard, heat-conducting plate and fin.
Preferably, the four corners of the circuit main board are provided with mounting angle grooves, the lower parts of the mounting angle grooves are fixedly welded with overhead pad feet, and mounting screw holes are arranged at the bottoms of the mounting angle grooves and the overhead pad feet in an alternating manner.
Preferably, the mounting screw is mounted at the mounting screw hole, interface mounting grooves are formed in the front side and the rear side of the circuit main board, and interface connecting sheets are fixedly welded in the interface mounting grooves.
Preferably, an upper element mounting groove is formed above the heat dissipation plate mounting groove, a lower element mounting groove is formed below the heat dissipation plate mounting groove, and heat conducting grooves are formed in two sides of the heat dissipation plate mounting groove.
Preferably, the heat-conducting plates are fixedly welded on two sides of the heat-radiating main plate, and the heat-radiating fins are fixedly welded on one side of each heat-conducting plate.
Preferably, the heat dissipation plate mounting groove is formed in the circuit main plate, the upper component mounting groove is formed in the upper side surface of the circuit main plate, the lower component mounting groove is formed in the bottom side surface of the circuit main plate, the heat dissipation main plate is mounted in the heat dissipation plate mounting groove, and the heat conduction plate is mounted at the heat conducting groove.
Compared with the prior art, the utility model has the following beneficial effects:
in the utility model, during production, the circuit main board can be clamped by the auxiliary fixing tool for the mounting angle groove, the circuit and the electronic element device can be conveniently welded at the upper element mounting groove and the lower element mounting groove, the production efficiency can be improved to a certain degree, when the digital product is mounted, the circuit main board can be mounted in the digital product shell by utilizing the mounting screw hole and the mounting screw at the mounting angle groove, the overhead pad foot can lift the bottom side surface of the circuit main board and the inner side surface of the digital product shell for a certain distance to provide a certain mounting space for the electronic element mounted at the lower element mounting groove, the double-sided circuit main board is designed, a larger operation area is provided by the surface area of the wired circuit main board, so that the digital product has stronger performance, and when the digital product is used, the heat energy generated when the electronic element and the circuit at the upper element mounting groove and the lower element mounting groove operate is absorbed by the heat dissipation main board in the heat dissipation plate mounting groove, the heat conducting plate conducts to the radiating fins to carry out radiating work, radiating holes can be formed in the digital product shell close to the radiating fins, radiating work is facilitated, and a certain autonomous radiating function is achieved.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a circuit board for a digital product according to the present invention;
FIG. 2 is a schematic diagram of a circuit board for digital products according to the present invention;
FIG. 3 is a schematic diagram of an internal slot structure of a circuit board for a digital product according to the present invention;
fig. 4 is a schematic diagram of a heat dissipation structure of a circuit board for a digital product according to the present invention.
In the figure: 1. a structural body; 101. a circuit main board; 102. mounting an angle groove; 103. an overhead foot pad; 104. mounting a screw hole; 105. mounting screws; 106. an interface mounting groove; 107. an interface connecting sheet; 2. an inner channel structure; 201. a heat dissipation plate mounting groove; 202. an upper component mounting slot; 203. a lower element mounting groove; 204. a heat conducting-out groove; 3. a heat dissipation structure; 301. a heat dissipation main board; 302. a heat conducting plate; 303. and a heat sink.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1 to 4, a circuit board for digital products comprises a structure body 1, wherein the structure body 1 comprises a circuit main board 101, an installation angle slot 102, an overhead pad foot 103, an installation screw hole 104, an installation screw 105, an interface installation slot 106 and an interface connection sheet 107, an internal slot 2 is arranged inside the structure body 1, the internal slot 2 comprises a heat dissipation plate installation slot 201, an upper element installation slot 202, a lower element installation slot 203 and a heat conduction slot 204, a heat dissipation structure 3 is arranged inside the internal slot 2, and the heat dissipation structure 3 comprises a heat dissipation main board 301, a heat conduction plate 302 and a heat dissipation fin 303;
Example two:
it should be noted that, the present invention is a circuit board for digital products, during production, the circuit board 101 can be clamped by the auxiliary fixing tool of the installation angle slot 102, the welding of the circuit and the electronic component at the upper component installation slot 202 and the lower component installation slot 203 is facilitated, and the production efficiency can be improved to a certain extent, when in installation, the circuit board 101 can be installed in the digital product casing by using the installation screw hole 104 and the installation screw 105 at the installation angle slot 102, the overhead foot pad 103 can lift the bottom side surface of the circuit board 101 and the inner side surface of the digital product casing for a certain distance, so as to provide a certain installation space for the electronic component installed at the lower component installation slot 203, the design of the double-sided circuit board 101, with the surface area of the wired circuit board 101, provide a larger operation area, so that the digital product has stronger performance, when in use, the heat energy generated when the electronic component and the circuit at the upper component installation slot 202 and the lower component installation slot 203 run, the heat dissipation plate is absorbed by the heat dissipation main plate 301 in the heat dissipation plate installation groove 201 and is conducted to the heat dissipation fins 303 by the heat conduction plate 302 for heat dissipation work, and heat dissipation holes can be formed in the digital product shell close to the heat dissipation fins 303, so that the heat dissipation work is facilitated, and a certain autonomous heat dissipation function is achieved.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. A circuit board for a digital product, comprising: including main structure body (1), main structure body (1) includes circuit mainboard (101), installation angle groove (102), built on stilts pad foot (103), installation screw (104), installation screw (105), interface mounting groove (106) and interface connection piece (107), main structure body (1) is inside to have seted up inside groove structure (2), inside groove structure (2) are including heating panel mounting groove (201), last component mounting groove (202), lower component mounting groove (203) and heat derivation groove (204), install heat radiation structure (3) in inside groove structure (2), heat radiation structure (3) are including heat dissipation mainboard (301), heat-conducting plate (302) and fin (303).
2. A circuit board for a digital product according to claim 1, wherein: the circuit board is characterized in that mounting angle grooves (102) are formed in four corners of the circuit board (101), overhead pad feet (103) are fixedly welded below the positions where the mounting angle grooves (102) are formed, and mounting screw holes (104) are formed in the bottoms of the mounting angle grooves (102) and the overhead pad feet (103) in an inserting mode.
3. A circuit board for a digital product according to claim 2, wherein: installation screw (105) are installed to installation screw hole (104) department, interface mounting groove (106) have been seted up to side both sides around circuit mainboard (101), interface connection piece (107) are installed to interface mounting groove (106) internal fixation welding.
4. A circuit board for a digital product according to claim 3, wherein: an upper element mounting groove (202) is formed above the heat dissipation plate mounting groove (201), a lower element mounting groove (203) is formed below the heat dissipation plate mounting groove (201), and heat conducting grooves (204) are formed in two sides of the heat dissipation plate mounting groove (201).
5. The circuit board of claim 4, wherein: heat-conducting plate (302) are installed to heat dissipation mainboard (301) both sides fixed welding, heat-conducting plate (302) one side fixed welding installs fin (303).
6. The circuit board of claim 5, wherein: the heat dissipation plate mounting groove (201) is formed in the circuit main plate (101), the upper element mounting groove (202) is formed in the upper side surface of the circuit main plate (101), the lower element mounting groove (203) is formed in the bottom side surface of the circuit main plate (101), the heat dissipation main plate (301) is mounted in the heat dissipation plate mounting groove (201), and the heat conduction plate (302) is mounted at the heat conducting groove (204).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220114522.4U CN216700449U (en) | 2022-01-17 | 2022-01-17 | Circuit board for digital product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220114522.4U CN216700449U (en) | 2022-01-17 | 2022-01-17 | Circuit board for digital product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216700449U true CN216700449U (en) | 2022-06-07 |
Family
ID=81821907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220114522.4U Active CN216700449U (en) | 2022-01-17 | 2022-01-17 | Circuit board for digital product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216700449U (en) |
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2022
- 2022-01-17 CN CN202220114522.4U patent/CN216700449U/en active Active
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