CN219812289U - Double-layer circuit board with high heat dissipation - Google Patents
Double-layer circuit board with high heat dissipation Download PDFInfo
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- CN219812289U CN219812289U CN202320580447.5U CN202320580447U CN219812289U CN 219812289 U CN219812289 U CN 219812289U CN 202320580447 U CN202320580447 U CN 202320580447U CN 219812289 U CN219812289 U CN 219812289U
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- heat
- heat conducting
- cover plate
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- curved
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 claims abstract description 71
- 239000010949 copper Substances 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-heat-dissipation double-layer circuit board, which comprises an upper main board and a lower main board, wherein the upper main board is positioned above the lower main board, a heat conducting base plate is fixedly connected between the upper main board and the lower main board, heat conducting seats are fixedly connected to the left side and the right side of the heat conducting base plate, a first curved heat conducting copper sheet, a second curved heat conducting copper sheet, a heat conducting copper strip and a convex heat conducting strip are embedded on the upper surface and the lower surface of the heat conducting base plate, the thickness of the heat conducting copper strip is increased, a bulge and a complex heat exchange structure are not required to be arranged on the upper side and the lower side of the heat conducting base plate, the heat conducting structure is added under the condition that the normal installation and the use of the circuit board are not influenced, the design structure is more reasonable, the convex heat conducting strip is fixedly arranged in an installation groove on the top side of the lower cover board, an exhaust fan is started, and the exhaust fan can rapidly conduct heat conducted to the convex heat conducting strip to the heat conducting base plate to realize high-efficiency heat dissipation, and the circuit board can also conduct high-efficiency ventilation and heat dissipation operation under the environment with low ventilation efficiency.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a double-layer circuit board with high heat dissipation.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.
In the prior art, the integration level of the electronic product is higher and higher, so that a double-layer main board appears on the market, but the double-layer of the prior art has the following defects: the heat dissipation performance is relatively poor, the mainboard cannot obtain enough heat dissipation, the application number 202122142804.3 discloses a high-heat dissipation double-layer circuit board, the high-heat dissipation double-layer circuit board comprises a lower mainboard and an upper mainboard, a heat dissipation mechanism is arranged between the lower mainboard and the upper mainboard, the heat dissipation mechanism comprises a heat dissipation plate, the heat dissipation plate is arranged at the bottom of the lower mainboard, a through hole is formed in the middle of the heat dissipation plate, the front end and the rear end of the through hole are communicated with the front end and the rear end of the heat dissipation plate, a groove is formed in the bottom of the heat dissipation plate, and the groove is communicated with the bottom of the heat dissipation plate; the device is that the radiating plate is added in the middle of the circuit board, and the groove cavity is formed in the radiating plate, so that the thickness of the whole circuit board is increased, normal use is affected, the requirement on the air circulation rate is too high, and when the ventilation efficiency is low, the ventilation heat exchange structure in the radiating plate can affect the whole radiating efficiency of the circuit board.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
Aiming at the problems in the related art, the utility model provides a double-layer circuit board with high heat dissipation so as to overcome the technical problems in the prior art.
For this purpose, the utility model adopts the following specific technical scheme:
the utility model provides a high radiating double-deck circuit board, includes mainboard, lower mainboard, it is located the mainboard top down to go up the mainboard, fixedly connected with heat conduction base plate between last mainboard and the lower mainboard, the equal fixedly connected with heat conduction seat in heat conduction base plate left and right sides.
Preferably, the upper side and the lower side of the heat conducting substrate are respectively embedded and fixed with a first curved heat conducting copper sheet, one side of the first curved heat conducting copper sheet is provided with a second curved heat conducting copper sheet, and the top sides of the first curved heat conducting copper sheet and the second curved heat conducting copper sheet are all flush with the upper side and the lower side of the heat conducting substrate.
Preferably, the two ends of the first curved heat conducting copper sheet and the second curved heat conducting copper sheet are respectively and fixedly connected with a heat conducting copper strip, the outer side of the heat conducting copper strip is fixedly connected with a convex heat conducting sheet, the heat conducting copper strip and the convex heat conducting sheet are embedded in the upper side and the lower side of the heat conducting substrate, and the convex heat conducting sheet extends out of the heat conducting substrate.
Preferably, the outer surfaces of the first curved heat conducting copper sheet, the second curved heat conducting copper sheet, the heat conducting copper strip and the convex heat conducting sheet are coated with heat conducting silica gel.
Preferably, the heat conduction seat comprises an upper cover plate and a lower cover plate, the bottom side of the upper cover plate is fixedly connected with the lower cover plate, mounting grooves are respectively formed in the bottom side of the upper cover plate and the top side of the lower cover plate in a digging mode, the mounting grooves penetrate through the front sides of the upper cover plate and the lower cover plate, and the convex heat conduction sheets are fixedly connected with the bottom side of the inner wall of the mounting grooves of the lower cover plate.
Preferably, the top side of the lower cover plate is fixedly connected with an exhaust fan, the bottom side of the exhaust fan penetrates through the inside of the installation groove at the bottom of the upper cover plate, the inner sides of the upper cover plate and the lower cover plate are respectively fixedly connected with the upper main plate and the middle parts of the two sides of the lower main plate, the bottoms of the left side and the right side of the lower cover plate are respectively fixedly connected with a positioning plate, and connecting bolts are arranged on the positioning plates in a penetrating manner.
The beneficial effects of the utility model are as follows:
1. the first curved heat conducting copper sheet, the second curved heat conducting copper sheet, the heat conducting copper strip and the convex heat conducting strip are embedded in the upper surface and the lower surface of the heat conducting substrate, so that the thickness of the heat conducting copper strip is increased, the heat conducting structure is not required to be added under the condition that the normal installation and use of the circuit board are not affected, and the design structure is more reasonable;
2. the protruding type heat conducting strip is fixed to be set up inside the mounting groove of lower apron upside, starts the exhaust fan, and the exhaust fan can be quick carries out high-efficient heat dissipation with the heat that conducts to protruding type heat conducting strip, even under the environment at ventilation efficiency end, the circuit board also can carry out efficient ventilation, heat dissipation operation.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the overall structure of a high heat dissipation double-layer circuit board according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a top structure of a heat conductive substrate of a high heat dissipation dual-layer circuit board according to an embodiment of the present utility model;
fig. 3 is a schematic diagram of an internal structure of a heat conducting base of a double-layer circuit board with high heat dissipation according to an embodiment of the utility model.
In the figure:
1. an upper main board; 2. a lower main board; 3. a thermally conductive substrate; 4. a heat conduction seat; 5. the first curved heat conducting copper sheet; 6. a second curved thermally conductive copper sheet; 7. a thermally conductive copper strip; 8. convex heat conductive sheet; 9. thermally conductive silica gel; 10. an upper cover plate; 11. a lower cover plate; 12. a mounting groove; 13. an exhaust fan; 14. a positioning plate; 15. and (5) connecting bolts.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the utility model, a double-layer circuit board with high heat dissipation is provided.
Example 1
As shown in fig. 1-3, a high heat dissipation double-layer circuit board according to an embodiment of the utility model comprises an upper main board 1 and a lower main board 2, wherein the upper main board 1 is positioned above the lower main board 2, a heat conducting base plate 3 is fixedly connected between the upper main board 1 and the lower main board 2, heat conducting seats 4 are fixedly connected on the left side and the right side of the heat conducting base plate 3, first curved heat conducting copper sheets 5 are respectively embedded and fixed on the upper side and the lower side of the heat conducting base plate 3, a second curved heat conducting copper sheet 6 is arranged on one side of the first curved heat conducting copper sheet 5, the top sides of the first curved heat conducting copper sheets 5 and the second curved heat conducting copper sheets 6 are flush with the upper side and the lower side of the heat conducting base plate 3, heat conducting copper bars 7 are respectively fixedly connected on the two ends of the first curved heat conducting copper sheets 5 and the second curved heat conducting copper sheets 6, convex heat conducting sheets 8 are fixedly connected on the outer sides of the heat conducting copper bars 7 and the convex heat conducting sheets 8 are respectively embedded and arranged on the upper side and the lower side of the heat conducting base plate 3, the convex heat conducting fins 8 extend out of the heat conducting substrate 3, the heat conducting substrate 3 is arranged between the upper main board 1 and the lower main board 2, the first curved heat conducting copper sheets 5 and the second curved heat conducting copper sheets 6 on the upper side and the lower side of the heat conducting substrate 3 are respectively contacted with the bottom side of the upper main board 1 and the top side of the lower main board, so that the generated heat is absorbed and then transferred to the heat conducting copper strips 7 on the two ends of the heat conducting substrate, and transferred to the left side and the right side of the upper main board 1 and the lower main board 2 through the convex heat conducting fins 8, the first curved heat conducting copper sheets 5, the second curved heat conducting copper sheets 6, the heat conducting copper strips 7 and the convex heat conducting fins 8 are embedded with the upper surface and the lower surface of the heat conducting substrate 3, only the thickness of the heat conducting copper strips 7 is increased, the convex and complex heat exchanging structures are not required to be arranged on the upper side and the lower side of the heat conducting substrate 3, the heat conducting structures are added under the condition that the normal installation and the use of the circuit board are not affected, the design structure is more reasonable.
Example two
As shown in fig. 1-3, a high heat dissipation double-layer circuit board according to an embodiment of the present utility model includes an upper motherboard 1 and a lower motherboard 2, where the upper motherboard 1 is located above the lower motherboard 2, a heat conducting substrate 3 is fixedly connected between the upper motherboard 1 and the lower motherboard 2, the left and right sides of the heat conducting substrate 3 are fixedly connected with heat conducting bases 4, the outer surfaces of the first curved heat conducting copper sheet 5, the second curved heat conducting copper sheet 6, the heat conducting copper strip 7 and the convex heat conducting strip 8 are coated with heat conducting silica gel 9, and the heat conducting silica gel 9 is not coated outside the first curved heat conducting copper sheet 5, the second curved heat conducting copper sheet 6, the heat conducting copper strip 7 and the convex heat conducting strip 8, so that the heat transfer rate and the heat dissipation efficiency of the heat in the first curved heat conducting copper sheet 5, the second curved heat conducting copper sheet 6, the heat conducting copper strip 7 and the convex heat conducting strip 8 can be further improved.
Example III
As shown in fig. 1-3, a high heat dissipation double-layer circuit board according to an embodiment of the utility model comprises an upper main board 1 and a lower main board 2, wherein the upper main board 1 is positioned above the lower main board 2, a heat conducting base plate 3 is fixedly connected between the upper main board 1 and the lower main board 2, the left side and the right side of the heat conducting base plate 3 are fixedly connected with a heat conducting base 4, the heat conducting base 4 comprises an upper cover plate 10 and a lower cover plate 11, the bottom side of the upper cover plate 10 is fixedly connected with the lower cover plate 11, mounting grooves 12 are respectively dug on the bottom side of the upper cover plate 10 and the top side of the lower cover plate 11, the mounting grooves 12 penetrate through the front sides of the upper cover plate 10 and the lower cover plate 11, a convex heat conducting sheet 8 is fixedly connected with the bottom side of the inner wall of the mounting groove 12 of the lower cover plate 11, the top side of the lower cover plate 11 is fixedly connected with an exhaust fan 13, the bottom side of the exhaust fan 13 penetrates through the inside of the mounting groove 12 at the bottom of the upper cover plate 10, the upper cover plate 10 and the inner side of the lower cover plate 11 are fixedly connected with the middle parts of the two sides of the upper main plate 1 and the lower main plate 2 respectively, the bottoms of the left side and the right side of the lower cover plate 11 are fixedly connected with the positioning plates 14 respectively, the positioning plates 14 are penetrated with connecting bolts 15, the connecting bolts 15 are penetrated and installed on the positioning plates 14, the upper main plate 1 and the lower main plate 2 can be installed by utilizing the heat conducting base 4, after high heat is transferred to the convex heat conducting fins 8, the convex heat conducting fins 8 are fixedly arranged inside the installation grooves 12 on the top side of the lower cover plate 11, the exhaust fans 13 are started, and the exhaust fans 13 can rapidly conduct heat to the convex heat conducting fins 8 to conduct efficient heat dissipation, so that the circuit board can conduct efficient ventilation and heat dissipation operation even under the environment with low ventilation efficiency.
In summary, by means of the above technical scheme of the present utility model, when the device is used, the heat conducting base plate 3 is disposed between the upper main board 1 and the lower main board 2, the first curved heat conducting copper sheet 5 and the second curved heat conducting copper sheet 6 on the upper side and the lower side of the heat conducting base plate 3 respectively contact the bottom side of the upper main board 1 and the top side of the lower main board, so that the generated heat is absorbed, then transferred to the heat conducting copper strips 7 on the two ends of the heat conducting copper sheets, and transferred to the left side and the right side of the upper main board 1 and the lower main board 2 through the convex heat conducting strips 8, the first curved heat conducting copper sheet 5, the second curved heat conducting copper sheet 6, the heat conducting copper strips 7 and the convex heat conducting strips 8 are embedded in the upper surface and the lower surface of the heat conducting base plate 3, and the connecting bolts 15 are installed on the positioning plate 14 in a penetrating manner, after the high heat is transferred to the convex heat conducting strips 8, the convex heat conducting strips 8 are fixedly disposed in the installation grooves 12 on the top side of the lower cover board 11, the fan 13 is started, and the fan 13 can rapidly conduct the heat to the convex heat conducting strips 8, and the heat is efficiently dissipated to the heat conducting plate and the air-dissipating circuit at the bottom, and the high efficiency can also be used for ventilating the circuit.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (5)
1. The utility model provides a high radiating double-deck circuit board, includes mainboard (1), lower mainboard (2), its characterized in that, last mainboard (1) is located mainboard (2) top down, fixedly connected with heat conduction base plate (3) between last mainboard (1) and the lower mainboard (2), heat conduction base plate (3) both sides all fixedly connected with heat conduction seat (4), heat conduction base plate (3) upper and lower both sides inlay respectively and are fixed with first curved heat conduction copper sheet (5), first curved heat conduction copper sheet (5) one side is equipped with second curved heat conduction copper sheet (6), first curved heat conduction copper sheet (5), second curved heat conduction copper sheet (6) top side all with heat conduction base plate (3) upper and lower both sides parallel and level.
2. The high-heat-dissipation double-layer circuit board according to claim 1, wherein the two ends of the first curved heat-conducting copper sheet (5) and the second curved heat-conducting copper sheet (6) are respectively fixedly connected with a heat-conducting copper strip (7), the outer side of the heat-conducting copper strip (7) is fixedly connected with a convex heat-conducting strip (8), the heat-conducting copper strip (7) and the convex heat-conducting strip (8) are embedded in the upper side and the lower side of the heat-conducting substrate (3), and the convex heat-conducting strip (8) extends out of the heat-conducting substrate (3).
3. The high heat dissipation double-layer circuit board according to claim 2, wherein the outer surfaces of the first curved heat conducting copper sheet (5), the second curved heat conducting copper sheet (6), the heat conducting copper strips (7) and the convex heat conducting fins (8) are coated with heat conducting silica gel (9).
4. The high-heat-dissipation double-layer circuit board according to claim 3, wherein the heat conduction seat (4) comprises an upper cover plate (10) and a lower cover plate (11), the bottom side of the upper cover plate (10) is fixedly connected with the lower cover plate (11), mounting grooves (12) are respectively dug on the bottom side of the upper cover plate (10) and the top side of the lower cover plate (11), the mounting grooves (12) penetrate through the front sides of the upper cover plate (10) and the lower cover plate (11), and the convex heat conduction sheets (8) are fixedly connected with the bottom side of the inner wall of the mounting grooves (12) of the lower cover plate (11).
5. The high-heat-dissipation double-layer circuit board according to claim 4, wherein the top side of the lower cover plate (11) is fixedly connected with an exhaust fan (13), the bottom side of the exhaust fan (13) penetrates through the inside of a mounting groove (12) at the bottom of the upper cover plate (10), the inner sides of the upper cover plate (10) and the lower cover plate (11) are respectively fixedly connected with the middle parts of two sides of the upper main plate (1) and the lower main plate (2), the bottoms of the left side and the right side of the lower cover plate (11) are respectively fixedly connected with a positioning plate (14), and connecting bolts (15) are respectively arranged on the positioning plates (14) in a penetrating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320580447.5U CN219812289U (en) | 2023-03-22 | 2023-03-22 | Double-layer circuit board with high heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320580447.5U CN219812289U (en) | 2023-03-22 | 2023-03-22 | Double-layer circuit board with high heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219812289U true CN219812289U (en) | 2023-10-10 |
Family
ID=88216274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320580447.5U Active CN219812289U (en) | 2023-03-22 | 2023-03-22 | Double-layer circuit board with high heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219812289U (en) |
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2023
- 2023-03-22 CN CN202320580447.5U patent/CN219812289U/en active Active
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