CN219421155U - Printed circuit board with good heat dissipation effect - Google Patents
Printed circuit board with good heat dissipation effect Download PDFInfo
- Publication number
- CN219421155U CN219421155U CN202320072799.XU CN202320072799U CN219421155U CN 219421155 U CN219421155 U CN 219421155U CN 202320072799 U CN202320072799 U CN 202320072799U CN 219421155 U CN219421155 U CN 219421155U
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- heat dissipation
- copper sheet
- dissipation effect
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a printed circuit board with good heat dissipation effect, which comprises a printed circuit board main body, wherein symmetrically arranged locking blocks are clamped between the outer walls of two sides of the printed circuit board main body, a supporting plate is fixedly arranged between the bottoms of the locking blocks, a supporting frame is arranged between the bottoms of the locking blocks, a heat dissipation copper sheet is laid between the surfaces of the supporting plate, heat conduction components distributed at equal intervals are inserted between the surfaces of the heat dissipation copper sheet and the bottom surface of the printed circuit board main body, and a ventilation component positioned at one end of the heat conduction component is arranged on the side wall of the heat dissipation copper sheet. The utility model has thinner overall thickness on the premise of ensuring the heat dissipation effect, can keep the overall miniaturization of the printed circuit board, can quickly reduce the temperature of the printed circuit board and prolongs the service life of the printed circuit board.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a printed circuit board with good heat dissipation effect.
Background
The names of the circuit boards are ceramic circuit boards, aluminum oxide ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper plates, impedance boards, PCBs, ultrathin circuit boards, printed circuit boards and the like, and the circuit boards enable circuits to be miniaturized and visualized, and play an important role in mass production of fixed circuits and optimizing layout of electric appliances. Because the circuit board generates heat when current passes through the circuit board during operation, the heat dissipation effect of the circuit board needs to be considered during design of the circuit board.
The application number CN202122538692.3 discloses a printed circuit board with good heat dissipation effect, which comprises a printed circuit board body, wherein the left side and the right side of the printed circuit board body are connected with a heat dissipation box through an adjusting mechanism. According to the utility model, the motor and the fan blades are arranged above the printed circuit board body, so that the motor drives the fan blades to rotate to heat the printed circuit board body, and the motor is placed in different grid spaces, so that the position of the motor can be adjusted, the motor is positioned above the main heating element, and the accurate heat dissipation is realized.
However, the above patent has the problem that the overall thickness of the printed circuit board is large due to the action of the adjusting rod and the transverse plate, and a larger space is required to be reserved when the printed circuit board is arranged, so that the structural size of the device is large.
Disclosure of Invention
The utility model mainly aims to provide the printed circuit board with good heat dissipation effect, which has thinner overall thickness on the premise of ensuring the heat dissipation effect, can keep the overall miniaturization of the printed circuit board, can quickly reduce the temperature of the printed circuit board, prolongs the service life of the printed circuit board and can effectively solve the problems in the background art.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a printed circuit board that radiating effect is good, includes the printed circuit board main part, all the joint has the locking piece that the symmetry set up between the both sides outer wall of printed circuit board main part, and installs between the bottom of locking piece and be fixed with the layer board, install the support frame between the bottom of locking piece, spread between the surface of layer board and dispel the heat copper sheet, it has equidistant distributed's heat conduction subassembly to peg graft between the surface of heat copper sheet and the bottom surface of printed circuit board main part, the ventilation module that is located heat conduction subassembly one end is installed to the lateral wall of heat copper sheet.
Further, the heat conduction subassembly includes forked tail card strip, heat conduction copper bar, round hole and rectangular hole, forked tail card strip laminating is at the surface of heat dissipation copper sheet, heat conduction copper bar butt is between the top of forked tail card strip and the bottom of printed circuit board main part, the inside structure of heat conduction copper bar has the rectangular hole and is the round hole that the symmetry set up with the rectangular hole.
Further, the ventilation assembly comprises a fixing plate, a vertical plate, a protective net and a miniature fan, wherein the fixing plate is fixed at the end part of the radiating copper sheet, the vertical plate is fixedly arranged on the surface of the end part of the fixing plate, an air inlet hole is formed in the side wall of the vertical plate, the protective net is welded and fixed in the air inlet hole, and the miniature fan is arranged on one side, close to the main body of the printed circuit board, of the vertical plate.
Further, a plurality of dovetail clamping grooves are formed in the surface of the supporting plate, and the dovetail clamping grooves are distributed at equal intervals.
Further, the bottom of the fixing plate is flush with the bottom of the radiating copper sheet.
Further, the number of the heat conducting components is equal to the number of the ventilation components.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the printed circuit board with good heat dissipation effect, the heat conduction assembly, the supporting plate and the supporting frame are arranged, the heat conduction assembly is arranged on the upper side of the supporting frame, the increase of the whole thickness of the printed circuit board body due to the heat dissipation effect of the printed circuit board body is avoided, and the whole miniaturization of the printed circuit board body is facilitated;
2. this printed circuit board that radiating effect is good, through ventilation module and the heat conduction subassembly that sets up, the heat that produces of the during operation of printed circuit board main part can be conducted fast to drive outside air fast cycle flow through ventilation module, in order to reduce the temperature of printed circuit board main part, the life of extension printed circuit board main part.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a printed circuit board with good heat dissipation effect according to the present utility model.
Fig. 2 is a schematic structural view of a locking block and a supporting plate of a printed circuit board with good heat dissipation effect.
Fig. 3 is a schematic structural diagram of a heat conductive assembly of a printed circuit board with good heat dissipation effect according to the present utility model.
Fig. 4 is a schematic structural diagram of a ventilation assembly of a printed circuit board with good heat dissipation effect according to the present utility model.
In the figure: 1. a printed circuit board main body; 2. a locking block; 3. a supporting plate; 4. a support frame; 5. a heat dissipation copper sheet; 6. a heat conducting component; 61. dovetail clamping strips; 62. a thermally conductive copper strip; 63. a round hole; 64. a rectangular hole; 7. a ventilation assembly; 71. a fixing plate; 72. a vertical plate; 73. a protective net; 74. a micro fan.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1-4, a printed circuit board with good heat dissipation effect comprises a printed circuit board main body 1, lock blocks 2 symmetrically arranged are clamped between the outer walls of two sides of the printed circuit board main body 1, a supporting plate 3 is fixedly arranged between the bottoms of the lock blocks 2, a supporting frame 4 is arranged between the bottoms of the lock blocks 2, a heat dissipation copper sheet 5 is paved between the surfaces of the supporting plate 3, a heat conduction assembly 6 distributed at equal intervals is inserted between the surfaces of the heat dissipation copper sheet 5 and the bottom surface of the printed circuit board main body 1, a ventilation assembly 7 positioned at one end of the heat conduction assembly 6 is arranged on the side wall of the heat dissipation copper sheet 5, the heat conduction assembly 6 comprises a dovetail clamping strip 61, a heat conduction copper strip 62, round holes 63 and rectangular holes 64, the dovetail clamping strip 61 is attached to the surface of the heat dissipation 5, the heat conduction copper strip 62 is abutted between the top of the dovetail clamping strip 61 and the bottom of the printed circuit board main body 1, the rectangular holes 64 and round holes 63 symmetrically arranged about the rectangular holes 64 are formed in the inner structure of the heat conduction copper strip 62, the ventilation assembly 7 comprises a fixing plate 71, a vertical plate 72, a protection net 73 and a micro fan 74, the fixing plate 71 is fixedly arranged at the end of the copper sheet 5, the fixing plate is fixedly arranged at the end of the bottom of the copper sheet 7, the fixing plate is close to the bottom of the copper sheet 7, the fixing plate is fixedly arranged at the end of the copper sheet 7, and is fixedly arranged at the bottom of the air inlet assembly 72, and is fixedly arranged on the bottom end of the copper sheet 7, and is close to the bottom of the air inlet assembly 72.
In order to facilitate the installation of the heat conducting component 6 on the surface of the supporting plate 3, as shown in fig. 1-3, the surface of the supporting plate 3 is configured with a plurality of dovetail clamping grooves, and the dovetail clamping grooves are distributed at equal intervals.
It should be noted that, the present utility model is a printed circuit board with good heat dissipation effect, when in use, the printed circuit board main body 1 generates a great amount of heat during working, then the printed circuit board main body 1 conducts the heat to the surface of the heat dissipation copper sheet 5 through the dovetail clamping strip 61 by the heat conduction copper strip 62 attached to the printed circuit board main body, and under the action of the heat conduction copper strip 62 with a certain distance, the round hole 63 and the rectangular hole 64, the micro fan 74 drives the air at the outer side of the printed circuit board main body 1 to circulate rapidly, and the high temperature air is blown away rapidly, thereby reducing the overall temperature of the printed circuit board main body 1, avoiding the damage of the printed circuit board main body 1 due to the high temperature, and prolonging the service life of the printed circuit board main body 1.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a printed circuit board that radiating effect is good, includes printed circuit board main part (1), its characterized in that, all the joint has locking piece (2) that the symmetry set up between the both sides outer wall of printed circuit board main part (1), and installs between the bottom of locking piece (2) and be fixed with layer board (3), install support frame (4) between the bottom of locking piece (2), spread between the surface of layer board (3) radiating copper sheet (5), peg graft between the surface of radiating copper sheet (5) and the bottom surface of printed circuit board main part (1) have equidistant distributed heat conduction subassembly (6), ventilation module (7) that are located heat conduction subassembly (6) one end are installed to the lateral wall of radiating copper sheet (5).
2. The printed circuit board with good heat dissipation effect as defined in claim 1, wherein: the heat conduction assembly (6) comprises a dovetail clamping strip (61), a heat conduction copper strip (62), a round hole (63) and a rectangular hole (64), wherein the dovetail clamping strip (61) is attached to the surface of the heat dissipation copper sheet (5), the heat conduction copper strip (62) is abutted between the top of the dovetail clamping strip (61) and the bottom of the printed circuit board main body (1), and the rectangular hole (64) and the round hole (63) which are symmetrically arranged with respect to the rectangular hole (64) are formed in the heat conduction copper strip (62).
3. The printed circuit board with good heat dissipation effect as defined in claim 1, wherein: the ventilation assembly (7) comprises a fixing plate (71), a vertical plate (72), a protective net (73) and a micro fan (74), wherein the fixing plate (71) is fixed at the end part of the radiating copper sheet (5), the vertical plate (72) is fixedly arranged on the end surface of the fixing plate (71), an air inlet hole is formed in the side wall of the vertical plate (72), the protective net (73) is welded and fixed in the air inlet hole, and the micro fan (74) is arranged on one side, close to the printed circuit board main body (1), of the vertical plate (72).
4. The printed circuit board with good heat dissipation effect as defined in claim 1, wherein: the surface of the supporting plate (3) is provided with a plurality of dovetail clamping grooves which are distributed at equal intervals.
5. A printed circuit board with good heat dissipation effect according to claim 3, wherein: the bottom of the fixing plate (71) is flush with the bottom of the radiating copper sheet (5).
6. The printed circuit board with good heat dissipation effect as defined in claim 1, wherein: the number of the heat conducting components (6) is equal to the number of the ventilation components (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320072799.XU CN219421155U (en) | 2023-01-10 | 2023-01-10 | Printed circuit board with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320072799.XU CN219421155U (en) | 2023-01-10 | 2023-01-10 | Printed circuit board with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219421155U true CN219421155U (en) | 2023-07-25 |
Family
ID=87210547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320072799.XU Active CN219421155U (en) | 2023-01-10 | 2023-01-10 | Printed circuit board with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219421155U (en) |
-
2023
- 2023-01-10 CN CN202320072799.XU patent/CN219421155U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |