CN219352186U

CN219352186U - High-frequency high-speed circuit board based on high-thickness-diameter deep hole electroplating technology

Info

Publication number: CN219352186U
Application number: CN202223252684.3U
Authority: CN
Inventors: 赵俊; 张志强; 王东府
Original assignee: Shenzhen Octopus Circuit Technology Co ltd
Current assignee: Shenzhen Octopus Circuit Technology Co ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-07-14
Anticipated expiration: 2032-12-02

Abstract

The utility model discloses a high-frequency high-speed circuit board based on a high-thickness deep hole electroplating technology, which comprises a shell, wherein transverse plates are arranged at the left end and the right end of the shell, rectangular through grooves penetrating front and back are formed in the front end of the shell, the upper end of the shell is connected with a cover, a filter screen is arranged at the right end of the shell, a circuit board main body is arranged in the shell, a heat dissipation coating is arranged at the upper end of the circuit board main body, through holes are formed in the rear part of the upper end of the circuit board main body, a heat dissipation part is arranged at the left part of the upper end of the transverse plate, and the heat dissipation part extends into the shell. According to the high-frequency high-speed circuit board based on the high-thickness deep hole electroplating technology, normal heat dissipation of the circuit board can be ensured by arranging the shell, the cover and the heat dissipation component to be matched together, and the heat dissipation effect of the upper surface of the circuit board main body can be improved by arranging the heat dissipation coating, so that the temperature of the circuit board in operation is reduced.

Description

High-frequency high-speed circuit board based on high-thickness-diameter deep hole electroplating technology

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-frequency high-speed circuit board based on a high-thickness-diameter deep hole electroplating technology.

Background

The names of the circuit boards are as follows: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.

The prior art (publication number: CN 210328344U) discloses a high-frequency high-speed circuit board based on a high-thickness deep hole electroplating technology, which comprises a circuit board body, wherein a fixed frame is fixedly arranged at the edge of the lower surface of the circuit board body, two fixed bars are fixedly arranged at the lower end of the fixed frame, sliding grooves are formed in adjacent side surfaces of the two fixed bars, a sliding rod is fixedly arranged in the sliding grooves, a reset spring is sleeved on the outer surface of the sliding rod in a sliding manner, a sliding plate is slidably arranged between the two fixed bars, one end of the sliding plate is fixedly provided with a sliding block, the sliding block is slidably sleeved on the sliding rod, a fixed hole is formed in the other end of the sliding plate, and the fixed hole penetrates through the lower surface of the sliding plate;

the above patent is through designing the slide, can select the screw of suitable length according to the required height of installing of circuit board, and the installation is simple convenient, is convenient for adjust the height, but has following drawback, after long-time use, the dust is easily piled up at the upper surface of circuit board, influences the heat dissipation on its surface, and when the temperature was too high, the circuit board can the operation of moving down frequently, leads to the circuit board can not high-frequency high-speed operation, needs further improvement, and we propose a high-frequency high-speed circuit board based on high thick footpath deep hole electroplating technique for this reason.

Disclosure of Invention

The utility model mainly aims to provide a high-frequency high-speed circuit board based on a high-thickness deep hole electroplating technology, which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a high frequency high-speed circuit board based on high thick footpath deep hole electroplating technique, includes the casing, the diaphragm is all installed to the left end and the right-hand member of casing, the rectangle logical groove that runs through around having been seted up to the front end of casing, the upper end of casing is connected with the lid, the right-hand member of casing is provided with the filter screen, the inside of casing is provided with the circuit board main part, the upper end of circuit board main part is provided with the heat dissipation coating, the via hole has been seted up at the upper end rear portion of circuit board main part, the left side the upper end left part of diaphragm is provided with the radiator, the radiator extends to in the casing.

Preferably, the heat dissipation part comprises a miniature air pump and a filter box, wherein the miniature air pump and the filter box are both arranged on a left transverse plate, the air suction end of the miniature air pump extends into the filter box, the left end of the filter box is provided with an air inlet, the filter box is internally provided with a dust filtering net, the air discharge end of the miniature air pump extends to the shell and is connected with a hollow plate, and the right end of the hollow plate is provided with an air discharge hole.

Preferably, the heat dissipation coating comprises a primer coating, the primer coating is arranged at the upper end of the circuit board main body, and an infrared radiation heat dissipation layer is arranged at the upper end of the primer coating.

Preferably, the left inner wall and the right inner wall of the shell are provided with support plates, and the circuit board main body is connected with the support plates.

Preferably, the exhaust hole is located above the circuit board main body.

Preferably, the transverse plate is provided with a mounting hole.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the high-frequency high-speed circuit board based on the high-thickness deep hole electroplating technology, the normal heat dissipation of the circuit board can be ensured by arranging the shell, the cover and the heat dissipation component to be matched together, when the circuit board is used, the cover and the shell can prevent dust from falling on the upper surface of the circuit board main body, so that the dust is prevented from affecting the normal heat dissipation of the circuit board main body, meanwhile, the power supply of the micro air pump is started, the micro air pump filters external air through the dust filtering net and then conveys the air into the hollow board, then the air is discharged from the exhaust hole, blows the upper surface of the circuit board main body, takes away heat of the high-heating element and the surface of the circuit board main body, and ensures the high-frequency high-speed operation of the circuit board main body;

2. according to the high-frequency high-speed circuit board based on the high-thickness deep hole electroplating technology, the heat dissipation effect of the upper surface of the circuit board main body can be improved through the heat dissipation coating, when the circuit board is used, the infrared radiation heat dissipation layer has good heat radiation and thermal infrared emissivity, the heat dissipation area and conductivity of the circuit board main body can be increased, the heat exchange effect is improved, the heat of the heating body is rapidly dissipated to the periphery, the cooling effect is achieved, and the temperature of the circuit board in operation is reduced.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a high-frequency high-speed circuit board based on a high-thickness deep hole plating technology;

FIG. 2 is a schematic diagram of an explosion structure of a high-frequency high-speed circuit board based on a high-thickness deep hole electroplating technology;

FIG. 3 is a schematic diagram of the overall structure of a heat dissipating component of a high-frequency high-speed circuit board based on the high-thickness deep hole plating technology of the present utility model;

FIG. 4 is a schematic diagram of the overall structure of a hollow slab of a high-frequency high-speed circuit board based on the high-thickness deep hole plating technology;

FIG. 5 is a schematic diagram of the overall structure of a heat dissipation coating of a high-frequency high-speed circuit board based on a high-thickness deep hole plating technology;

in the figure: 1. a housing; 2. rectangular through grooves; 3. a cross plate; 4. a heat radiating member; 5. a mounting hole; 6. a cover; 7. a circuit board main body; 8. a support plate; 9. a filter screen; 10. a heat-dissipating coating; 11. a via hole; 41. a micro air pump; 42. a filter box; 43. a dust filtering net; 44. a hollow slab; 45. an exhaust hole; 46. an air inlet hole; 101. a primer coating; 102. an infrared radiation heat dissipation layer.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-5, a high-frequency high-speed circuit board based on high-thickness deep hole electroplating technology comprises a shell 1, wherein transverse plates 3 are installed at the left end and the right end of the shell 1, rectangular through grooves 2 penetrating through front and back are formed in the front end of the shell 1, a cover 6 is connected to the upper end of the shell 1, the cover 6 is detachably connected to the shell 1 through bolts, a filter screen 9 is arranged at the right end of the shell 1, the filter screen 9 is used for preventing dust from entering the shell 1, a circuit board main body 7 is arranged in the shell 1, a heat dissipation coating 10 is arranged at the upper end of the circuit board main body 7, through holes 11 are formed in the rear portion of the upper end of the circuit board main body 7, a plurality of through holes 11 are formed in the rear portion of the upper end of the left transverse plate 3 and are used for conveniently connecting upper and lower surface circuits of the circuit board main body 7, a heat dissipation part 4 is arranged at the left end of the left transverse plate 3, and the heat dissipation part 4 extends into the shell 1.

The heat dissipation part 4 includes miniature air pump 41 and rose box 42, miniature air pump 41 and rose box 42 are all installed on left side diaphragm 3, miniature air pump 41's the end of breathing in extends to rose box 42 in, inlet port 46 has been seted up to the left end of rose box 42, be provided with dust filter net 43 in the rose box 42, dust filter net 43 is arranged in filtering the dust in the air, miniature air pump 41's exhaust end extends to casing 1 and is connected with hollow plate 44, exhaust hole 45 has been seted up to hollow plate 44's right-hand member, exhaust hole 45 is provided with a plurality of, casing 1, lid 6 and heat dissipation part 4 cooperate together and are used for guaranteeing the normal heat dissipation of circuit board, avoid the dust to influence the normal heat dissipation of circuit board main part 7, take away the heat on high heating element and circuit board main part 7 surface.

The heat dissipation coating 10 comprises a primer coating 101, the primer coating 101 is arranged at the upper end of the circuit board main body 7, an infrared radiation heat dissipation layer 102 is arranged at the upper end of the primer coating 101, the main components of the infrared radiation heat dissipation layer 102 are graphene and carbon nanotubes, and the heat dissipation coating 10 is used for improving the heat dissipation effect of the upper surface of the circuit board main body 7.

The support plate 8 is installed on the left inner wall and the right inner wall of the shell 1, the circuit board main body 7 is connected with the support plate 8, and as a specific embodiment, the circuit board main body 7 is detachably connected with the support plate 8 through bolts.

The exhaust hole 45 is located above the circuit board main body 7, the transverse plate 3 is provided with mounting holes 5, and two mounting holes 5 are arranged.

It should be noted that, the utility model is a high-frequency high-speed circuit board based on high-thickness deep hole electroplating technology, when in use, the transverse plate 3 is installed at a designated installation position, the cover 6 and the shell 1 can prevent dust from falling on the upper surface of the circuit board main body 7, so as to avoid the dust from affecting the normal heat dissipation of the circuit board main body 7, meanwhile, the power supply of the micro air pump 41 is started, the micro air pump 41 filters the outside air through the dust filtering net 43 and then conveys the air into the hollow plate 44, and then discharges the air from the air outlet 45, blows the upper surface of the circuit board main body 7, takes away the heat of the high heating element and the surface of the circuit board main body 7, discharges the hot air through the filter net 9, the infrared radiation heat dissipation layer 102 has good heat radiation and heat emissivity, can increase the heat dissipation area and conductivity of the circuit board main body 7, promote the heat exchange effect, and rapidly radiate the heat of the heating element to the periphery.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. High-frequency high-speed circuit board based on high thick footpath deep hole electroplating technique, including casing (1), its characterized in that: the left end and the right-hand member of casing (1) all install diaphragm (3), rectangle logical groove (2) that run through around the front end of casing (1) has been seted up, the upper end of casing (1) is connected with lid (6), the right-hand member of casing (1) is provided with filter screen (9), the inside of casing (1) is provided with circuit board main part (7), the upper end of circuit board main part (7) is provided with heat dissipation coating (10), via hole (11) have been seted up at the upper end rear portion of circuit board main part (7), the left side the upper end left part of diaphragm (3) is provided with radiator unit (4), radiator unit (4) extend to in casing (1).

2. The high-frequency high-speed circuit board based on the high-thickness deep hole plating technology as claimed in claim 1, wherein: the utility model provides a heat dissipation part (4) is including miniature air pump (41) and rose box (42), miniature air pump (41) and rose box (42) are all installed on left diaphragm (3), the end of breathing in of miniature air pump (41) extends to in rose box (42), inlet port (46) have been seted up to the left end of rose box (42), be provided with dust filter net (43) in rose box (42), the exhaust end of miniature air pump (41) extends to casing (1) and is connected with empty core plate (44), exhaust hole (45) have been seted up to the right-hand member of empty core plate (44).

3. The high-frequency high-speed circuit board based on the high-thickness deep hole plating technology as claimed in claim 2, wherein: the heat dissipation coating (10) comprises a primer coating (101), wherein the primer coating (101) is arranged at the upper end of the circuit board main body (7), and an infrared radiation heat dissipation layer (102) is arranged at the upper end of the primer coating (101).

4. The high-frequency high-speed circuit board based on the high-thickness deep hole plating technology according to claim 3, wherein: the left inner wall and the right inner wall of the shell (1) are respectively provided with a supporting plate (8), and the circuit board main body (7) is connected with the supporting plates (8).

5. The high-frequency high-speed circuit board based on the high-thickness deep hole plating technology according to claim 4, wherein: the exhaust hole (45) is positioned above the circuit board main body (7).

6. The high-frequency high-speed circuit board based on the high-thickness deep hole plating technology according to claim 5, wherein the high-frequency high-speed circuit board is characterized in that: the transverse plate (3) is provided with a mounting hole (5).