CN217484842U - High-efficient radiating power module structure - Google Patents

Abstract

The utility model relates to a radiating technical field of electronic equipment, concretely relates to high-efficient radiating power module structure. Including the inside module body that is equipped with the cavity, the front end of module body is equipped with the air outlet in both sides position, the rear end of cavity is equipped with the air intake in both sides position, forms the wind channel between the air intake of homonymy and the air outlet, and the module body is inherent with the air outlet corresponds position department and is fixed with out the fan, corresponds position department with the air intake and is fixed with into the fan, the both sides inner wall and the rear end face inner wall of module body all are fixed with the radiator, the interior diapire of module body is fixed with the circuit board, closely be provided with insulating heat conduction pad between the interior diapire of circuit board and module body, be equipped with the MOS pipe that is used for connecting circuit board on the radiator. Through having adopted multiple heat dissipation mode, greatly improved the radiating rate of module.

Description

High-efficient radiating power module structure

Technical Field

The utility model relates to a radiating technical field of electronic equipment, concretely relates to high-efficient radiating power module structure.

Background

With the rapid development of electronic technology, the functions of electronic devices are becoming powerful, resulting in greater power consumption and higher temperature rise. For the electronic equipment of the module, whether the electronic equipment can safely and reliably work is crucial to the performance of a product, because components on a printed board in the module are compactly arranged, the components can generate a large amount of heat after the module works when being electrified, if the heat cannot be dissipated in time in the cavity structure of the module, the heat dissipation efficiency is low, the normal work of the module is influenced, and the service life of the module is reduced, so that the high and low heat dissipation efficiency plays a very important role in influencing the working performance and the service life of the module.

To sum up, the utility model discloses a design a heat radiation structure and solve the problem that exists.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high-efficient radiating power module structure to prior art's defect, can greatly improve the radiating efficiency of module.

The utility model discloses a high-efficient radiating power module structure, including the inside module body that is equipped with the cavity, the front end of module body is equipped with the air outlet in both sides position, the rear end of cavity is equipped with the air intake in both sides position, forms the wind channel between the air intake of homonymy and the air outlet, the module body is inherent with the air outlet corresponds position department and is fixed with out the fan, corresponds position department with the air intake and is fixed with into the fan, the both sides inner wall and the rear end face inner wall of module body all are fixed with the radiator, the inner diapire of module body is fixed with the circuit board, closely be provided with insulating heat conduction pad between the inner diapire of circuit board and module body, be equipped with the MOS pipe that is used for connecting circuit board on the radiator.

It is comparatively preferred, the radiator all including heat dissipation tooth base plate with range upon range of set up in heat dissipation tooth on the heat dissipation tooth base plate, heat dissipation tooth base plate perpendicular to the inner diapire setting of module body, heat dissipation tooth base plate is the soaking board, be fixed with the MOS pipe that is used for connecting the circuit board on the heat dissipation tooth base plate.

Preferably, an insulating paper is arranged between the MOS tube and the heat dissipation tooth substrate.

Preferably, the heat dissipation teeth stacked in the radiators at the two sides are located in an air duct formed between the air inlet and the air outlet at the side.

Preferably, the radiator fixed on the inner wall of the rear end face is provided with a through hole which penetrates through the radiator from front to back and is communicated with the air inlet.

Preferably, a boss is arranged at a position, corresponding to the circuit board, of the inner bottom wall of the module body, and the circuit board is arranged on the boss.

Preferably, the circuit board is provided with high-power-consumption components, and insulating heat-conducting pads are tightly arranged between the tops of the high-power-consumption components and the radiator and the inner top wall of the module body.

It is comparatively preferred, be fixed with the front panel on the preceding terminal surface of module body, the front panel is equipped with the air outlet in both sides position, the preceding terminal surface of module body is equipped with the through-hole that is used for intercommunication air outlet and air-out fan, the air outlet is matrix distribution's slotted hole, the air intake is matrix distribution's round hole.

Preferably, handles are fixedly arranged on two sides of the front panel.

Preferably, support bars are arranged on the outer sides of the two side walls of the module body, and the length direction of the support bars is consistent with the direction of the modules inserted into the subrack.

The technical scheme adopts multiple heat dissipation modes to improve the heat dissipation rate. The first mode is to install the components and parts on the end face of the base plate of the soaking plate radiator, the heat emitted by the components and parts can be quickly conducted to the heat dissipation teeth of the radiator, the heat dissipation teeth are positioned on the air channel, the heat on the heat dissipation teeth is rapidly conducted to the air outlet in a convection mode through forced air cooling of the fan, meanwhile, the insulating heat conduction pad on the upper surface of the heat dissipation teeth can conduct the heat on the upper surface of the heat dissipation teeth to the top cover plate in a conduction mode, and the insulating heat conduction pad on the bottom surface of the circuit board can conduct the heat on the circuit board to the bottom surface of the cavity body.

The utility model has the advantages that: this scheme will be used for the components and parts of connecting circuit board to install on the radiator, and the heat that components and parts gived off can directly be taken away by the radiator. Besides the radiator, the heat dissipation is accelerated through an air duct formed by the air inlets, the air outlets and the fans on the two sides. In addition, an insulating heat conduction pad is tightly arranged between the circuit board and the inner bottom wall of the module body, and heat of the circuit board can be conducted to the bottom surface of the module through the insulating heat conduction pad. Through having adopted above multiple radiating mode, greatly improved the radiating rate of module.

Drawings

FIG. 1 is a schematic view of the first angle (without top cover plate) structure of the present invention;

FIG. 2 is a schematic view of a second angle (without a top cover plate) according to the present invention;

fig. 3 is a schematic diagram of the structure of the cavity inside the module body of the present invention;

FIG. 4 is a schematic sectional view of the present invention;

FIG. 5 is a schematic view of a left heat sink;

fig. 6 is a schematic view of a rear heat sink structure.

In the figure, 1-module body, 2-front panel, 3-top cover plate, 4-circuit board, 5-left radiator, 6-right radiator, 7-rear radiator, 8-left fan, 9-right fan, 10-rear fan and 11-high power consumption component

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Example one

Fig. 1 to 6 are schematic structural diagrams illustrating a power module structure for efficient heat dissipation according to a preferred embodiment of the present application, and for convenience of description, only the portions related to the embodiment are shown, which are detailed as follows:

to this paper utility model's a high-efficient radiating power module structure, the inside cavity that is equipped with of module body 1, the preceding terminal surface left and right sides respectively opens the air outlet 15 that has a big round hole to be used for communicateing front panel 2, and the rear end face has set up several rows of little through-holes as air intake 17. The preceding terminal surface and the front panel 2 of module body 1 pass through bolted connection, the up end passes through bolted connection with lamina tecti 3, 1 internally mounted of module body has a circuit board 4 and three group's fans, circuit board 4 passes through the fix with screw on the little boss of 1 bottom surface of module body, the boss is integrative with module body 1, insulating heat conduction pad has been placed between circuit board 4 and the module body 1, left side fan 8 is installed in the interior antetheca left side air outlet department of module body 1, right side fan 9 is installed in the interior antetheca right side air outlet department of module body 1, left side fan 8 and right side fan 9 all play the effect of airing exhaust outside module body 1, back fan 10 is installed in the interior back wall right side air inlet department of module body 1, play the effect of airing exhaust in module body 1. The front panel 2 is provided with devices such as buttons and indicator lamps, the left side and the right side are provided with handles 16, the modules are conveniently inserted into or drawn out of the plug-in box, the handles penetrate through the front panel from the interior of the module body 1 through screws to be connected, and meanwhile, the front panel 2 is provided with a long round hole at a position corresponding to the air outlet of the module body 1 to serve as the air outlet. The left and right outer side walls of the module body 1 are fixedly connected with supporting bars 12, the supporting bars 12 and the module body 1 are integrated, and when the module is inserted into the plug-in box, the supporting bars 12 play a role in guiding and supporting the module.

In one embodiment, referring to fig. 1, 4, 5, and 6, the left heat sink 5, the right heat sink 6, and the rear heat sink 7 are substantially identical in structure and made of aluminum alloy, the surfaces of the left heat sink 5, the right heat sink 6, and the rear heat sink 7 are blackened to increase the radiation absorption rate, the bottom surfaces of the three heat sinks are provided with threaded holes, and the left heat sink 5, the right heat sink 6, and the rear heat sink 7 are mounted on the left side, the right side, and the rear side of the circuit board 4 by passing screws through the bottom surface of the circuit board 4.

A heat dissipation tooth substrate 13 is arranged at one end of the heat radiator facing the inner side of the cavity, the heat dissipation tooth substrate 13 is made into a soaking plate, a threaded hole is formed in the end face of the soaking plate, an MOS (metal oxide semiconductor) tube connected with the circuit board is mounted on the end face through a screw, and insulating paper is placed between the MOS tube and the end face of the substrate. The upper level of heat dissipation tooth base plate 13 sets up a plurality of heat dissipation teeth 14, the heat dissipation tooth of left side radiator 5 and right radiator 6 is in the module body 1 about on the wind channel respectively, back radiator 7 is placed in the rear end of module body 1, its terminal surface still is provided with the through-hole except that being provided with the screw hole of installation MOS pipe, the air intake through-hole axial that through-hole axial and module body 1 rear end set up is unanimous, three radiator and high power consumption components and parts 11 top are all pasted and are had insulating heat conduction pad, the thickness of insulating heat conduction pad is greater than the distance between radiator and components and parts top and lamina tecti 3, after lamina tecti 3 passes through the fix with screw at module body 1 up end, insulating heat conduction pad can receive certain compression.

The working principle is as follows:

referring to fig. 1 and 2, after the module is powered on, the temperature in the module body 1 gradually rises, the temperature of the high-power consumption component is conducted to the top cover plate 3 through the insulating heat conducting pad, the temperature of the bottom surface of the circuit board 4 is also conducted to the bottom surface of the module body 1 through the insulating heat conducting pad, the heat on the heat dissipation teeth of the left radiator 5 and the right radiator 6 is dissipated by three heat transfer modes of conduction, forced air cooling and radiation, the blackening treatment on the surfaces of the radiators increases the radiation absorption rate, the high temperature on the surfaces of the components in the module body 1 is absorbed to the surfaces of the radiators in an electromagnetic wave mode, the heat of the MOS tube on the end surface is efficiently conducted to the radiating teeth through the substrate (soaking plate), the heat is then exchanged with the air flow on the air channel to be conducted to the outside of the module body 1, and the heat at the top end of the radiator is conducted to the outer surface of the top cover plate 3 through the insulating heat conducting pad and the top cover plate 3. The heat dissipation mode on the end face and the top face of the rear radiator 7 is the same as that of the left radiator 5 and the right radiator 6, and the difference is that the rear radiator 7 is not positioned on an air channel formed by a fan, so that the heat transfer on the heat dissipation teeth of the rear radiator 7 does not belong to a forced air cooling heat dissipation mode like the left radiator 5 and the right radiator 6, but belongs to a natural air cooling heat dissipation mode. The temperature of components and parts on the circuit board has been reduced high-efficiently to multiple radiating mode, has effectively reduced the temperature in the module body 1 promptly, can reach balanced with external environment temperature after the temperature drops to a certain fixed numerical value, has reduced the influence that the high temperature caused precision circuit components and parts, has improved the performance and the life of product.

The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims (10)

1. The utility model provides a high-efficient radiating power module structure which characterized in that: including inside module body (1) that is equipped with the cavity, the front end of module body (1) is equipped with air outlet (15) in both sides position, the rear end of cavity is equipped with air intake (17) in both sides position, forms the wind channel between air intake (17) and the air outlet (15) of homonymy, module body (1) inherent with air outlet (15) correspond position department and are fixed with out the fan, correspond position department with air intake (17) and are fixed with into the fan, the both sides inner wall and the rear end face inner wall of module body (1) all are fixed with the radiator, the interior diapire of module body (1) is fixed with circuit board (4), closely be provided with insulating heat conduction pad between the interior diapire of circuit board (4) and module body (1), be equipped with the MOS pipe that is used for connecting circuit board (4) on the radiator.

2. The power module structure for efficient heat dissipation of claim 1, wherein: the radiator all including heat dissipation tooth base plate (13) with range upon range of set up in heat dissipation tooth (14) on heat dissipation tooth base plate (13), heat dissipation tooth base plate (13) perpendicular to the inner diapire setting of module body (1), heat dissipation tooth base plate (13) are the soaking board, be fixed with the MOS pipe that is used for connecting circuit board (4) on heat dissipation tooth base plate (13).

3. The power module structure for efficient heat dissipation of claim 2, wherein: and insulating paper is arranged between the MOS tube and the heat dissipation tooth substrate (13).

4. The power module structure for efficient heat dissipation of claim 2, wherein: the heat dissipation teeth (14) which are arranged in the radiators at the two sides in a stacked mode are located in an air duct formed between the air inlet (17) and the air outlet (15) at the side.

5. The power module structure for efficient heat dissipation of claim 2, wherein: the radiator fixed on the inner wall of the rear end face is provided with a through hole which penetrates through the radiator from front to back and is communicated with the air inlet (17).

6. The power module structure for efficient heat dissipation of claim 1, wherein: the inner bottom wall of the module body (1) is provided with a boss at a position corresponding to the circuit board (4), and the circuit board (4) is arranged on the boss.

7. The power module structure for efficient heat dissipation of claim 1, wherein: the heat dissipation module is characterized in that a high-power-consumption component (11) is arranged on the circuit board (4), and an insulating heat conduction pad is tightly arranged between the top of the high-power-consumption component (11) and the radiator and the inner top wall of the module body (1).

8. The power module structure for efficient heat dissipation of claim 1, wherein: be fixed with front panel (2) on the preceding terminal surface of module body (1), front panel (2) are equipped with air outlet (15) in both sides position, the preceding terminal surface of module body (1) is equipped with the through-hole that is used for communicateing air outlet (15) and air-out fan, air outlet (15) are the slotted hole of matrix distribution, air intake (17) are the round hole of matrix distribution.

9. The power module structure for efficient heat dissipation of claim 8, wherein: handles (16) are fixedly arranged on two sides of the front panel (2).

10. The power module structure for efficient heat dissipation of claim 8, wherein: the module is characterized in that supporting strips (12) are arranged on the outer sides of two side walls of the module body (1), and the length direction of the supporting strips (12) is consistent with the direction of the module inserted into the subrack.

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