CN211606922U

CN211606922U - Heat dissipation device for circuit board

Info

Publication number: CN211606922U
Application number: CN202020678525.1U
Authority: CN
Inventors: 沈鑫; 王登军; 李军
Original assignee: Liaoning Orita Electronic Co ltd
Current assignee: Liaoning Orita Electronic Co ltd
Priority date: 2020-04-28
Filing date: 2020-04-28
Publication date: 2020-09-29
Anticipated expiration: 2030-04-28

Abstract

The utility model discloses a heat abstractor for circuit board, the load simulator comprises a case, the bottom fixedly connected with heating panel on machine case right side, the positive top of heating panel and the equal fixedly connected with mounting panel in bottom, one side of mounting panel is provided with buffer, the inner chamber fixedly connected with radiator fan of machine case, radiator fan's quantity is two, and connects through the electric wire electricity between two radiator fan. The utility model discloses a quick-witted case, the heating panel, radiator fan, the cooperation of first outlet duct and intake pipe, radiator fan drives gaseous flow, it flows in heating panel inner chamber through first outlet duct to be gaseous, take away the steam that flows into heating panel inner chamber from the intake pipe, cool down the circuit board, cooperation through electric wire and thermistor, it is higher when the temperature, thermistor resistance is less, radiator fan power is big more, further improve the cooling effect, thereby improve the radiating effect, the poor problem of current device radiating effect has been solved.

Description

Heat dissipation device for circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a heat abstractor for circuit board.

Background

The circuit board is a circuit miniaturization and visualization, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, and in order to prevent the danger caused by overheating in the use process, the circuit board needs to be radiated, and a common radiating device has too thin thickness in the processing process, excessive radiating teeth of products, easy deformation and poor radiating effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor for circuit board possesses the good advantage of radiating effect, has solved the poor problem of current device radiating effect.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat abstractor for circuit board, includes quick-witted case, the bottom fixedly connected with heating panel on machine case right side, the positive top of heating panel and the equal fixedly connected with mounting panel in bottom, one side of mounting panel is provided with buffer, the inner chamber fixedly connected with radiator fan of machine case, radiator fan's quantity is two, and connects through the electric wire electricity between two radiator fan, the surface of electric wire is provided with thermistor, the bottom intercommunication on machine incasement chamber right side has first outlet duct, the front of heating panel is provided with the intake pipe.

Preferably, the buffering device comprises a buffering spring and a buffering plate, one side of the mounting plate is fixedly connected with the buffering spring, the other side of the buffering spring is fixedly connected with the buffering plate, and the front side of the buffering plate is provided with a chamfer.

Preferably, the right side of the thermistor penetrates through the case and extends to the outer side of the case, and the top of the cooling fan is electrically connected with a power line.

Preferably, the bottom of the air inlet pipe is fixedly connected with a baffle, and the baffle and the horizontal plane form an inclined shape.

Preferably, the right side of the heat dissipation plate is provided with five second air outlet pipes.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a quick-witted case, the heating panel, radiator fan, the cooperation of first outlet duct and intake pipe, radiator fan drives gaseous flow, it flows in heating panel inner chamber through first outlet duct to be gaseous, take away the steam that flows into heating panel inner chamber from the intake pipe, cool down the circuit board, cooperation through electric wire and thermistor, it is higher when the temperature, thermistor resistance is less, radiator fan power is big more, further improve the cooling effect, thereby improve the radiating effect, the poor problem of current device radiating effect has been solved.

2. The utility model discloses a buffer spring and buffer board's cooperation is convenient for fix the circuit board, makes things convenient for heat abstractor and circuit board connection, and the later stage of being convenient for is changed the maintenance, runs through quick-witted case and extends to the quick-witted case outside through the right side of design thermistor, is convenient for adjust radiator fan power in real time, through the design baffle, carries out the water conservancy diversion to the air current, avoids gaseous through intake-tube discharge.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a sectional view of the utility model;

fig. 3 is a right side view of the structure of the present invention.

In the figure: 1. a chassis; 2. a heat dissipation plate; 3. mounting a plate; 4. a buffer device; 41. a buffer spring; 42. a buffer plate; 5. a heat radiation fan; 6. an electric wire; 7. a thermistor; 8. a first air outlet pipe; 9. an air inlet pipe; 10. a power line; 11. a baffle plate; 12. and a second air outlet pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a heat dissipating device for a circuit board comprises a case 1, a heat dissipating plate 2 is fixedly connected to the bottom of the right side of the case 1, a second air outlet pipe 12 is arranged on the right side of the heat dissipating plate 2, the number of the second air outlet pipes 12 is five, the circuit board is conveniently fixed by the cooperation of a buffer spring 41 and a buffer plate 42, the heat dissipating device is conveniently connected with the circuit board, and is convenient for later-stage replacement and maintenance, the right side of a thermistor 7 is designed to penetrate through the case 1 and extend to the outer side of the case 1, so that the power of a heat dissipating fan 5 is conveniently adjusted in real time, airflow is guided by a baffle plate 11 to avoid gas from being discharged through an air inlet pipe 9, a mounting plate 3 is fixedly connected to the top and the bottom of the front side of the heat dissipating plate 2, a buffer device 4 is arranged on one side of the mounting plate 3, the other side of the buffer spring 41 is fixedly connected with a buffer plate 42, the front side of the buffer plate 42 is provided with a chamfer, the inner cavity of the case 1 is fixedly connected with two cooling fans 5, the two cooling fans 5 are electrically connected through an electric wire 6, the surface of the electric wire 6 is provided with a thermistor 7, the right side of the thermistor 7 penetrates through the case 1 and extends to the outer side of the case 1, the top of the cooling fan 5 is electrically connected with a power wire 10, the bottom of the right side of the inner cavity of the case 1 is communicated with a first air outlet pipe 8, the front side of the cooling plate 2 is provided with an air inlet pipe 9, the bottom of the air inlet pipe 9 is fixedly connected with a baffle plate 11, the baffle plate 11 is inclined with the horizontal plane, through the cooperation of the case 1, the cooling plate 2, the cooling fans 5, the first air outlet pipe 8 and the air inlet, the hot air flowing into the inner cavity of the heat dissipation plate 2 from the air inlet pipe 9 is taken away, the circuit board is cooled, and through the matching of the electric wire 6 and the thermistor 7, when the temperature is higher, the thermistor 7 resistance is smaller, the power of the heat dissipation fan 5 is larger, the cooling effect is further improved, so that the heat dissipation effect is improved, and the problem of poor heat dissipation effect of the existing device is solved.

During the use, place the circuit board between two buffer boards 42, fix the circuit board through buffer spring 41, make things convenient for heat abstractor and circuit board connection, the later stage of being convenient for is changed the maintenance, through external power supply 5 circular telegrams radiator fan, radiator fan 5 drives gaseous flow, it flows in 2 inner chambers of radiator plate through first outlet duct 8 to be gaseous, take away the steam that flows into 2 inner chambers of radiator plate from intake pipe 9, cool down the circuit board, cooperation through electric wire 6 and thermistor 7, it is higher when the temperature, thermistor 7 resistance is more small, radiator fan 5 power is big more, further improve the cooling effect, through design baffle 11, carry out the water conservancy diversion to the air current, avoid gaseous discharging through intake pipe 9, thereby improve the radiating effect.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent. In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat abstractor for circuit board, includes quick-witted case (1), its characterized in that: bottom fixedly connected with heating panel (2) on machine case (1) right side, the positive top of heating panel (2) and the equal fixedly connected with mounting panel (3) in bottom, one side of mounting panel (3) is provided with buffer (4), inner chamber fixedly connected with radiator fan (5) of machine case (1), the quantity of radiator fan (5) is two, and connects through electric wire (6) electricity between two radiator fan (5), the surface of electric wire (6) is provided with thermistor (7), the bottom intercommunication on machine case (1) inner chamber right side has first outlet duct (8), the front of heating panel (2) is provided with intake pipe (9).

2. A heat dissipating device for a circuit board according to claim 1, wherein: buffer (4) include buffer spring (41) and buffer board (42), one side fixedly connected with buffer spring (41) of mounting panel (3), the opposite side fixedly connected with buffer board (42) of buffer spring (41), the front of buffer board (42) is provided with the chamfer.

3. A heat dissipating device for a circuit board according to claim 1, wherein: the right side of the thermistor (7) penetrates through the case (1) and extends to the outer side of the case (1), and the top of the heat dissipation fan (5) is electrically connected with a power line (10).

4. A heat dissipating device for a circuit board according to claim 1, wherein: the bottom fixedly connected with baffle (11) of intake pipe (9), baffle (11) are the slope form with the horizontal plane.

5. A heat dissipating device for a circuit board according to claim 1, wherein: the right side of heating panel (2) is provided with second outlet duct (12), the quantity of second outlet duct (12) is five.