CN211150543U - Heat radiator for IGBT module - Google Patents

Heat radiator for IGBT module Download PDF

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Publication number
CN211150543U
CN211150543U CN201922111335.1U CN201922111335U CN211150543U CN 211150543 U CN211150543 U CN 211150543U CN 201922111335 U CN201922111335 U CN 201922111335U CN 211150543 U CN211150543 U CN 211150543U
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CN
China
Prior art keywords
platform
cooling
igbt module
air
placing
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Active
Application number
CN201922111335.1U
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Chinese (zh)
Inventor
金明星
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Muling Beiyi Semiconductor Technology Co ltd
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Muling Beiyi Semiconductor Technology Co ltd
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Priority to CN201922111335.1U priority Critical patent/CN211150543U/en
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Publication of CN211150543U publication Critical patent/CN211150543U/en
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Abstract

The utility model discloses a heat abstractor of IGBT module, include water cooler, air cooler, place platform and connecting hole, the water cooler is located and is placed in the platform, the air cooler is located and is placed in the platform, the upper surface of placing the platform is located to the connecting hole, the water cooler includes inlet tube, outlet pipe, water inlet, delivery port and cooling tube, the inlet tube is located on the lateral wall of placing the platform, the outlet pipe is located and is placed on the lateral wall of platform and locate the plane of symmetry of inlet tube, the water inlet is located on the inlet tube, the delivery port is located on the outlet pipe, the cooling tube is located between inlet tube and the outlet pipe, the inside of placing the platform is located to the cooling tube. The utility model relates to a radiating technical field of IGBT module specifically is one kind and makes the IGBT module cool off more rapidly through dual cooling mode, has improved life, has reduced the loss of IGBT module in service, satisfies the demand of work, is a very practical device.

Description

Heat radiator for IGBT module
Technical Field
The utility model relates to a radiating technical field of IGBT module specifically is a heat abstractor of IGBT module.
Background
In recent years, electric locomotives for railway traction in China are rapidly developed, the types of electric elements used by the electric locomotives are more and more, the electric elements of a transformer and a main converter generate heat loss in working and emit a large amount of heat, and in order to ensure the normal working of the transformer and the main converter, a proper radiator is required to meet the running requirements of different motors and electric appliances on the locomotives under different working conditions.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned current difficult problem, the utility model provides a heat abstractor of IGBT module makes the IGBT module can cool off more rapidly through dual cooling mode, has improved life, has reduced the loss of IGBT module in service, satisfies the demand of work, is a very practical device.
The utility model adopts the following technical scheme: the utility model provides a heat abstractor of IGBT module, includes water cooler, air cooler, places platform and connecting hole, the water cooler is located and is placed the bench, the air cooler is located and is placed the bench, the upper surface of placing the platform is located to the connecting hole, the water cooler includes inlet tube, outlet pipe, water inlet, delivery port and cooling tube, the inlet tube is located on the lateral wall of placing the platform, the outlet pipe is located on the lateral wall of placing the platform and is located the plane of symmetry of inlet tube, the water inlet is located on the inlet tube, the delivery port is located on the outlet pipe, the cooling tube is located between inlet tube and the outlet pipe, the inside of placing the platform is located to the cooling tube, the water cooler with the air cooler carries out dual cooling to the IGBT module, place the platform and place the IGBT module, the connecting hole is connected and.
Further, the cooling pipe is arranged in a U-shaped pipeline.
Further, the placing table is provided with an L-shaped hollow cavity, the water cooler is arranged on the inner side of the L-shaped long side of the placing table, and the air cooler is arranged on the inner side of the L-shaped short side of the placing table.
Further, the air cooler includes air cooling chamber, cooling fan rack, air cooling fan and air conditioning discharge port, the air cooling chamber is located and is placed the bench and locate the minor face department of placing the platform, inside the air cooling chamber was located to the cooling fan rack, the air cooling fan is located in the cooling fan rack, the air conditioning discharge port is located on the air cooling chamber and is located the one side that is close to the cooling tube, the cooling fan rack plays the supporting role, the air cooling fan makes air conditioning, the air conditioning discharge port makes air conditioning discharge.
Further, the cooling fan rack is arranged in a grid shape, and the air cooling fans are provided with four groups.
Further, the cold air discharge port is provided between the air cooling fan and the cooling pipe.
Furthermore, the connecting holes are provided with a plurality of groups, and the connecting holes are arranged on the placing table and are arranged on the L-shaped long edge of the placing table.
Adopt above-mentioned structure the utility model discloses the beneficial effect who gains as follows: the utility model provides a heat abstractor of IGBT module makes the IGBT module can cool off more rapidly through dual cooling mode, has improved life, has reduced the loss in the IGBT module operation, satisfies the demand of work, is a very practical device.
Drawings
Fig. 1 is a schematic view of the overall structure of a heat dissipation device of an IGBT module according to the present invention;
fig. 2 is the utility model relates to a heat abstractor's of IGBT module internal structure schematic diagram.
The cooling system comprises a water cooler 1, an air cooler 2, an air cooler 3, a placing table 4, a connecting hole 5, a water inlet pipe 6, a water outlet pipe 7, a water inlet 8, a water outlet 9, a cooling pipe 10, an air cooling cavity 11, a cooling fan placing frame 12, an air cooling fan 13 and an air cooling outlet.
Detailed Description
The technical solution of the present invention will be described in further detail with reference to the following embodiments, and the technical features or the connection relations of the present invention, which are not described in detail, are the prior art adopted.
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-2, the technical scheme adopted by the utility model is as follows: the utility model provides a heat abstractor of IGBT module, includes water cooler 1, air cooler 2, places platform 3 and connecting hole 4, water cooler 1 is located and is placed in the platform 3, air cooler 2 is located and is placed in the platform 3, connecting hole 4 is located the upper surface of placing platform 3, water cooler 1 includes inlet tube 5, outlet pipe 6, water inlet 7, delivery port 8 and cooling tube 9, inlet tube 5 is located on the lateral wall of placing platform 3, connecting hole 4 outlet pipe 6 is located and is placed on the lateral wall of platform 3 and locate the plane of symmetry of inlet tube 5, water inlet 7 is located on inlet tube 5, delivery port 8 is located on outlet pipe 6, cooling tube 9 is located between inlet tube 5 and the outlet pipe 6, cooling tube 9 locates the inside of placing platform 3.
The cooling pipe 9 is arranged in a U-shaped pipeline.
The placing table 3 is provided with an L hollow cavity, the water cooler 1 is arranged on the inner side of the L long side of the placing table 3, and the air cooler 2 is arranged on the inner side of the L short side of the placing table 3.
Air cooler 2 includes air cooling chamber 10, cooling fan rack 11, air cooling fan 12 and air conditioning discharge port 13, air cooling chamber 10 is located and is placed on platform 3 and locate the minor face department of placing platform 3, cooling fan rack 11 is located inside air cooling chamber 10, air cooling fan 12 is located in cooling fan rack 11, air conditioning discharge port 13 is located on air cooling chamber 10 and is located the one side that is close to cooling tube 9.
The cooling fan placing rack 11 is arranged in a shape like a Chinese character tian, and the air cooling fans 12 are provided with four groups.
The cold air discharge port 13 is provided between the air cooling fan 12 and the cooling pipe 9.
The connecting holes 4 are provided with a plurality of groups, and the connecting holes 4 are arranged on the placing table 3 and are arranged on the L-shaped long edge of the placing table 3.
When the IGBT module cooling device is used specifically, a user connects an IGBT module to the plane of the placing table 3 through the connecting holes 4, and can connect a plurality of IGBT modules to the placing table 3 through the connecting holes 4 with a plurality of groups, then the user cools and cools the IGBT module through the water cooler 1 and the air cooler 2 when using the IGBT module, the user introduces cooling water into the water inlet pipe 5 through the water inlet 7, the cooling water flows gradually from the U-shaped cooling pipe 9 in the water inlet pipe 5 under the action of water flow, cools the IGBT module in work in the flowing process, takes away heat generated by the operation of the IGBT module along with the cooling water, and finally discharges the cooling water out of the device from the water outlet 8 on the water outlet pipe 6, meanwhile, the user cools the IGBT module through the water cooler 1 and the air cooler 2 together, the cooling speed is accelerated, the user turns on air cooling air at the moment, the air cooling fan 12 rotates in the cooling fan placing frame 11, the cold wind of production flows through cold air discharge port 13, and on the one hand, cold air blows the cooling to placing the IGBT above the platform 3, and on the other hand, cold air enters into around cooling tube 9 through placing the inside cold air discharge port 13 of platform 3, makes the cooling water can cool down the heat that the IGBT produced at the flow in-process, can be cooled down by cold air again and make the heat of IGBT module can be more taken away, has realized the purpose of dual cooling, above just is the heat abstractor's of whole IGBT module work flow.
The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims (7)

1. The utility model provides a heat abstractor of IGBT module which characterized in that: including water cooler, air cooler, place platform and connecting hole, the water cooler is located and is placed the bench, the air cooler is located and is placed the bench, the upper surface of placing the platform is located to the connecting hole, the water cooler includes inlet tube, outlet pipe, water inlet, delivery port and cooling tube, the inlet tube is located on the lateral wall of placing the platform, the outlet pipe is located and is placed on the lateral wall of platform and locate the plane of symmetry of inlet tube, the water inlet is located on the inlet tube, the delivery port is located on the outlet pipe, the cooling tube is located between inlet tube and the outlet pipe, the inside of placing the platform is located to the cooling tube.
2. The heat dissipation device of an IGBT module according to claim 1, characterized in that: the cooling pipe is arranged in a U-shaped pipeline.
3. The heat dissipation device of IGBT module as claimed in claim 2, wherein said platform is formed as an L-type hollow cavity, said water cooler is disposed on the inner side of L-type long side of the platform, and said air cooler is disposed on the inner side of L-type short side of the platform.
4. The heat dissipation device of an IGBT module according to claim 3, characterized in that: the air cooler comprises an air cooling cavity, a cooling fan placing frame, an air cooling fan and an air cooling discharge port, the air cooling cavity is arranged on the placing platform and is arranged at the short edge of the placing platform, the cooling fan placing frame is arranged inside the air cooling cavity, the air cooling fan is arranged in the cooling fan placing frame, and the air cooling discharge port is arranged on the air cooling cavity and is arranged on one side close to the cooling pipe.
5. The heat dissipation device of an IGBT module according to claim 4, characterized in that: the cooling fan placing rack is arranged in a shape like a Chinese character tian, and the air cooling fans are provided with four groups.
6. The heat dissipation device of an IGBT module according to claim 5, characterized in that: the cold air outlet is arranged between the air cooling fan and the cooling pipe.
7. The heat dissipation device of IGBT module as claimed in claim 6, wherein said connection holes are provided in several groups, and said connection holes are provided on said placement table and on said L-shaped long side of said placement table.
CN201922111335.1U 2019-11-30 2019-11-30 Heat radiator for IGBT module Active CN211150543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922111335.1U CN211150543U (en) 2019-11-30 2019-11-30 Heat radiator for IGBT module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922111335.1U CN211150543U (en) 2019-11-30 2019-11-30 Heat radiator for IGBT module

Publications (1)

Publication Number Publication Date
CN211150543U true CN211150543U (en) 2020-07-31

Family

ID=71773993

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922111335.1U Active CN211150543U (en) 2019-11-30 2019-11-30 Heat radiator for IGBT module

Country Status (1)

Country Link
CN (1) CN211150543U (en)

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