CN207113338U - A cooling frame for electronic device production and processing - Google Patents
A cooling frame for electronic device production and processing Download PDFInfo
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- CN207113338U CN207113338U CN201720746292.2U CN201720746292U CN207113338U CN 207113338 U CN207113338 U CN 207113338U CN 201720746292 U CN201720746292 U CN 201720746292U CN 207113338 U CN207113338 U CN 207113338U
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- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 68
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 239000004519 grease Substances 0.000 claims abstract description 7
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及冷却设备技术领域,特别涉及一种电子器件生产加工用冷却架。The utility model relates to the technical field of cooling equipment, in particular to a cooling frame for production and processing of electronic devices.
背景技术Background technique
电子器件在经过多道程序加工后会产生较多热量,直接影响后续加工流程和进度,所以此时我们需要对产生高温电子器件进行有效降温冷却,现有的冷却方式一般采用风冷,风冷是冷却方式的一种,即用空气作为媒介冷却需要冷却的物体。风冷是一种经济效益高的冷却方式,只需要对成型物料进行鼓风作业便可达到冷却的目的,但一般的风冷装置中通常设置有若干个固定风扇,风扇数量的多少和冷却效果成正比,这样的方式不经济需要大量的风扇,进行小批量冷却作业时又浪费大量电能。而且对于固定不动的电子器件,其背面很难得到降温,往往只是对着叶片的那面降温,冷却效果较差。因此我们对此做出改进,提出一种电子器件生产加工用冷却架。Electronic devices will generate more heat after multi-program processing, which directly affects the subsequent processing process and progress. Therefore, we need to effectively cool down the high-temperature electronic devices at this time. The existing cooling methods generally use air cooling, air cooling It is a kind of cooling method, that is, using air as a medium to cool the object that needs to be cooled. Air cooling is a cooling method with high economic benefits. It only needs to blow air to the molding material to achieve the purpose of cooling. However, the general air cooling device is usually equipped with several fixed fans. The number of fans and the cooling effect In direct proportion, this method is uneconomical and requires a large number of fans, and wastes a lot of electric energy when performing small-batch cooling operations. Moreover, for fixed electronic devices, it is difficult to cool the back side of the electronic device, and it is often only cooled against the side of the blade, and the cooling effect is relatively poor. Therefore, we make improvements to this, and propose a cooling rack for the production and processing of electronic devices.
发明内容Contents of the invention
本实用新型的主要目的在于提供一种电子器件生产加工用冷却架,可以有效解决背景技术中的问题。The main purpose of the utility model is to provide a cooling rack for the production and processing of electronic devices, which can effectively solve the problems in the background technology.
为实现上述目的,本实用新型采取的技术方案为:In order to achieve the above object, the technical scheme that the utility model takes is:
一种电子器件生产加工用冷却架,包括空心支架,所述空心支架对称固定在顶板底部,所述顶板下方安装有第一水冷系统和第二水冷系统,所述第一水冷系统和第二水冷系统一端均设置有散热器,所述散热器一侧连接有水管,所述水管与膨胀水箱接通,所述膨胀水箱与水管之间安装有水套,所述水套一侧设有水泵,所述水泵上方固定连接有导热板,所述导热板一端设置有导轨,所述导轨固定在顶板与底座之间,且导轨上安装有风机,所述风机外围设有防尘罩,所述空心支架内侧设有散热片,且空心支架外侧固定有散热板,所述散热板一侧设有挂钩,所述挂钩上放置有电源线,所述电源线一端连接有电源插头,所述底座下方安装有制动滚轮。A cooling frame for the production and processing of electronic devices, comprising a hollow support, the hollow support is symmetrically fixed on the bottom of the top plate, a first water cooling system and a second water cooling system are installed under the top plate, and the first water cooling system and the second water cooling system One end of the system is equipped with a radiator, one side of the radiator is connected with a water pipe, the water pipe is connected to the expansion tank, a water jacket is installed between the expansion tank and the water pipe, and a water pump is provided on one side of the water jacket. A heat conduction plate is fixedly connected above the water pump, and a guide rail is arranged at one end of the heat conduction plate, and the guide rail is fixed between the top plate and the base, and a fan is installed on the guide rail, and a dust cover is arranged on the periphery of the fan, and the hollow The inner side of the bracket is provided with a cooling fin, and the outer side of the hollow bracket is fixed with a cooling plate, and one side of the cooling plate is provided with a hook, and a power cord is placed on the hook, and one end of the power cord is connected to a power plug, and a Has brake rollers.
进一步地,所述水套内循环有冷却液。Further, cooling fluid circulates in the water jacket.
进一步地,所述风机安装有两个,且风机与导轨之间通过连接件固定。Further, two fans are installed, and the fans and the guide rails are fixed by connecting pieces.
进一步地,所述空心支架内填充有导热硅脂。Further, the hollow bracket is filled with heat-conducting silicone grease.
进一步地,所述第一水冷系统和第二水冷系统均通过导热板安装在横板底部。Further, both the first water cooling system and the second water cooling system are installed on the bottom of the horizontal plate through the heat conduction plate.
进一步地,所述膨胀水箱内设有增压器。Further, a supercharger is provided in the expansion tank.
进一步地,所述散热片设置有多组。Further, the heat sinks are provided in multiple groups.
与现有技术相比,本实用新型具有如下有益效果:Compared with the prior art, the utility model has the following beneficial effects:
1、通过在横板下方利用导热板固定连接第一水冷系统和第二水冷系统,在散热器和水套的配合下,有效对横板上放置的电子器件进行全面冷却,风机在导轨上方便调整位置。1. The first water cooling system and the second water cooling system are fixedly connected by using a heat conduction plate under the horizontal plate. With the cooperation of the radiator and the water jacket, the electronic components placed on the horizontal plate can be effectively cooled. The fan is convenient on the guide rail. Adjust position.
2、通过散热片将空心支架之间的热量传至散热板,空心支架的空腔内填充导热硅脂,使得传热效果好,冷却散热高效快速,结构合理,功能使用方便,适合广泛推广。2. The heat between the hollow brackets is transferred to the cooling plate through the heat sink, and the cavity of the hollow bracket is filled with heat-conducting silicone grease, so that the heat transfer effect is good, the cooling and heat dissipation are efficient and fast, the structure is reasonable, the function is convenient to use, and it is suitable for wide promotion.
附图说明Description of drawings
图1为本实用新型一种电子器件生产加工用冷却架的整体结构示意图。FIG. 1 is a schematic diagram of the overall structure of a cooling rack for the production and processing of electronic devices of the present invention.
图2为本实用新型一种电子器件生产加工用冷却架的背面结构示意图。Fig. 2 is a schematic diagram of the back structure of a cooling rack for production and processing of electronic devices of the present invention.
图3为本实用新型一种电子器件生产加工用冷却架的水冷系统结构示意图。Fig. 3 is a schematic structural diagram of a water cooling system of a cooling rack for electronic device production and processing according to the present invention.
图中:1、顶板;2、空心支架;3、散热板;4、横板;5、防尘罩;6、风机;7、第一水冷系统;8、第二水冷系统;9、底座;10、制动滚轮;11、导轨;12、挂钩;13、电源线;14、连接件;15、电源插头;16、散热器;17、导热板;18、水管;19、水泵;20、水套;21、导热硅脂;22、散热片;23、膨胀水箱。In the figure: 1. Top plate; 2. Hollow bracket; 3. Radiating plate; 4. Horizontal plate; 5. Dust cover; 6. Fan; 7. First water cooling system; 8. Second water cooling system; 9. Base; 10. Brake roller; 11. Guide rail; 12. Hook; 13. Power cord; 14. Connector; 15. Power plug; 16. Radiator; 17. Heat conduction plate; 18. Water pipe; 19. Water pump; 20. Water 21. Thermal grease; 22. Heat sink; 23. Expansion water tank.
具体实施方式Detailed ways
为使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体实施方式,进一步阐述本实用新型。In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific embodiments.
如图1-3所示,一种电子器件生产加工用冷却架,包括空心支架2,所述空心支架2对称固定在顶板1底部,所述顶板1下方安装有第一水冷系统7和第二水冷系统8,所述第一水冷系统7和第二水冷系统8一端均设置有散热器16,所述散热器16一侧连接有水管18,所述水管18与膨胀水箱23接通,所述膨胀水箱23与水管18之间安装有水套20,所述水套20一侧设有水泵19,所述水泵19上方固定连接有导热板17,所述导热板17一端设置有导轨11,所述导轨11固定在顶板1与底座9之间,且导轨11上安装有风机6,所述风机6外围设有防尘罩5,所述空心支架2内侧设有散热片22,且空心支架2外侧固定有散热板3,所述散热板3一侧设有挂钩12,所述挂钩12上放置有电源线13,所述电源线13一端连接有电源插头15,所述底座9下方安装有制动滚轮10。As shown in Figures 1-3, a cooling frame for the production and processing of electronic devices includes a hollow support 2, which is symmetrically fixed on the bottom of the top plate 1, and a first water cooling system 7 and a second water cooling system 7 are installed under the top plate 1. Water-cooling system 8, one end of the first water-cooling system 7 and the second water-cooling system 8 is provided with a radiator 16, one side of the radiator 16 is connected with a water pipe 18, and the water pipe 18 is connected to the expansion tank 23, and the A water jacket 20 is installed between the expansion water tank 23 and the water pipe 18. A water pump 19 is provided on one side of the water jacket 20. A heat conducting plate 17 is fixedly connected above the water pump 19. A guide rail 11 is provided at one end of the heat conducting plate 17. The guide rail 11 is fixed between the top plate 1 and the base 9, and a fan 6 is installed on the guide rail 11, the fan 6 is provided with a dust cover 5 on the periphery, the hollow support 2 is provided with a cooling fin 22 inside, and the hollow support 2 A cooling plate 3 is fixed on the outside, a hook 12 is arranged on one side of the cooling plate 3, a power cord 13 is placed on the hook 12, a power plug 15 is connected to one end of the power cord 13, and a system is installed below the base 9. Moving roller 10.
其中,所述水套20内循环有冷却液,便于加速冷却。Wherein, cooling liquid is circulated in the water jacket 20 to facilitate accelerated cooling.
其中,所述风机6安装有两个,且风机6与导轨11之间通过连接件14固定,便于充分风冷。Wherein, two fans 6 are installed, and the fans 6 and the guide rails 11 are fixed by connecting pieces 14, so as to facilitate sufficient air cooling.
其中,所述空心支架2内填充有导热硅脂21,便于将散热片22热量传至散热板3。Wherein, the hollow bracket 2 is filled with heat-conducting silicone grease 21 to facilitate the heat transfer from the cooling fin 22 to the cooling plate 3 .
其中,所述第一水冷系统7和第二水冷系统8均通过导热板17安装在横板4底部。Wherein, both the first water cooling system 7 and the second water cooling system 8 are installed on the bottom of the horizontal plate 4 through the heat conduction plate 17 .
其中,所述膨胀水箱23内设有增压器。Wherein, the expansion tank 23 is provided with a supercharger.
其中,所述散热片22设置有多组,便于快速散热。Wherein, the heat dissipation fins 22 are arranged in multiple groups to facilitate rapid heat dissipation.
需要说明的是,本实用新型为一种电子器件生产加工用冷却架,工作时,在横板4下方利用导热板17固定连接第一水冷系统7和第二水冷系统8,运行水冷系统,在散热器16和水套20的配合下,通过导热板17有效对横板4上放置的电子器件进行全面冷却,风机6在导轨11上方便调整位置,通过散热片22将空心支架2之间的热量传至散热板3,空心支架2的空腔内填充导热硅脂21,传热更加快速,该种冷却架,冷却全面彻底,使用效果好。It should be noted that the utility model is a cooling rack for the production and processing of electronic devices. When working, the first water cooling system 7 and the second water cooling system 8 are fixedly connected with the heat conduction plate 17 under the horizontal plate 4, and the water cooling system is operated. Under the cooperation of the radiator 16 and the water jacket 20, the electronic devices placed on the horizontal plate 4 are effectively fully cooled through the heat conducting plate 17, and the position of the fan 6 is conveniently adjusted on the guide rail 11. The heat is transmitted to the heat dissipation plate 3, and the cavity of the hollow support 2 is filled with heat-conducting silicone grease 21, so that the heat transfer is more rapid. This kind of cooling frame has comprehensive and thorough cooling and good use effect.
以上显示和描述了本实用新型的基本原理和主要特征和本实用新型的优点。本行业的技术人员应该了解,本实用新型不受上述实施例的限制,上述实施例和说明书中描述的只是说明本实用新型的原理,在不脱离本实用新型精神和范围的前提下,本实用新型还会有各种变化和改进,这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。The basic principles and main features of the present utility model and the advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model The new model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720746292.2U CN207113338U (en) | 2017-06-26 | 2017-06-26 | A cooling frame for electronic device production and processing |
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| CN201720746292.2U CN207113338U (en) | 2017-06-26 | 2017-06-26 | A cooling frame for electronic device production and processing |
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| CN207113338U true CN207113338U (en) | 2018-03-16 |
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| CN201720746292.2U Expired - Fee Related CN207113338U (en) | 2017-06-26 | 2017-06-26 | A cooling frame for electronic device production and processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807240A (en) * | 2018-07-04 | 2018-11-13 | 芜湖启迪打印机科技有限公司 | A kind of cooling frame mechanism of electronic device production |
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- 2017-06-26 CN CN201720746292.2U patent/CN207113338U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807240A (en) * | 2018-07-04 | 2018-11-13 | 芜湖启迪打印机科技有限公司 | A kind of cooling frame mechanism of electronic device production |
| CN108807240B (en) * | 2018-07-04 | 2024-03-29 | 芜湖启迪打印机科技有限公司 | Cooling rack mechanism for electronic device production |
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