CN219496740U - Optical communication module with high heat dissipation rate - Google Patents

Abstract

The utility model discloses an optical communication module with high heat dissipation rate, which comprises an optical communication module main body, wherein a printed circuit board is arranged in the optical communication module main body through a metal bracket, the top of the printed circuit board is connected with a chip, the chip is of a flip-chip structure, a heat dissipation assembly is arranged at the top of the optical communication module main body, the heat dissipation assembly comprises heat dissipation holes, and the heat dissipation holes are arranged at the top of the optical communication module main body in a penetrating manner. According to the utility model, the radiating holes and the grating plates are arranged, so that the radiating efficiency of the optical communication module is improved, the grating plates are arranged at the top of the radiating holes in a covering manner through arranging the radiating holes on the optical communication module main body, so that air inside and outside the optical communication module main body can flow for exchange, the heat radiated by the chip arranged in the optical communication module can be discharged, and the chip adopts a flip-chip packaging structure, so that the chip has excellent thermal characteristics, the conduction of the heat is facilitated, and the radiating efficiency of the optical communication module is more efficient.

Description

Optical communication module with high heat dissipation rate

Technical Field

The utility model relates to the technical field of optical communication equipment, in particular to an optical communication module with high heat dissipation rate.

Background

The optical module is composed of an optoelectronic device, a functional circuit, an optical interface and the like, wherein the optoelectronic device comprises an emitting part and a receiving part. Along with the progress of technology, optical communication products increasingly tend to be miniaturized and highly integrated, optical modules for communication products also develop toward miniaturization and high integration, and accordingly, the number and types of optical devices integrated in the optical modules are also increased, and the optical modules serve as carriers for transmission between a switch and equipment, so that the optical modules play an important role in the optical fiber communication process due to higher efficiency and safety compared with copper cable transmission.

The existing optical communication module is inconvenient to improve the heat dissipation efficiency of the optical communication module, the optical communication module can generate a large amount of heat in the communication process, the heat generated by the whole optical module needs to be dissipated in time in order to ensure the normal operation of optical communication, the existing optical communication module is used for dissipating heat by attaching the heating surface of the optical communication module to the shell, the heat dissipation is realized by attaching the shell to the module, and the inside of the optical communication module is not beneficial to rapid heat dissipation.

Disclosure of Invention

The utility model aims to provide an optical communication module with high heat dissipation rate, so as to solve the problem that the internal rapid heat dissipation effect of the optical communication module proposed in the background art is poor.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high heat dissipation rate's optical communication module, includes optical communication module main part, the inside of optical communication module main part has the printed circuit board through metal support mounting, the top of printed circuit board is connected with the chip, the chip is the flip-chip structure, radiating component is installed at the top of optical communication module main part, radiating component is including the louvre, the louvre runs through and sets up in the top of optical communication module main part, radiating component is including mounting groove body and grid board, the mounting groove body sets up in the top of optical communication module main part along the edge of louvre, the grid board is connected with the inner wall of mounting groove body, the grid board passes through mounting groove body and installs in the top of optical communication module main part, the inside air of optical communication module can flow outward through the aperture that the grid board established, and the heat that the chip work produced can flow outside through the grid board aperture.

Preferably, the heat dissipation assembly comprises fixing holes and magnetic blocks A, wherein the fixing holes are symmetrically formed in four corners of the installation groove body, the magnetic blocks A are installed in the fixing holes, the bottoms of the magnetic blocks A are connected with the inner bottom wall of the fixing holes, and the fixing holes provide space for the connection of the magnetic blocks B and the magnetic blocks A.

Preferably, the heat dissipation assembly comprises a magnetic block B, wherein the magnetic block B is arranged at the bottom of the grid plate and is of a cylindrical structure, and the magnetic block B can extend into the fixing hole to be magnetically connected with the magnetic block A.

Preferably, the heat dissipation assembly comprises a gauze, the gauze is arranged at the bottom of the grating plate, the top of the gauze is connected with the surface of the magnetic block B in a penetrating way, the grating plate is fixed at the top of the installation groove body under the action of the magnetic block B and the magnetic block A, and the grating plate and the installation groove body are clamped and fixed at the position of the gauze.

Preferably, the buffer assembly is arranged in the optical communication module main body, the buffer assembly comprises a heat conducting silicon chip and heat conducting metal sheets, the heat conducting silicon chip is symmetrically connected to two sides of the printed circuit board, the heat conducting metal sheets are connected with the heat conducting silicon chip and are far away from the surface of the printed circuit board, heat generated by the operation of the printed circuit board can be transferred to the heat conducting metal sheets through the heat conducting silicon chip, and compared with the heat conducting silicon chip, the heat conducting metal sheets are higher in hardness, and the installation positions of the heat conducting silicon chip on the printed circuit board can be fixed through clamping.

Preferably, the buffer assembly comprises a radiating fin, the radiating fin is connected with the surface of the heat conducting metal sheet far away from the heat conducting silicon chip through heat conducting silicone grease, the radiating fin can accelerate the heat dissipation of the heat conducting metal sheet, the radiating fin can assist in accelerating the heat dissipation of the heat conducting metal sheet, and the heat accumulation of the heat conducting metal sheet is prevented from affecting the heat dissipation of the printed circuit board.

Preferably, the buffer assembly comprises a limiting metal plate, a connecting block and an adjusting bolt, wherein the limiting metal plate is connected with the heat dissipation surface of the radiating fin in a fitting way, the adjusting bolt is connected with a connecting block bearing, the surface of the connecting block, which is far away from the adjusting bolt, is fixedly connected with the surface, which is far away from the radiating fin, of the limiting metal plate, the rotating adjusting bolt can enable the limiting metal plate to generate displacement through the connecting block, and the relative position of the adjusting bolt and the optical communication module can be adjusted in a rotating way, so that the fixing effect on printed circuit boards with different sizes can be achieved.

Preferably, the buffer assembly comprises a fixing plate, the fixing plate is symmetrically arranged in the optical communication module main body, the fixing plate is connected with the adjusting bolt in a threaded penetrating manner, the fixing plate is used for fixing the mounting position of the adjusting bolt in the optical communication module, and the fixing plate is internally provided with threads to assist the displacement of the adjusting bolt to generate thrust.

Preferably, the buffer assembly comprises a ventilation plate and a through hole, the ventilation plate is symmetrically arranged on the surface of the optical communication module body, the through hole is penetrated between the two groups of ventilation plates, the nut end of the adjusting bolt is movably arranged in the through hole, the heat of the radiating fin can be radiated outside through the radial direction of the ventilation plate hole, and the adjusting bolt penetrates through the fixing hole for installation, so that a space can be provided for position adjustment of the adjusting bolt.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the radiating holes and the grating plates are arranged, so that the radiating efficiency of the optical communication module is improved, the grating plates are arranged at the top of the radiating holes in a covering manner through arranging the radiating holes on the optical communication module main body, so that air inside and outside the optical communication module main body can flow for exchange, the heat radiated by the chip arranged in the optical communication module can be discharged, and the chip adopts a flip-chip packaging structure, so that the chip has excellent thermal characteristics, the conduction of the heat is facilitated, and the radiating efficiency of the optical communication module is more efficient;

2. according to the utility model, the fixing effect of the built-in circuit board of the optical communication module main body is enhanced by installing the heat conducting silicon chip, the heat conducting metal sheet and the adjusting bolt, the distance can be adjusted by rotating the adjusting bolt, so that the heat conducting metal sheet clamps and fixes the printed circuit board with a cylinder-free size through the heat conducting silicon chip, the heat conducting silicon chip has a certain buffering effect, the heat conducting metal sheet is prevented from wearing the edge of the printed circuit board, the heat conducting silicon chip has good heat conducting property, the heat of the printed circuit board can be transmitted to the heat conducting metal sheet, and the heat dissipation of the printed circuit board is not influenced while the fixing effect of the printed circuit board is realized.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a chip structure according to the present utility model;

FIG. 3 is a schematic diagram of a printed circuit board structure according to the present utility model;

FIG. 4 is a schematic diagram of a heat dissipating structure according to the present utility model;

FIG. 5 is a schematic diagram of a gauze structure according to the present utility model;

FIG. 6 is a schematic diagram of a magnetic block A according to the present utility model;

fig. 7 is a schematic view of a heat sink according to the present utility model.

In the figure: 1. an optical communication module body; 2. a printed circuit board; 3. a chip; 4. a heat radiation hole; 5. installing a groove body; 6. a grating plate; 7. a fixing hole; 8. a magnetic block A; 9. a magnetic block B; 10. gauze; 11. a thermally conductive silicon wafer; 12. a heat conductive metal sheet; 13. a heat sink; 14. a limit metal plate; 15. a connecting block; 16. an adjusting bolt; 17. a fixing plate; 18. a ventilation board; 19. and a through hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 6 and fig. 7, an embodiment of the present utility model provides an optical communication module with high heat dissipation rate, which includes an optical communication module body 1, wherein a printed circuit board 2 is mounted in the optical communication module body 1 through a metal bracket, a chip 3 is connected to the top of the printed circuit board 2, the chip 3 is in a flip-chip structure, a heat dissipation component is mounted on the top of the optical communication module body 1, the heat dissipation component includes a heat dissipation hole 4, the heat dissipation hole 4 penetrates through the top of the optical communication module body 1, the heat dissipation component includes a mounting groove body 5 and a grid plate 6, the mounting groove body 5 is disposed on the top of the optical communication module body 1 along an edge of the heat dissipation hole 4, the grid plate 6 is connected with an inner wall of the mounting groove body 5, the grid plate 6 is mounted on the top of the optical communication module body 1 through the mounting groove body 5, and air in the optical communication module can flow to the outside through an aperture provided by the grid plate 6.

Further, when the optical communication module main body 1 is in use, the power consumption and the heat productivity of the built-in chip 3 are large, the grating plate 6 is installed at the top of the optical communication module main body 1, the heat emitted by the chip 3 can be discharged out of the optical communication module main body 1 through the aperture of the grating plate 6, and the chip 3 adopts a flip-chip structure, so that the thermal characteristics of the chip 3 are improved, and the overall heat dissipation efficiency of the optical communication module is improved.

Referring to fig. 4-6, the heat dissipation assembly includes a fixing hole 7 and a magnetic block A8, the fixing hole 7 is symmetrically disposed at four corners of the mounting groove 5, the magnetic block A8 is mounted in the fixing hole 7, the bottom of the magnetic block A8 is connected with the inner bottom wall of the fixing hole 7, the heat dissipation assembly includes a magnetic block B9, the magnetic block B9 is mounted at the bottom of the grid plate 6, the magnetic block B9 is in a cylindrical structure, the magnetic block B9 can extend into the fixing hole 7 to be magnetically connected with the magnetic block A8, the heat dissipation assembly includes a gauze 10, the gauze 10 is mounted at the bottom of the grid plate 6, and the top of the gauze 10 is in penetrating connection with the surface of the magnetic block B9.

Further, the magnetic block B9 stretches into the fixing hole 7 to be magnetically connected with the magnetic block A8, the grating plate 6 is fixedly installed in the installation groove body 5, the gauze 10 is connected with the magnetic block B9 in a penetrating mode, the gauze is installed between the grating plate 6 and the heat dissipation hole 4, and dust entering the optical communication module through the grating plate 6 is blocked.

Referring to fig. 1, 3 and 4, the buffer assembly is installed inside the optical communication module body 1, the buffer assembly comprises a heat conducting silicon wafer 11 and a heat conducting metal sheet 12, the heat conducting silicon wafer 11 is symmetrically connected to two sides of the printed circuit board 2, the heat conducting metal sheet 12 is far away from the surface of the printed circuit board 2 with the heat conducting silicon wafer 11, the buffer assembly comprises a heat radiating sheet 13, the heat radiating sheet 13 is connected with the heat conducting metal sheet 12 through heat conducting silicone grease and the surface of the heat conducting metal sheet 12 far away from the heat conducting silicon wafer 11, the heat radiating sheet 13 can accelerate the heat radiation of the heat conducting metal sheet 12, the buffer assembly comprises a limit metal plate 14, a connecting block 15 and an adjusting bolt 16, the limit metal plate 14 is in fit connection with the heat radiating surface of the heat radiating sheet 13, the adjusting bolt 16 is in bearing connection with the connecting block 15, the surface of the connecting block 15 far away from the adjusting bolt 16 is fixedly connected with the surface of the limit metal plate 14 far away from the heat radiating sheet 13, the adjusting bolt 16 can enable the limit metal plate 14 to generate displacement through the connecting block 15, the buffer assembly comprises a fixing plate 17, the fixing plate 17 is symmetrically arranged inside the optical communication module body 1, the fixing plate 17 is connected with the adjusting bolt 16 through threads, the through the penetrating through the connecting assembly, the thread, the buffer assembly comprises a through hole 19 and a ventilation hole 19, and the ventilation hole 19 is arranged between the two ventilating hole groups and is arranged at the two ventilating hole groups, and has the ventilating hole 19.

Further, when the optical communication module main body 1 is assembled, the adjusting bolts 16 are rotated to push the limiting metal plates 14, the distance between the two groups of limiting metal plates 14 is shortened to clamp the middle assembly together, the heat conducting silicon chip 11 is in fit connection with the printed circuit board 2 under the thrust of the heat conducting metal sheet 12, the mounting position of the printed circuit board 2 is fixed, the heat conducting silicon chip 11 has super-strong heat conducting effect, heat on the surface of the printed circuit board 2 can be assisted to conduct, and the heat of the printed circuit board 2 is conducted to the radiating fin 13 through the heat conducting metal sheet 12, so that the mounting position of the printed circuit board 2 is fixed under the condition that the radiating effect of the printed circuit board 2 is not affected.

Working principle: when the optical communication module main body 1 is assembled, the adjusting bolts 16 are rotated to push the limiting metal plates 14, the distance between the two groups of limiting metal plates 14 is shortened to clamp the middle assembly together, the heat conducting silicon chip 11 is kept in fit connection with the printed circuit board 2 under the thrust of the heat conducting metal plates 12, the installation position of the printed circuit board 2 is fixed, the heat conducting silicon chip 11 has super-strong heat conducting effect, heat of the surface of the printed circuit board 2 can be assisted to conduct, the heat of the printed circuit board 2 is conducted to the radiating fins 13 through the heat conducting metal plates 12, so that the installation position of the printed circuit board 2 is fixed under the condition that the radiating effect of the printed circuit board 2 is not influenced, when the optical communication module main body 1 is used, the power consumption of a built-in chip 3 is large, the heat productivity is large, the grid plate 6 is installed at the top of the optical communication module main body 1, the heat emitted by the chip 3 can be discharged out of the optical communication module main body 1 through the aperture set by the grid plate 6, and the chip 3 adopts a flip-chip structure to improve the heat characteristic of the chip 3 so as to improve the whole radiating efficiency of the optical communication module.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (9)

1. The utility model provides a high heat dissipation rate's optical communication module, includes optical communication module main part (1), printed circuit board (2) are installed through the metal support to the inside of optical communication module main part (1), the top of printed circuit board (2) is connected with chip (3), its characterized in that: the chip (3) is of a flip-chip structure, and a heat dissipation assembly is arranged at the top of the optical communication module main body (1);

the heat dissipation assembly comprises a heat dissipation hole (4), the heat dissipation hole (4) penetrates through the top of the optical communication module main body (1), the heat dissipation assembly comprises an installation groove body (5) and a grating plate (6), and the installation groove body (5) is arranged at the top of the optical communication module main body (1) along the edge of the heat dissipation hole (4);

the grating plate (6) is connected with the inner wall of the installation groove body (5), the grating plate (6) is installed at the top of the optical communication module main body (1) through the installation groove body (5), and air in the optical communication module main body (1) can flow outwards through the aperture arranged by the grating plate (6).

2. The high heat dissipating optical communication module of claim 1, wherein: the heat dissipation assembly comprises a fixing hole (7) and a magnetic block A (8), wherein the fixing hole (7) is symmetrically arranged at four corners of the installation groove body (5), the magnetic block A (8) is installed in the fixing hole (7), and the bottom of the magnetic block A (8) is connected with the inner bottom wall of the fixing hole (7).

3. The high heat dissipating optical communication module of claim 2, wherein: the heat dissipation assembly comprises a magnetic block B (9), wherein the magnetic block B (9) is arranged at the bottom of the grid plate (6), the magnetic block B (9) is of a cylindrical structure, and the magnetic block B (9) can extend into the fixing hole (7) to be magnetically connected with the magnetic block A (8).

4. A high heat dissipating optical communication module in accordance with claim 3, wherein: the heat dissipation assembly comprises a gauze (10), wherein the gauze (10) is arranged at the bottom of the grating plate (6), and the top of the gauze (10) is connected with the surface of the magnetic block B (9) in a penetrating way.

5. The high heat dissipating optical communication module of claim 1, wherein: the optical communication module is characterized in that a buffer assembly is arranged in the optical communication module main body (1) and comprises a heat conduction silicon wafer (11) and heat conduction metal sheets (12), the heat conduction silicon wafer (11) is symmetrically connected to two sides of the printed circuit board (2), and the heat conduction metal sheets (12) are connected with the surface, far away from the printed circuit board (2), of the heat conduction silicon wafer (11).

6. The high heat dissipating optical communication module of claim 5, wherein: the buffer component comprises radiating fins (13), the radiating fins (13) are connected with the surface, far away from the heat-conducting silicon wafer (11), of the heat-conducting metal sheet (12) through heat-conducting silicone grease, and the radiating fins (13) can accelerate heat dissipation of the heat-conducting metal sheet (12).

7. The high heat dissipating optical communication module of claim 6, wherein: the buffer assembly comprises a limiting metal plate (14), a connecting block (15) and an adjusting bolt (16), wherein the limiting metal plate (14) is connected with the radiating surface of the radiating fin (13) in a fitting mode, the adjusting bolt (16) is connected with the connecting block (15) in a bearing mode, the surface of the connecting block (15) away from the adjusting bolt (16) is fixedly connected with the surface of the limiting metal plate (14) away from the radiating fin (13), and the limiting metal plate (14) is enabled to generate displacement by rotating the adjusting bolt (16) through the connecting block (15).

8. The high heat dissipating optical communication module of claim 6, wherein: the buffer assembly comprises a fixing plate (17), the fixing plate (17) is symmetrically arranged in the optical communication module main body (1), and the fixing plate (17) is connected with the adjusting bolt (16) in a threaded penetrating mode.

9. The high heat dissipating optical communication module of claim 6, wherein: the buffering assembly comprises ventilation plates (18) and through holes (19), the ventilation plates (18) are symmetrically arranged on the surface of the optical communication module main body (1), the through holes (19) are formed between the two groups of ventilation plates (18) in a penetrating mode, and the nut ends of the adjusting bolts (16) are movably arranged in the through holes (19).