CN212992844U - Chip heat dissipation type Ethernet switch - Google Patents
Chip heat dissipation type Ethernet switch Download PDFInfo
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- CN212992844U CN212992844U CN202022012453.XU CN202022012453U CN212992844U CN 212992844 U CN212992844 U CN 212992844U CN 202022012453 U CN202022012453 U CN 202022012453U CN 212992844 U CN212992844 U CN 212992844U
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- ethernet
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Abstract
The utility model discloses a chip heat dissipation type ethernet switch, include: a printed circuit board electrically connected with the Ethernet chip; a heat sink fixedly connected to the ethernet chip, the heat sink comprising: the heat absorption pipe is arranged at the lower end of the heat dissipation assembly; the heat dissipation assembly is arranged on the heat dissipation assembly, and the heat dissipation assembly is fixedly connected with the heat absorption pipe. According to the utility model discloses, set up the radiating part on the inside chip of ethernet switch to it is overheated to cause the damage to the chip to have avoided the chip.
Description
Technical Field
The utility model relates to a network communication equipment technical field specifically is a chip heat dissipation type ethernet switch.
Background
In life, the use of ethernet switches is very widespread, and the transmission rate of ethernet switches is faster than that of routers.
However, the existing ethernet switch needs to work for a long time, which is a problem of poor heat dissipation effect, easy damage of internal parts and short service life, and most of heat sources of the ethernet switch are from chips inside the switch, so the heat dissipation problem of the chip of the ethernet switch becomes an important link of heat dissipation of the whole ethernet switch.
In view of the above, there is a need to develop a chip-on-chip ethernet switch to solve the above problems.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists among the prior art, the utility model discloses a main objective provides a chip heat dissipation type ethernet switch, and it adopts the mode of setting the radiator unit on the ethernet switch chip for the good heat dissipation function is realized to ethernet switch chip under the cooperation of heat absorption pipe and radiator, thereby has avoided leading to the emergence of its damage problem because of the ethernet switch chip is overheated.
In order to achieve the above objects and other advantages in accordance with the present invention, there is provided a chip heat dissipation type ethernet switch, comprising: a printed circuit board electrically connected with the Ethernet chip; a heat sink fixedly connected to the ethernet chip, the heat sink comprising: the heat absorption pipe is arranged at the lower end of the heat dissipation assembly; the heat dissipation assembly is arranged on the heat dissipation assembly, and the heat dissipation assembly is fixedly connected with the heat absorption pipe.
Optionally, the heat absorbing pipe is in a spiral ring shape.
Optionally, the heat absorbing pipe is a hollow structure.
Optionally, the cross-sectional area of the heat radiation body is gradually increased from bottom to top.
Optionally, a heat dissipation groove is arranged on the heat dissipation body.
Optionally, the printed circuit board further includes:
the network port module is electrically arranged on the printed circuit board;
the power indicator light is electrically arranged on the printed circuit board;
the network port module and the power indicator lamp are correspondingly arranged on the same side of the printed circuit board.
Optionally, the net port modules are all provided with net port signal lamps.
Optionally, a heat conducting foam is arranged between the bottom plate and the printed circuit board.
Optionally, the network port module is provided with a plurality of RS-485 interfaces.
The technical scheme has the following advantages or beneficial effects: the main objective of the utility model is to provide a chip heat dissipation type ethernet switch, its adoption sets up the mode with radiator unit on the ethernet switch chip for the good heat dissipation function is realized to the ethernet switch chip under the cooperation of heat-absorbing pipe and radiator, thereby has avoided leading to the emergence of its damage problem because of the ethernet switch chip is overheated.
Drawings
Fig. 1 is a schematic structural diagram of a chip heat dissipation ethernet switch according to an embodiment of the present invention;
fig. 2 is an exploded view of a chip heat dissipation ethernet switch according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a printed circuit board in a chip heat dissipation ethernet switch according to an embodiment of the present invention;
fig. 4 is a bottom view of a printed circuit board in a chip heat dissipation ethernet switch according to an embodiment of the present invention.
Description of reference numerals: 1-a printed circuit board; 11-a network port module; 111-network signal lights; 12-power signal lamp; 13-an ethernet chip; 14-a power supply module; 15-heat conducting foam; 2-a housing; 3-a bottom plate; 4-a heat dissipation assembly; 41-a heat absorption tube; 42-a heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components.
In the following description, terms such as center, thickness, height, length, front, back, rear, left, right, top, bottom, upper, lower, etc., are defined with respect to the configurations shown in the respective drawings, and in particular, "height" corresponds to a dimension from top to bottom, "width" corresponds to a dimension from left to right, "depth" corresponds to a dimension from front to rear, which are relative concepts, and thus may be varied accordingly depending on the position in which it is used, and thus these or other orientations should not be construed as limiting terms.
Terms concerning attachments, coupling and the like (e.g., "connected" and "attached") refer to a relationship wherein structures are secured or attached, either directly or indirectly, to one another through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
Fig. 1 to 4 illustrate an embodiment of a chip heat dissipation ethernet switch according to the present invention. The chip heat dissipation type Ethernet switch comprises a printed circuit board 1, a power supply and a power supply, wherein the printed circuit board is electrically connected with an Ethernet chip 13; a heat sink 4 fixedly connected to the ethernet chip 13, wherein the heat sink 4 includes: a heat absorbing pipe 41, wherein the heat absorbing pipe 41 is arranged at the lower end of the heat dissipation assembly 4; and the heat radiator 42 is arranged at the upper end of the heat radiation component 4, and the heat radiator 42 is fixedly connected with the heat absorption tube 41.
For better solution ethernet chip 13's heat dissipation problem, the utility model discloses a structure that uses heat absorption pipe 41 and radiator 42 cooperation is divided into heat absorption and two parts of heat dissipation with whole radiating process, and the heat absorption effect is realized to the heat absorption pipe 41 of copper pipe system, and copper pipe heat-conduction ability is strong, can realize quick heat absorption, and the radiator 42 of aluminium alloy system, the radiating efficiency is high, has shortened the radiating time greatly, has strengthened the radiating effect of ethernet chip 13.
Referring to fig. 2, 3 and 4, the printed circuit board 1 is provided with mounting holes around, and the printed circuit board 1 includes: the network port module 11 is electrically arranged on the printed circuit board 1 and used for connecting external equipment and connecting external network cables or optical modem conversion signals, the network port module 11 is provided with a plurality of RS-485 interfaces, the interfaces are simple and convenient to wire, strong in anti-noise interference performance and long in transmission distance, and have multi-station capability, each interface is provided with a network signal lamp 111 used for port rate and data, the network signal lamp 111 is an LED display lamp, green represents 1000Mbps, yellow represents 100Mbps, and flicker represents that port connection is effective;
the power indicator 12 is electrically arranged on the printed circuit board 1, and is electrically arranged on the printed circuit board 1, the power indicator 12 is used for monitoring the power state, and the power indicator 12 is an LED display lamp;
the network port module 11 and the power indicator 12 are correspondingly arranged on the same side of the printed circuit board 1, so that the operation and observation of workers are facilitated;
and the power supply module 14 is electrically arranged on the printed circuit board 1 and arranged on one side adjacent to the network port module 11, the power supply module 14 is a redundant power supply connection port, and the power supply module 14 supports the input of a wide-range low-voltage alternating current or direct current power supply.
The ethernet chip 13 is electrically disposed on the upper surface of the printed circuit board 1.
Further, the power module 14 is connected to an external power supply to supply power to electronic components in the ethernet switch; the external data is transmitted to the ethernet chip 13 through the network port module 11, and after being processed by the ethernet chip 13, the processed data is transmitted to the external device by the network port module 11.
Referring to fig. 2 and 3, the heat dissipation assembly 4 is fixedly connected to the ethernet chip 13 through a thermal conductive adhesive, and the heat dissipation assembly 4 includes: the heat absorbing pipe 41 is arranged at the lower end of the heat dissipation device 4 to better absorb the heat emitted by the ethernet chip 13, and the heat absorbing pipe 41 is in a spiral ring shape, so that the heat absorbing pipe 41 absorbs the heat of the ethernet chip 13 and emits a part of the heat at the same time; furthermore, the heat absorbing pipe 41 is a hollow structure, so that the flow area between the heat absorbing pipe 41 and air is increased, the heat absorbing pipe 41 further radiates more heat, the heat absorbing pipe 41 is a copper pipe, the heat conducting capacity of the copper pipe is strong, and a large amount of heat energy generated by the running of the Ethernet chip can be quickly brought to the copper pipe.
The heat sink 42 is arranged at the upper end of the heat dissipation assembly 4, the heat sink 42 is fixedly connected with the heat absorption tube 41 through heat conducting glue, the sectional area of the heat sink 42 is gradually increased from bottom to top, the heat dissipation area of the heat sink 42 is increased, a heat dissipation groove is formed in the heat sink, the heat dissipation area of the heat sink 42 is further increased, the heat sink 42 is an aluminum profile, the heat absorption tube 41 in a copper tube system and the heat sink 42 in an aluminum profile system are tightly combined with each other, a large amount of heat energy is rapidly diffused to the heat sink 42 and is taken away by the flow of air, and the good heat dissipation of the Ethernet chip 13 is realized by adopting the structural design.
Referring to fig. 1 and 2, a bottom plate through hole matched with the network port module 11 and the power indicator 12 is formed in the front side of the bottom plate 3, a bayonet is installed on the surface of the network port module 11, when the network port module 11 penetrates through the corresponding position of the bottom plate through hole, the bayonet is abutted against the edge of the through hole, the bayonet is pressed inwards, the bayonet clamps the network port module 11 in the through hole, further, the bottom plate 3 is provided with a fixing column provided with a threaded hole, and the printed circuit board 1 is fixedly connected with the fixing column through a bolt; the heat-conducting foam 15 is arranged between the opposite surfaces of the bottom plate 3 and the printed circuit board 1, so that the heat-conducting, fixing, vibration-damping and vibration-absorbing effects are achieved, the circuit board is prevented from being damaged by sudden external force, a mounting plate is formed on the rear side of the bottom plate along the vertical direction, and threaded hole bosses are formed on the left side and the right side of the bottom plate towards the inner side;
referring to fig. 1 and 2, through holes matched with the punching bosses are formed in the left side, the right side and the rear side of the shell 2, the bottom plate 3 is fixedly connected with the shell 2 through bolts, a power supply through hole matched with the power supply module is formed in the right side of the shell, and the power supply module is clamped in the power supply through hole.
Furthermore, the bottom plate 3 and the shell 2 are connected to form a flat box, and by adopting the structure, the effect of reducing the volume of the Ethernet switch is achieved, and the arrangement and the installation are convenient.
The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields of application suitable for this invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.
Claims (9)
1. A chip-on-board ethernet switch, comprising:
a printed circuit board (1) to which an Ethernet chip (13) is electrically connected;
a heat sink (4) fixedly connected to the Ethernet chip (13), the heat sink (4) comprising: the heat absorption pipe (41), the said heat absorption pipe (41) is set up in the lower end of the said heat dissipating assembly (4); the heat dissipation assembly (4) comprises a heat dissipation body (42), wherein the heat dissipation body (42) is arranged at the upper end of the heat dissipation assembly (4), and the heat dissipation body (42) is fixedly connected with the heat absorption pipe (41).
2. The ethernet chip heat spreader switch of claim 1, wherein the heat sink tubing (41) is in the form of a helical loop.
3. The ethernet chip heat spreader switch of claim 2, wherein the heat sink tubing (41) is hollow.
4. The ethernet chip on board heat spreader switch of claim 1, wherein the cross-sectional area of the heat spreader (42) increases from bottom to top.
5. The chip-on-board Ethernet switch of claim 3, wherein the heat sink (42) has a heat sink recess.
6. A chip radiating ethernet switch according to claim 1, wherein said printed circuit board (1) further comprises:
a network port module (11) which is electrically arranged on the printed circuit board (1);
a power indicator (12) electrically disposed on the printed circuit board (1);
the network port module (11) and the power indicator lamp (12) are correspondingly arranged on the same side of the printed circuit board (1).
7. The chip heat dissipation type Ethernet switch according to claim 6, wherein the network port modules (11) are provided with network port signal lamps (111).
8. The ethernet switch, as set forth in claim 6, characterized in that a heat conducting foam (15) is arranged between the backplane (3) and the printed circuit board (1).
9. The chip-on-board ethernet switch according to claim 6, wherein said network port module (11) is provided with a plurality of RS-485 interfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022012453.XU CN212992844U (en) | 2020-09-15 | 2020-09-15 | Chip heat dissipation type Ethernet switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022012453.XU CN212992844U (en) | 2020-09-15 | 2020-09-15 | Chip heat dissipation type Ethernet switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212992844U true CN212992844U (en) | 2021-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022012453.XU Active CN212992844U (en) | 2020-09-15 | 2020-09-15 | Chip heat dissipation type Ethernet switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212992844U (en) |
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2020
- 2020-09-15 CN CN202022012453.XU patent/CN212992844U/en active Active
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