CN210093834U

CN210093834U - Small-sized medium-power solid-state relay

Info

Publication number: CN210093834U
Application number: CN201920771972.9U
Authority: CN
Inventors: 刘迎露
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-05-27
Filing date: 2019-05-27
Publication date: 2020-02-18
Anticipated expiration: 2029-05-27

Abstract

The utility model relates to a small-size medium power solid state relay. The to-be-solved technical problem of the utility model is to provide a solid state relay that small, power is big, simple to operate and heat dispersion are good. The utility model discloses a technical scheme include: the circuit board is at least connected with a switch tube and a pin, the upper end of the shell is provided with a radiating fin and an L-shaped radiator, and the radiating fin is provided with a base surface, a heat conducting surface and a mounting column; the base surface is arranged on the upper end surface of the shell; the heat conducting surface extends into the shell and is attached to the surface of the switch tube; the L-shaped radiator is provided with a transverse radiating surface and a longitudinal radiating surface which are vertical to each other and a plurality of fins distributed on the transverse radiating surface and the longitudinal radiating surface. The utility model discloses a solid state relay advantage lies in: the installation is convenient, and the trouble of traditional multi-screw fixation is omitted; the volume is small and exquisite, do not account for the space, and heat dispersion is good.

Description

Small-sized medium-power solid-state relay

Technical Field

The utility model relates to a small-size medium power solid state relay.

Background

Compared with the traditional contact relay, the solid-state relay has the advantages of no spark, no noise, high speed, low driving power consumption, corrosion resistance and the like, and is widely applied to occasions such as heating, machinery, industrial control equipment and the like. However, higher heat can be generated in the working process, and a heat dissipation base needs to be matched with a common medium-power solid-state relay, so that the defects of large volume, large occupied space for installation and inconvenience for installation exist.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a small-size medium power solid state relay that small, power are big, simple to operate and heat dispersion are good.

In order to solve the above problem, the utility model discloses a technical scheme include: the shell and establish circuit board in the shell, be connected with switch tube and participating in on the circuit board at least, its characterized in that: the upper end of the shell is provided with a radiating fin and an L-shaped radiator, and the radiating fin is provided with a base surface, a heat conducting surface and a mounting column; the base surface is arranged on the upper end surface of the shell; the heat conducting surface extends into the shell and is attached to the surface of the switch tube; the mounting post extends away from the housing; the L-shaped radiator is provided with a transverse radiating surface and a longitudinal radiating surface which are vertical to each other and a plurality of fins which are distributed on the transverse radiating surface and the longitudinal radiating surface, the transverse radiating surface of the L-shaped radiator is attached to the base surface of the radiating fin, a clamping groove is arranged on the transverse radiating surface, and a mounting column of the radiating fin is arranged in the clamping groove; the pins are connected to the lower end of the circuit board and extend out of the base at the bottom of the shell.

The solid-state relay is characterized in that: the upper end surface of the shell is provided with a first mounting groove, and second mounting grooves are arranged corresponding to two sides of the first mounting groove; the base surface of the radiating fin is arranged in the first mounting groove and is hooked with the second mounting groove through hooks arranged on two sides.

The solid-state relay is characterized in that: the upper end of the circuit board is connected with a light emitting diode, and the light emitting diode is aligned to the light transmission hole in the upper end of the shell.

The solid-state relay is characterized in that: transparent colloid is sealed in the light-transmitting hole.

The solid-state relay is characterized in that: radiating silica gel is coated between the transverse radiating surface of the L-shaped radiator and the base surface of the radiating fin.

The solid-state relay is characterized in that: and heat dissipation silica gel is coated between the heat conduction surface of the heat dissipation sheet and the switch tube.

The utility model discloses a solid state relay, its characterized in that: and heat dissipation silica gel is coated between the heat conduction surface of the heat dissipation sheet and the switch tube.

The solid-state relay is characterized in that: the heat sink 5 is integrally formed by punching.

The utility model discloses a solid state relay advantage lies in:

1. the installation is convenient, after the installation column of the radiating fin is arranged in the slot hole of the L-shaped radiator, the lower end of the installation column is deformed by screwing (usually by means of a vice), so that the L-shaped radiator can be clamped and fixed, and the trouble of traditional multi-screw fixation is omitted;

2. small size and no space occupation: because the L-shaped radiator is adopted, the radiating fins extend along the directions of two sides of the shell, and the thickness shape of the radiator is matched with that of the shell, the volume of the solid-state relay is greatly reduced;

3. the heat dissipation performance is good, the heat of the heating source (switch tube) is firstly led out through the heat dissipation fins, and then the heat dissipation is carried out through the L-shaped heat dissipater, and the heat dissipation effect of the heat dissipation device is far better than that of the heat dissipation device which directly dissipates heat to the shell.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic structural diagram of a solid-state relay according to the present invention;

fig. 2 is an exploded view of the solid-state relay of the present invention;

fig. 3 is a cross-sectional view of the solid-state relay of the present invention;

fig. 4 and 5 are schematic structural views of the heat sink of the present invention at different angles;

FIG. 6 is a schematic structural view of the "L" -shaped heat sink of the present invention;

fig. 7 is a schematic structural diagram of the housing of the present invention.

Detailed Description

As shown in fig. 1 to 7, the solid-state relay of the present invention includes a housing 1 and a circuit board 2 disposed in the housing 1. At least a switch tube 3 and a pin 4 are connected to the circuit board 2. The upper end of the shell 1 is provided with a radiating fin 5 and an L-shaped radiator 6. The radiating fin 5 is provided with a base surface 7, a heat conducting surface 8 and a mounting column 9, and the radiating fin 5 is integrally formed in a punching mode. The base surface 7 is mounted on an upper end surface 10 of the housing 1 and is shaped to conform to the upper end surface 10, and is generally rectangular. The heat conducting surface 8 extends into the shell 1 and is attached to the surface of the switch tube 3. The mounting posts 9 extend away from the housing 1. The L-shaped heat sink 6 has a transverse heat dissipating surface 11 and a longitudinal heat dissipating surface 12 perpendicular to each other, and a plurality of fins 13 distributed on the transverse heat dissipating surface 11 and the longitudinal heat dissipating surface 12. The transverse radiating surfaces 11 and the longitudinal radiating surfaces 12 are shaped to fit the end faces of the housing 1. The transverse radiating surface 11 of the L-shaped radiator 6 is attached to the base surface 7 of the radiating fin 5, a clamping groove 14 is formed in the transverse radiating surface 11, the mounting column 9 of the radiating fin 5 is arranged in the clamping groove hole 14, and the lower end of the mounting column is deformed by screwing (usually by means of a vice) so as to clamp and fix the L-shaped radiator 6. The pins 4 are attached to the lower end of the circuit board 2 and extend from a base 15 at the bottom of the housing 1. Through the structure, the solid-state relay is relatively flat and small in overall structure.

Further, the upper end surface 10 of the housing 1 is provided with a first mounting groove 16, and second mounting grooves 17 are arranged on two sides corresponding to the first mounting groove 16. The base surface 7 of the heat sink 5 is installed in the first installation groove 16 and is hooked with the second installation groove 17 through hooks 18 arranged on two sides, so that the heat sink 5 can be firmly fixed on the housing 1.

Further, the circuit board 2 is connected with a light emitting diode 19 at the upper end, and the light emitting diode 19 is aligned with the light transmission hole 20 at the upper end of the housing 1. When the base surface 7 of the heat sink 5 covers the light-transmitting hole 20, the light-transmitting hole is also provided on the base surface. The light emitting diode 19 is used for indicating the working state of the solid-state relay.

Further, a transparent colloid is sealed in the light hole 20 to play a role of water resistance and transparent light guide.

Furthermore, heat dissipation silica gel is coated between the transverse heat dissipation surface 11 of the L-shaped heat radiator 6 and the base surface 7 of the heat dissipation fin 5, so that the heat dissipation effect is improved, and the L-shaped heat radiator 6 is firm.

Furthermore, heat dissipation silica gel is coated between the heat conducting surface 8 of the heat dissipation sheet 5 and the switch tube 3 to improve the heat dissipation effect.

The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the present invention, and any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention are all included within the protection scope of the present invention.

Claims

1. The utility model provides a small-size medium power solid state relay, includes shell (1) and establishes circuit board (2) in shell (1), be connected with switch tube (3) and participate in (4) at least on circuit board (2), its characterized in that: the upper end of the shell (1) is provided with a radiating fin (5) and an L-shaped radiator (6), and the radiating fin (5) is provided with a base surface (7), a heat conducting surface (8) and a mounting column (9); the base surface (7) is mounted on an upper end surface (10) of the housing (1); the heat conducting surface (8) extends into the shell (1) and is attached to the surface of the switch tube (3); the mounting column (9) extends in the direction away from the shell (1); "L" shape radiator (6) have mutually perpendicular's horizontal cooling surface (11) and vertical cooling surface (12) and a plurality of distribution are in fin (13) on horizontal cooling surface (11) and vertical cooling surface (12), the horizontal cooling surface (11) of "L" shape radiator (6) laminate in base face (7) of fin (5), be provided with draw-in groove (14) on horizontal cooling surface (11), erection column (9) of fin (5) set up in draw-in groove (14), participate in (4) and connect circuit board (2) lower extreme, and follow stretch out in base (15) of shell (1) bottom.

2. The miniature medium power solid state relay of claim 1, wherein: a first mounting groove (16) is formed in the upper end face (10) of the shell (1), and second mounting grooves (17) are formed in the two sides corresponding to the first mounting groove (16); the base surface (7) of the radiating fin (5) is arranged in the first mounting groove (16) and is hooked with the second mounting groove (17) through hooks (18) arranged on two sides.

3. The miniature medium power solid state relay of claim 1, wherein: the upper end of the circuit board (2) is connected with a light emitting diode (19), and the light emitting diode (19) is aligned to a light transmission hole (20) at the upper end of the shell (1).

4. The miniature medium power solid state relay of claim 3, wherein: transparent colloid is sealed in the light hole (20).

5. The miniature medium power solid state relay of claim 1, wherein: radiating silica gel is coated between the transverse radiating surface (11) of the L-shaped radiator (6) and the base surface (7) of the radiating fin (5).

6. The miniature medium power solid state relay of claim 1, wherein: and heat dissipation silica gel is coated between the heat conduction surface (8) of the heat dissipation fin (5) and the switch tube (3).

7. The miniature medium power solid state relay of claim 1, wherein: the radiating fins (5) are integrally formed in a punch forming mode.