CN108870342B - Heat radiating device for high-power LED light source - Google Patents

Heat radiating device for high-power LED light source Download PDF

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Publication number
CN108870342B
CN108870342B CN201810852603.2A CN201810852603A CN108870342B CN 108870342 B CN108870342 B CN 108870342B CN 201810852603 A CN201810852603 A CN 201810852603A CN 108870342 B CN108870342 B CN 108870342B
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China
Prior art keywords
heat
heat pipe
pipe
heat dissipation
accommodating
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CN201810852603.2A
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Chinese (zh)
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CN108870342A (en
Inventor
吕文卿
芮志明
吴展宏
向德祥
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JIANGSU HONGLI PHOTOELECTRIC TECHNOLOGY CO LTD
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JIANGSU HONGLI PHOTOELECTRIC TECHNOLOGY CO LTD
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Priority to CN201810852603.2A priority Critical patent/CN108870342B/en
Publication of CN108870342A publication Critical patent/CN108870342A/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention provides a heat dissipation device for a high-power LED light source, which can solve the problems of uneven heat transfer, small heat dissipation area and non-ideal heat dissipation effect of the traditional heat dissipation device. The heat dissipation module comprises a bracket bottom plate and a heat dissipation module, wherein the heat dissipation module comprises a substrate, and a plurality of heat dissipation fins are arranged on the front surface of the substrate; the heat pipe assembly is clamped between the back surfaces of the base plates of the two heat dissipation modules arranged in pairs, and the heat pipe assembly extends to be arranged on the support bottom plate.

Description

Heat radiating device for high-power LED light source
Technical Field
The invention relates to the field of radiators, in particular to a radiating device for a high-power LED light source.
Background
The LED light source is a novel light source which is widely applied and rapidly developed at present due to the advantages of energy conservation, high efficiency, small volume, long service life, high response speed, low driving voltage, strong shock resistance and the like. However, the LED light source generates a large amount of heat during operation, and if the heat cannot be timely discharged, the junction temperature of the LED will be quickly increased, so that the performance and the service life of the LED light source are affected, and therefore, how to effectively dissipate the heat of the LED light source becomes one of the key technologies for LED development.
The conventional heat dissipation of the LED mostly adopts a fin heat dissipation mode, but for a high-power LED light source, especially a COB light source with a power of more than 70W, the conventional fin heat dissipation cannot meet the requirement, and a heat pipe is usually added on the basis of a heat dissipation fin to improve the heat transfer performance, for example, the chinese patent application with publication No. CN107763589a discloses a heat sink for a light source with a higher integration level, which is mounted on a second bottom plate through a first bottom plate of a heat sink body, and a heat pipe for heat conduction is arranged between the first bottom plate and the second bottom plate, and the LED light source is mounted on the bottom surface of the second bottom plate; although the heat pipe can effectively improve the heat transfer performance between the LED light source and the radiator, the heat pipe is only arranged on the installation side of the fins of the radiator and the first bottom plate and is only unidirectionally arranged along the arrangement direction of the fins of the radiator, so that the obvious problem of uneven heat transfer exists; meanwhile, the existing radiator adopts a structure of being installed on the second bottom plate in a parallel and laminated mode, so that the radiator has the problems of large size and large occupied space.
Disclosure of Invention
The invention provides a heat dissipation device for a high-power LED light source, which can solve the problems of uneven heat transfer, small heat dissipation area and unsatisfactory heat dissipation effect of the traditional heat dissipation device.
The technical scheme is that the heat dissipating device for the high-power LED light source comprises a bracket bottom plate and a heat dissipating module, wherein the heat dissipating module comprises a substrate, and a plurality of heat dissipating fins are arranged on the front surface of the substrate, and the heat dissipating device is characterized in that: the heat pipe assembly is used for conducting heat, the heat dissipation modules are arranged on the top surface of the support base plate in pairs, LED light sources are arranged on the bottom surface of the support base plate, the two heat dissipation modules in pairs are arranged on the top surface of the support base plate in a mode that the back of the substrate is close to the back, meanwhile, the substrate of the heat dissipation modules is perpendicular to the support base plate, and the heat pipe assembly is clamped between the back surfaces of the substrates of the two heat dissipation modules in pairs and is arranged on the support base plate in an extending mode.
It is further characterized by: the heat pipe assembly comprises a first heat pipe and a second heat pipe, wherein the first heat pipe and the second heat pipe are in a straight line shape, the second heat pipe comprises a first pipe section and a second pipe section which are vertically arranged, the first pipe section of the first heat pipe and the first pipe section of the second heat pipe are clamped between the back surfaces of substrates of the two heat dissipation modules which are arranged in pairs, the first pipe section of the first heat pipe and the first pipe section of the second heat pipe are arranged in a crossing way, and the first pipe section of the second heat pipe extends to the top surface of the support bottom plate so that the second pipe section is attached to the top surface of the support bottom plate;
the end part of one side of the first pipe section of the second heat pipe is connected with the end part of one side of the second pipe section in a round angle manner;
the first heat pipes are arranged in clamping planes formed on the back sides of the base plates of the two groups of heat dissipation modules and are parallel to the support base plate, and the first pipe sections of the second heat pipes are perpendicularly crossed with the first heat pipes.
It is further characterized in that: and in the two heat dissipation modules arranged in pairs, a first heat pipe groove for accommodating the first heat pipe is formed in the back surface of the substrate of one heat dissipation module, a second heat pipe groove for accommodating the first pipe section of the second heat pipe is formed in the back surface of the substrate of the other heat dissipation module, and a third heat pipe groove for accommodating the second pipe section of the second heat pipe is formed in the support bottom plate.
It is further characterized in that: the back of the base plate of the two heat dissipation modules arranged in pairs is provided with a first heat pipe groove for accommodating the first heat pipe or a second heat pipe groove for accommodating the first pipe section of the second heat pipe, and the support base plate is provided with a third heat pipe groove for accommodating the second pipe section of the second heat pipe.
It is further characterized by: an intermediate baffle is arranged between the back surfaces of the substrates of the two groups of heat dissipation modules arranged in pairs, the intermediate baffle is vertically arranged on the support bottom plate, and each heat dissipation module, the intermediate baffle and the support bottom plate are all provided with the heat pipe assembly.
Further, the first heat pipe is in a clamping plane formed on the back surfaces of the substrates of the two groups of heat dissipation modules and parallel to the support base plate, and the first pipe section of the second heat pipe is perpendicular to the first heat pipe.
Still further, a first heat pipe groove for accommodating a first heat pipe in the heat pipe assembly or a second heat pipe groove for accommodating a first pipe section of a second heat pipe in the heat pipe assembly is formed on two side surfaces of the middle partition plate, a second heat pipe groove for accommodating a first pipe section of the second heat pipe or a first heat pipe groove for accommodating the first heat pipe is formed on the back surface of the substrate of the heat radiation module, and a third heat pipe groove for accommodating a second pipe section of the second heat pipe is formed on the support bottom plate.
The invention has the beneficial effects that: the LED light sources are arranged on the bottom surface of the bracket bottom plate in pairs, the two paired heat dissipation modules are arranged on the top surface of the bracket bottom plate in a mode of leaning back of the back surface of the substrate, and meanwhile, the heat dissipation fins of the heat dissipation modules are perpendicular to the substrate, so that heat generated by the LED light sources can be directly and rapidly dissipated by a plurality of heat dissipation fins on the two paired heat dissipation modules after passing through the bracket bottom plate, and the whole heat dissipation device is compact in structure and small in occupied volume; meanwhile, the heat pipe assembly is clamped between the back surfaces of the base plates of the two heat dissipation modules arranged in pairs, and the heat pipe assembly is arranged on the support base plate in an extending mode, so that heat transfer between the support base plate and the heat dissipation modules and between the two groups of heat dissipation modules is more uniform and rapid, the heat dissipation speed and heat dissipation performance of the LED light source can be greatly improved, and the service life of the LED light source is prolonged.
Drawings
FIG. 1 is a schematic view of a first form of a heat sink for a high power LED light source according to the present invention;
FIG. 2 is a schematic view of a second form of a heat sink for a high power LED light source according to the present invention;
FIG. 3 is a schematic view of a third form of a heat sink for a high power LED light source according to the present invention;
fig. 4 is a schematic structural view of a bracket base plate with an intermediate partition plate in the heat dissipating device of the present invention.
Reference numerals: 10-bracket bottom plate, 20-heat radiation module, 21-substrate, 22-heat radiation fin, 31-first heat pipe, 32-second heat pipe, 321-first pipe section, 322-second pipe section, 40-middle partition board, 51-first heat pipe groove, 52-second heat pipe groove, 53-third heat pipe groove.
Detailed Description
The invention relates to a heat dissipating device for a high-power LED light source, which is shown in fig. 1, and comprises a bracket base plate 10 and a heat dissipating module 20, wherein the heat dissipating module 20 comprises a base plate 21, and a plurality of heat dissipating fins 22 are arranged on the front surface of the base plate 21; the heat dissipation modules are arranged on the top surface of the support base plate 10 in a paired mode, the LED light sources are arranged on the bottom surface of the support base plate 10, the two paired heat dissipation modules 20 are arranged on the top surface of the support base plate 10 in a mode that the back surfaces of the substrates 21 are close to the back surfaces of the two heat dissipation modules, the heat dissipation fins 22 of the heat dissipation modules are perpendicular to the substrates 21, the heat pipe assemblies are clamped between the back surfaces of the substrates 21 of the two paired heat dissipation modules 20 and are arranged on the support base plate 10 in an extending mode, the heat pipe assemblies are located between the support base plate 10 and the heat dissipation modules 20 on the corresponding sides, and therefore heat dissipation of the heat pipe assemblies on one side surface of the substrate 21 of the heat dissipation module 20 can be achieved, heat dissipation efficiency and heat dissipation speed can be effectively improved, and rapid and uniform heat dissipation can be guaranteed.
For ease of understanding, the front surface of the substrate 21 in the present invention specifically refers to the surface on which the heat sink 22 is mounted, and the surface on which the heat sink 22 is not mounted, which is opposite to the front surface, is the back surface; one side surface of the bracket base plate 10 facing the heat dissipation module 20 is defined as a top surface, and the other side surface opposite to the top surface is defined as a bottom surface.
The heat pipe assembly comprises a first heat pipe 31 in a straight line shape and a second heat pipe 32 in an L shape, wherein the second heat pipe 32 in the L shape comprises a first pipe section 321 and a second pipe section 322 which are vertically arranged, the first pipe sections 321 of the first heat pipe 31 and the second heat pipe 32 are clamped between the back surfaces of the base plates 21 of the two heat dissipation modules 20 which are arranged in pairs, the first pipe sections 31 of the first heat pipe 31 and the first pipe sections 321 of the second heat pipe 32 are arranged in a crossing way, and the first pipe sections 321 of the second heat pipe 32 extend to the top surface of the bracket bottom plate 10 so that the second pipe sections 322 are attached to the top surface of the bracket bottom plate 10; the cross arrangement of the first heat pipe 31 and the first pipe section 321 of the second heat pipe 32 can realize simultaneous heat dissipation in two directions between the two heat dissipation modules 20, so that the uniformity of heat dissipation can be improved, and the heat dissipation speed can be greatly improved; the first pipe section 321 and the second pipe section 322 of the second heat pipe 32 are connected by a round angle.
In a preferred embodiment, the first heat pipes 31 and the first pipe sections 321 of the second heat pipes 32 are vertically crossed, and the first heat pipes 31 are parallel to the bracket base plate 10 in a clamping plane formed by the back surfaces of the substrates 21 of the two groups of heat dissipation modules 20.
In order to ensure reliable contact between the first heat pipe 31, the second heat pipe 32 and the heat dissipation modules 20 on two sides to form excellent and effective heat conduction effect, and simultaneously to facilitate installation and positioning between the first heat pipe 31, the second heat pipe 32 and the corresponding heat dissipation modules 20, heat pipe grooves can be formed on the substrate 21 and the bracket bottom plate 10 of the corresponding heat dissipation modules 20, and the first heat pipe 31 and the second heat pipe 32 are arranged in the corresponding heat pipe grooves; the arrangement of the heat pipe assembly and the corresponding heat pipe groove is described in detail below with reference to the accompanying drawings:
referring to fig. 1, in two heat dissipation modules 20 arranged in pairs, two first heat pipe grooves 51 for accommodating the first heat pipe 31 are formed on the back surface of the substrate 21 of one heat dissipation module 20, two second heat pipe grooves 52 for accommodating the first pipe sections 321 of the L-shaped second heat pipes 32 are formed on the back surface of the substrate 21 of the other heat dissipation module 20, two third heat pipe grooves 53 for accommodating the second pipe sections 322 of the L-shaped second heat pipes 32 are also formed on the bracket base plate 10, and the orientations of the second pipe sections 322 of the two L-shaped second heat pipes 32 are opposite, so that the heat dissipation modules 20 on both sides can contact the corresponding second pipe sections 322 of the second heat pipes, and the heat conduction effect is ensured; meanwhile, when the first pipe sections 321 of the first heat pipe 31 and the second heat pipe 32 are accommodated in the corresponding first heat pipe groove 51 and second heat pipe groove 52, the first pipe sections 321 of the first heat pipe 31 and the second heat pipe 32 can be respectively contacted with the base plates 21 of the two heat dissipation modules 20, so that a good heat conduction effect is further achieved on the two groups of heat dissipation modules 20.
In practical applications, the arrangement may also be that the back surfaces of the base plates 21 of the two heat dissipation modules 20 arranged in pairs are provided with first heat pipe grooves 51 (see fig. 2) for accommodating the first heat pipes 31, and meanwhile, the two first heat pipe grooves 51 on the back surfaces of the two base plates 21 are staggered, at this time, the first pipe sections 321 of the second heat pipes 32 in the L shape are directly clamped between the back surfaces of the base plates 21 of the two heat dissipation modules 20, and the first pipe sections 321 of the second heat pipes 32 can be in contact with the first heat pipes 31; or the back surfaces of the base plates 21 of the two heat dissipation modules 20 arranged in pairs are respectively provided with a second heat pipe groove 52 (see fig. 3) for accommodating the first pipe section 321 of the L-shaped second heat pipe 32, and the two second pipe grooves 212 are staggered, so that the first heat pipe 31 is directly clamped between the base plates 21 of the two heat dissipation modules 20; in both cases, the bracket base plate is provided with a third heat pipe groove 53 for accommodating the second pipe section 322 of the second heat pipe 32 having an L-shape.
In addition, an intermediate baffle 40 is arranged between two heat dissipation modules 20 arranged in pairs, as shown in fig. 4, the intermediate baffle 40 is vertically arranged on the bracket base plate 10, a heat pipe assembly 30 is arranged between each heat dissipation module 20 and the intermediate baffle 40, and the two groups of heat pipe assemblies 30 are staggered; therefore, the integrity and rigidity of the whole heat dissipation device can be effectively enhanced on the basis of ensuring the heat dissipation effect.
Referring to fig. 4, the two sides of the middle partition plate 40 are respectively provided with a first heat pipe groove 51 for accommodating the first heat pipe 31, and the first heat pipe grooves 51 on the two sides of the middle partition plate 40 are staggered up and down; the back surfaces of the base plates 21 of the two groups of heat dissipation modules 20 are respectively provided with a second heat pipe groove 52 for accommodating the first pipe section 321 of the L-shaped second heat pipe 32, the bracket bottom plate 10 is provided with a third heat pipe groove 53 for accommodating the second pipe section 322 of the L-shaped second heat pipe 32, and the two second heat pipe grooves 52 on the base plates 21 of the two groups of heat dissipation modules 20 and the two corresponding third heat pipe grooves 53 on the bracket bottom plate 10 are arranged in a front-back staggered manner; the opposite way may be adopted, that is, the second heat pipe grooves 52 for accommodating the first pipe sections 321 of the second heat pipes 32 are formed on both sides of the intermediate partition 40, and the first heat pipe grooves 51 for accommodating the first heat pipes 31 are formed on the back surface of the substrate 21 of the heat dissipation module 20.
In the heat pipe assembly of the present invention, the cross sections of the first heat pipe 31 and the second heat pipe 33 may be any one of circular, rectangular or semicircular, and the cross sections of the corresponding first heat pipe groove 51, the second heat pipe groove 52 and the third heat pipe groove 53 for accommodating the corresponding heat pipes may be only matched with the outer shape surfaces of the heat pipes, so that the heat pipes can be stably and reliably limited in the heat pipe grooves, and stable and good heat conductivity performance is ensured.
The foregoing describes the embodiments of the present invention in detail, but the description is only a preferred embodiment of the invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications of the invention are intended to fall within the scope of the invention.

Claims (8)

1. A heat abstractor for high-power LED light source, it includes support bottom plate and heat dissipation module, the heat dissipation module includes the base plate, arrange on the front of base plate and be provided with a plurality of fin, its characterized in that: the heat pipe assembly is used for conducting heat, the heat dissipation modules are arranged on the top surface of the support base plate in pairs, the LED light sources are arranged on the bottom surface of the support base plate, the two heat dissipation modules in pairs are arranged on the top surface of the support base plate in a mode that the back surface of the substrate is close to the back surface, meanwhile, the substrate of the heat dissipation module is perpendicular to the support base plate, the heat pipe assembly is clamped between the back surfaces of the substrates of the two heat dissipation modules in pairs, and the heat pipe assembly is arranged on the support base plate in an extending mode;
the heat pipe assembly comprises a first heat pipe and a second heat pipe, wherein the first heat pipe is in a straight line shape, the second heat pipe is in an L shape and comprises a first pipe section and a second pipe section which are vertically arranged, the first pipe section of the first heat pipe and the first pipe section of the second heat pipe are clamped between the back surfaces of substrates of the two heat dissipation modules which are arranged in pairs, the first pipe section of the second heat pipe and the first pipe section of the second heat pipe are arranged in a crossed mode, the first pipe section of the second heat pipe extends to the top surface of the support bottom plate so that the second pipe section is attached to the top surface of the support bottom plate, and the directions of the second pipe sections of the two L-shaped second heat pipes are opposite.
2. The heat sink for a high power LED light source of claim 1, wherein: and one side end part of the first pipe section and one side end part of the second pipe section of the second heat pipe are connected in a round angle.
3. The heat sink for a high power LED light source of claim 1, wherein: the first heat pipes are arranged in clamping planes formed on the back sides of the base plates of the two groups of heat dissipation modules and are parallel to the support base plate, and the first pipe sections of the second heat pipes are perpendicularly crossed with the first heat pipes.
4. A heat sink for a high power LED light source according to any one of claims 1 to 3, characterized in that: and in the two heat dissipation modules arranged in pairs, a first heat pipe groove for accommodating the first heat pipe is formed in the back surface of the substrate of one heat dissipation module, a second heat pipe groove for accommodating the first pipe section of the second heat pipe is formed in the back surface of the substrate of the other heat dissipation module, and a third heat pipe groove for accommodating the second pipe section of the second heat pipe is formed in the support bottom plate.
5. A heat sink for a high power LED light source according to any one of claims 1 to 3, characterized in that: the back of the base plate of the two heat dissipation modules arranged in pairs is provided with a first heat pipe groove for accommodating the first heat pipe or a second heat pipe groove for accommodating the first pipe section of the second heat pipe, and the support base plate is provided with a third heat pipe groove for accommodating the second pipe section of the second heat pipe.
6. The heat sink for a high power LED light source of claim 1 or 2, wherein: an intermediate baffle is arranged between the back surfaces of the substrates of the two groups of heat dissipation modules arranged in pairs, the intermediate baffle is vertically arranged on the support bottom plate, and each heat dissipation module, the intermediate baffle and the support bottom plate are all provided with the heat pipe assembly.
7. The heat sink for a high power LED light source of claim 6, wherein: the first heat pipe is arranged in a clamping plane formed by the middle partition plate and the back surface of the substrate of the heat radiation module and is parallel to the support bottom plate, and the first pipe section of the second heat pipe is perpendicular to the first heat pipe.
8. The heat sink for a high power LED light source of claim 7, wherein: the two sides of the middle partition board are respectively provided with a first heat pipe groove for accommodating a first heat pipe in the heat pipe assembly or a second heat pipe groove for accommodating a first pipe section of a second heat pipe in the heat pipe assembly, the back surfaces of the substrates of the two groups of heat dissipation modules are respectively correspondingly provided with a second heat pipe groove for accommodating the first pipe section of the second heat pipe or a first heat pipe groove for accommodating the first heat pipe, and the support bottom board is provided with a third heat pipe groove for accommodating the second pipe section of the second heat pipe.
CN201810852603.2A 2018-07-30 2018-07-30 Heat radiating device for high-power LED light source Active CN108870342B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810852603.2A CN108870342B (en) 2018-07-30 2018-07-30 Heat radiating device for high-power LED light source

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Application Number Priority Date Filing Date Title
CN201810852603.2A CN108870342B (en) 2018-07-30 2018-07-30 Heat radiating device for high-power LED light source

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CN108870342A CN108870342A (en) 2018-11-23
CN108870342B true CN108870342B (en) 2023-11-03

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022714A (en) * 2006-02-16 2007-08-22 富准精密工业(深圳)有限公司 Radiating module
CN101072485A (en) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 Radiating device
CN101415312A (en) * 2007-10-19 2009-04-22 富准精密工业(深圳)有限公司 Radiating device
KR20100055320A (en) * 2009-09-02 2010-05-26 송민훈 Heat dissipation structure of led lamp using convective flow
KR101113461B1 (en) * 2010-09-01 2012-04-16 김민환 The led lighting apparatus to improve heat discharge and luminous intensity function
CN102454966A (en) * 2010-10-22 2012-05-16 富准精密工业(深圳)有限公司 Heat radiation device and LED lamp applying same
CN205690921U (en) * 2016-06-13 2016-11-16 常熟市格威普气体设备有限公司 A kind of panel radiator
CN207185079U (en) * 2017-09-14 2018-04-03 苏州科勒迪电子有限公司 A kind of heat pipe radiator module
CN207217588U (en) * 2017-09-08 2018-04-10 东莞市光引实业有限公司 The radiator structure of great power LED
CN208487601U (en) * 2018-07-30 2019-02-12 江苏宏力光电科技股份有限公司 A kind of radiator for high-power LED light source

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022714A (en) * 2006-02-16 2007-08-22 富准精密工业(深圳)有限公司 Radiating module
CN101072485A (en) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 Radiating device
CN101415312A (en) * 2007-10-19 2009-04-22 富准精密工业(深圳)有限公司 Radiating device
KR20100055320A (en) * 2009-09-02 2010-05-26 송민훈 Heat dissipation structure of led lamp using convective flow
KR101113461B1 (en) * 2010-09-01 2012-04-16 김민환 The led lighting apparatus to improve heat discharge and luminous intensity function
CN102454966A (en) * 2010-10-22 2012-05-16 富准精密工业(深圳)有限公司 Heat radiation device and LED lamp applying same
CN205690921U (en) * 2016-06-13 2016-11-16 常熟市格威普气体设备有限公司 A kind of panel radiator
CN207217588U (en) * 2017-09-08 2018-04-10 东莞市光引实业有限公司 The radiator structure of great power LED
CN207185079U (en) * 2017-09-14 2018-04-03 苏州科勒迪电子有限公司 A kind of heat pipe radiator module
CN208487601U (en) * 2018-07-30 2019-02-12 江苏宏力光电科技股份有限公司 A kind of radiator for high-power LED light source

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