CN108870342A - Radiator for high-power LED light source - Google Patents

Radiator for high-power LED light source Download PDF

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Publication number
CN108870342A
CN108870342A CN201810852603.2A CN201810852603A CN108870342A CN 108870342 A CN108870342 A CN 108870342A CN 201810852603 A CN201810852603 A CN 201810852603A CN 108870342 A CN108870342 A CN 108870342A
Authority
CN
China
Prior art keywords
heat pipe
heat
bottom plate
bracket bottom
pipeline section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810852603.2A
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Chinese (zh)
Other versions
CN108870342B (en
Inventor
吕文卿
芮志明
吴展宏
向德祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU HONGLI PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
JIANGSU HONGLI PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201810852603.2A priority Critical patent/CN108870342B/en
Publication of CN108870342A publication Critical patent/CN108870342A/en
Application granted granted Critical
Publication of CN108870342B publication Critical patent/CN108870342B/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention provides the radiators for high-power LED light source, can solve the problem that the existing heat transfer of existing heat sink arrangement is uneven, heat dissipation area is small, heat dissipation effect is undesirable.It includes bracket bottom plate and heat radiation module, and heat radiation module includes substrate, and several cooling fins are disposed on the front of substrate;It further includes for thermally conductive heat pipe assembly, heat radiation module is arranged in pairs on the top surface of bracket bottom plate, the bottom surface of bracket bottom plate is equipped with LED light source, the substrate that two pairs of heat radiation modules are installed on heat radiation module simultaneously on the top surface of bracket bottom plate in the form of substrate back backrest surface is vertical with bracket bottom plate, and heat pipe assembly is clipped between the back side of the substrate for two heat radiation modules being arranged in pairs and heat pipe assembly is extended on bracket bottom plate.

Description

Radiator for high-power LED light source
Technical field
The present invention relates to radiator fields, particularly for the radiator of high-power LED light source.
Background technique
LED light source is due to energy-efficient, small in size, the service life is long, fast response time, driving voltage are low, shock resistance The advantages such as strong are to become a kind of new type light source for being widely used and rapidly developing at present.But LED light source is during operation A large amount of heat can be generated, if heat cannot be discharged in time, will lead to LED junction temperature rapid increase, to influence LED light The performance and used life in source, therefore how key technology one of of the effective heat dissipation as LED development is carried out to LED light source.
Currently used LED heat dissipation is the form to be radiated using fin mostly, and for high-power LED light source, especially COB light source greater than 70W, traditional fin heat dissipation can not be met the requirements, it will usually install heat pipe additional on the basis of cooling fin To improve heat transfer property, such as the Chinese invention patent application of Publication No. CN107763589A, it discloses one kind for integrating The radiator for spending high light source is installed on the second bottom plate and in the first bottom plate and the by the first bottom plate of radiator body It is provided between two bottom plates for thermally conductive heat pipe, LED light source is installed on the bottom surface of the second bottom plate;Although its heat pipe can be effective Improve the heat transfer property between LED light source and radiator, but its heat pipe is only arranged at the fin and the first bottom plate of radiator Installation side and heat pipe are only unidirectionally to be arranged along the orientation of the fin of radiator, thus it is uneven to there is apparent heat transfer The problem of;Simultaneously as existing radiator is installed on the structure on the second bottom plate, therefore its volume with using parallel stacking Problem larger, occupied space is big.
Summary of the invention
In view of the above-mentioned problems, can solve existing heat dissipation the present invention provides the radiator for high-power LED light source The problem that the existing heat transfer of device device is uneven, heat dissipation area is small, heat dissipation effect is undesirable.
Its technical solution is the radiator for high-power LED light source comprising bracket bottom plate and heat radiation module, institute Stating heat radiation module includes substrate, and several cooling fins are disposed on the front of the substrate, it is characterised in that:It further includes using In thermally conductive heat pipe assembly, the heat radiation module is arranged in pairs on the top surface of the bracket bottom plate, the bracket bottom plate Bottom surface is equipped with LED light source, and two pairs of heat radiation modules are installed on the bracket in the form of substrate back backrest surface The substrate of the heat radiation module is vertical with the bracket bottom plate simultaneously on the top surface of bottom plate, and the heat pipe assembly is clipped on to be set in pairs Between the back side of the substrate for two heat radiation modules set and the heat pipe assembly is extended on the bracket bottom plate.
It is further characterized by:The heat pipe assembly includes linear the first heat pipe and the second L-shaped heat pipe, The second L-shaped heat pipe includes vertically disposed first pipeline section and the second pipeline section, and first heat pipe is warm with described second First pipeline section of pipe be clipped between the substrate back for the described two heat radiation modules being arranged in pairs and first heat pipe with First pipeline section of second heat pipe is arranged in a crossed manner, and the first pipeline section of second heat pipe extends to the top surface of the bracket bottom plate Above so that second pipeline section is bonded with the top surface of the bracket bottom plate;
Rounded connection between one side end of the first pipeline section of second heat pipe and a side end of the second pipeline section;
First heat pipe clamping in plane of being formed of the back side of the substrate of two groups of heat radiation modules and with the branch Frame bottom plate is parallel, and the first pipeline section of second heat pipe and the first heat pipe square crossing are arranged.
It is further characterized in that:In the described two heat radiation modules being arranged in pairs, the base of one of heat radiation module The first corrugated heat pipe for accommodating first heat pipe is offered on the back side of plate, the back side of the substrate of another heat radiation module is opened The second corrugated heat pipe equipped with the first pipeline section for accommodating second heat pipe, and offer on the bracket bottom plate for accommodating The third corrugated heat pipe of second pipeline section of second heat pipe.
It is further further characterized in that:It is offered on the back side of the substrate for the described two heat radiation modules being arranged in pairs For accommodating the first corrugated heat pipe of first heat pipe or the second corrugated heat pipe of the first pipeline section for accommodating second heat pipe, The third corrugated heat pipe of the second pipeline section for accommodating second heat pipe is offered on the bracket bottom plate.
It is further further characterized in that:Intermediate bulkhead is equipped between the substrate back for two groups of heat radiation modules being arranged in pairs, The intermediate bulkhead is vertically set on the bracket bottom plate, each described heat radiation module and the intermediate bulkhead, bracket bottom The heat pipe assembly is provided between plate.
Further, first heat pipe clamps in plane simultaneously what the back side of the substrate of two groups of heat radiation modules was formed Parallel with the bracket bottom plate, the first pipeline section of second heat pipe is vertically arranged with first heat pipe.
Further, it is offered respectively on the two sides of the intermediate bulkhead for accommodating the first heat in the heat pipe assembly Second corrugated heat pipe of the first corrugated heat pipe of pipe or the first pipeline section for accommodating the second heat pipe in the heat pipe assembly, described in two groups Offered respectively on the back side of the substrate of heat radiation module the first pipeline section for accommodating second heat pipe the second corrugated heat pipe or For accommodating the first corrugated heat pipe of first heat pipe, for accommodating second heat pipe is offered on the bracket bottom plate The third corrugated heat pipe of two pipeline sections.
The beneficial effects of the present invention are:Its heat radiation module is arranged in pairs on the top surface of bracket bottom plate, and LED light source is set It is placed on the bottom surface of bracket bottom plate, two pairs of heat radiation modules are installed on bracket bottom plate in the form of substrate back backrest surface The cooling fin of heat radiation module is vertical with substrate simultaneously on top surface, so that the heat that LED light source generates can after passing through bracket bottom plate Directly by the direct rapid cooling of several cooling fins in two pairs of heat radiation modules, and make entire construction for heat radiating device tight Gather, occupy it is small in size;Simultaneously between the back side of the heat pipe assembly substrate that is clipped on two heat radiation modules being arranged in pairs and heat pipe Component is extended on bracket bottom plate, so that the heat transfer between bracket bottom plate and heat radiation module, between two groups of heat radiation modules is more Add uniformly quickly, so as to greatly improve the radiating rate and heat dissipation performance of LED light source, extend the service life of LED light source.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the present invention for the first form of the radiator of high-power LED light source;
Fig. 2 is structural schematic diagram of the present invention for second of form of the radiator of high-power LED light source;
Fig. 3 is structural schematic diagram of the present invention for the third form of the radiator of high-power LED light source;
Fig. 4 is the structural schematic diagram for being provided with intermediate bulkhead in radiator of the present invention on bracket bottom plate.
Appended drawing reference:10- bracket bottom plate, 20- heat radiation module, 21- substrate, 22- cooling fin, the first heat pipe of 31-, 32- Two heat pipes, the first pipeline section of 321-, the second pipeline section of 322-, 40- intermediate bulkhead, the first corrugated heat pipe of 51-, the second corrugated heat pipe of 52-, 53- Third corrugated heat pipe.
Specific embodiment
The present invention is used for the radiator of high-power LED light source, sees Fig. 1 comprising bracket bottom plate 10 and heat radiation module 20, Heat radiation module 20 includes substrate 21, is arranged with several cooling fins 22 on the front of substrate 21;Heat radiation module is set in pairs of form It is placed on the top surface of bracket bottom plate 10, the bottom surface of bracket bottom plate 10 is equipped with LED light source, and two pairs of heat radiation modules 20 are with each The form of 21 back side backrest surface of self-reference substrate is installed on the top surface of bracket bottom plate 10 cooling fin 22 and substrate of heat radiation module simultaneously 21 is vertical, and heat pipe assembly is clipped between the back side of the substrate 21 for two heat radiation modules 20 being arranged in pairs and heat pipe assembly extends It is set on bracket bottom plate 10, so that heat pipe assembly part is located between bracket bottom plate 10 and the heat radiation module 20 of respective side, from And realize the heat dissipation that heat pipe assembly had not only been able to achieve on 21 one side of substrate of heat radiation module 20, but also be able to achieve to heat radiation module 20 22 one side of cooling fin on heat dissipation, therefore radiating efficiency and radiating rate can be effectively improved, it is ensured that Quick uniform heat dissipation.
In order to make it easy to understand, in the present invention front of substrate 21 specifically refer to installation cooling fin 22 one side, then with front The opposite one side for not installing cooling fin 22 is the back side;The one side for defining bracket bottom plate 10 towards heat radiation module 20 is top surface, Then the another side opposite with top surface is bottom surface.
Heat pipe assembly includes linear the first heat pipe 31 and the second L-shaped heat pipe 32, the second L-shaped heat pipe 32 Including vertically disposed first pipeline section 321 and the second pipeline section 322, the first pipeline section 321 of the first heat pipe 31 and the second heat pipe 32 is Be clipped between 21 back side of substrate for two heat radiation modules 20 being arranged in pairs and the first heat pipe 31 and the second heat pipe 32 first Pipeline section 321 is arranged in a crossed manner, and the first pipeline section 321 of the second heat pipe 32, which extends on the top surface of bracket bottom plate 10, makes the second pipeline section 322 are bonded with the top surface of bracket bottom plate 10;Wherein, the first heat pipe 31 and the first pipeline section 321 of the second heat pipe 32 is arranged in a crossed manner It can be realized between two heat radiation modules 20 heat dissipation while in both direction, thus the uniformity of heat dissipation, while energy can be improved Greatly improve radiating rate;Between one side end of the first pipeline section 321 of the second heat pipe 32 and a side end of the second pipeline section 322 Rounded connection.
321 square crossing of the first pipeline section of preferred technical solution, the first heat pipe 31 and the second heat pipe 32 is arranged, and first What the back side of the substrate 21 of 31 two groups of heat radiation modules 20 of heat pipe was formed clamps in plane and parallel with bracket bottom plate 10.
In order to guarantee the reliable contacts between the first heat pipe 31, the second heat pipe 32 and the heat radiation module 20 of two sides with shape At excellent effective conduction of heat, at the same for the ease of the first heat pipe 31, the second heat pipe 32 and corresponding heat radiation module 20 it Between installation positioning, corrugated heat pipe can be opened up on the substrate 21 of corresponding heat radiation module 20, on bracket bottom plate 10, by first heat Pipe 31, the second heat pipe 32 are set in corresponding corrugated heat pipe;With reference to the accompanying drawing for heat pipe assembly and corresponding corrugated heat pipe Arrangement elaborates:
Fig. 1 is seen, in two heat radiation modules 20 being arranged in pairs, on the back side of the substrate 21 of one of heat radiation module 20 Two are offered for accommodating the first corrugated heat pipe 51 of the first heat pipe 31, the back side of the substrate 21 of another heat radiation module 20 opens up There is the second corrugated heat pipe 52 of two the first pipeline sections 321 for accommodating the second L-shaped heat pipe 32, and same on bracket bottom plate 10 Offer the third corrugated heat pipes 53 of two the second pipeline sections 322 for accommodating the second L-shaped heat pipe 32, two L-shaped the The direction of second pipeline section 322 of two heat pipes 32 is reversed, to guarantee that the heat radiation module 20 of two sides can be with corresponding second Second pipeline section 322 of heat pipe contacts, it is ensured that conduction of heat;First pipeline section of each first heat pipe 31, the second heat pipe 32 simultaneously 321 be contained in corresponding first corrugated heat pipe 51, in the second corrugated heat pipe 52 when, the first pipeline section of the first heat pipe 31, the second heat pipe 32 321 can contact with the substrate 21 of two heat radiation modules 20 respectively, to further play well to two groups of heat radiation modules 20 Conduction of heat.
Can also occur this arrangement, the i.e. substrate in two heat radiation modules 20 being arranged in pairs in practical applications The first corrugated heat pipe 51 (see Fig. 2) for accommodating the first heat pipe 31, while the back of two pieces of substrates 21 are offered on 21 back side Two first corrugated heat pipes 51 in face are arranged in a staggered manner, and the first pipeline section 321 of the second L-shaped at this time heat pipe 32 is directly clipped on two Between 21 back side of substrate of a heat radiation module 20 and the first pipeline section 321 of the second heat pipe 32 can be contacted with the first heat pipe 31; Or it is offered on the back side of the substrate 21 for two heat radiation modules 20 being arranged in pairs for accommodating the second L-shaped heat pipe 32 The first pipeline section 321 the second corrugated heat pipe 52 (see Fig. 3) and two the second tube seats 212 be arranged in a staggered manner, the first heat pipe 31 is straight at this time It connects between the substrate 21 for being clipped on two heat radiation modules 20;In the case of this two kinds, offer on bracket bottom plate for accommodating in L The third corrugated heat pipe 53 of second pipeline section 322 of the second heat pipe 32 of shape.
In addition, being equipped with intermediate bulkhead 40 between two heat radiation modules 20 being arranged in pairs, see that Fig. 4, intermediate bulkhead 40 are vertical Ground is set on bracket bottom plate 10, and heat pipe assembly 30, and two are provided between each heat radiation module 20 and intermediate bulkhead 40 Group heat pipe assembly 30 is arranged in a staggered manner;Thereby, it is possible to effectively enhance the whole of entire radiator on the basis of guaranteeing heat dissipation effect Body and rigidity.
See Fig. 4, offer the first corrugated heat pipe 51 for accommodating the first heat pipe 31 on the two sides of intermediate bulkhead 40 respectively, And the first about 51 corrugated heat pipe of 40 two sides of intermediate bulkhead is arranged in a staggered manner;It opens respectively at the back side of the substrate 21 of two groups of heat radiation modules 20 The second corrugated heat pipe 52 equipped with the first pipeline section 321 for accommodating the second L-shaped heat pipe 32 opens up on bracket bottom plate 10 useful In the third corrugated heat pipe 53 for the second pipeline section 322 for accommodating the second L-shaped heat pipe 32, and on the substrate 21 of two groups of heat radiation modules 20 Two the second corrugated heat pipes 52 and corresponding bracket bottom plate 10 on two third corrugated heat pipes 53 front and back be arranged in a staggered manner;? The second corrugated heat pipe 52 for being used to accommodate the first pipeline section 321 of the second heat pipe 32 can be provided with by the way of opposite On the two sides of spacing board 40, and the first corrugated heat pipe 51 for being used to accommodate the first heat pipe 31 is provided with to the substrate of heat radiation module 20 21 back side.
In heat pipe assembly in the present invention, the first heat pipe 31, the second heat pipe 33 section can be round, rectangle or semicircle It is any in shape, and accordingly for accommodating the first corrugated heat pipe 51, the second corrugated heat pipe 52 and third corrugated heat pipe of corresponding heat pipe As long as 53 section can be matched with the external surface of heat pipe, so that heat pipe can reliablely and stablely be limited in corrugated heat pipe It is interior, it is ensured that moderately good heat-conductive characteristic.
Specific implementation of the invention is described in detail above, but content is only the preferable embodiment party of the invention Case should not be considered as limiting the invention the practical range of creation.It is all to become according to equalization made by the invention application range Change and improve etc., it should still be within the scope of the patent of the present invention.

Claims (9)

1. being used for the radiator of high-power LED light source comprising bracket bottom plate and heat radiation module, the heat radiation module include base Plate is disposed with several cooling fins on the front of the substrate, it is characterised in that:It further includes for thermally conductive heat pipe heat Part, the heat radiation module are arranged in pairs on the top surface of the bracket bottom plate, and the bottom surface of the bracket bottom plate is equipped with LED light Source, two pairs of heat radiation modules are installed on the top surface of the bracket bottom plate in the form of substrate back backrest surface, together The substrate of Shi Suoshu heat radiation module is vertical with the bracket bottom plate, and it is described scattered that the heat pipe assembly is clipped on two be arranged in pairs Between the back side of the substrate of thermal module and the heat pipe assembly is extended on the bracket bottom plate.
2. the radiator according to claim 1 for high-power LED light source, it is characterised in that:The heat pipe assembly Including the first linear heat pipe and the second L-shaped heat pipe, the second L-shaped heat pipe includes vertically disposed first First pipeline section of pipeline section and the second pipeline section, first heat pipe and second heat pipe be clipped on be arranged in pairs it is described two Between the substrate back of heat radiation module and the first pipeline section of first heat pipe and second heat pipe is arranged in a crossed manner, and described second First pipeline section of heat pipe extends to the top surface for making second pipeline section Yu the bracket bottom plate on the top surface of the bracket bottom plate Fitting.
3. the radiator according to claim 2 for high-power LED light source, it is characterised in that:Second heat pipe A side end of the first pipeline section and a side end of the second pipeline section between rounded connection.
4. the radiator according to claim 2 for high-power LED light source, it is characterised in that:First heat pipe In plane and parallel with the bracket bottom plate, second heat is clamped what the back side of the substrate of two groups of heat radiation modules was formed First pipeline section of pipe and the first heat pipe square crossing are arranged.
5. according to the radiator for high-power LED light source any in claim 2~4, it is characterised in that:In pairs In the described two heat radiation modules being arranged, offered on the back side of the substrate of one of heat radiation module for accommodating described first First corrugated heat pipe of heat pipe, the back side of the substrate of another heat radiation module offer the first pipe for accommodating second heat pipe Second corrugated heat pipe of section, and the third heat pipe of the second pipeline section for accommodating second heat pipe is offered on the bracket bottom plate Slot.
6. according to the radiator for high-power LED light source any in claim 2~4, it is characterised in that:In pairs The first corrugated heat pipe for accommodating first heat pipe is offered on the back side of the substrate for the described two heat radiation modules being arranged Or the second corrugated heat pipe of the first pipeline section for accommodating second heat pipe, it offers on the bracket bottom plate described for accommodating The third corrugated heat pipe of second pipeline section of the second heat pipe.
7. the radiator according to claim 2 or 3 for high-power LED light source, it is characterised in that:It is arranged in pairs Intermediate bulkhead is equipped between the substrate back of two groups of heat radiation modules, the intermediate bulkhead is vertically set on the bracket bottom plate, The heat pipe assembly is provided between each described heat radiation module and the intermediate bulkhead, bracket bottom plate.
8. the radiator according to claim 7 for high-power LED light source, it is characterised in that:First heat pipe It is in and parallel with the bracket bottom plate in clamping in plane of being formed of the substrate back of the intermediate bulkhead and the heat radiation module, First pipeline section of second heat pipe is vertically arranged with first heat pipe.
9. the radiator according to claim 8 for high-power LED light source, it is characterised in that:The intermediate bulkhead Two sides on offer the first corrugated heat pipe for accommodating the first heat pipe in the heat pipe assembly or described for accommodating respectively Second corrugated heat pipe of the first pipeline section of the second heat pipe in heat pipe assembly, it is right respectively on the back side of the substrate of heat radiation module described in two groups That answers offers the second corrugated heat pipe of the first pipeline section for accommodating second heat pipe or for accommodating first heat pipe First corrugated heat pipe offers the third corrugated heat pipe of the second pipeline section for accommodating second heat pipe on the bracket bottom plate.
CN201810852603.2A 2018-07-30 2018-07-30 Heat radiating device for high-power LED light source Active CN108870342B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810852603.2A CN108870342B (en) 2018-07-30 2018-07-30 Heat radiating device for high-power LED light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810852603.2A CN108870342B (en) 2018-07-30 2018-07-30 Heat radiating device for high-power LED light source

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CN108870342A true CN108870342A (en) 2018-11-23
CN108870342B CN108870342B (en) 2023-11-03

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022714A (en) * 2006-02-16 2007-08-22 富准精密工业(深圳)有限公司 Radiating module
CN101072485A (en) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 Radiating device
CN101415312A (en) * 2007-10-19 2009-04-22 富准精密工业(深圳)有限公司 Radiating device
KR20100055320A (en) * 2009-09-02 2010-05-26 송민훈 Heat dissipation structure of led lamp using convective flow
KR101113461B1 (en) * 2010-09-01 2012-04-16 김민환 The led lighting apparatus to improve heat discharge and luminous intensity function
CN102454966A (en) * 2010-10-22 2012-05-16 富准精密工业(深圳)有限公司 Heat radiation device and LED lamp applying same
CN205690921U (en) * 2016-06-13 2016-11-16 常熟市格威普气体设备有限公司 A kind of panel radiator
CN207185079U (en) * 2017-09-14 2018-04-03 苏州科勒迪电子有限公司 A kind of heat pipe radiator module
CN207217588U (en) * 2017-09-08 2018-04-10 东莞市光引实业有限公司 The radiator structure of great power LED
CN208487601U (en) * 2018-07-30 2019-02-12 江苏宏力光电科技股份有限公司 A kind of radiator for high-power LED light source

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022714A (en) * 2006-02-16 2007-08-22 富准精密工业(深圳)有限公司 Radiating module
CN101072485A (en) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 Radiating device
CN101415312A (en) * 2007-10-19 2009-04-22 富准精密工业(深圳)有限公司 Radiating device
KR20100055320A (en) * 2009-09-02 2010-05-26 송민훈 Heat dissipation structure of led lamp using convective flow
KR101113461B1 (en) * 2010-09-01 2012-04-16 김민환 The led lighting apparatus to improve heat discharge and luminous intensity function
CN102454966A (en) * 2010-10-22 2012-05-16 富准精密工业(深圳)有限公司 Heat radiation device and LED lamp applying same
CN205690921U (en) * 2016-06-13 2016-11-16 常熟市格威普气体设备有限公司 A kind of panel radiator
CN207217588U (en) * 2017-09-08 2018-04-10 东莞市光引实业有限公司 The radiator structure of great power LED
CN207185079U (en) * 2017-09-14 2018-04-03 苏州科勒迪电子有限公司 A kind of heat pipe radiator module
CN208487601U (en) * 2018-07-30 2019-02-12 江苏宏力光电科技股份有限公司 A kind of radiator for high-power LED light source

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