CN213462471U - Improved generation intercom PCB circuit board structure - Google Patents
Improved generation intercom PCB circuit board structure Download PDFInfo
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- CN213462471U CN213462471U CN202022985245.8U CN202022985245U CN213462471U CN 213462471 U CN213462471 U CN 213462471U CN 202022985245 U CN202022985245 U CN 202022985245U CN 213462471 U CN213462471 U CN 213462471U
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Abstract
The utility model discloses an improved generation intercom PCB circuit board structure, including circuit board body, wiring, interface and speech processing module, the wiring is installed to the one end of circuit board body, the inside one side of circuit board body is provided with additional strengthening, and one side of additional strengthening is fixed with the fin, one side of fin is fixed with the heat conduction base plate, and one side of heat conduction base plate all is provided with the louvre. The utility model discloses a be provided with the radiating effect that the fin has strengthened the circuit board body, when circuit board body uses for a long time, this meeting of circuit board produces certain heat, and the fin can dispel the heat to the circuit board body this moment, and the fin gives off the heat to heat conduction base plate department, derives to heat dissipation hole department by heat conduction base plate, and the louvre can give off the heat, reaches radiating function, has strengthened the radiating effect of circuit board body, has prolonged the life of circuit board body.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is an improved generation intercom PCB circuit board structure.
Background
The interphone is a most commonly used communication tool in various social production activities, and has extremely important functions relative to the aspects of transportation, engineering management, fire control and the like, wherein the PCB is one of the parts in the interphone, so that a special improved interphone PCB structure is used;
however, when the prior interphone PCB circuit board structure in the market is used, the heat dissipation effect of the circuit board body is poor, and the circuit board body can generate aging phenomenon when used for a long time, so that the service life of the circuit board body is shortened, and an improved interphone PCB circuit board structure is developed to solve the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an improved generation intercom PCB circuit board structure to the radiating effect who proposes its circuit board body among the solution above-mentioned background art is relatively poor, and this meeting of circuit board produces ageing phenomenon during long time use, shortens the life's of circuit board body problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an improved generation intercom PCB circuit board structure, includes circuit board body, wiring, interface and speech processing module, the wiring is installed to the one end of circuit board body, the both sides of circuit board body all are fixed with mounting structure, the interface is installed at the top of circuit board body one end, speech processing module is installed to the intermediate position department of circuit board body one end, pronunciation transceiver module is installed to the bottom of circuit board body one end, the outside of circuit board body is provided with the intercom casing, the inside one side of circuit board body is provided with additional strengthening, and one side of additional strengthening is fixed with the fin, one side of fin is fixed with the heat conduction base plate, and one side of heat conduction base plate all is provided with the louvre.
Preferably, the mounting structure comprises a clamping block, a connecting piece, a rubber block and a clamping groove, the connecting piece is fixed on two sides of the circuit board body, the clamping block is fixed on one side of the connecting piece, the rubber block is fixed on the top end and the bottom end of the clamping block, and the clamping groove is formed in two sides of the inner portion of the interphone shell.
Preferably, the outer diameter of the clamping block is smaller than the inner diameter of the clamping groove, and a clamping structure is formed between the clamping block and the clamping groove.
Preferably, the rubber blocks are arranged elastically, and the clamping blocks are distributed symmetrically about the vertical center line of the circuit board body.
Preferably, the reinforcing structure comprises a reinforcing layer, a reserved cavity and supporting ribs, the reinforcing layer is arranged on one side of the interior of the circuit board body, the reserved cavity is fixed on one side of the reinforcing layer, and the supporting ribs are fixed in the reserved cavity.
Preferably, the length of the supporting ribs is the same, and the supporting ribs are obliquely arranged in the reserved cavity.
Compared with the prior art, the beneficial effects of the utility model are that: the improved interphone PCB circuit board structure not only enhances the heat dissipation effect of the circuit board body and prolongs the service life of the circuit board body, but also realizes convenient installation and fixation of the circuit board body, is convenient and fast to operate, enhances the structural strength inside the circuit board body and reduces the phenomenon of fracture of the circuit board body;
(1) the radiating effect of the circuit board body is enhanced by the radiating fins, when the circuit board body is used for a long time, a certain amount of heat can be generated by the circuit board body, the radiating fins can radiate the circuit board body, the heat is radiated to the heat conducting base plate by the radiating fins and is led out to the radiating holes by the heat conducting base plate, the heat is radiated by the radiating holes, the radiating function is achieved, the radiating effect of the circuit board body is enhanced, and the service life of the circuit board body is prolonged;
(2) the circuit board body is convenient to mount and fix by the mounting structure, the circuit board body is taken during mounting, the circuit board body is placed inside the interphone shell, then the clamping blocks are sequentially clamped into the clamping grooves, and the rubber blocks have certain elasticity, so that the tightness of the connecting sheets in the clamping grooves can be enhanced, and the operation is convenient;
(3) through being provided with additional strengthening through the enhancement layer can strengthen the inside structural strength of circuit board body, the brace rod is provided with a plurality ofly, and the brace rod can improve the stability of circuit board body inner structure, and the brace rod can disperse the power that the circuit board body received simultaneously, reduces the cracked phenomenon of circuit board body production.
Drawings
Fig. 1 is a schematic front view of the present invention;
fig. 2 is a schematic view of the structure of the utility model in front elevation after installation;
FIG. 3 is a schematic side view of the partial cross-sectional structure of the present invention;
fig. 4 is an enlarged partial cross-sectional view of the point a in fig. 2 according to the present invention.
In the figure: 1. a circuit board body; 2. wiring; 3. a mounting structure; 301. a clamping block; 302. connecting sheets; 303. a rubber block; 304. a card slot; 4. an interface; 5. a voice processing module; 6. a voice transceiving module; 7. an interphone housing; 8. a reinforcing structure; 801. a reinforcing layer; 802. reserving a cavity; 803. supporting ribs; 9. a heat sink; 10. a heat conductive substrate; 11. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: an improved interphone PCB circuit board structure comprises a circuit board body 1, a wiring 2, a plug port 4 and a voice processing module 5, wherein the wiring 2 is installed at one end of the circuit board body 1, mounting structures 3 are fixed on two sides of the circuit board body 1, the plug port 4 is installed at the top of one end of the circuit board body 1, the voice processing module 5 is installed at the middle position of one end of the circuit board body 1, a voice transceiving module 6 is installed at the bottom end of one end of the circuit board body 1, an interphone shell 7 is arranged outside the circuit board body 1, a reinforcing structure 8 is arranged on one side inside the circuit board body 1, a radiating fin 9 is fixed on one side of the reinforcing structure 8, a heat conducting substrate 10 is fixed on one side of the radiating fin 9, and radiating holes 11 are formed in one;
specifically, as shown in fig. 3, when the mechanism is used, firstly, when the circuit board body 1 is used for a long time, the circuit board body 1 generates a certain amount of heat, at this time, the heat sink 9 can dissipate the heat of the circuit board body 1, the heat sink 9 dissipates the heat to the heat conducting substrate 10, the heat conducting substrate 10 leads out the heat dissipating hole 11, and the heat dissipating hole 11 dissipates the heat, so that the heat dissipating function is achieved, the heat dissipating effect of the circuit board body 1 is enhanced, and the service life of the circuit board body 1 is prolonged;
the mounting structure 3 comprises a clamping block 301, a connecting sheet 302, rubber blocks 303 and clamping grooves 304, the connecting sheet 302 is fixed on two sides of the circuit board body 1, the clamping block 301 is fixed on one side of the connecting sheet 302, the rubber blocks 303 are fixed on the top end and the bottom end of the clamping block 301, the clamping grooves 304 are arranged on two sides inside the interphone shell 7, the outer diameter of the clamping block 301 is smaller than the inner diameter of the clamping groove 304, a clamping structure is formed between the clamping block 301 and the clamping grooves 304, the rubber blocks 303 are arranged elastically, and the clamping blocks 301 are distributed symmetrically about the vertical center line of the circuit board body 1;
specifically, as shown in fig. 1, fig. 2 and fig. 4, when the mechanism is used, firstly, during installation, the circuit board body 1 is taken, the circuit board body 1 is placed inside the interphone shell 7, and then the fixture blocks 301 are sequentially clamped into the interior of the fixture grooves 304, because the rubber blocks 303 have certain elasticity, the tightness of the connecting sheets 302 in the interior of the fixture grooves 304 can be enhanced by the rubber blocks 303, so that the circuit board body 1 is convenient to install and fix, and the operation is convenient;
the reinforcing structure 8 comprises a reinforcing layer 801, a reserved cavity 802 and supporting ribs 803, wherein the reinforcing layer 801 is arranged on one side of the interior of the circuit board body 1, the reserved cavity 802 is fixed on one side of the reinforcing layer 801, the supporting ribs 803 are fixed in the reserved cavity 802, the lengths of the supporting ribs 803 are the same, and the supporting ribs 803 are obliquely arranged in the reserved cavity 802;
specifically, as shown in fig. 3, when the mechanism is used, firstly, the structural strength inside the circuit board body 1 can be enhanced through the reinforcing layer 801, the plurality of support ribs 803 are provided, the support ribs 803 can improve the stability of the internal structure of the circuit board body 1, and meanwhile, the support ribs 803 can disperse the force applied to the circuit board body 1, thereby enhancing the structural strength inside the circuit board body 1 and reducing the phenomenon that the circuit board body 1 is broken.
The working principle is as follows: when the utility model is used, the improved interphone PCB structure external power supply comprises, firstly, during installation, the circuit board body 1 is taken, the circuit board body 1 is placed inside the interphone shell 7, then the fixture blocks 301 are sequentially clamped into the interior of the fixture grooves 304, and as the rubber blocks 303 have certain elasticity, the tightness of the connecting sheets 302 in the fixture grooves 304 can be enhanced by the rubber blocks 303;
secondly, when the circuit board body 1 is used for a long time, the circuit board body 1 can generate certain heat, at the moment, the heat dissipation sheet 9 can dissipate the heat of the circuit board body 1, the heat dissipation sheet 9 dissipates the heat to the heat conduction substrate 10, the heat conduction substrate 10 leads out the heat dissipation hole 11, and the heat dissipation hole 11 dissipates the heat to achieve the heat dissipation function;
finally, the internal structural strength of the circuit board body 1 can be enhanced through the reinforcing layer 801, the supporting ribs 803 are provided in a plurality, the stability of the internal structure of the circuit board body 1 can be improved by the supporting ribs 803, and the force applied to the circuit board body 1 can be dispersed by the supporting ribs 803.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides an improved generation intercom PCB circuit board structure, includes circuit board body (1), wiring (2), interface (4) and speech processing module (5), its characterized in that: wiring (2) are installed to the one end of circuit board body (1), the both sides of circuit board body (1) all are fixed with mounting structure (3), interface (4) are installed at the top of circuit board body (1) one end, voice processing module (5) are installed to the intermediate position department of circuit board body (1) one end, pronunciation transceiver module (6) are installed to the bottom of circuit board body (1) one end, the outside of circuit board body (1) is provided with intercom casing (7), the inside one side of circuit board body (1) is provided with additional strengthening (8), and one side of additional strengthening (8) is fixed with fin (9), one side of fin (9) is fixed with heat conduction base plate (10), and one side of heat conduction base plate (10) all is provided with louvre (11).
2. The improved interphone PCB circuit board structure of claim 1, characterized in that: mounting structure (3) include fixture block (301), connection piece (302), rubber block (303) and draw-in groove (304), connection piece (302) all are fixed in the both sides of circuit board body (1), one side of connection piece (302) is fixed with fixture block (301), and the top and the bottom of fixture block (301) all are fixed with rubber block (303), the inside both sides of intercom casing (7) all are provided with draw-in groove (304).
3. The improved interphone PCB circuit board structure of claim 2, characterized in that: the outer diameter of the fixture block (301) is smaller than the inner diameter of the clamping groove (304), and a clamping structure is formed between the fixture block (301) and the clamping groove (304).
4. The improved interphone PCB circuit board structure of claim 2, characterized in that: the rubber blocks (303) are arranged elastically, and the fixture blocks (301) are symmetrically distributed around the vertical center line of the circuit board body (1).
5. The improved interphone PCB circuit board structure of claim 1, characterized in that: the reinforced structure (8) comprises a reinforced layer (801), a reserved cavity (802) and supporting ribs (803), wherein the reinforced layer (801) is arranged on one side of the interior of the circuit board body (1), the reserved cavity (802) is fixed on one side of the reinforced layer (801), and the supporting ribs (803) are fixed in the interior of the reserved cavity (802).
6. The improved interphone PCB circuit board structure of claim 5, characterized in that: the length of the supporting ribs (803) is the same, and the supporting ribs (803) are obliquely arranged in the reserved cavity (802).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022985245.8U CN213462471U (en) | 2020-12-10 | 2020-12-10 | Improved generation intercom PCB circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022985245.8U CN213462471U (en) | 2020-12-10 | 2020-12-10 | Improved generation intercom PCB circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213462471U true CN213462471U (en) | 2021-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022985245.8U Active CN213462471U (en) | 2020-12-10 | 2020-12-10 | Improved generation intercom PCB circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213462471U (en) |
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2020
- 2020-12-10 CN CN202022985245.8U patent/CN213462471U/en active Active
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