CN214256727U

CN214256727U - Multilayer impedance HDI circuit board

Info

Publication number: CN214256727U
Application number: CN202120120046.2U
Authority: CN
Inventors: 孙小丽; 李小华; 李鑫达
Original assignee: Shenzhen Jinchuang Yida Electronics Co ltd
Current assignee: Shenzhen Jinchuang Yida Electronics Co ltd
Priority date: 2021-01-18
Filing date: 2021-01-18
Publication date: 2021-09-21
Anticipated expiration: 2031-01-18

Abstract

The utility model discloses a multilayer impedance HDI circuit board, including the installation frame, the inboard lower part fixed mounting of installation frame has the support ring, installation frame lower extreme fixed mounting has No. two packing rings and a packing ring respectively, open respectively at the installation frame middle part has a plurality of mounting holes and a plurality of shoulder hole, heat abstractor has been placed on support ring upper portion, heat abstractor upper end fixedly connected with circuit plate, it is a plurality of the mounting hole is inside and a plurality of the common fixed mounting in shoulder hole has a plurality of protection fixing device. The utility model discloses a multilayer impedance HDI circuit board, through the cooperation installation of fixed block, fixed screw, insulating centre gripping post, curb plate, shoulder hole, guard piece and a plurality of screw hole, can avoid the circuit board because of striking damage when being convenient for circuit board installation operation; in addition, the arrangement of the heat dissipation device, the first gasket and the second gasket can ensure air circulation, and heat dissipation is facilitated.

Description

Multilayer impedance HDI circuit board

Technical Field

The utility model relates to a circuit board technical field, in particular to multilayer impedance HDI circuit board.

Background

The multilayer HDI circuit board is a multilayer high-density interconnection circuit board, has high anti-interference capability, is a field with the fastest development in the printed circuit board industry, and is widely applied to electronic products with high requirements on circuit board integration level, such as mobile phones, MP3, smart watches and the like. The existing multilayer HDI circuit board often has the following problems in the use process: 1. the existing multilayer HDI circuit board is only convenient to mount with a certain size when being mounted, and is inconvenient to mount circuit boards with different sizes, so that the multilayer HDI circuit board is extremely inconvenient to mount, and is extremely easy to damage when being impacted, and does not have a self-protection function; 2. the heat dissipation effect of the existing multilayer HDI circuit board to the multilayer HDI circuit board at the back is often not good in the heat dissipation process, and the multilayer HDI circuit board at the back is often directly attached and installed on an external installation part, so that the heat dissipation is difficult.

SUMMERY OF THE UTILITY MODEL

A primary object of the utility model is to provide a multilayer impedance HDI circuit board can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the multilayer impedance HDI circuit board comprises an installation frame, wherein a support ring is fixedly installed at the lower part of the inner side of the installation frame, a second washer is fixedly arranged on the outer side of the lower end of the mounting frame, a first washer is fixedly arranged on the inner side of the lower end of the mounting frame, the middle part of the mounting frame is respectively provided with a plurality of mounting holes and a plurality of stepped holes, the upper part of the support ring is provided with a heat dissipation device, the upper end of the heat dissipation device is fixedly connected with a circuit plate, the interiors of the plurality of mounting holes are communicated with the interiors of the plurality of stepped holes, the plurality of mounting holes are positioned on one side of the plurality of stepped holes away from the circuit plate, a plurality of protective fixing devices are fixedly mounted inside the plurality of mounting holes and the interiors of the plurality of stepped holes together, the upper end of the circuit plate is provided with a plurality of micropores, and the circuit board is of a multilayer structure, and the aperture of the plurality of stepped holes is larger than that of the plurality of mounting holes.

Preferably, the heat dissipation device comprises a heat conduction plate, a heat dissipation plate is fixedly mounted at the lower end of the heat conduction plate, and a plurality of heat dissipation fins are fixedly mounted at the lower end of the heat dissipation plate.

Preferably, the lower end heights of the plurality of radiating fins are respectively higher than the lower end height of the first gasket and the lower end height of the second gasket, heat-conducting insulating glue is coated between the heat-conducting plate and the circuit plate, and the radiating plate is located at the upper end of the supporting ring.

Preferably, it is a plurality of protection fixing device includes protection piece and fixed block, open the fixed block upper end has a plurality of screw holes, and is a plurality of the common threaded connection in screw hole has the fixed screw, the equal fixedly connected with curb plate in one side that the protection piece was kept away from to the fixed block, the equal fixed mounting in one side that the fixed block was kept away from to the curb plate has insulating centre gripping post.

Preferably, the installation frame lower extreme is all run through to the fixed screw lower extreme, fixed screw upper end and shoulder hole upper portion threaded connection, one side that the fixed block was kept away from to insulating centre gripping post all contacts with circuit plate lateral wall, the protection piece is located one side that the circuit plate was kept away from to the fixed block.

Preferably, the protection part comprises a sleeve, a telescopic guide pillar and a buffering punch head, a cavity is formed in the sleeve, spring pieces are fixedly sleeved on the outer surface of the telescopic guide pillar, the telescopic guide pillar is fixedly connected with the buffering head, the buffering head penetrates through one side, far away from the circuit board, of the sleeve, the telescopic guide pillar and the spring pieces are located in the cavity, and the buffering head is located in the mounting hole.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) in the utility model, the fixing operation of circuit boards with different sizes can be realized through the matching installation of the fixing block, the fixing screw, the insulating clamping column, the side plate, the stepped hole and the threaded holes, thereby facilitating the installation operation of the circuit board; the protection piece can enable the circuit board to have a self-protection function, the circuit board is prevented from being damaged due to impact, and the strength of the circuit board is improved.

(2) The utility model discloses in, realize the radiating operation at the circuit plate back through heat-conducting plate, heating panel and radiating fin, and radiating fin can further enlarge heat radiating area, improves circuit plate's radiating effect, and the setting up of a packing ring and No. two packing rings can make and leave the space between radiating piece and external mounting spare, guarantees the circulation of air, avoids multilayer HDI circuit board often directly to paste tightly to install on external mounting spare, the thermal scattering and disappearing of being convenient for.

Drawings

Fig. 1 is a longitudinal sectional view of a multilayer impedance HDI circuit board according to the present invention;

FIG. 2 is an enlarged view of the multilayer impedance HDI circuit board at A in FIG. 1 according to the present invention;

fig. 3 is a schematic structural diagram of a protection fixing device for a multilayer impedance HDI circuit board according to the present invention;

fig. 4 is a schematic diagram of an internal structure of a shielding component of a multilayer impedance HDI circuit board according to the present invention.

In the figure: 1. a first washer; 2. a second washer; 3. a heat sink; 4. a protective fixture; 5. mounting holes; 6. micropores; 7. a circuit board member; 8. a mounting frame; 9. a stepped hole; 10. a support ring; 31. a heat conducting plate; 32. a heat dissipating fin; 33. a heat dissipation plate; 41. a guard; 42. a fixed block; 43. a threaded hole; 44. fixing screws; 45. an insulating clamping post; 46. a side plate; 411. a cavity; 412. a sleeve; 413. a spring member; 414. a telescopic guide post; 415. and a buffer head.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a multilayer impedance HDI circuit board comprises an installation frame 8, a support ring 10 is fixedly installed on the lower portion of the inner side of the installation frame 8, a second gasket 2 is fixedly installed on the outer side of the lower end of the installation frame 8, a first gasket 1 is fixedly installed on the inner side of the lower end of the installation frame 8, a plurality of installation holes 5 and a plurality of stepped holes 9 are respectively opened in the middle of the installation frame 8, a heat dissipation device 3 is placed on the upper portion of the support ring 10, a circuit board 7 is fixedly connected to the upper end of the heat dissipation device 3, the interiors of the installation holes 5 are all communicated with the interiors of the stepped holes 9, the installation holes 5 are all located on one side of the plurality of stepped holes 9 far away from the circuit board 7, a plurality of protection fixing devices 4 are jointly fixedly installed inside the plurality of installation holes 5 and the interiors of the plurality of stepped holes 9, a plurality of micropores 6 are opened on the upper end of the circuit board 7, and the circuit board 7 is of a multilayer structure, and the aperture of each stepped hole 9 is larger than that of each mounting hole 5.

In order to perform the heat dissipation operation on the lower end surface of the circuit board 7, the heat dissipation device 3 comprises a heat conduction plate 31, a heat dissipation plate 33 is fixedly installed at the lower end of the heat conduction plate 31, and a plurality of heat dissipation fins 32 are fixedly installed at the lower end of the heat dissipation plate 33; the heights of the lower ends of the plurality of radiating fins 32 are respectively higher than the height of the lower end of the first gasket 1 and the height of the lower end of the second gasket 2, so that a gap is reserved between the radiating piece and an external mounting piece, air circulation is ensured, heat dissipation is facilitated, heat conducting insulating glue is coated between the heat conducting plate 31 and the circuit board piece 7, and the radiating plate 33 is positioned at the upper end of the support ring 10; the plurality of protection fixing devices 4 comprise a protection part 41 and a fixing block 42, the upper end of the fixing block 42 is provided with a plurality of threaded holes 43, the plurality of threaded holes 43 are internally and jointly in threaded connection with fixing screws 44, one side, away from the protection part 41, of the fixing block 42 is fixedly connected with a side plate 46, one side, away from the fixing block 42, of the side plate 46 is fixedly provided with an insulating clamping column 45, the fixing clamping positions can be adjusted by the matched installation of the plurality of threaded holes 43 and the fixing screws 44, and the fixing operation of the circuit plate pieces 7 with different sizes can be realized; in order to fixedly connect the circuit board 7, the lower ends of the fixing screws 44 penetrate through the lower end of the mounting frame 8, the upper ends of the fixing screws 44 are in threaded connection with the upper part of the stepped hole 9, one side of the insulating clamping column 45, which is far away from the fixing block 42, is in contact with the outer side wall of the circuit board 7, and the protection piece 41 is positioned on one side of the fixing block 42, which is far away from the circuit board 7; protection part 41 includes sleeve 412, flexible guide pillar 414 and buffering head 415, sleeve 412 is inside to be opened there is cavity 411, flexible guide pillar 414 surface all fixedly cup joints spring part 413, fixed connection between flexible guide pillar 414 and the buffering head 415, buffering head 415 runs through one side that sleeve 412 kept away from circuit board 7, flexible guide pillar 414 and spring part 413 all are located inside cavity 411, buffering head 415 is located inside mounting hole 5, when circuit board 7 lateral wall receives external striking, the buffering head 415 that is located mounting hole 5 can be to the one side motion that is close to flexible guide pillar 414 under the effect of striking, flexible guide pillar 414 and spring part 413 shrink this moment, thereby cushion the impact force, avoid the circuit board 7 in the installation frame 8 impaired.

It should be noted that, the present invention is a multilayer impedance HDI circuit board, when the HDI circuit board can push the protection fixing device 4 to one side close to the circuit board 7, and abut the insulating clamping column 45 against the outer surface of the circuit board 7, then the worker can use the fixing screw 44 to penetrate the corresponding screw hole 43 and connect with the upper portion of the stepped hole 9, so as to fix the circuit board 7, thereby ensuring the stability of the using process, when the side wall of the circuit board 7 is impacted by the outside, the buffer head 415 in the mounting hole 5 can move to one side close to the telescopic guide column 414 under the impact force, at this time, the telescopic guide column 414 and the spring piece 413 shrink, thereby buffering the impact force, avoiding the circuit board 7 in the mounting frame 8 from being damaged, playing the self-protection role, and the heat generated by the circuit board 7 in the using process of the circuit board 7 is transmitted to the heat-dissipating plate 33 through the heat-conducting plate 31, and finally discharged from the heat dissipation plate 33 and the heat dissipation fins 32 on the heat dissipation plate 33, thereby enlarging the heat dissipation area and improving the heat dissipation effect of the circuit board 7, and the arrangement of the first gasket 1 and the second gasket 2 can leave a gap between the heat dissipation member and an external mounting member, thereby ensuring air circulation and facilitating heat dissipation.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A multilayer impedance HDI circuit board, includes installation frame (8), its characterized in that: the installation frame is characterized in that a support ring (10) is fixedly installed on the lower portion of the inner side of the installation frame (8), a second gasket (2) is fixedly installed on the outer side of the lower end of the installation frame (8), a first gasket (1) is fixedly installed on the inner side of the lower end of the installation frame (8), a plurality of installation holes (5) and a plurality of stepped holes (9) are respectively opened in the middle of the installation frame (8), a heat dissipation device (3) is placed on the upper portion of the support ring (10), a circuit board (7) is fixedly connected to the upper end of the heat dissipation device (3), the interiors of the installation holes (5) are communicated with the interiors of the stepped holes (9), the installation holes (5) are located on one side, away from the circuit board (7), of the interiors of the installation holes (5) and the interiors of the stepped holes (9), a plurality of protection fixing devices (4) are jointly and fixedly installed on the interiors of the installation holes (5) and the stepped holes (9), a plurality of micropores (6) are formed in the upper end of the circuit board (7), the circuit board (7) is of a multilayer structure, and the aperture of the stepped hole (9) is larger than that of the mounting holes (5).

2. A multilayer impedance HDI circuit board according to claim 1 wherein: heat abstractor (3) include heat-conducting plate (31), heat-conducting plate (31) lower extreme fixed mounting has heating panel (33), heating panel (33) lower extreme fixed mounting has a plurality of radiating fin (32).

3. A multilayer impedance HDI circuit board according to claim 2 wherein: a plurality of radiating fin (32) lower extreme height is higher than packing ring (1) lower extreme height and No. two packing rings (2) lower extreme height respectively, the coating has heat conduction insulating cement between heat-conducting plate (31) and circuit plate (7), heating panel (33) are located support ring (10) upper end.

4. A multilayer impedance HDI circuit board according to claim 1 wherein: a plurality of protection fixing device (4) are including protection piece (41) and fixed block (42), open on fixed block (42) upper end has a plurality of screw holes (43), and is a plurality of screw hole (43) inside common threaded connection has set screw (44), the equal fixedly connected with curb plate (46) in one side that protection piece (41) were kept away from in fixed block (42), the equal fixed mounting in one side that fixed block (42) were kept away from in curb plate (46) has insulating centre gripping post (45).

5. The multilayer impedance HDI circuit board of claim 4, wherein: the utility model discloses a circuit board spare (7) and protection piece, including fixed screw (44), mounting frame (8) lower extreme is all run through to fixed screw (44) lower extreme, fixed screw (44) upper end and shoulder hole (9) upper portion threaded connection, one side that fixed block (42) were kept away from in insulating centre gripping post (45) all contacts with circuit board spare (7) lateral wall, protection piece (41) are located one side that circuit board spare (7) were kept away from in fixed block (42).

6. The multilayer impedance HDI circuit board of claim 4, wherein: the protection piece (41) comprises a sleeve (412), a telescopic guide post (414) and a buffering head (415), a cavity (411) is formed in the sleeve (412), a spring piece (413) is fixedly sleeved on the outer surface of the telescopic guide post (414), the telescopic guide post (414) is fixedly connected with the buffering head (415), the buffering head (415) penetrates through one side, away from a circuit board piece (7), of the sleeve (412), the telescopic guide post (414) and the spring piece (413) are located in the cavity (411), and the buffering head (415) is located in a mounting hole (5).