CN214381970U - Heat dissipation type printed circuit board - Google Patents
Heat dissipation type printed circuit board Download PDFInfo
- Publication number
- CN214381970U CN214381970U CN202120404156.1U CN202120404156U CN214381970U CN 214381970 U CN214381970 U CN 214381970U CN 202120404156 U CN202120404156 U CN 202120404156U CN 214381970 U CN214381970 U CN 214381970U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- fixing frame
- printed circuit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000741 silica gel Substances 0.000 claims abstract description 8
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 5
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000035939 shock Effects 0.000 description 7
- 238000013016 damping Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002028 premature Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
散热型印刷电路板，涉及印刷电路板技术领域，包括电路板本体和包裹在电路板本体边缘的固定框，固定框包括底框和顶盖，底框的顶面设置有用于放置电路板本体的放置槽，放置槽内侧与所述顶盖的内侧均设置有导热硅胶层，固定框的外边缘固定有若干散热片，本实用新型通过底框和顶盖相配合，将电路板安装在放置槽内，安装和拆卸简单方便，同时电路板产生的热量通过固定框和散热片散发出去，达到电路板散热的目的；通过散热柱将电路板表面的热量传递到电路板的底部，通过散热小风扇将电路板底部的热量吹走，加速降低了电路板下方的热量聚集；通过圆筒、移动板、缓冲弹簧和减震杆相配合，使电路板具备减震效果，避免电路板因振动造成损坏。
A heat-dissipating printed circuit board relates to the technical field of printed circuit boards, and includes a circuit board body and a fixing frame wrapped around the edge of the circuit board body. The fixing frame includes a bottom frame and a top cover, and the top surface of the bottom frame is provided with a A placement slot, the inner side of the placement slot and the inner side of the top cover are both provided with a thermally conductive silica gel layer, and a number of heat sinks are fixed on the outer edge of the fixing frame. The utility model installs the circuit board in the placement slot by cooperating with the bottom frame and the top cover. Inside, the installation and disassembly are simple and convenient, and the heat generated by the circuit board is dissipated through the fixing frame and the heat sink to achieve the purpose of heat dissipation of the circuit board; The heat at the bottom of the circuit board is blown away, which accelerates and reduces the heat accumulation under the circuit board; through the cooperation of the cylinder, the moving plate, the buffer spring and the shock-absorbing rod, the circuit board has a shock-absorbing effect to avoid damage to the circuit board due to vibration .
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to heat dissipation type printed circuit board.
Background
In recent years, electronic technology has been rapidly advanced, electronic devices have become more precise, and particularly, in the case of miniaturization and precision of electronic components, the temperature of the circuit board is high due to more and more heat generated by the operation of the electronic components, and thus the heat dissipation requirement of the circuit board is also higher.
In order to improve the heat dissipation effect of the conventional circuit board, a metal substrate is generally used to absorb heat and dissipate heat of the circuit. But the radiating effect of metal substrate itself is also not very high, and the heat often can gather to be difficult to rapid dissipation cooling on the base plate, influences circuit board wholeness ability. Generally, the heat dissipation is accelerated by installing the heat dissipation fins at the bottom of the circuit board through the fixing bolts, and the installation and the disassembly are troublesome. Moreover, most of the existing circuit boards have no shock absorption capability, and can cause premature damage when vibration occurs.
SUMMERY OF THE UTILITY MODEL
In view of the above, in order to solve the problems in the prior art, the present invention provides a heat dissipation type printed circuit board.
The technical scheme is as follows: comprises a circuit board body and a fixing frame wrapped on the edge of the circuit board body, wherein the fixing frame is made of heat-conducting materials, the fixing frame comprises a bottom frame and a top cover, the top surface of the bottom frame is provided with a placing groove for placing the circuit board body, the top cover is detachably connected with the top surface of the bottom frame to form a structure for fixing the circuit board body in the placing groove, the inner side of the placing groove and the inner side of the top cover are both provided with a heat-conducting silica gel layer, the outer edge of the fixing frame is fixed with a plurality of radiating fins, the bottom of the fixed frame is provided with a bottom plate, the fixed frame is connected with the bottom plate through a buffer mechanism, a plurality of slots are formed in the bottom surface of the circuit board body, heat dissipation columns are inserted in the slots, a vertical plate is arranged on any side wall of the bottom plate, and a plurality of small heat dissipation fans are installed on the inner side surface of the vertical plate.
Preferably, the draw-in groove has been seted up to the top surface of underframe, the bottom surface of top cap be equipped with the card strip of draw-in groove cooperation joint top cap lid closes when the underframe top, the marginal protrusion of top cap underframe edge sets up.
Preferably, the buffer mechanism comprises a cylinder fixed on the top surface of the bottom plate, a moving plate is connected in the cylinder in a sliding mode, the bottom surface of the moving plate is connected with the inner bottom surface of the cylinder through a buffer spring, the top surface of the moving plate is connected with a damping rod, and the damping rod penetrates through the top surface of the cylinder and is connected with the bottom surface of the fixed frame.
Preferably, the four corners of the bottom plate are provided with mounting holes.
Preferably, the heat radiating fins are waved.
Preferably, the top of the heat dissipation column is bonded in the slot through a heat conducting adhesive, and the heat dissipation column is made of an aluminum material.
Preferably, the fixed frame with the fin is made of aluminum, the fixed frame with the fin is fixedly connected through integrated molding.
The utility model provides a heat dissipation type printed circuit board compares beneficial effect with prior art and does:
1: the utility model has the advantages that the bottom frame is matched with the top cover, the circuit board is arranged in the placing groove, the installation and the disassembly are simple and convenient, and simultaneously, the heat generated by the circuit board is distributed through the fixing frame and the radiating fins, so as to achieve the purpose of radiating the circuit board;
2: the heat dissipation column of the utility model transfers the heat on the surface of the circuit board to the bottom of the circuit board, and blows away the heat on the bottom of the circuit board through the small heat dissipation fan, thereby accelerating the reduction of the heat accumulation below the circuit board, having obvious heat dissipation effect and being suitable for popularization;
3: the utility model discloses a drum, movable plate, buffer spring and shock-absorbing rod cooperate, make the circuit board possess the shock attenuation effect, avoid the circuit board to cause the damage because of the vibration, solve current circuit board most of all not have absorbing ability, can lead to the problem of too early damage when taking place the vibration.
Drawings
Figure 1 is a side view of the entire interior of the utility model.
Fig. 2 is an overall side view of the utility model.
Fig. 3 is an overall plan view of the utility model.
In the figure: 1-circuit board body, 2-fixed frame, 3-bottom frame, 4-top cover, 5-placement groove, 6-heat conduction silica gel layer, 7-heat sink, 8-bottom plate, 9-slot, 10-heat dissipation column, 11-vertical plate, 12-small heat dissipation fan, 13-card slot, 14-card strip, 15-cylinder, 16-movable plate, 17-buffer spring, 18-shock-absorbing rod, 19-mounting hole.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention, and in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or position relationship based on the drawings, and are only for convenience of description of the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as limiting the present invention.
Furthermore, the terms "outer", "inner" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance in the description of the present invention, it being understood that unless otherwise explicitly stated or limited, the terms "mounted", "connected" and "connected" are to be broadly construed, e.g., fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present invention will be described in further detail below with reference to specific embodiments and with reference to the accompanying drawings.
The first embodiment is as follows: as shown in fig. 1 to 3, the heat dissipation type printed circuit board includes a circuit board body 1 and a fixing frame 2 wrapped on the edge of the circuit board body 1, wherein the fixing frame 2 is made of a heat conductive material.
Wherein, fixed frame 2 includes underframe 3 and top cap 4, and the top surface of underframe 3 is provided with the standing groove 5 that is used for placing circuit board body 1, and standing groove 5 and the big or small looks adaptation of circuit board, top cap 4 detachable connect the top surface formation of underframe 3 with circuit board body 1 fix the structure inside standing groove 5.
The inboard of standing groove 5 all is provided with heat conduction silica gel layer 6 with the inboard of top cap 4, and heat conduction silica gel layer 6 bonds in the inboard of standing groove 5 inboard and top cap 4 through the heat conduction glue, and the outward flange of fixed frame 2 is fixed with a plurality of fin 7. Wherein, heat conduction silica gel layer 6 can absorb the heat that circuit board body 1 produced and conduct for fixed frame 2, and heat conduction silica gel layer 6 can also protect circuit board body 1 simultaneously, prevents that 1 edge of circuit board body from being worn and torn.
In the embodiment, the fixing frame 2 and the heat sink 7 are made of aluminum, and the fixing frame 2 and the heat sink 7 are fixedly connected by integral molding. In the embodiment, the fixing frame 2 and the heat sink 7 are made of aluminum, which is beneficial to quickly dispersing heat energy generated by electronic components on the circuit board body 1, thereby protecting the circuit board.
The utility model discloses a underframe 3 and top cap 4 cooperate, install the circuit board in standing groove 5, the installation with dismantle simple and conveniently, the heat that the circuit board produced distributes away through fixed frame 2 and fin 7 simultaneously, reach the radiating purpose of circuit board, wherein the setting of fin 7 can accelerate the radiating rate of fixed frame 2, and fin 7 is the wave, the wavy fin can prolong, increase heat transfer area.
The bottom of the fixed frame 2 is provided with a bottom plate 8, and the fixed frame 2 is connected with the bottom plate 8 through a buffer mechanism. Set up buffer gear, make the circuit board possess the shock attenuation effect, avoid the circuit board to cause the damage because of the vibration, solve present circuit board most all do not have absorbing ability, can lead to premature failure's problem when the emergence vibration.
The bottom surface of the circuit board body 1 is provided with a plurality of slots 9, heat dissipation columns 10 are inserted in the slots 9, wherein the tops of the heat dissipation columns 10 are bonded in the slots 9 through heat conducting glue, and the heat dissipation columns 10 are made of aluminum materials, so that the heat dissipation efficiency of the heat dissipation columns 10 can be further accelerated.
Any side wall of the bottom plate 8 is provided with a vertical plate 11, the vertical plate 11 and the bottom plate 8 are fixedly connected by welding, a plurality of small heat dissipation fans 12 are installed on the inner side surface of the vertical plate 11, the small heat dissipation fans 12 adopt the prior art, the model of the small heat dissipation fans 12 can be MQ20060HBL2, a plurality of through grooves are formed in the vertical plate 11, and the small heat dissipation fans 12 are fixed inside the through grooves by screws.
When the circuit board body 1 is used, heat generated by the circuit board body 1 is transferred to the heat dissipation column 10, then the heat dissipation column 10 transfers the heat to the bottom of the circuit board, the small heat dissipation fan 12 is started, the small heat dissipation fan 12 blows away the heat at the bottom of the circuit board, and heat accumulation below the circuit board is reduced at an accelerated speed.
Example two: further on the basis of above-mentioned embodiment, draw-in groove 13 has been seted up to the top surface of underframe 3, and draw-in groove 13 sets up with underframe 3 integrated into one piece, and top cap 4's bottom surface is equipped with the card strip 14 with draw-in groove 13 matched with joint, and when top cap 4 lid closed underframe 3 top, top cap 4's edge protrusion underframe 3 edge setting sets up, sets up like this and conveniently takes off top cap 4 from underframe 3. The circuit board body 1 is convenient to install and disassemble.
Example three: on the basis of the above embodiment, the buffering mechanism further includes a cylinder 15 fixed on the top surface of the bottom plate 8, the cylinder 15 is fixedly welded on the top surface of the bottom plate 8, a moving plate 16 is slidably connected in the cylinder 15, the bottom surface of the moving plate 16 is connected with the inner bottom surface of the cylinder 15 through a buffering spring 17, two ends of the buffering spring 17 are respectively fixedly welded with the moving plate 16 and the cylinder 15, the top surface of the moving plate 16 is connected with a damping rod 18, the damping rod 18 is fixedly welded with the top surface of the moving plate 16, and the damping rod 18 penetrates through the top surface of the cylinder 15 and is fixedly welded with the bottom surface of the fixed frame 2. Through the cooperation of the cylinder 15, the moving plate 16, the buffer spring 17 and the shock absorption rod 18, the circuit board has a shock absorption effect, and the circuit board is prevented from being damaged due to vibration.
Example four: further on the basis of above-mentioned embodiment, mounting hole 19 has all been seted up at four edges of bottom plate 8, sets up mounting hole 19, conveniently installs bottom plate 8 inside electronic equipment.
To sum up, the utility model has the advantages that the bottom frame is matched with the top cover, the circuit board is arranged in the placing groove, the installation and the disassembly are simple and convenient, and simultaneously, the heat generated by the circuit board is distributed out through the fixing frame and the radiating fins, so that the purpose of radiating the circuit board is achieved; the heat on the surface of the circuit board is transferred to the bottom of the circuit board through the heat dissipation column, and the heat on the bottom of the circuit board is blown away through the small heat dissipation fan, so that the heat accumulation below the circuit board is reduced at an accelerated speed; through the cooperation of drum, movable plate, buffer spring and shock attenuation pole, make the circuit board possess the shock attenuation effect, avoid the circuit board to cause the damage because of the vibration.
While the present invention has been particularly shown and described with reference to the preferred embodiments thereof, and many methods and approaches to the practice thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120404156.1U CN214381970U (en) | 2021-02-24 | 2021-02-24 | Heat dissipation type printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120404156.1U CN214381970U (en) | 2021-02-24 | 2021-02-24 | Heat dissipation type printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214381970U true CN214381970U (en) | 2021-10-08 |
Family
ID=77966217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120404156.1U Expired - Fee Related CN214381970U (en) | 2021-02-24 | 2021-02-24 | Heat dissipation type printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214381970U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118139268A (en) * | 2024-01-31 | 2024-06-04 | 杭州出厂科技有限公司 | A multi-layer circuit board with high efficiency in heat dissipation |
-
2021
- 2021-02-24 CN CN202120404156.1U patent/CN214381970U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118139268A (en) * | 2024-01-31 | 2024-06-04 | 杭州出厂科技有限公司 | A multi-layer circuit board with high efficiency in heat dissipation |
| CN118139268B (en) * | 2024-01-31 | 2025-01-28 | 中山市良臣子电器有限公司 | A multi-layer circuit board with high efficiency in heat dissipation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211008 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |