CN220984173U - Solid state disk heat dissipation shell - Google Patents

Abstract

The utility model provides a solid state disk heat dissipation shell, belongs to the technical field of solid state disk production, and is used for solving the technical problems that the existing solid state disk is poor in heat dissipation effect under the wrapping of the shell and is not beneficial to the release of flash memory particle performance. The heat dissipation device comprises an upper shell and a lower shell, wherein a first mounting groove is formed in the upper shell, a heat dissipation copper block is fixed in the first mounting groove, heat dissipation fins are arranged on the outer side of the heat dissipation copper block, a first heat dissipation silica gel sheet is adhered on the inner side of the heat dissipation copper block, a second mounting groove is formed in the lower shell, a heat dissipation copper sheet is fixed in the second mounting groove, and a second heat dissipation silica gel sheet is adhered on the inner side of the heat dissipation copper sheet; the solid state disk heat dissipation shell can transfer heat of flash memory particles on the PCB substrate to the heat dissipation fins, and due to the wavy structure that the heat dissipation fins diverge from each other, the heat dissipation effect is further improved, the influence of temperature on the release of the flash memory particles is reduced, and the use effect of the solid state disk is improved.

Description

Solid state disk heat dissipation shell

Technical Field

The utility model belongs to the technical field of solid state disk production, and relates to a solid state disk heat dissipation shell.

Background

The solid state disk is called SSD for short, also called solid state drive, and is a hard disk made of solid state electronic memory chip array. The solid state disk is identical to the common hard disk in terms of the specification, definition, function and use method of the interface, but the solid state disk has the characteristics of rapid reading and writing, light weight, low energy consumption, small volume and the like which are not possessed by the traditional mechanical hard disk.

In practical application, the solid state disk has high efficiency of the internal elements, correspondingly generates higher heat, wherein the heat productivity of the flash memory particles is maximum, the proper temperature can improve the read-write speed, but the function of the solid state disk is affected by the excessively high temperature for a long time, the existing heat dissipation device is just to paste the heat dissipation fin above the flash memory particles, and the heat dissipation effect is still limited due to the wrapping of the shell, so that the performance release of the flash memory particles is greatly limited.

Based on the above, we design a solid state disk heat dissipation shell with better heat dissipation effect.

Disclosure of utility model

The utility model aims to solve the problems in the prior art, and provides a solid state disk heat dissipation shell, which aims to solve the technical problems that: how to improve the heat dissipation effect of the solid state disk shell and reduce the influence of temperature on the release of flash memory particle performance.

The aim of the utility model can be achieved by the following technical scheme:

The utility model provides a solid state hard disk shell that looses, includes casing and lower casing, go up through the screw fixation between casing and the lower casing, the PCB base plate is located between casing and the lower casing, and the fixed flash memory grain of PCB base plate one side is close to the casing, first mounting groove has been seted up on the casing, be fixed with the heat dissipation copper billet in the first mounting groove, and the outside of heat dissipation copper billet is provided with heat radiation fin, the inboard of heat dissipation copper billet is pasted and is had first heat dissipation silica gel piece, and the opposite side of first heat dissipation silica gel piece is pasted tightly with the flash memory grain on the PCB base plate, the second mounting groove has been seted up on the lower casing, be fixed with the heat dissipation copper sheet in the second mounting groove, the inboard of heat dissipation copper sheet is pasted and is had the second heat dissipation silica gel piece, and the opposite side of second heat dissipation silica gel piece is pasted tightly with the one side that the flash memory grain was kept away from to the PCB base plate.

And a third radiating silica gel sheet is adhered to the outer side of the radiating copper sheet, a protective film is adhered to the outer side of the third radiating silica gel sheet, and an extension angle is arranged at the corner of the protective film.

By adopting the structure, when the solid state disk is installed, the protective film is torn off through the extension angle, then the third radiating silica gel sheet is attached to the mounting frame of the chassis, the heat transfer effect between the radiating copper sheet and the mounting frame of the chassis can be improved, and the protective film can prevent dust from adhering to the outer side of the third radiating silica gel sheet before the solid state disk is installed.

And a plurality of supporting pieces are fixed on the inner side of the upper shell, and the inner sides of the supporting pieces are propped against the edge of the PCB substrate.

By adopting the structure, when in actual use, the support sheet can improve the stability of the PCB substrate, and the PCB substrate is provided with a movable protection effect when the operator carries the case.

The edge and the below of last casing all are provided with the mounting hole, and the lower casing outside is fixed with a plurality of magnetic sheets, and the magnetic sheet is located the edge of radiating copper sheet.

By adopting the structure, when the novel heat dissipation system is used, an operator can fix the solid state disk through the mounting hole, if the chassis mounting frame is made of iron materials, the solid state disk is adsorbed on the chassis mounting frame through the magnetic sheets, the novel heat dissipation system is more convenient to mount, the magnetic sheets are distributed around the heat dissipation copper sheets, and the third heat dissipation silicon sheets can be pressed on the chassis mounting frame to the maximum extent, so that the heat conduction effect is guaranteed.

The upper edges of the radiating fins are corrugated, and the peaks and the troughs of two adjacent radiating fins diverge from each other.

By adopting the structure, when in actual use, the heat dissipation fins with the structure can improve the distance between the heat dissipation fins, so that the air duct in the case can conveniently take away heat nearby the heat dissipation fins, and the heat dissipation effect is further improved.

Compared with the prior art, the solid state disk heat dissipation shell has the following advantages:

1. Through heat dissipation copper billet and first heat dissipation silica gel piece, can be with the heat transfer of flash memory granule on the PCB base plate to on the heat radiation fins, because the wave-like structure of heat radiation fins mutual fork, under the effect in quick-witted case wind channel, further improve the radiating effect, reduce the influence of temperature to flash memory granule performance release, improve solid state disk result of use.

2. Through radiating copper sheet, second radiating silica gel piece and third radiating silica gel piece, on transmitting the heat of PCB base plate to the quick-witted case mounting bracket, utilize quick-witted case wind channel to the radiating effect of quick-witted case mounting bracket, realize the heat dissipation to solid state disk, further improve the radiating effect of solid state disk.

3. Through the magnetic sheet, when the chassis mounting frame is made of iron, the step of mounting the solid state disk is simplified, and the solid state disk is conveniently mounted in the chassis by an operator.

Drawings

FIG. 1 is a schematic top view of the present utility model;

FIG. 2 is a schematic view of the bottom structure of the present utility model;

FIG. 3 is a schematic view of a split construction of the present utility model;

FIG. 4 is a schematic view of the internal structure of the upper housing of the present utility model;

FIG. 5 is a schematic view of the split construction of part of the present utility model;

fig. 6 is a schematic structural diagram of a heat sink fin according to the present utility model.

In the figure: 1. an upper housing; 2. a lower housing; 3. a PCB substrate; 4. a first mounting groove; 5. a heat-dissipating copper block; 6. a heat radiation fin; 7. a first heat-dissipating silicone sheet; 8. a second mounting groove; 9. a heat dissipation copper sheet; 10. a second heat dissipation silica gel sheet; 11. a third heat dissipation silica gel sheet; 12. a protective film; 13. a support sheet; 14. a magnetic sheet; 15. and (5) mounting holes.

Detailed Description

The technical scheme of the patent is further described in detail below with reference to the specific embodiments.

Embodiments of the present patent are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the patent and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and are therefore not to be construed as limiting the patent.

In the description of this patent, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be fixedly connected, disposed, detachably connected, disposed, or integrally connected, disposed, for example. The specific meaning of the terms in this patent will be understood by those of ordinary skill in the art as the case may be.

Referring to fig. 1-6, the embodiment provides a solid state hard disk heat dissipation shell, which comprises an upper shell 1 and a lower shell 2, wherein the upper shell 1 and the lower shell 2 are fixed by screws, a PCB substrate 3 is positioned between the upper shell 1 and the lower shell 2, one side of the PCB substrate 3 for fixing flash memory particles is close to the upper shell 1, a first mounting groove 4 is formed in the upper shell 1, a heat dissipation copper block 5 is fixed in the first mounting groove 4, a heat dissipation fin 6 is arranged on the outer side of the heat dissipation copper block 5, a first heat dissipation silica gel sheet 7 is adhered on the inner side of the heat dissipation copper block 5, the other side of the first heat dissipation silica gel sheet 7 is adhered to the flash memory particles on the PCB substrate 3, a second mounting groove 8 is formed in the lower shell 2, a heat dissipation copper sheet 9 is fixed in the second mounting groove 8, a second heat dissipation silica gel sheet 10 is adhered on the inner side of the heat dissipation copper sheet 9, and the other side of the second heat dissipation silica gel sheet 10 is adhered to one side of the PCB substrate 3 away from the flash memory particles.

A third heat dissipation silica gel sheet 11 is adhered to the outer side of the heat dissipation copper sheet 9, a protective film 12 is adhered to the outer side of the third heat dissipation silica gel sheet 11, and an extension angle is arranged at the corner of the protective film 12; when the solid state disk is installed, the protective film 12 is torn off through the extension angle, then the third heat dissipation silica gel piece 11 is attached to the installation frame of the chassis, the heat transfer effect between the heat dissipation copper sheet 9 and the installation frame of the chassis can be improved, and the protective film 12 can prevent dust from adhering to the outer side of the third heat dissipation silica gel piece 11 before the solid state disk is installed.

A plurality of supporting pieces 13 are fixed on the inner side of the upper shell 1, and the inner side of the supporting pieces 13 is propped against the edge of the PCB substrate 3; in actual use, the support piece 13 can improve the stability of the PCB substrate 3, and provide a moving protection effect for the PCB substrate 3 when the operator carries the chassis.

The edge and the lower part of the upper shell 1 are provided with mounting holes 15, the outer side of the lower shell 2 is fixedly provided with a plurality of magnetic sheets 14, and the magnetic sheets 14 are positioned at the edge of the radiating copper sheet 9; when using, operating personnel can fix solid state hard disk through mounting hole 15, if the quick-witted case mounting bracket is the iron material, still accessible magnetic sheet 14 adsorbs solid state hard disk on the quick-witted case mounting bracket, and the installation is more convenient, and magnetic sheet 14 distributes around heat dissipation copper sheet 9 moreover, can furthest with third heat dissipation silica gel piece 11 pressfitting on the quick-witted case mounting bracket, guarantees the heat conduction effect.

The upper edges of the radiating fins 6 are corrugated, and the peaks and the troughs of two adjacent radiating fins 6 diverge from each other; when in actual use, the heat dissipation fins 6 with the structure can improve the distance between the heat dissipation fins, so that the air duct in the case can conveniently take away the heat nearby the heat dissipation fins 6, and the heat dissipation effect is further improved.

In this embodiment, the above fixing methods are all the most commonly used fixing methods in the art, such as welding, bolting, etc.; the above electrical components, such as the PCB substrate 3, are all products of the prior art, and can be directly purchased and used in the market, and the specific principle is not repeated.

The working principle of the utility model is as follows:

When the solid state hard disk is installed, the protective film 12 is torn off firstly, then the solid state hard disk can be fixed on the chassis mounting frame through the mounting holes 15 and bolts, if the chassis mounting frame is made of iron materials, the solid state hard disk can be adsorbed on the chassis mounting frame through the magnetic sheets 14, the installation is more convenient, the magnetic sheets 14 are distributed around the radiating copper sheets 9, the third radiating silica gel sheet 11 can be pressed on the chassis mounting frame to the greatest extent, the heat conduction effect is ensured, when the solid state hard disk type solid state hard disk heat radiator is used, the PCB substrate 3 heats, the heat of flash memory particles is transferred to the radiating fins 6 through the first radiating silica gel sheet 7 and the radiating copper block 5, the peaks and the troughs of the two adjacent radiating fins 6 are mutually diverged, the distance between the radiating fins 6 is larger, the air flue inside the chassis is convenient for taking away the heat nearby the radiating fins 6, the heat on the other side of the PCB substrate 3 can be transferred to the chassis mounting frame through the second radiating silica gel sheet 10, the radiating copper sheets 9 and the third radiating silica gel sheet 11, and the radiating effect of the chassis is improved.

While the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes may be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims (5)

1. The utility model provides a solid state hard disk shell that looses, includes casing (1) and inferior valve body (2), go up between casing (1) and inferior valve body (2) through the screw fixation, PCB base plate (3) are located between casing (1) and inferior valve body (2) and one side that PCB base plate (3) fixed flash memory grain is close to casing (1), a serial communication port, go up and offered first mounting groove (4) on casing (1), be fixed with heat dissipation copper piece (5) in first mounting groove (4), and the outside of heat dissipation copper piece (5) is provided with heat radiation fin (6), the inboard of heat dissipation copper piece (5) is pasted and is had first heat dissipation silica gel piece (7), and the opposite side of first heat dissipation silica gel piece (7) is pasted tightly with the flash memory grain on PCB base plate (3), has offered second mounting groove (8) on inferior valve body (2), is fixed with copper sheet (9) in second mounting groove (8), and the opposite side of second heat dissipation silica gel piece (10) is pasted with one side that the flash memory grain is kept away from to PCB base plate (3).

2. The solid state disk heat dissipation shell according to claim 1, wherein a third heat dissipation silica gel sheet (11) is adhered to the outer side of the heat dissipation copper sheet (9), a protection film (12) is adhered to the outer side of the third heat dissipation silica gel sheet (11), and an extension angle is arranged at a corner of the protection film (12).

3. The solid state disk heat dissipation shell according to claim 1 or 2, wherein a plurality of supporting pieces (13) are fixed on the inner side of the upper shell (1), and the inner sides of the supporting pieces (13) are abutted against the edge of the PCB substrate (3).

4. The solid state disk heat dissipation shell according to claim 1, wherein the edge and the lower part of the upper shell (1) are provided with mounting holes (15), a plurality of magnetic sheets (14) are fixed on the outer side of the lower shell (2), and the magnetic sheets (14) are positioned on the edge of the heat dissipation copper sheet (9).

5. The solid state disk heat dissipation shell according to claim 1, wherein the upper edges of the heat dissipation fins (6) are corrugated, and the peaks and the troughs of two adjacent heat dissipation fins (6) diverge from each other.