CN211403364U - Heat dissipation device for electrical equipment - Google Patents
Heat dissipation device for electrical equipment Download PDFInfo
- Publication number
- CN211403364U CN211403364U CN201922332583.9U CN201922332583U CN211403364U CN 211403364 U CN211403364 U CN 211403364U CN 201922332583 U CN201922332583 U CN 201922332583U CN 211403364 U CN211403364 U CN 211403364U
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- CN
- China
- Prior art keywords
- heat
- heat dissipation
- radiating
- electrical equipment
- base plate
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 11
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipation device field, in particular to an electrical equipment heat dissipation device, which comprises a heat radiator, the utility model adopts heat conducting glue to connect between a heat dissipation connecting plate and a heat dissipation substrate, thereby leading heat to the heat dissipation substrate rapidly, compared with the traditional metal heat conduction, the heat conduction effect is better, through arranging a heat conduction cavity in the heat dissipation substrate, the heat conduction cavity is filled with high-efficiency heat conduction liquid, thereby realizing rapid conveying of heat on the heat dissipation substrate to the heat dissipation sheet, through arranging a vacuum cavity in the heat dissipation sheet, thereby realizing rapid transmission of heat on the heat dissipation sheet, greatly increasing the heat dissipation effect of the heat dissipation sheet, through arranging heat dissipation holes on the side surface of the heat dissipation sheet, and evenly distributing on the heat dissipation sheet, the side surface of a fixing frame is provided with air holes, the fixing frame is provided with a clamping groove, which can fix a fan, thereby the, the heat dissipation efficiency of the heat dissipation fins is greatly improved.
Description
Technical Field
The utility model relates to a heat abstractor field specifically is an electrical equipment heat abstractor.
Background
Generally, a heat dissipation device in a computer is mainly composed of a heat dissipation plate and a fan. After the computer is started, the heat dissipation device starts to work, the CPU can generate a large amount of heat when working, the heat dissipation fins are used for absorbing the heat generated by the CPU, and then the heat of the heat dissipation fins is blown away through the movement of the fan, so that the heat dissipation device works circularly and helps the CPU to dissipate heat.
The traditional radiating fins are all composed of sheet-shaped heat conducting material sheets which are arranged in an arrangement mode, although the radiating device with the structure can radiate heat, the situation that a CPU is broken frequently occurs due to the fact that the radiating situation is not ideal, particularly for the existing computer equipment, the size is smaller and smaller originally, heat is accumulated in the equipment, if the heat is not dissipated in time, the computer equipment is easily damaged, and therefore based on the situation, the structure of the existing radiating device cannot meet the radiating requirement of a computer, and the radiating device can be adapted to the situation needing further improvement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electrical equipment heat abstractor to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electrical equipment heat abstractor, includes the radiator, the radiator top is provided with the fixed plate, the fixed plate top is provided with the bleeder vent, the bleeder vent side is connected with the draw-in groove, the radiator side is provided with the heat dissipation base plate, heat dissipation base plate side is provided with the heat-dissipating connection board, the heat-dissipating connection board side is connected with the buckle, the inside heat conduction chamber that is provided with of heat-dissipating base plate, heat dissipation base plate opposite side is provided with the fin, the fin side is provided with the louvre, the.
Preferably, the fixing plate is fixedly connected with the heat dissipation substrate through screws, so that the fixing plate and the heat dissipation substrate can be conveniently detached and connected.
Preferably, the clamping groove is embedded and connected with the fixing plate, so that the clamping groove is connected with the fixing plate more tightly, and a fan is conveniently mounted on the fixing plate to increase the heat dissipation effect.
Preferably, the heat radiation connecting plate is fixedly connected with the heat radiation base plate through a heat radiation glue, so that heat on the heat radiation connecting plate is better conveyed to the heat radiation base plate.
Preferably, the buckle is connected with heat dissipation base plate formula as an organic whole, and the radiator of being convenient for is inseparabler to be fixed on the mainboard, makes heat transmission efficiency higher, the fin is connected with heat dissipation base plate formula as an organic whole, and the heat is carried on the fin on the heat dissipation base plate of being convenient for.
Preferably, the heat conducting cavity is filled with heat conducting liquid, so that heat on the heat radiating substrate is greatly accelerated to be transmitted to the heat radiating fin, and the heat radiating efficiency is improved.
Preferably, the radiating holes penetrate through the radiating fins, so that heat on the radiating fins can be rapidly distributed conveniently, and the radiating holes are uniformly distributed on the radiating fins, so that the radiating efficiency of the radiating fins can be increased conveniently.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model adopts the heat-conducting glue between the heat-radiating connecting plate and the heat-radiating substrate to lead heat into the heat-radiating substrate quickly, compared with the traditional metal heat conduction, the heat-conducting effect is better, the heat-conducting cavity is arranged in the heat-radiating substrate, the high-efficiency heat-conducting liquid is filled in the heat-conducting cavity, thereby realizing the quick transmission of heat on the heat-radiating substrate, greatly accelerating the heat export, the vacuum cavity is arranged in the heat-radiating fin to realize the quick transmission of heat on the heat-radiating fin, greatly increasing the heat-radiating effect of the heat-radiating fin, the heat-radiating holes are arranged on the side surface of the heat-radiating fin and are evenly distributed on the heat-radiating fin, the air holes are arranged on the side surface of the fixing frame, the clamping groove is arranged on the fixing frame, the fan can be fixed, thereby, the heat dissipation efficiency of the heat dissipation fins is greatly improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic side view of the present invention;
fig. 3 is a schematic view of the structure of the heat sink of the present invention.
In the figure: 1. a heat sink; 2. a heat-dissipating substrate; 3. a heat radiation connecting plate; 4. buckling; 5. a fixing plate; 6. air holes are formed; 7. a heat sink; 8. a heat conducting cavity; 9. a vacuum chamber; 10. a card slot; 11. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an electrical equipment heat abstractor, including radiator 1, 1 top of radiator is provided with fixed plate 5, 5 tops of fixed plate are provided with bleeder vent 6, the 6 sides of bleeder vent are connected with draw-in groove 10, 1 side of radiator is provided with radiating basal plate 2, 2 sides of radiating basal plate are provided with the heat-dissipating connecting plate 3, 2 sides of heat-dissipating connecting plate are connected with buckle 4, the inside heat conduction chamber 8 that is provided with of radiating basal plate 2, 3 opposite sides of radiating basal plate are provided with fin 7, 7 sides of fin are provided with louvre 11, the inside vacuum.
Furthermore, the fixing plate 5 is fixedly connected with the heat dissipation substrate 2 through screws, so that the fixing plate 5 and the heat dissipation substrate 2 can be conveniently detached and connected.
Further, the clamping groove 10 is connected with the fixing plate 5 in an embedded mode, so that the clamping groove 10 is connected with the fixing plate 5 more tightly, a fan is conveniently installed on the fixing plate 5, and the heat dissipation effect is improved.
Furthermore, the heat radiation connecting plate 3 is fixedly connected with the heat radiation base plate 2 through heat radiation glue, so that heat on the heat radiation connecting plate 3 is better conveyed to the heat radiation base plate 2.
Further, buckle 4 is connected with heat dissipation base plate 2 formula as an organic whole, and the radiator 1 of being convenient for is inseparabler fixes on the mainboard, makes heat transmission efficiency higher, and fin 7 is connected with heat dissipation base plate 2 formula as an organic whole, and the heat is carried on fin 7 on the heat dissipation base plate 2 of being convenient for.
Furthermore, the heat conducting liquid is filled in the heat conducting cavity 8, so that heat on the heat radiating substrate 2 is greatly accelerated to be transmitted to the heat radiating fins 7, and the heat radiating efficiency is improved.
Furthermore, the heat dissipation holes 11 penetrate through the heat dissipation fins 7, so that heat on the heat dissipation fins 7 can be dissipated more rapidly, and the heat dissipation holes 11 are uniformly distributed on the heat dissipation fins 7, so that the heat dissipation efficiency of the heat dissipation fins 7 can be increased.
The working principle is as follows: firstly, coating silicone grease on the heat dissipation connecting plate 3, fixedly connecting the radiator 1 with a CPU (central processing unit) needing heat dissipation through the buckle 4, connecting the heat dissipation fan with the fixing plate 5 through the clamping groove 10 after connection is completed, and finally opening the use device, wherein the heat generated by the CPU is discharged by the radiator 1.
The utility model has the advantages that the heat conducting glue is adopted between the heat-radiating connecting plate 3 and the heat-radiating base plate 2 for connecting, thereby the heat is quickly led into the heat-radiating base plate, compared with the traditional metal heat conduction, the heat conducting effect is better, the heat conducting cavity 8 is arranged in the heat-radiating base plate 2, the heat conducting cavity 8 is filled with high-efficiency heat conducting liquid, thereby the heat on the heat-radiating base plate is quickly transmitted to the heat-radiating fin, the heat is greatly accelerated to be led out, the vacuum 9 cavity is arranged in the heat-radiating fin 7, thereby the quick transmission of the heat on the heat-radiating fin 7 is realized, the heat radiating effect of the heat-radiating fin 7 is greatly increased, the heat radiating holes 11 are arranged on the side surface of the heat-radiating fin 7 and are uniformly distributed on the heat-radiating fin 7, the air holes 6 are arranged on the side surface of, the heat on the radiating fins 7 is quickly discharged, and the radiating efficiency of the radiating fins is greatly improved
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an electrical equipment heat abstractor, includes radiator (1), its characterized in that: radiator (1) top is provided with fixed plate (5), fixed plate (5) top is provided with bleeder vent (6), bleeder vent (6) side is connected with draw-in groove (10), radiator (1) side is provided with heat dissipation base plate (2), heat dissipation base plate (2) side is provided with heat-radiating connection board (3), heat-radiating connection board (3) side is connected with buckle (4), heat dissipation base plate (2) inside is provided with heat conduction chamber (8), heat dissipation base plate (2) opposite side is provided with fin (7), fin (7) side is provided with louvre (11), inside vacuum cavity (9) that is provided with of fin (7).
2. The heat sink for electrical equipment of claim 1, wherein: the fixing plate (5) is fixedly connected with the heat dissipation substrate (2) through screws.
3. The heat sink for electrical equipment of claim 1, wherein: the clamping groove (10) is connected with the fixing plate (5) in an embedded mode.
4. The heat sink for electrical equipment of claim 1, wherein: the heat dissipation connecting plate (3) is fixedly connected with the heat dissipation base plate (2) through heat dissipation glue.
5. The heat sink for electrical equipment of claim 1, wherein: the buckle (4) is connected with the heat dissipation base plate (2) in an integrated mode, and the heat dissipation sheet (7) is connected with the heat dissipation base plate (2) in an integrated mode.
6. The heat sink for electrical equipment of claim 1, wherein: and the heat conduction cavity (8) is filled with heat conduction liquid.
7. The heat sink for electrical equipment of claim 1, wherein: the radiating holes (11) penetrate through the radiating fins (7), and the radiating holes (11) are uniformly distributed on the radiating fins (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922332583.9U CN211403364U (en) | 2019-12-23 | 2019-12-23 | Heat dissipation device for electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922332583.9U CN211403364U (en) | 2019-12-23 | 2019-12-23 | Heat dissipation device for electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211403364U true CN211403364U (en) | 2020-09-01 |
Family
ID=72214482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922332583.9U Expired - Fee Related CN211403364U (en) | 2019-12-23 | 2019-12-23 | Heat dissipation device for electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211403364U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980482A (en) * | 2022-04-26 | 2022-08-30 | 浙江机电职业技术学院 | A kind of self-heating substrate and preparation method thereof |
-
2019
- 2019-12-23 CN CN201922332583.9U patent/CN211403364U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980482A (en) * | 2022-04-26 | 2022-08-30 | 浙江机电职业技术学院 | A kind of self-heating substrate and preparation method thereof |
| CN114980482B (en) * | 2022-04-26 | 2023-05-05 | 浙江机电职业技术学院 | Self-heat-dissipation substrate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200901 Termination date: 20201223 |