CN109068545A - A kind of heat sinking circuit board - Google Patents
A kind of heat sinking circuit board Download PDFInfo
- Publication number
- CN109068545A CN109068545A CN201811080776.3A CN201811080776A CN109068545A CN 109068545 A CN109068545 A CN 109068545A CN 201811080776 A CN201811080776 A CN 201811080776A CN 109068545 A CN109068545 A CN 109068545A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pedestal
- heat
- heat sinking
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of heat sinking circuit boards, including electronic equipment inner casing, pedestal and circuit board, support plate is arranged in base upper surface, the first cooling fin is arranged in support plate upper surface, chip is arranged in circuit board upper surface, capacitor is set on the right side of chip, circuit element is arranged away from the side of chip in capacitor, radiator is arranged away from the side of capacitor in circuit element, the second heat sink is arranged in heat sink interior, fixing seat is set above the second heat sink, above fixing seat in setting fixed column, and dustproof shell is set above fixing seat, radiator fan is set inside dustproof shell, the present invention passes through being used cooperatively using the first cooling fin and radiator, it can radiate to two surfaces above and below circuit board；Meanwhile so that circuit board is not directly contacted with pedestal by pillar, the heat-dissipating space of circuit board is increased, radiating efficiency is improved, increases the service life of circuit board.
Description
Technical field
The present invention relates to technical field of electronic products, specifically a kind of heat sinking circuit board.
Background technique
Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and the type of circuit board is more at present, can be adapted for various
Electrical equipment etc. can effectively drive the operation of equipment.
Circuit board can generate heat during the course of work, therefore radiating is the essential procedure of circuit board,
Traditional circuit board is mounted on inside equipment, not for the measure of heat dissipation, leads to circuit board and electronic component accelerated ageing,
And the heat-sinking capability of the radiator installed additional is limited, and can only radiate to one surface of circuit board, heat dissipation effect is poor,
Influence the operation of electronic equipment.
Summary of the invention
The purpose of the present invention is to provide a kind of heat sinking circuit boards, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the invention provides the following technical scheme:
A kind of heat sinking circuit board, including electronic equipment inner casing, pedestal and circuit board；The base upper surface setting support
Plate；The first cooling fin is arranged in the support plate upper surface；Chip is arranged in the circuit board upper surface；Setting electricity on the right side of the chip
Container；Circuit element is arranged away from the side of chip in the capacitor；The circuit element is dissipated away from the setting of the side of capacitor
Thermal；The second heat sink is arranged in the heat sink interior；Fixing seat is set above second heat sink；The fixing seat
Top is arranged in fixed column, and dustproof shell is arranged above fixing seat；Radiator fan is set inside the dustproof shell.
As a further solution of the present invention: pedestal is arranged in electronic equipment inner casing upper surface；The susceptor surface is set
Set the first mounting hole.
As a further solution of the present invention: first mounting hole is arranged four, is separately positioned on four sides of pedestal
Angle Position, and the first bolt is set in the first mounting hole.
As a further solution of the present invention: pillar is arranged in the base upper surface；Described pillar setting two, and
Circuit board is arranged in pillar upper end.
As a further solution of the present invention: the second mounting hole is arranged in the circuit board surface；Second mounting hole is set
It sets, and is separately positioned on four corner locations of circuit board；Second bolt is set in second mounting hole.
As a further solution of the present invention: the support plate is arranged to trapezoidal.
As a further solution of the present invention: first cooling fin is made of metallic aluminium, and the first fin surface
Setting heat dissipation circular hole, while circuit board is arranged in the first cooling fin upper end.
As further scheme of the invention: second heat sink is made of metallic copper.
Compared with prior art, the beneficial effects of the present invention are:
The present invention can carry out two surfaces above and below circuit board by being used cooperatively using the first cooling fin and radiator
Heat dissipation；Meanwhile so that circuit board is not directly contacted with pedestal by pillar, the heat-dissipating space of circuit board is increased, heat dissipation effect is improved
Rate increases the service life of circuit board.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of heat sinking circuit board.
Fig. 2 is a kind of structure top view of heat sinking circuit board.
Fig. 3 is the structural schematic diagram of support plate and the first cooling fin in a kind of heat sinking circuit board.
In figure: 1- electronic equipment inner casing, 2- pedestal, the first mounting hole of 3-, the first bolt of 4-, 5- pillar, 6- circuit board, 7-
Second mounting hole, the second bolt of 8-, 9- support plate, the first cooling fin of 10-, 11- chip, 12- capacitor, 13- circuit element,
14- radiator, the second cooling fin of 15-, 16- fixing seat, 17- fixed column, 18- dustproof shell, 19- radiator fan, 20- heat dissipation circle
Hole.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
The embodiment of this patent is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining this patent, and cannot be understood as a limitation of this patent.
In the description of this patent, it is to be understood that term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship, be merely for convenience of description this patent and simplify description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to this patent.
In the description of this patent, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection ", " setting " shall be understood in a broad sense, for example, it may be being fixedly linked, being arranged, may be a detachable connection, set
It sets, or is integrally connected, is arranged.For the ordinary skill in the art, above-mentioned art can be understood as the case may be
The concrete meaning of language in this patent.
Please refer to Fig. 1-3, a kind of heat sinking circuit board, including electronic equipment inner casing 1, pedestal 2 and circuit board 6；It is described
Pedestal 2 is arranged in 1 upper surface of electronic equipment inner casing, is used to completely cut off electronic equipment internal charged components and shell, prevents electronics from setting
Standby electric leakage；The first mounting hole 3 is arranged in 2 surface of pedestal；First mounting hole 3 is arranged four, is separately positioned on pedestal 2
Four corner locations, and the first bolt 4 is set in the first mounting hole 3, by the first bolt 4 by pedestal 2 and electronic equipment
Inner casing 1 is fixed up；Pillar 5 is arranged in 2 upper surface of pedestal；The pillar 5 is arranged two, and is arranged in 5 upper end of pillar
Circuit board 6；The second mounting hole 7 is arranged in 6 surface of circuit board, is used to mounting circuit boards 6；The setting of second mounting hole 74
It is a, and it is separately positioned on four corner locations of circuit board 6；Second bolt 8 is set in second mounting hole 7, by the
Circuit board 6 and pillar 5 are fixed up by two bolts 8；Support plate 9 is arranged in 2 upper surface of pedestal；The support plate 9 is arranged to
Trapezoidal, the first cooling fin 10 is arranged in upper surface prevents circuit board 6 to be burned for radiating to 6 bottom of circuit board；Institute
It states the first cooling fin 10 to be made of metallic aluminium, there is good thermal conductivity, and 10 surface of the first cooling fin setting heat dissipation circular hole,
Enhance heat dissipation performance, while circuit board 6 is arranged in 10 upper end of the first cooling fin；Chip 11 is arranged in 6 upper surface of circuit board；It is described
Capacitor 12 is set on the right side of chip 11；Circuit element 13 is arranged away from the side of chip 11 in the capacitor 12；The chip 11,
Capacitor 12 and circuit element 13 are used to constitute circuit board operation basic module；The circuit element 13 deviates from the one of capacitor 12
Radiator 14 is arranged in side, for radiating to 6 upper surface of circuit board；Second heat sink is set inside the radiator 14
15；Second heat sink 15 is made of metallic copper, has good thermal conductivity, and is arranged above the second heat sink 15 and fixes
Seat 16, for the second cooling fin is fixed up；Fixed column 17 is set above the fixing seat 16, is used to fixing seat 17 is fixed
On radiator 14, and dustproof shell 18 is set above fixing seat 16；Radiator fan 19 is set inside the dustproof shell 18, is led to
Crossing dustproof shell 18 prevents extraneous dust from falling to 15 surface of the second cooling fin, influences heat dissipation effect.
The working principle of the invention is: in use, whole circuit board is mounted on electronic equipment by the first bolt 4
On inner casing 1, the heat that upper surface generates at work of circuit board 6 passes through the second cooling fin 15 for heat derives, then passes through heat dissipation
Fan 19 takes heat out of；Meanwhile the heat that generates of 6 bottom lower surface of circuit board by the first cooling fin 10 by heat derives,
The heat dissipation circular hole 20 on 10 surface of the first cooling fin can quickly take away heat；Pillar 5 supports circuit board 6 simultaneously, heat
Removing can be distributed faster from upper and lower two surfaces.
The present invention, can be to two surfaces above and below circuit board by being used cooperatively using the first cooling fin and radiator
It radiates；Meanwhile so that circuit board is not directly contacted with pedestal by pillar, the heat-dissipating space of circuit board is increased, is improved scattered
The thermal efficiency increases the service life of circuit board.
The preferred embodiment of the patent is described in detail above, but this patent is not limited to above-mentioned embodiment party
Formula within the knowledge of one of ordinary skill in the art can also be under the premise of not departing from this patent objective
It makes a variety of changes.
Claims (8)
1. a kind of heat sinking circuit board, including electronic equipment inner casing (1), pedestal (2) and circuit board (6)；It is characterized in that, institute
State pedestal (2) upper surface setting support plate (9)；The first cooling fin (10) are arranged in support plate (9) upper surface；The circuit board
(6) upper surface setting chip (11)；Capacitor (12) are set on the right side of the chip (11)；The capacitor (12) deviates from chip
(11) circuit element (13) are arranged in side；Radiator is arranged away from the side of capacitor (12) in the circuit element (13)
(14)；The second heat sink (15) are set inside the radiator (14)；Fixing seat is set above second heat sink (15)
(16)；Above the fixing seat (16) in setting fixed column (17), and dustproof shell (18) are set above fixing seat (16)；It is described
Radiator fan (19) are set inside dustproof shell (18).
2. a kind of heat sinking circuit board according to claim 1, which is characterized in that on the electronic equipment inner casing (1)
Pedestal (2) are arranged in surface；The first mounting hole (3) are arranged in pedestal (2) surface.
3. a kind of heat sinking circuit board according to claim 2, which is characterized in that the first mounting hole (3) setting
Four, four corner locations of pedestal (2) are separately positioned on, and the first bolt (4) are set in the first mounting hole (3).
4. a kind of heat sinking circuit board according to claim 1, which is characterized in that pedestal (2) the upper surface setting
Pillar (5)；The pillar (5) is arranged two, and circuit board (6) are arranged in pillar (5) upper end.
5. a kind of heat sinking circuit board according to claim 4, which is characterized in that circuit board (6) the surface setting
Second mounting hole (7)；Second mounting hole (7) setting (4) is a, and is separately positioned on four corners position of circuit board (6)
It sets；The second bolt (8) are set in second mounting hole (7).
6. a kind of heat sinking circuit board according to claim 1, which is characterized in that the support plate (9) is arranged to ladder
Shape.
7. a kind of heat sinking circuit board according to claim 1, which is characterized in that first cooling fin (10) is by gold
Belong to aluminium to be made, and the first cooling fin (10) surface setting heat dissipation circular hole, while circuit board is arranged in the first cooling fin (10) upper end
(6).
8. a kind of heat sinking circuit board according to claim 1, which is characterized in that second heat sink (15) is by gold
Belong to copper at.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811080776.3A CN109068545A (en) | 2018-09-17 | 2018-09-17 | A kind of heat sinking circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811080776.3A CN109068545A (en) | 2018-09-17 | 2018-09-17 | A kind of heat sinking circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109068545A true CN109068545A (en) | 2018-12-21 |
Family
ID=64762638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811080776.3A Withdrawn CN109068545A (en) | 2018-09-17 | 2018-09-17 | A kind of heat sinking circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109068545A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970896A (en) * | 2020-08-05 | 2020-11-20 | 泰州市博泰电子有限公司 | Mobile communication circuit board and gold plating method thereof |
| CN112193156A (en) * | 2020-10-14 | 2021-01-08 | 云中芯半导体技术(苏州)有限公司 | Integrated circuit board with function of reminding automobile of being hit |
| CN112584654A (en) * | 2020-12-23 | 2021-03-30 | 深圳市雄富新能源科技有限公司 | Efficient direct current converter |
-
2018
- 2018-09-17 CN CN201811080776.3A patent/CN109068545A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970896A (en) * | 2020-08-05 | 2020-11-20 | 泰州市博泰电子有限公司 | Mobile communication circuit board and gold plating method thereof |
| CN112193156A (en) * | 2020-10-14 | 2021-01-08 | 云中芯半导体技术(苏州)有限公司 | Integrated circuit board with function of reminding automobile of being hit |
| CN112584654A (en) * | 2020-12-23 | 2021-03-30 | 深圳市雄富新能源科技有限公司 | Efficient direct current converter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109068545A (en) | A kind of heat sinking circuit board | |
| US20060181852A1 (en) | Heat sink module for an electronic device | |
| JP2007266527A (en) | Inverter device for vehicle | |
| CN112020266B (en) | Multipurpose radiator, manufacturing method thereof, board card and multipurpose radiator platform | |
| CN203912432U (en) | Radiator and programmable logic controller | |
| CN209693142U (en) | A kind of heat radiating type printed wiring board | |
| CN103384465B (en) | The heat-conducting system of electronic power component attachment in the circuit board | |
| CN210956722U (en) | Independently driven multi-chip LED aluminum nitride ceramic support | |
| WO2012093840A2 (en) | Thermal convection and thermal conduction combination-type heat sink apparatus for electronic device | |
| CN211702829U (en) | Electric appliance structure with heat dissipation shielding function | |
| CN209861447U (en) | Heat radiation structure of motor controller | |
| CN209472831U (en) | A kind of high heat dissipation FR-4 single-side coated copper plate | |
| CN206948783U (en) | A kind of electronic circuit board multi-functional clamp | |
| CN219535873U (en) | Industrial control switch power supply heat dissipation bare board and industrial control switch power supply | |
| CN105827178A (en) | Motor control device | |
| CN214627815U (en) | Novel heat dissipation supporting device of power element for controller | |
| CN217283532U (en) | Multilayer printed circuit board capable of quickly radiating heat | |
| CN205464905U (en) | Novel contravariant D. C. Welder | |
| CN108336047A (en) | A kind of device carrying out electronic element radiating using phase change heat storage material | |
| CN217064409U (en) | Fixed printed circuit board | |
| TW201410127A (en) | Electronic device | |
| US20220087052A1 (en) | Energy vehicle and electrical control box thereof | |
| CN104617064B (en) | Stack-up power module | |
| JP2013092559A (en) | Image display apparatus | |
| CN206743645U (en) | One kind clearly indicates device circuit board beneficial to imaging effect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181221 |
|
| WW01 | Invention patent application withdrawn after publication |