CN217283532U - Multilayer printed circuit board capable of quickly radiating heat - Google Patents
Multilayer printed circuit board capable of quickly radiating heat Download PDFInfo
- Publication number
- CN217283532U CN217283532U CN202220339439.7U CN202220339439U CN217283532U CN 217283532 U CN217283532 U CN 217283532U CN 202220339439 U CN202220339439 U CN 202220339439U CN 217283532 U CN217283532 U CN 217283532U
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- CN
- China
- Prior art keywords
- heat
- multilayer printed
- plate
- wiring board
- printed wiring
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer printed circuit board capable of fast heat dissipation, which comprises a bottom plate, wherein the top of the bottom plate is provided with four correspondingly arranged positioning components, each positioning component comprises a heat-conducting copper block, a mounting groove, a movable plate, a movable post, a spring, a pressing plate, a pulling block and a positioning groove, the mounting groove is arranged on the heat-conducting copper block, the movable plate is arranged in the mounting groove, the top of the movable plate is connected with the pressing plate through the movable post, the spring is sleeved on the movable post, the pulling block is arranged at the top of the pressing plate, the positioning groove is arranged at the corresponding corner position of the heat-conducting copper block, a heat-conducting plate is fixedly connected between the heat-conducting copper blocks, the top of the heat-conducting plate is provided with a multilayer printed circuit board main body, the positioning components can be used for installing, fixing and protecting the multilayer printed circuit board capable of fast heat dissipation, and is convenient to install and disassemble, the circuit board is not easy to be damaged, and the use of the multilayer printed circuit board is facilitated.
Description
Technical Field
The utility model relates to a multilayer printed wiring board that can dispel heat fast belongs to multilayer printed wiring board technical field.
Background
Multilayer printed wiring board is one of the important part of electronic industry, and present multilayer printed wiring board can produce a large amount of heats when using, and especially bottom position is difficult for effluvium, and then influences multilayer printed wiring board's use, and secondly, multilayer printed wiring board relies on the bolt installation more, and the installation is dismantled inconveniently to easy damage when the installation is dismantled is unfavorable for multilayer printed wiring board's use.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model overcomes current defect, provides a multilayer printed wiring board that can dispel the heat fast to solve the problem in the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme:
a multi-layer printed circuit board capable of quickly dissipating heat comprises a bottom plate, wherein the top of the bottom plate is provided with four correspondingly arranged positioning components, each positioning component comprises a heat-conducting copper block, a mounting groove, a movable plate, a movable column, a spring, a pressing plate, a pulling block and a positioning groove, the mounting groove is formed in the heat-conducting copper block, the movable plate is arranged in the mounting groove, the top of the movable plate is connected with the pressing plate through the movable column, the spring is sleeved on the movable column, the pulling block is arranged at the top of the pressing plate, the positioning groove is formed in the corresponding corner position of the heat-conducting copper block, a heat-conducting plate is fixedly connected between the heat-conducting copper blocks, the top of the heat-conducting plate is provided with a multi-layer printed circuit board main body, the multi-layer printed circuit board main body is movably connected with the positioning components, one side of the multi-layer printed circuit board main body is provided with a fixing frame, the fixing frame is arranged at the top of the bottom plate, and a plurality of heat-dissipating fans are arranged on the fixing frame, the position of the heat dissipation fan corresponds to the multilayer printed circuit board main body.
Furthermore, fixing holes are formed in the positions of four corners of the bottom plate.
Further, the spring is arranged in the mounting groove, and the movable column penetrates through the heat conduction copper block.
Furthermore, a pressing block is arranged at the position, corresponding to the positioning groove, of the bottom of the pressing plate, and a non-slip mat is arranged at the bottom of the pressing block.
Furthermore, the bottom of the heat conducting plate is provided with uniformly arranged radiating fins.
Further, a gap with a certain distance exists between the heat conducting plate and the bottom plate.
The utility model has the advantages that: 1. by arranging the positioning assembly, the structure of the positioning assembly comprises the heat conduction copper block, the mounting groove, the movable plate, the movable column, the spring, the pressing plate, the pulling block and the positioning groove, so that the positioning and fixing of the multilayer printed circuit board main body are facilitated, the mounting and dismounting of the multilayer printed circuit board main body are facilitated, four corners of the multilayer printed circuit board main body can be protected, and the use of the multilayer printed circuit board main body is facilitated;
2. through setting up heat-conducting plate and heat dissipation fan, derive the heat in the multilayer printed wiring board main part to rely on the fast flowing air current to lead away the heat of bottom, so that the heat dissipation of multilayer printed wiring board.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is an external view of a multilayer printed wiring board capable of dissipating heat rapidly according to the present invention;
FIG. 2 is an external view of the heat-conducting copper block and the heat-conducting plate of the multi-layer printed circuit board of the present invention capable of fast heat dissipation;
fig. 3 is a schematic structural diagram of a positioning assembly of a multilayer printed wiring board capable of dissipating heat rapidly according to the present invention;
fig. 4 is a side view of the heat-conducting plate of the multi-layer printed circuit board of the present invention capable of dissipating heat rapidly.
Reference numbers in the figures: 1. a base plate; 2. a positioning assembly; 3. a heat-conducting copper block; 4. mounting grooves; 5. a movable plate; 6. a movable post; 7. a spring; 8. pressing a plate; 9. pulling the block; 10. positioning a groove; 11. a heat conducting plate; 12. a multilayer printed wiring board main body; 13. a fixed mount; 14. a heat dissipation fan; 15. a fixing hole; 16. briquetting; 17. a non-slip mat; 18. and heat dissipation fins.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
As shown in fig. 1-4, a multilayer printed wiring board capable of dissipating heat rapidly comprises a bottom plate 1, wherein four positioning components 2 are correspondingly arranged on the top of the bottom plate 1, the positioning components 2 comprise a heat-conducting copper block 3, a mounting groove 4, a movable plate 5, a movable column 6, a spring 7, a pressing plate 8, a pulling block 9 and a positioning groove 10, the mounting groove 4 is arranged on the heat-conducting copper block 3, the movable plate 5 is arranged in the mounting groove 4, the top of the movable plate 5 is connected with the pressing plate 8 through the movable column 6, the spring 7 is sleeved on the movable column 6, the pulling block 9 is arranged on the top of the pressing plate 8, the positioning groove 10 is arranged at a corner position corresponding to the heat-conducting copper block 3, a heat-conducting plate 11 is fixedly connected between the heat-conducting copper blocks 3, a multilayer printed wiring board main body 12 is arranged on the top of the heat-conducting plate 11, the multilayer printed wiring board main body 12 is movably connected with the positioning components 2, the multilayer printed circuit board is characterized in that a fixing frame 13 is arranged on one side of the multilayer printed circuit board main body 12, the fixing frame 13 is arranged at the top of the bottom plate 1, a plurality of heat dissipation fans 14 are arranged on the fixing frame 13, and the positions of the heat dissipation fans 14 correspond to the multilayer printed circuit board main body 12.
Specifically, as shown in fig. 1, fixing holes 15 are formed at four corners of the bottom plate 1, and a gap with a certain distance exists between the heat conducting plate 11 and the bottom plate 1.
Specifically, as shown in fig. 3, the spring 7 is disposed in the mounting groove 4, the movable column 6 penetrates through the heat-conducting copper block 3, a pressing block 16 is disposed at a position corresponding to the positioning groove 10 at the bottom of the pressing plate 8, and an anti-slip pad 17 is disposed at the bottom of the pressing block 16.
Specifically, as shown in fig. 4, the heat conducting plate 11 is provided with uniformly arranged heat dissipating fins 18 at the bottom.
The utility model discloses the theory of operation: when the heat dissipation fan is used, the multilayer printed circuit board main body 12 is arranged at the top of the heat conduction plate 11, the four corners of the multilayer printed circuit board main body 12 are located in the positioning grooves 10, the heat on the multilayer printed circuit board main body 12 can be outwards led out by the heat conduction plate 11 and the heat conduction copper block 3 by means of the elasticity of the spring 7, the heat dissipation fan 14 is started, and when air current passes through the bottom of the heat conduction plate 11, the heat can be quickly taken away, so that the heat dissipation of the multilayer printed circuit board is facilitated.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement made by the technical personnel in the field on the basis of the present invention, replacement or modification all belong to the protection scope of the present invention.
Claims (6)
1. The multilayer printed circuit board capable of rapidly dissipating heat comprises a bottom plate (1) and is characterized in that four positioning components (2) which are correspondingly arranged are arranged at the top of the bottom plate (1), each positioning component (2) comprises a heat-conducting copper block (3), a mounting groove (4), a movable plate (5), a movable column (6), a spring (7), a pressing plate (8), a pulling block (9) and a positioning groove (10), the mounting groove (4) is formed in the heat-conducting copper block (3), the movable plate (5) is arranged in the mounting groove (4), the top of the movable plate (5) is connected with the pressing plate (8) through the movable column (6), the spring (7) is sleeved on the movable column (6), the pulling block (9) is arranged at the top of the pressing plate (8), the positioning groove (10) is arranged at the corresponding corner position of the heat-conducting copper block (3), and a heat-conducting plate (11) is fixedly connected between the heat-conducting copper blocks (3), heat-conducting plate (11) top is equipped with multilayer printed wiring board main part (12), multilayer printed wiring board main part (12) swing joint locating component (2), multilayer printed wiring board main part (12) one side is equipped with mount (13), bottom plate (1) top is located in mount (13), be equipped with a plurality of heat dissipation fans (14) on mount (13), the position of heat dissipation fan (14) is corresponding with multilayer printed wiring board main part (12).
2. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 1, wherein: and fixing holes (15) are formed in the positions of four corners of the bottom plate (1).
3. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 2, wherein: the spring (7) is arranged in the mounting groove (4), and the movable column (6) penetrates through the heat-conducting copper block (3).
4. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 3, wherein: a pressing block (16) is arranged at the position, corresponding to the positioning groove (10), of the bottom of the pressing plate (8), and an anti-slip pad (17) is arranged at the bottom of the pressing block (16).
5. The multilayer printed wiring board capable of rapidly dissipating heat according to claim 4, wherein: the bottom of the heat conducting plate (11) is provided with uniformly arranged radiating fins (18).
6. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 5, wherein: a gap with a certain distance exists between the heat conducting plate (11) and the bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220339439.7U CN217283532U (en) | 2022-02-18 | 2022-02-18 | Multilayer printed circuit board capable of quickly radiating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220339439.7U CN217283532U (en) | 2022-02-18 | 2022-02-18 | Multilayer printed circuit board capable of quickly radiating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217283532U true CN217283532U (en) | 2022-08-23 |
Family
ID=82854934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220339439.7U Expired - Fee Related CN217283532U (en) | 2022-02-18 | 2022-02-18 | Multilayer printed circuit board capable of quickly radiating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217283532U (en) |
-
2022
- 2022-02-18 CN CN202220339439.7U patent/CN217283532U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220823 |