CN210429153U

CN210429153U - LED display screen based on spiral copper pipe heat radiation structure

Info

Publication number: CN210429153U
Application number: CN201921295620.7U
Authority: CN
Inventors: 张波; 王冬兰
Original assignee: Shenzhen Jilante Technology Co ltd
Current assignee: Shenzhen Jilante Technology Co ltd
Priority date: 2019-08-05
Filing date: 2019-08-05
Publication date: 2020-04-28
Anticipated expiration: 2029-08-05

Abstract

The utility model discloses a LED display screen based on spiral copper pipe heat radiation structure derives constant current drive chip through the heat-conducting plate to absorb and take away the heat of constant current drive chip through spiral heat dissipation copper pipe combination water-cooling, the radiating effect is good. Specifically, this LED display screen is equipped with PCB circuit board and the heat-conducting plate of connection on the PCB circuit board in this display frame body including showing the frame body. The PCB circuit board is arranged on the display frame body, and a plurality of constant current driving chips are arranged on the back surface of the PCB circuit board. The heat-conducting plate sets up the back at the PCB board, and its front is equipped with the arch that contacts with constant current drive chip, and its back is equipped with spiral helicine recess, is equipped with spiral heat dissipation copper pipe in the recess, and the center of spiral heat dissipation copper pipe has the water inlet, and the periphery side of spiral heat dissipation copper pipe has the delivery port, and water inlet and delivery port all lead to pipe and be connected with outside water tank.

Description

LED display screen based on spiral copper pipe heat radiation structure

Technical Field

The utility model relates to a technical field of LED display screen, in particular to LED display screen based on spiral copper pipe heat radiation structure.

Background

As a new generation of information display equipment, the LED display screen is widely applied to various industries such as governments, schools, hospitals and market lamps, so that the requirements of people on the reliability, the service life and the like of the LED display screen are higher and higher. The existing LED display driving circuit widely adopts a high-speed CMOS circuit, so that most of the power consumption on a circuit board is concentrated on a constant current driving chip, and the heat dissipation of the circuit board is concentrated on the constant current driving chip. Most of the existing heat dissipation modes of the LED display screen are air cooling heat dissipation, and the heat dissipation cannot be well carried out on the driving chip.

SUMMERY OF THE UTILITY MODEL

Problem to prior art existence, the utility model aims at providing a LED display screen based on spiral copper pipe heat radiation structure to distribute away the heat that constant current driver chip produced fast.

In order to achieve the above object, the utility model provides a LED display screen based on spiral copper pipe heat radiation structure, it includes the display frame body, be equipped with PCB circuit board and connect the heat-conducting plate on PCB circuit board in the display frame body;

the PCB circuit board is arranged on the front surface of the display frame body, the front surface of the PCB circuit board faces outwards, LED light-emitting elements which are regularly arranged are arranged on the PCB circuit board, the back surface of the PCB circuit board faces towards the inner side of the display frame body, and a plurality of regularly distributed constant current driving chips are arranged on the PCB circuit board;

the heat-conducting plate is arranged on the back face of the PCB, a plurality of bulges which are contacted with the constant-current driving chip are arranged on the front face of the heat-conducting plate, a spiral groove is formed in the back face of the heat-conducting plate, a spiral heat-radiating copper pipe is arranged in the groove, a water inlet is formed in the center of the spiral heat-radiating copper pipe, a water outlet is formed in the peripheral side of the spiral heat-radiating copper pipe, and the water inlet and the water outlet are connected with an external.

Preferably, the contact surface of the constant current driving chip and the heat conducting plate is provided with heat conducting silica gel.

Preferably, the outer wall of the spiral heat dissipation copper pipe is flat.

Preferably, the spiral heat dissipation copper pipe is bonded and embedded in the groove through heat conduction silica gel.

Preferably, the PCB circuit board is provided with a fixing block, and the heat conducting plate is fixedly connected to the fixing block through screws.

Preferably, the constant current driving chips are projected in the spiral area of the PCB circuit board by being located in the groove.

Preferably, a bottom plate is arranged on the back of the display frame body, and heat dissipation holes are formed in the bottom plate.

Preferably, the water inlet of the spiral heat dissipation copper pipe extends towards the bottom plate along the perpendicular line and penetrates through the bottom plate.

Preferably, the heat-conducting plate is an aluminum plate.

The technical scheme of the utility model through set up the heat-conducting plate with the contact of constant current drive chip in the display screen, on deriving the heat-conducting plate with the heat that constant current drive chip produced, the rethread is equipped with spiral heat dissipation copper pipe on the heat-conducting plate to the intraductal mobile cold water that lets in of copper, utilize copper pipe and cold water to absorb the heat on the heat-conducting plate fast and take away along with cold water, thereby effectively improve constant current drive chip's radiating efficiency, guarantee the life of LED display screen.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a cross-sectional view of an embodiment of the present invention;

fig. 2 is a schematic structural view of a heat dissipation portion of the present invention;

fig. 3 is an exploded view of the heat dissipating portion of the present invention;

the purpose of the present invention is to provide a novel and improved method and apparatus for operating a computer.

Detailed Description

The utility model provides a LED display screen based on spiral copper pipe heat radiation structure.

Referring to fig. 1 to 3, fig. 1 is a sectional view of an embodiment of the present invention, fig. 2 is a schematic structural view of a heat dissipating portion of the present invention, and fig. 3 is an exploded schematic view of the heat dissipating portion of the present invention.

As shown in fig. 1-3, in the embodiment of the present invention, the LED display screen based on the spiral copper tube heat dissipation structure includes a display frame 100, a PCB circuit board 200 and a heat conducting plate 300 connected to the PCB circuit board 200 are disposed in the display frame 100.

The front surface of the display frame 100 is provided with a receiving groove, and the PCB board 200 is mounted in the receiving groove. The front surface of the PCB 200 faces outward relative to the display frame 100, and the LED light emitting elements 210 are arranged regularly thereon. The back surface of the PCB 200 faces the inner side of the display frame 100 and abuts on the receiving groove, and a plurality of constant current driving chips 220 are disposed thereon and distributed in a rectangular shape.

The heat conducting plate 300 is disposed on the back surface of the PCB 200, the front surface of the heat conducting plate is disposed opposite to the back surface of the PCB 200, and a plurality of step-shaped protrusions 300a are disposed opposite to each row of the constant current driving chips 220, and end surfaces of the protrusions 300a are in contact with the surface of the constant current driving chips 220 to rapidly absorb heat generated by the constant current driving chips 220. The protrusion 300a is also used to ensure that there is enough space between the heat conducting plate 300 and the PCB 200 to dissipate the remaining heat, so as to avoid heat accumulation due to too close distance between the two.

A spiral groove 300b is formed in the back surface of the heat conductive plate 300, and a spiral heat dissipating copper pipe 400 is formed in the groove 300 b. The center of the spiral heat dissipation copper pipe 400 is provided with a water inlet 400a, the peripheral side of the spiral heat dissipation copper pipe 400 is provided with a water outlet 400b, and the water inlet 400a and the water outlet 400b are both connected with an external water tank through water pipes. By arranging the spiral heat dissipation copper pipe 400, the heat conducted out of the heat conduction plate 300 can be absorbed quickly, and the cold water flowing into the spiral heat dissipation copper pipe 400 takes away the heat absorbed by the copper pipe, so that the heat dissipation efficiency of the constant current driving chip 220 is improved. The water inlet 400a of the spiral heat dissipation copper pipe 400 is arranged in the center of the spiral heat dissipation copper pipe 400, so that heat conducted from the constant current driving chip 220 by the heat conduction plate 300 can be absorbed from the center to the periphery, the area which is located in the center and difficult to dissipate heat is preferentially cooled, the constant current driving chip 220 which is located on the periphery is driven to cool, and the heat dissipation effect of the spiral heat dissipation copper pipe 400 on the constant current driving chip 220 is guaranteed.

In this embodiment, the constant current driving chip 220 is projected in the spiral area of the PCB 200 through the groove 300b, that is, the constant current driving chip 220 indirectly contacts the spiral heat dissipating copper tube 400 through the heat conducting plate 300, so that the spiral heat dissipating copper tube 400 can better absorb and take away the heat of the constant current driving chip 220.

The technical scheme of the utility model through set up the heat-conducting plate 300 with the contact of constant current drive chip 220 in the display screen, on deriving the heat that constant current drive chip 220 produced to heat-conducting plate 300, the rethread is equipped with spiral heat dissipation copper pipe 400 on heat-conducting plate 300, and to letting in mobile cold water in the copper pipe, utilize copper pipe and cold water to absorb the heat on the heat-conducting plate 300 fast and take out along with cold water, thereby effectively improve the radiating efficiency of constant current drive chip 220, guarantee the life of LED display screen.

In a preferred embodiment of the present invention, the contact surface between the constant current driving chip 220 and the heat conducting plate 300 is provided with a heat conducting silica gel, so as to ensure the heat conduction efficiency between the constant current driving chip 220 and the heat conducting plate 300.

In a preferred embodiment of the present invention, the outer wall of the spiral heat dissipating copper tube 400 is flat to increase the contact area between the spiral heat dissipating copper tube 400 and the heat conducting plate 300, thereby improving the heat absorbing efficiency of the spiral heat dissipating copper tube 400. Further, the spiral heat dissipating copper pipe 400 is bonded and embedded in the groove 300b by a heat conductive silicone adhesive.

In a preferred embodiment of the present invention, the fixing block 230 is disposed on the PCB 200, and the heat conducting plate 300 is fixedly connected to the fixing block 230 by a screw 310, so as to ensure effective contact between the heat conducting plate 300 and the constant current driving chip 220.

The utility model discloses a concrete implementation way, the back of display frame body 100 is equipped with bottom plate 500, is equipped with louvre 500a on the bottom plate 500 for the heat in the display screen frame distributes away through louvre 500 a.

Preferably, the inlet 400a of the spiral radiating copper pipe 400 extends toward the base plate 500 along a perpendicular line thereof and penetrates the base plate 500, so that the spiral radiating copper pipe 400 is connected to an external water pipe.

The utility model discloses an in the embodiment, heat-conducting plate 300 adopts heat conduction aluminum plate, and aluminum plate's heat conduction efficiency is good, and is with low costs.

The above is only the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all of which are in the utility model discloses a conceive, utilize the equivalent structure transform that the content of the specification and the attached drawings did, or directly/indirectly use all to include in other relevant technical fields the patent protection scope of the present invention.

Claims

1. A LED display screen based on a spiral copper pipe heat dissipation structure is characterized by comprising a display frame body, wherein a PCB circuit board and a heat conducting plate connected to the PCB circuit board are arranged in the display frame body;

the heat conducting plate is arranged on the back surface of the PCB, a plurality of bulges which are contacted with the constant current driving chip are arranged on the front surface of the heat conducting plate, a spiral groove is arranged on the back surface of the heat conducting plate, and a spiral heat dissipation copper pipe is arranged in the groove; the center of the spiral heat dissipation copper pipe is provided with a water inlet, the peripheral side of the spiral heat dissipation copper pipe is provided with a water outlet, and the water inlet and the water outlet are connected with an external water tank through water pipes.

2. The LED display screen based on the spiral copper tube heat dissipation structure as recited in claim 1, wherein a contact surface of the constant current driving chip and the heat conducting plate is provided with heat conducting silica gel.

3. The LED display screen based on the spiral copper pipe heat dissipation structure as recited in claim 1, wherein the outer wall of the spiral heat dissipation copper pipe is flat.

4. The LED display screen based on the spiral copper pipe heat dissipation structure as recited in claim 3, wherein the spiral heat dissipation copper pipe is bonded and embedded in the groove through a heat conduction silica gel.

5. The LED display screen based on the spiral copper pipe heat dissipation structure as recited in claim 1, wherein a fixing block is disposed on the PCB, and the heat conduction plate is fixedly connected to the fixing block through screws.

6. The LED display screen based on the spiral copper pipe heat dissipation structure as recited in claim 1, wherein the constant current driving chips are projected in a spiral area of the PCB circuit board together with the groove.

7. The LED display screen based on the spiral copper pipe heat dissipation structure as defined in claim 1, wherein a bottom plate is disposed on a back surface of the display frame body, and heat dissipation holes are disposed on the bottom plate.

8. The LED display screen based on spiral copper pipe heat dissipation structure as recited in claim 7, wherein the water inlet of the spiral heat dissipation copper pipe extends along a perpendicular line thereof toward the bottom plate and penetrates through the bottom plate.

9. The LED display screen based on the spiral copper pipe heat dissipation structure as recited in any one of claims 1 to 8, wherein the heat conducting plate is an aluminum plate.