CN108662472A - A kind of good side entrance back module of heat dissipation - Google Patents

A kind of good side entrance back module of heat dissipation Download PDF

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Publication number
CN108662472A
CN108662472A CN201810532111.5A CN201810532111A CN108662472A CN 108662472 A CN108662472 A CN 108662472A CN 201810532111 A CN201810532111 A CN 201810532111A CN 108662472 A CN108662472 A CN 108662472A
Authority
CN
China
Prior art keywords
heat dissipation
heat
radiating fin
backboard
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810532111.5A
Other languages
Chinese (zh)
Inventor
赵圣铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Poly Technology Co Ltd
Original Assignee
Jiangsu Poly Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Poly Technology Co Ltd filed Critical Jiangsu Poly Technology Co Ltd
Priority to CN201810532111.5A priority Critical patent/CN108662472A/en
Publication of CN108662472A publication Critical patent/CN108662472A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a kind of good side entrance back modules of heat dissipation, including backboard, LED light bar and heat sink, the backboard bottom is equipped with for light source being fixed and the pedestal of heat conduction, one side surface of the pedestal is equipped with heat sink, another side surface is equipped with one group of radiating fin, and the heat sink includes:Interconnect the horizontal component and vertical portion of l-shaped, horizontal component lower part connect base, top connects LED light bar, the vertical portion side is provided with the protrusion of support light guide plate, the other side with connect backboard, groove between the adjacent fin of the radiating fin forms heat dissipation channel, is equipped with radiator fan between the radiating fin, the air outlet of the radiator fan is opposite with heat dissipation channel.The present invention forms efficient heat dissipation channel, is blown to heat dissipation channel by radiator fan, heat is taken away and achievees the purpose that cooling, to improve heat-sinking capability by the way that heat sink, heat-conducting base and radiating fin is arranged.

Description

A kind of good side entrance back module of heat dissipation
Technical field
The present invention relates to display screen technology field more particularly to a kind of good side entrance back modules of heat dissipation.
Background technology
For side entering-type LED backlight module, due to will produce a large amount of heat when LED operation, asked if not solving heat dissipation Topic, if can cause the decaying of LED light emission luminance and the shortening heat of service life that cannot timely conduct, LED light Chip temperature will increase, and quantum efficiency will be reduced greatly, lead to LED light brightness decay, emission wavelength offset, accelerate it always Change speed, in some instances it may even be possible to cause to fail, seriously affect the working life of LED light, it is therefore desirable to which a series of cooling measures are to ensure The normal work of LED backlight.Existing side entering-type LED backlight module is that LED light bar is fixed on aluminium heat sink, but aluminium The thermal coefficient of material is not very high, causes heat conduction apart from limited, heat effectively cannot be shed by heat, driven simultaneously Circuit also will produce partial heat at work.
Invention content
Against the above deficiency, it the present invention provides a kind of good side entrance back module of heat dissipation, can not only solve to carry on the back Optical mode group LED backlight heat dissipation problem, while the heat dissipation of driving circuit can also be solved, it is simple in structure, it is functional.
The present invention is achieved by the following technical solutions:A kind of good side entrance back module of heat dissipation, including backboard, LED light bar and heat sink, the backboard bottom are equipped with for light source being fixed and the pedestal of heat conduction, and the one of the pedestal Side surface is equipped with heat sink, and another side surface is equipped with one group of radiating fin, and the heat sink includes:Interconnect l-shaped Horizontal component and vertical portion, horizontal component lower part connect base, top connect LED light bar, the vertical portion one Side be provided with support light guide plate protrusion, the other side with connect backboard, the groove type between the adjacent fin of the radiating fin At heat dissipation channel, radiator fan is equipped between the radiating fin, the air outlet of the radiator fan is opposite with heat dissipation channel.
Further include drive circuit board and thermal conductive belt, the drive circuit board as a preferred technical solution of the present invention Pass through heat conduction band connection with radiating fin.
As a preferred technical solution of the present invention, described thermal conductive belt one end is arranged between driving circuit and backboard, The other end is arranged between heat dissipation scales and backboard.
Compared with prior art, beneficial effects of the present invention are:By the way that heat sink, heat-conducting base and heat radiating fin is arranged Piece forms the heat distributed when efficient heat dissipation channel, heat sink and heat-conducting base work LED backplane optics, quickly leads Enter to radiating fin, heat dissipation channel formed by the groove between radiating fin, is blown to heat dissipation channel by radiator fan, Make to form air-flow in heat dissipation channel, heat taken away and achievees the purpose that cooling, to improve heat-sinking capability, while radiating fin and Heat transfer is carried out by thermal conductive belt between drive circuit board, heat when can be by drive circuit works is taken away.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention;
Fig. 2 is the structure schematic diagram of the present invention.
Reference numerals list:1, backboard;2, LED light bar;3, cooling fin;4, pedestal;5, light guide plate;6, radiating fin;7、 Radiator fan;8, driving circuit;9, thermal conductive belt.
Specific implementation mode
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following specific implementation modes are only For illustrating the present invention rather than limiting the scope of the invention.It should be noted that word " preceding " used in the following description, " rear ", "left", "right", "up" and "down" refer to that the direction in attached drawing, word "inner" and "outside" refer respectively to direction or remote Direction from geometric center of specific component.
Embodiment:As depicted in figs. 1 and 2, a kind of good side entrance back module of heat dissipation, including backboard 1, LED light bar 2 With heat sink 3, backboard bottom is equipped with for light source being fixed and the pedestal of heat conduction 4, a side surface of pedestal 4 are equipped with Heat sink 3, another side surface are equipped with one group of radiating fin 6, and heat sink 3 includes:It interconnects the horizontal component of l-shaped and erects Straight part, horizontal component lower part connect base 4, top connect LED light bar 2, and vertical portion side is provided with support light guide plate 5 Protrusion, the other side with connect backboard 1, groove between the adjacent fin of radiating fin 6 forms heat dissipation channel, between radiating fin Equipped with radiator fan 7, the air outlet of radiator fan 7 is opposite with heat dissipation channel.
Backboard and pedestal are integrally formed, and pedestal 4 uses heat-conducting, and cooling fin 3 is identical as traditional cooling fin, use Aluminium section bar, has the effect of heat dissipation and support concurrently, LED light bar 2 when working generated heat sub-fraction dissipated by heat sink 3 Hair, most of to transfer heat to radiating fin 6 by pedestal 4, the groove between adjacent fin forms heat dissipation channel, described 7 air outlets of radiator fan are opposite with heat dissipation channel, and the heat in one group of heat dissipation scales of radiating electric fan pair radiates.Work as heat dissipation After starting fan, cold air is sucked and is blowed chilled air into heat dissipation channel through radiator fan air outlet, cold air air point For two-way, in the heat dissipation channel for respectively enteing two radiating fins, cold air is made to take heat out of, to realize heat dissipation.
The present invention is by being arranged thermal conductive belt 9, and thermal conductive belt 9 uses heat conductive silica gel band, by 6 phase of driving circuit 8 and radiating fin Connection, driving circuit 8 are electrically connected with display panel and backlight module, and drive signal is provided for display panel and backlight module, are driven Heat is also passed to by thermal conductive belt 9 on radiating fin caused by dynamic circuit chips, carries out radiating treatment.
Finally it should be noted that:The foregoing is merely the preferred embodiments of the present invention, are not intended to restrict the invention, to the greatest extent Present invention has been described in detail with reference to the aforementioned embodiments for pipe, for those skilled in the art, still can be with Technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features.It is all Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the present invention Within the scope of shield.

Claims (3)

1. a kind of good side entrance back module of heat dissipation, including backboard, LED light bar and heat sink, it is characterised in that:The back of the body Board bottom portion is equipped with for light source being fixed and the pedestal of heat conduction, and a side surface of the pedestal is equipped with heat sink, separately One side surface is equipped with one group of radiating fin, and the heat sink includes:The horizontal component and vertical portion of l-shaped are interconnected, Horizontal component lower part connect base, top connect LED light bar, and the vertical portion side is provided with the convex of support light guide plate It rises, the other side and connect backboard, the groove formation heat dissipation channel between the adjacent fin of the radiating fin, the radiating fin Between be equipped with radiator fan, the air outlet of the radiator fan is opposite with heat dissipation channel.
2. according to the good side entrance back module of heat dissipation described in claim 1, it is characterised in that:It further include driving circuit Plate and thermal conductive belt, the drive circuit board and radiating fin pass through heat conduction band connection.
3. according to the good side entrance back module of heat dissipation described in claim 2, it is characterised in that:Described thermal conductive belt one end It is arranged between driving circuit and backboard, the other end is arranged between heat dissipation scales and backboard.
CN201810532111.5A 2018-05-29 2018-05-29 A kind of good side entrance back module of heat dissipation Pending CN108662472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810532111.5A CN108662472A (en) 2018-05-29 2018-05-29 A kind of good side entrance back module of heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810532111.5A CN108662472A (en) 2018-05-29 2018-05-29 A kind of good side entrance back module of heat dissipation

Publications (1)

Publication Number Publication Date
CN108662472A true CN108662472A (en) 2018-10-16

Family

ID=63777990

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810532111.5A Pending CN108662472A (en) 2018-05-29 2018-05-29 A kind of good side entrance back module of heat dissipation

Country Status (1)

Country Link
CN (1) CN108662472A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113870728A (en) * 2021-09-03 2021-12-31 深圳创维-Rgb电子有限公司 Display back plate, display module and manufacturing method of display module
CN115774353A (en) * 2021-09-06 2023-03-10 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202182392U (en) * 2011-08-19 2012-04-04 深圳市华星光电技术有限公司 Backlight module and liquid crystal display
CN102563454A (en) * 2011-10-12 2012-07-11 深圳市华星光电技术有限公司 LED backlight module and liquid crystal display device
CN103925531A (en) * 2014-05-08 2014-07-16 青岛海信电器股份有限公司 Backlight module and liquid crystal display device
CN206805077U (en) * 2017-06-15 2017-12-26 深圳Tcl新技术有限公司 Side entrance back module and liquid crystal display device
CN107589592A (en) * 2017-09-08 2018-01-16 深圳市华星光电技术有限公司 Radiator structure and backlight module for backlight module
CN208349021U (en) * 2018-05-29 2019-01-08 江苏聚泰科技有限公司 A kind of good side entrance back module of heat dissipation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202182392U (en) * 2011-08-19 2012-04-04 深圳市华星光电技术有限公司 Backlight module and liquid crystal display
CN102563454A (en) * 2011-10-12 2012-07-11 深圳市华星光电技术有限公司 LED backlight module and liquid crystal display device
CN103925531A (en) * 2014-05-08 2014-07-16 青岛海信电器股份有限公司 Backlight module and liquid crystal display device
CN206805077U (en) * 2017-06-15 2017-12-26 深圳Tcl新技术有限公司 Side entrance back module and liquid crystal display device
CN107589592A (en) * 2017-09-08 2018-01-16 深圳市华星光电技术有限公司 Radiator structure and backlight module for backlight module
CN208349021U (en) * 2018-05-29 2019-01-08 江苏聚泰科技有限公司 A kind of good side entrance back module of heat dissipation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113870728A (en) * 2021-09-03 2021-12-31 深圳创维-Rgb电子有限公司 Display back plate, display module and manufacturing method of display module
CN115774353A (en) * 2021-09-06 2023-03-10 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device
CN115774353B (en) * 2021-09-06 2024-04-19 苏州佳世达电通有限公司 Integrated liquid-cooled heat dissipation module, backlight module using same and display device

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SE01 Entry into force of request for substantive examination
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Application publication date: 20181016

RJ01 Rejection of invention patent application after publication