CN209897337U - Circuit board for high-power LED - Google Patents
Circuit board for high-power LED Download PDFInfo
- Publication number
- CN209897337U CN209897337U CN201920281034.0U CN201920281034U CN209897337U CN 209897337 U CN209897337 U CN 209897337U CN 201920281034 U CN201920281034 U CN 201920281034U CN 209897337 U CN209897337 U CN 209897337U
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting layer
- layer
- aluminum substrate
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 239000000110 cooling liquid Substances 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high-power circuit board for LED, including the conducting layer, the lower surface of conducting layer is provided with the epoxy layer, and the lower surface on epoxy layer is provided with aluminium base board, and the upper end of conducting layer is provided with the LED unit, and the upper end of conducting layer is provided with the insulating layer, and the upper surface of insulating layer is provided with ceramic cooling fin, and a week of LED unit is provided with the heat dissipation copper pipe. When the circuit board for the high-power LED is used, when the LED unit generates heat, the heat absorption is carried out through the heat dissipation copper pipe around the circuit board, the heat is dissipated through the heat dissipation holes, the conducting layer transmits the heat to the surfaces of the ceramic radiating fins and the aluminum substrate through the insulating layer and the epoxy resin layer when generating heat, the upper surface of the conducting layer dissipates the heat through the ceramic radiating fins, and the lower surface of the conducting layer dissipates the heat through the aluminum substrate and cooling liquid circularly flowing in the cooling groove so as to achieve the purpose.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is circuit board for high-power LED.
Background
With the rising of global environmental awareness, energy and power saving have become the current trend. The LED industry is one of the most attractive industries in recent years. Developed to date, LED products have the advantages of energy conservation, electricity saving, high efficiency, fast reaction time, long service life, no mercury, environmental protection benefit and the like.
At present, a large amount of heat energy is generated by a high-power LED during working, so that the LED circuit board is required to dissipate the generated heat energy in time, and the heat dissipation of the current LED circuit board is not ideal.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-power circuit board for LED to solve the problem that the circuit board heat dissipation provided.
In order to achieve the above object, the utility model provides a following technical scheme: the circuit board for the high-power LED comprises a conducting layer, wherein an epoxy resin layer is arranged on the lower surface of the conducting layer, an aluminum substrate is arranged on the lower surface of the epoxy resin layer, an LED unit is arranged at the upper end of the conducting layer, an insulating layer is arranged at the upper end of the conducting layer, a ceramic radiating fin is arranged on the upper surface of the insulating layer, and a radiating copper pipe is arranged around the LED unit.
Preferably, the inboard of aluminium base board is provided with the cooling groove, and the one end in cooling groove is connected with the inlet tube, and the other end of inlet tube is connected with the water pump, and the surface at epoxy layer is installed to the water pump, and the water sucking mouth of water pump is connected with the connecting pipe, and the one end of connecting pipe is connected with the coolant liquid case, and the surface at ceramic fin is installed to the one end of coolant liquid case, and the surface of the other end of coolant liquid case is provided with the circulating pipe, and the other end.
Preferably, a transformer is arranged on the surface of the conducting layer, and the transformer is connected with a water pump through a lead.
Preferably, the lower surface of the aluminum substrate is provided with heat dissipation fins.
Preferably, the surface of the heat dissipation copper pipe is provided with heat dissipation holes.
Compared with the prior art, the beneficial effects of the utility model are that: when the circuit board for the high-power LED is used, when the LED unit generates heat, the heat absorption is carried out through the heat dissipation copper pipe around the circuit board, the heat is dissipated through the heat dissipation holes, the conducting layer transmits the heat to the surfaces of the ceramic radiating fins and the aluminum substrate through the insulating layer and the epoxy resin layer when generating heat, the upper surface of the conducting layer dissipates the heat through the ceramic radiating fins, and the lower surface of the conducting layer dissipates the heat through the aluminum substrate and cooling liquid circularly flowing in the cooling groove so as to achieve the purpose.
Drawings
FIG. 1 is a schematic sectional view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the aluminum substrate of the present invention;
fig. 3 is a circuit diagram of the present invention.
In the figure: the LED module comprises a conductive layer 1, an LED unit 11, an epoxy resin layer 2, an insulating layer 3, an aluminum substrate 4, a heat dissipation fin 41, a temperature reduction groove 42, a ceramic heat dissipation fin 5, a heat dissipation copper pipe 6, a heat dissipation hole 61, a cooling liquid tank 7, a connecting pipe 71, a circulating pipe 72, a water pump 8, a water inlet pipe 81 and a transformer 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the circuit board for a high-power LED includes a conductive layer 1, an epoxy resin layer 2 disposed on a lower surface of the conductive layer 1, an aluminum substrate 4 disposed on a lower surface of the epoxy resin layer 2, an LED unit 11 disposed on an upper end of the conductive layer 1, an insulating layer 3 disposed on an upper end of the conductive layer 1, a ceramic heat sink 5 disposed on an upper surface of the insulating layer 3, and a heat sink copper tube 6 disposed around the LED unit 11.
Referring to fig. 1 and 2, a cooling tank 42 is disposed inside the aluminum substrate 4, one end of the cooling tank 42 is connected to a water inlet pipe 81, the other end of the water inlet pipe 81 is connected to a water pump 8, and the type of the water pump 8 is: NC35, wherein a water pump 8 is arranged on the surface of the epoxy resin layer 2, a connecting pipe 71 is connected to a water suction port of the water pump 8, a cooling liquid tank 7 is connected to one end of the connecting pipe 71, one end of the cooling liquid tank 7 is arranged on the surface of the ceramic radiating fin 5, a circulating pipe 72 is arranged on the surface of the other end of the cooling liquid tank 7, a cooling groove 42 is connected to the other end of the circulating pipe 72, and cooling liquid is conveyed into the cooling groove 42 through the water pump 8 to enable water in the cooling groove 42 to flow back into the cooling liquid tank 7 to achieve a cooling cycle.
Referring to fig. 3, the surface of the conductive layer 1 is provided with a transformer 9, the type of the transformer 9: EI48X24, transformer 9 converts 220v voltage into 12v voltage to supply power for water pump 8, and transformer 9 is connected with water pump 8 through the wire.
Referring to fig. 1, the lower surface of the aluminum substrate 4 is provided with heat dissipation fins 41, and the heat dissipation fins 41 increase the heat dissipation area of the aluminum substrate 4.
Referring to fig. 1, the surface of the heat dissipating copper tube 6 is provided with a heat dissipating hole 61, and the heat of the LED unit 11 absorbed by the heat dissipating copper tube 6 is dissipated through the heat dissipating copper tube 6 and the heat dissipating hole 61.
The utility model discloses when concrete implementation: when the circuit board for the high-power LED is used, the heat dissipation copper pipe 6 is arranged around the LED unit 11, the heat dissipation copper pipe 6 around the LED unit 11 can absorb heat of the LED unit 11 and dissipate the absorbed heat through the heat dissipation holes 61 on the surface of the heat dissipation copper pipe 6, when the conducting layer 1 generates heat, the heat is transmitted to the surfaces of the ceramic heat dissipation fins 5 and the aluminum substrate 4 through the insulating layer 3 and the epoxy resin layer 2, the upper surface of the conducting layer 1 is contacted with air through the ceramic heat dissipation fins 5 to dissipate heat, the lower surface of the conducting layer 1 is provided with the heat dissipation fins 41 through the aluminum substrate 4 and the lower surface of the aluminum substrate 4 to dissipate the absorbed heat of the aluminum substrate 4, the inner side of the aluminum substrate 4 is provided with the cooling groove 42, cooling liquid in the cooling groove 42 is cooled circularly through the water pump 8.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. Circuit board for high-power LED, including conducting layer (1), its characterized in that: the LED packaging structure is characterized in that an epoxy resin layer (2) is arranged on the lower surface of the conducting layer (1), an aluminum substrate (4) is arranged on the lower surface of the epoxy resin layer (2), an LED unit (11) is arranged at the upper end of the conducting layer (1), an insulating layer (3) is arranged at the upper end of the conducting layer (1), ceramic radiating fins (5) are arranged on the upper surface of the insulating layer (3), and a radiating copper pipe (6) is arranged on the periphery of the LED unit (11).
2. The wiring board for high-power LEDs according to claim 1, wherein: the aluminum substrate is characterized in that a cooling groove (42) is formed in the inner side of the aluminum substrate (4), one end of the cooling groove (42) is connected with a water inlet pipe (81), the other end of the water inlet pipe (81) is connected with a water pump (8), the water pump (8) is installed on the surface of the epoxy resin layer (2), a water suction port of the water pump (8) is connected with a connecting pipe (71), one end of the connecting pipe (71) is connected with a cooling liquid tank (7), one end of the cooling liquid tank (7) is installed on the surface of the ceramic radiating fin (5), a circulating pipe (72) is arranged on the surface of the other end of the cooling liquid tank (7).
3. The wiring board for high-power LEDs according to claim 1, wherein: the surface of the conducting layer (1) is provided with a transformer (9), and the transformer (9) is connected with a water pump (8) through a lead.
4. The wiring board for high-power LEDs according to claim 1, wherein: and the lower surface of the aluminum substrate (4) is provided with radiating fins (41).
5. The wiring board for high-power LEDs according to claim 1, wherein: and heat dissipation holes (61) are formed in the surface of the heat dissipation copper pipe (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920281034.0U CN209897337U (en) | 2019-03-04 | 2019-03-04 | Circuit board for high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920281034.0U CN209897337U (en) | 2019-03-04 | 2019-03-04 | Circuit board for high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209897337U true CN209897337U (en) | 2020-01-03 |
Family
ID=68997081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920281034.0U Expired - Fee Related CN209897337U (en) | 2019-03-04 | 2019-03-04 | Circuit board for high-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209897337U (en) |
-
2019
- 2019-03-04 CN CN201920281034.0U patent/CN209897337U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |