CN113124366A - High-efficiency heat dissipation device and method for integrated LED lamp - Google Patents
High-efficiency heat dissipation device and method for integrated LED lamp Download PDFInfo
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- CN113124366A CN113124366A CN202110277207.3A CN202110277207A CN113124366A CN 113124366 A CN113124366 A CN 113124366A CN 202110277207 A CN202110277207 A CN 202110277207A CN 113124366 A CN113124366 A CN 113124366A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses a high-efficiency heat dissipation device and a method for an integrated LED lamp.A heat generated by the work of an LED surface light source is directly transmitted to a U-shaped heat pipe through a ceramic substrate, a medium in the U-shaped heat pipe absorbs heat to become a gas, the gas flows to a side wall condensation end of a fin of a heat radiator, and the heat is dissipated into the air; the heat which is not taken away by the U-shaped heat pipe of the LED surface light source is transmitted to the Stirling engine through the lower plate of the fixing frame, the Stirling engine runs to drive the micro generator to generate electricity, the electric energy is transmitted to the power supply module, the power supply module supplies power to the LED surface light source, an electric fan is arranged right below each radiator fin, the power supply module is connected with the electric fan, and the wind power of the electric fan blows upwards to the radiator fins; the invention can effectively reduce the thermal contact resistance between the heat pipe and the radiating fin in the traditional heat pipe radiator, promote better heat transfer, recycle the waste heat which is not dissipated by the LED surface light source, reduce the working temperature of the high-power LED and improve the luminous efficiency of the LED.
Description
Technical Field
The invention relates to the field of integrated high-power LED lamps, in particular to a heat dissipation device of an LED lamp, which is used for reducing the working temperature of the LED lamp, collecting heat emitted by the LED lamp and realizing the reutilization of heat resources.
Background
As a new generation of lighting source, a high-power Light Emitting Diode (LED) has the outstanding advantages of energy conservation, environmental protection, high luminous efficiency, high response speed, long service life and the like, but the luminous efficiency of the LED is about 20%, the rest 80% of energy is converted into heat, and the heat raises the temperature of the high-power LED, so that the working voltage is reduced, the light intensity is reduced, the wavelength of light is lengthened, and the reliability and the service life of the LED are seriously influenced. The LED lamp is generally integrated by a plurality of point light sources to form an integrated light source surface, so that the normal work of devices is guaranteed, the heat dissipation management of the lamp is very important, and the good heat dissipation design is the guarantee of the quality and the reliability of the lamp, so that the problem of heat dissipation of the high-power LED lamp is particularly important to solve, and the heat dissipation problem of the LED lamp also becomes an important factor for restricting the development of the LED.
The existing methods for solving the problem of LED heat dissipation have two types: (1) the quality of an LED internal chip is improved, the single heat release is reduced, and the luminous efficiency is improved; (2) the heat dissipation design outside the high-power LED is improved, and a reasonable heat dissipation device is arranged. In the first heat dissipation mode, the electro-optic conversion efficiency of the LED is maintained at 20-30%, so that the quality improvement of an LED chip is difficult to break through the limit of the electro-optic conversion efficiency; the second heat dissipation method is a method of dissipating heat in a large number of cases. At present, the heat dissipation mode of the LED lamp can be divided into four types: the semiconductor refrigeration utilizes the Peltier effect, namely two different metals form a closed loop, and when direct current exists in the loop, temperature difference is generated between two metal joints. For example: the LED lamp disclosed in the document with chinese patent publication No. CN203147378U and entitled "high power LED lamp based on semiconductor cooling and heat dissipation" utilizes semiconductor cooling and heat dissipation, but the lamp does not fully utilize semiconductor cooling fins (PN type semiconductor fins), does not reuse the collected heat emitted by the LED lamp, and does not have the effect of energy saving.
Disclosure of Invention
The invention aims to solve the problem of heat dissipation of the existing integrated high-power LED, and provides a high-efficiency heat dissipation device and a heat dissipation method for an integrated LED lamp, which can fully reduce the working temperature of the high-power LED and recycle the waste heat which is not dissipated by an LED surface light source.
In order to achieve the above purpose, the technical scheme adopted by the high-efficiency heat dissipation device of the integrated LED lamp provided by the invention is as follows: the bottom of the LED surface light source is provided with a horizontally arranged base, the top of the LED surface light source is provided with a horizontally arranged fixing support for fixing the LED surface light source, the LED surface light source consists of a ceramic substrate and an LED chip, the fixing support consists of an upper fixing frame plate and a lower fixing frame plate, the ceramic substrate is horizontally arranged between the upper fixing frame plate and the lower fixing frame plate, the lower bottom surface of the ceramic substrate and the upper surface of the lower fixing frame plate are in contact with each other and penetrate through the bottom wall of the U-shaped heat pipe, the U-shaped opening of the U-shaped heat pipe faces the right lower side, and two side walls of the; the Stirling engine is arranged right below the lower plate of the fixing frame, the lower surface of the lower plate of the fixing frame is in close contact with the upper surface of a hot cavity of the Stirling engine, the external part of a cold cavity of the Stirling engine is connected with the micro generator, the micro generator is connected with the power supply module through a lead, and the power supply module is connected with the LED area light source through a power line.
Furthermore, an electric fan is arranged in the base and is positioned under each radiator fin, and the power supply module is connected with the electric fan through a power line.
Furthermore, a plurality of grooves which are parallel to each other are arranged on the upper surface of the lower plate of the fixing frame, the bottom wall part of a U-shaped heat pipe is tightly clamped by each groove, the upper surface of the U-shaped heat pipe is contacted with the lower surface of the ceramic substrate, and silver-containing heat-conducting silicone grease is filled in the grooves
The heat dissipation method of the high-efficiency heat dissipation device of the integrated LED lamp adopts the technical scheme that: the heat generated by the work of the LED surface light source is directly transferred to the U-shaped heat pipe through the ceramic substrate, the medium in the U-shaped heat pipe absorbs heat to become gas, the gas flows to the side wall condensation end of the radiator fin, and the heat is dissipated into the air; the heat that LED area light source was not taken away by U type heat pipe passes through the mount hypoplastron and passes to stirling, and stirling runs, drives micro generator and produces electricity, and the electric energy passes to power module, and power module supplies power for LED area light source.
Furthermore, an electric fan is arranged under each radiator fin, the power supply module is connected with the electric fan, and the wind power of the electric fan blows upwards to the radiator fins.
The invention has the advantages that after the technical scheme is adopted, the invention has the following advantages:
1. the heat dissipation device is a novel heat pipe and heat dissipation fin integrated device, and can effectively reduce the thermal contact resistance between the heat pipe and the heat dissipation fins in the traditional heat pipe radiator and promote better heat transfer.
2. According to the fixing support in the heat dissipation device, when the heat pipe is placed in the groove, the silver-containing heat conduction silicone grease is filled in the groove, so that a heat source can better conduct heat, and the heat of the heat source is effectively reduced.
3. The heat dissipation device provided by the invention collects heat by using the Stirling engine, and because the heat pipe cannot take away all heat of the heat source, the rest heat source can promote the work of the Stirling engine, the principle that the heat of the Stirling engine generates power is utilized, electric energy is further generated, and electricity is generated by the generator, so that the waste heat which is not dissipated by the LED surface light source is recycled, and the recycling of heat resources can be realized, so that the device is more energy-saving and environment-friendly, the phenomenon of overhigh heat when the high-power LED works is more efficiently solved, the working temperature of the high-power LED is reduced, the light efficiency of the LED is improved, and the service life of the LED.
Drawings
FIG. 1 is an axial view of the overall structure of an integrated LED lamp high-efficiency heat dissipation device according to the present invention;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a left side view of FIG. 2;
FIG. 5 is a top view of FIG. 2;
FIG. 6 is an enlarged top view of the lower plate 01 of the fixing frame of FIG. 1;
FIG. 7 is a top view of the assembly structure of the base 11 and the electric fan 10 in FIG. 3;
fig. 8 is an assembly structure view of the U-shaped heat pipe 05 and the radiator fin 06 in fig. 1.
In the figure: 00. a fixed frame upper plate; 01. a lower plate of the fixing frame; 02, LED area light source; 03.LED chips; 04. a ceramic substrate; 05. U-shaped heat pipes; 06. a heat sink fin; 07. a stirling engine; 08. a micro-generator; 09. a power supply module; 10. an electric fan; 11. a base; 12. a through hole; 13. a support pillar; 14. a groove; 15. a hollow pillar.
Detailed Description
As shown in fig. 1, 2, 3, 4 and 5, the bottom of the efficient heat dissipation device of an integrated LED lamp of the present invention is a base 11, the base 11 is horizontally disposed, and the top is a fixing bracket horizontally disposed, for fixing an LED surface light source 02. The fixed bolster is square structure, and four corners department is the top of a support column 13 of fixed connection respectively, and four support columns 13 are arranged perpendicularly, and the bottom of four support columns 13 is fixed on base 11, through support column 13 with base 11 and fixed bolster fixed connection.
The fixing support is composed of a fixing frame upper plate 00 and a fixing frame lower plate 01, wherein the fixing frame upper plate 00 is arranged right above the fixing frame lower plate 01 and is of a square structure. The LED surface light source 02 consists of a ceramic substrate 04 and a high-power LED chip 03. The ceramic substrate 04 is horizontally arranged between the fixing frame upper plate 00 and the fixing frame lower plate 01, a plurality of LED chips 03 arranged in an array mode are arranged on the upper surface of the ceramic substrate 04, and the LED chips 03 are bonded or welded on the upper surface of the ceramic substrate 04.
The lower bottom surface of the ceramic substrate 04 and the upper surface of the lower plate 01 of the fixing frame are contacted and penetrate through the U-shaped heat pipe 5, the U-shaped heat pipe 5 is of a U-shaped structure, and the U-shaped bottom wall of the U-shaped heat pipe penetrates through the space between the lower bottom surface of the ceramic substrate 04 and the upper surface of the lower plate 01 of the fixing frame and is respectively in close contact with the ceramic substrate 04 and the lower plate 01 of the fixing frame. Two side walls of the U-shaped heat pipe 5 respectively extend into one radiator fin 06, and the radiator fin 06 tightly wraps the side walls of the U-shaped heat pipe 5. Therefore, one radiator fin 06 is provided below each of both sides of the mount lower plate 01, and the two radiator fins 06 are symmetrically arranged on both sides with respect to the center of the mount lower plate 01. The U-shaped heat pipe 5 has a function of connecting the LED surface light source 02 and the heat sink fin 06 to promote heat conduction, and has a function of fixing the heat sink fin 06. The U-shaped heat pipe 05 is a closed pipe filled with a heat absorbing medium.
The middle part of the fixing frame upper plate 00 is provided with a notch matched with the LED chip 03, and the size of the notch is smaller than that of the ceramic substrate 04, so that light of the LED surface light source 02 can be diffused out, and the LED surface light source 02 can be fixed. Four corners of the fixing frame upper plate 00 and the fixing frame lower plate 01 are respectively provided with 4 through holes 12 which are communicated up and down and are matched with the supporting columns 13, the top ends of the supporting columns 13 are provided with threads and penetrate through the through holes 12, the fixing frame upper plate 00 and the fixing frame lower plate 01 are screwed up and down by nuts, and the LED surface light source 02 is clamped tightly so as to be positioned in the middle of the fixing frame upper plate 00 and the fixing frame lower plate 01 and not to be separated.
Mount upper plate 00, mount hypoplastron 01 are square injection molding, adopt the metal of high heat conduction to make, and the material chooses for use the aluminium material, can have better heat transfer, and stability is better.
The Stirling engine 07 is arranged right below the lower plate 01 of the fixing frame, the Stirling engine is provided with a hot cavity and a cold cavity, when medium gas in the hot cavity receives external heat, the gas can expand to further push a piston in the cavity to move towards the cold cavity, and power is output through the cycle that working medium (hydrogen or helium) in a cylinder is cooled, compressed, absorbed and expanded into a cycle. The lower surface of the lower plate 01 of the fixing frame is connected with a heat source on the upper surface of a heat cavity of the Stirling engine 07 to be in close contact with the heat source, part of heat generated by the LED area light source 02 can be transferred to the upper surface of the heat cavity of the Stirling engine 07, and the upper surface of the heat cavity of the Stirling engine 07 is tightly connected with the lower surface of the lower plate 01 of the fixing frame by using heat-conducting glue. The micro generator 08 is connected to the outside of the cold chamber of the stirling engine 07, and the micro generator 08 is used for converting the power of the stirling engine 07 into electric energy. The micro-generator 08 is disposed directly below the stirling engine 07, and both the stirling engine 07 and the micro-generator 08 are parallel to the base 11, in the middle right between the two radiator fins 06. The movement of the cold chamber piston of the stirling engine 07 provides kinetic energy to the micro-generator 08 for generating electricity.
A vertical hollow pillar 15 is fixedly connected between the bottom of the micro generator 08 and the base 11, the top ends of two identical hollow pillars 15 are fixedly connected with the bottom of the micro generator 08, and the bottom end is vertically fixed in the middle of the radiator base 11. The electric power generated by the micro-generator 08 is transmitted to the power module 09 through the inside of the hollow pillar 15 by a wire. The power module 09 is disposed right below the micro-generator 08 and is fixedly connected to the middle of the upper surface of the base 11. The power module 09 is connected with the LED surface light source 02 through a power line to supply power to the LED surface light source 02.
An electric fan 10 is arranged in the base 11 and is positioned right below each radiator fin 06, and the power supply module 09 is connected with the electric fan 10 through a power line to supply power to the electric fan 10. The two electric fans 10 are symmetrically arranged with respect to the power module 09, with the central rotation axis of the electric fans 10 perpendicular to the base 11. The power module 09 is also connected with an external power supply through a power line, when the electric energy generated by the micro generator 08 cannot sufficiently supply the electric fan 10 to work, the power module 09 is switched to supply power to the external power supply, so that the normal work of the electric fan 10 is ensured. The voltage stabilizing diode is connected between the electric fan 10 and the power supply module 09, so that the voltage stabilizing effect can be achieved, and the normal work of the electric fan 10 can be protected.
As shown in fig. 3, the heat sink fins 06 on the same side have a plurality of heat sink fins, and the plurality of heat sink fins are all arranged perpendicular to the base 11 and parallel to each other. The two heat sink fins 06 are symmetrically distributed with respect to the central axis of the base 11.
As shown in fig. 6, a plurality of grooves 14 are carved on the upper surface of the lower plate 01 of the fixing frame, and all the grooves 14 are parallel to each other and have the same size. The number of the grooves 14 is the same as that of the heat sink fins 06 on the same side, and is also the same as that of the U-shaped heat pipes 5. The size of the grooves 14 is matched with that of the U-shaped heat pipes 05, each groove 14 can tightly clamp the middle bottom wall part of one U-shaped heat pipe 05, and the upper surface of the U-shaped heat pipe 05 is in contact with the lower surface of the ceramic substrate 04. Silver-containing heat-conducting silicone grease is filled in the grooves 14, so that the thermal contact resistance between the U-shaped heat pipe 05 and the ceramic substrate 04 can be reduced.
As shown in fig. 7, two circular grooves are formed in the base 11 for receiving the electric fan 10, and the electric fan 10 does not interfere with the radiator fins 06 above the electric fan 10 when it is operated.
As shown in fig. 8, a U-shaped heat pipe 05 is connected between two symmetrical heat dissipation fins of the two heat dissipation fins 06, a U-shaped opening of the U-shaped heat pipe 05 faces right below, a side wall of the U-shaped heat pipe 05 is a heat pipe condensation section, and a middle section is a bottom and is clamped in a groove 14 on the lower plate 01 of the fixing frame. The bottoms of the two radiator fins 06 are close to the base 11, but the bottoms of the two radiator fins are not in contact with each other, so that hot air flowing is facilitated, in order to reduce thermal resistance of an interface, the radiator fins 06 and the U-shaped heat pipe 05 are integrally designed, the radiator fins 06 are directly manufactured at a condensation section of the U-shaped heat pipe 05, the radiator fins 06 wrap the condensation section of the heat pipe, the contact area between the condensation section of the heat pipe and the radiator fins 06 can be increased, and the heat pipe can be better radiated. In the traditional heat pipe radiator, the heat pipe penetrates through the multiple layers of fins, so that the contact area between the heat pipe and the fins is small, and air exists between contact surfaces because of non-integrated design, the heat resistance is high, and the heat transmission is hindered.
When the high-efficiency heat dissipation device of the integrated LED lamp works, the LED surface light source 02 works, generated heat is directly transmitted to the U-shaped heat pipe 05 through the ceramic substrate 04, a medium in the U-shaped heat pipe 05 absorbs heat and becomes gas, the gas flows to a condensation end of the radiator fin 06, namely a U-shaped side wall, and the gas is condensed and dissipated as the condensation section is directly connected with the radiator fin 06, and the heat is dissipated to the air through the fin; meanwhile, heat which is not taken away by the U-shaped heat pipe 05 of the LED surface light source 02 is transmitted to the Stirling engine 07 through the lower plate 01 of the fixing frame, so that the operation of the Stirling engine 07 is promoted, meanwhile, the Stirling engine 07 drives the micro generator to generate electricity, waste heat is converted into electricity, the electricity is transmitted to the power module 09 through a conducting wire, the power module 09 is connected with an external power supply and has the functions of storing and transmitting electricity, on one hand, the power module 09 can provide electric energy for the LED surface light source 02 group during working, on the other hand, the power module 09 is connected with the electric fan 10, wind power of the electric fan 10 blows upwards to the radiator fins 06, the convection exchange of the heat of the radiator.
Claims (10)
1. The utility model provides a high-efficient heat abstractor of integrated LED lamp, its bottom is base (11) of horizontal arrangement, and the top is the fixed bolster that is used for fixed LED area source (02) of horizontal arrangement, and LED area source (02) comprise ceramic substrate (04) and LED chip (03), characterized by: the fixing support is composed of a fixing frame upper plate (00) and a fixing frame lower plate (01), a ceramic substrate (04) is horizontally arranged between the fixing frame upper plate (00) and the fixing frame lower plate (01), the lower bottom surface of the ceramic substrate (04) and the upper surface of the fixing frame lower plate (01) are in contact with each other and penetrate through the bottom wall of the U-shaped heat pipe (5), the U-shaped opening of the U-shaped heat pipe (5) faces towards the right lower side, and two side walls of the U-shaped heat pipe respectively extend into a radiator fin (06); the Stirling engine (07) is arranged right below the lower plate (01) of the fixing frame, the lower surface of the lower plate (01) of the fixing frame is in close contact with the upper surface of a hot cavity of the Stirling engine (07), the micro generator (08) is connected to the outer portion of a cold cavity of the Stirling engine (07), the micro generator (08) is connected with the power supply module (09) through a lead, and the power supply module (09) is connected with the LED surface light source (02) through a power line.
2. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 1, wherein: an electric fan (10) is arranged in the base (11) and is positioned under each radiator fin (06), and the power module 09 is connected with the electric fan (10) through a power line.
3. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 2, wherein: the power supply module (09) is connected with an external power supply through a power line.
4. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 1, wherein: a plurality of grooves (14) which are parallel to each other are formed in the upper surface of the lower plate (01) of the fixing frame, the bottom wall portion of one U-shaped heat pipe (05) is tightly clamped by each groove (14), the upper surface of each U-shaped heat pipe (05) is in contact with the lower surface of the ceramic substrate (04), and silver-containing heat-conducting silicone grease is filled in each groove (14).
5. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 1, wherein: the bottoms of the two radiator fins (06) are both close to the base (11) but contact with each other.
6. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 1, wherein: the side wall of the U-shaped heat pipe (05) is wrapped by the radiator fin (06), and the radiator fin and the U-shaped heat pipe are integrated.
7. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 1, wherein: the two radiator fins (06) are symmetrically arranged on two sides relative to the center of the lower plate (01) of the fixing frame.
8. The high-efficiency heat dissipation device of the integrated LED lamp as set forth in claim 1, wherein: the upper plate (00) and the lower plate (01) of the fixing frame are both made of aluminum.
9. A heat dissipation method of the high efficiency heat dissipation device of the integrated LED lamp of claim 1, wherein: heat generated by the work of the LED surface light source (02) is directly transferred to the U-shaped heat pipe (05) through the ceramic substrate (04), a medium in the U-shaped heat pipe (05) absorbs heat and is changed into gas, the gas flows to the side wall condensation end of the radiator fin (06), and the heat is dissipated into the air; the heat which is not taken away by the U-shaped heat pipe (05) of the LED area light source (02) is transmitted to the Stirling engine (07) through the lower plate 01 of the fixing frame, the Stirling engine (07) operates to drive the micro generator (08) to generate electricity, the electric energy is transmitted to the power supply module (09), and the power supply module (09) supplies power to the LED area light source (02).
10. The heat dissipation method as claimed in claim 9, wherein: an electric fan (10) is arranged under each radiator fin (06), the power supply module (09) is connected with the electric fan (10), and wind power of the electric fan (10) blows upwards to the radiator fins (06).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110277207.3A CN113124366A (en) | 2021-03-15 | 2021-03-15 | High-efficiency heat dissipation device and method for integrated LED lamp |
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| CN202110277207.3A CN113124366A (en) | 2021-03-15 | 2021-03-15 | High-efficiency heat dissipation device and method for integrated LED lamp |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114838337A (en) * | 2022-05-16 | 2022-08-02 | 江苏大学 | High-efficient liquid cooling device of LED |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080151499A1 (en) * | 2006-12-26 | 2008-06-26 | Quanta Computer Inc. | Electronic device and heat dissipation module thereof |
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| CN114838337A (en) * | 2022-05-16 | 2022-08-02 | 江苏大学 | High-efficient liquid cooling device of LED |
| CN114838337B (en) * | 2022-05-16 | 2023-11-10 | 江苏大学 | LED efficient water-cooling heat dissipation device |
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Application publication date: 20210716 |