CN111380003A - LED heat dissipation support - Google Patents
LED heat dissipation support Download PDFInfo
- Publication number
- CN111380003A CN111380003A CN202010295762.4A CN202010295762A CN111380003A CN 111380003 A CN111380003 A CN 111380003A CN 202010295762 A CN202010295762 A CN 202010295762A CN 111380003 A CN111380003 A CN 111380003A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- led
- post
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses an LED heat dissipation support which comprises a base and an LED chip, wherein a heat conduction copper column is fixedly connected to the inner wall of the base, heat conduction glue is fixedly connected to the upper surface of the heat conduction copper column, the LED chip is fixedly bonded to the upper surface of the heat conduction glue, a cathode pin and an anode pin are arranged inside the LED chip, conductive connection pieces are respectively connected to the upper surfaces of the cathode pin and the anode pin in a lap joint mode, the lower surface of the base is movably connected with a heat dissipation column through a bolt, a cavity is formed in the heat dissipation column, and a heat dissipation sheet is fixedly connected to the surface of the heat dissipation column. This LED heat dissipation support sets up through the cooperation between LED chip, heat conduction copper post, heat conduction glue and the heat dissipation post, can transmit the heat that the LED chip gived off at the during operation to heat dissipation post department through heat conduction glue and heat conduction copper post, sets up through the cooperation between heat dissipation post, cavity, fin and the louvre, can give off the heat to the external world through heat dissipation post and fin on the one hand.
Description
Technical Field
The invention relates to the technical field of LED heat dissipation devices, in particular to an LED heat dissipation support.
Background
An LED light emitting diode is a solid state semiconductor device which can directly convert electrical energy into light energy, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support and is a cathode, the other end of the wafer is connected with an anode of a power supply, the whole wafer is encapsulated by epoxy resin, the semiconductor wafer is composed of two parts, one part is a P-type semiconductor, holes are dominant in the semiconductor wafer, the other end of the semiconductor wafer is an N-type semiconductor, electrons are mainly on the side, when the two semiconductors are connected, a P-N junction is formed between the two semiconductors, when current is applied to the wafer through a lead, the electrons are pushed to a P area, the electrons and the holes are combined in the P area, and then energy is emitted in the form of photons.
The LED lamp has the advantages that a large amount of heat can be generated when the existing LED chip works, the heat dissipation effect of the existing LED lamp is poor, the heat is difficult to dissipate, and the service life of the LED chip is shortened.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an LED heat dissipation bracket, which solves the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a LED heat dissipation support, includes base and LED chip, the inner wall fixedly connected with heat conduction copper post of base, the last fixed surface of heat conduction copper post is connected with the heat conduction glue, the last fixed surface who conducts the glue bonds and has the LED chip, the inside of LED chip is provided with negative pole pin and positive pole pin, the upper surface of negative pole pin and positive pole pin all overlap joint has electrically conductive splicing, the lower surface of base has the heat dissipation post through bolt swing joint, the cavity has been seted up to the inside of heat dissipation post, the fixed surface of heat dissipation post is connected with the fin, the louvre has been seted up to the inner wall of heat dissipation post, the bottom fixedly connected with stationary blade of heat dissipation post.
Optionally, the upper surface of the base is fixedly connected with an enclosing frame, and the surface of the enclosing frame is in threaded connection with a lens.
Optionally, both sides of the upper surface of the base are movably connected with clamping pieces through bolts.
Optionally, the number of the fixing pieces is two, and the two fixing pieces are symmetrically arranged by taking the vertical central line of the heat dissipation column as a symmetry axis.
Optionally, the number of the heat dissipation fins is several, and the several heat dissipation fins are fixedly connected to the surface of the heat dissipation column in an annular array.
(III) advantageous effects
The invention provides an LED heat dissipation bracket, which has the following beneficial effects:
this LED heat dissipation support, through the LED chip, the heat conduction copper post, heat conduction glue and the cooperation setting between the heat dissipation post, can transmit the heat that the LED chip gived off at the during operation to heat dissipation post department through heat conduction glue and heat conduction copper post, through the heat dissipation post, the cavity, cooperation setting between fin and the louvre, can give off the heat to the external world through heat dissipation post and fin on the one hand, on the other hand can be through the heat dissipation post, the cavity and louvre give off the heat to the air, can promote the circulation of air through the louvre, thereby reach and accelerate radiating purpose, can prolong the life of LED chip.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a thermally conductive copper pillar according to the present invention;
FIG. 3 is a schematic view of a base structure according to the present invention;
FIG. 4 is a schematic view of a heat-dissipating stud according to the present invention.
In the figure: 1. a base; 2. an LED chip; 3. a thermally conductive copper pillar; 4. heat conducting glue; 5. a cathode pin; 6. an anode pin; 7. a conductive tab; 8. a heat-dissipating column; 9. a cavity; 10. a heat sink; 11. heat dissipation holes; 12. a fixing sheet; 13. enclosing a frame; 14. a lens; 15. a clip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 4, the present invention provides a technical solution: an LED heat dissipation support comprises a base 1 and an LED chip 2, wherein the inner wall of the base 1 is fixedly connected with a heat conduction copper column 3, the upper surface of the heat conduction copper column 3 is fixedly connected with heat conduction glue 4, and the upper surface of the heat conduction glue 4 is fixedly bonded with the LED chip 2;
in order to facilitate the heat emitted by the LED chip 2 during operation to be transferred to the heat dissipation column 8, the LED chip 2 is internally provided with the cathode pin 5 and the anode pin 6, the upper surfaces of the cathode pin 5 and the anode pin 6 are respectively connected with the conductive connecting piece 7 in a lap joint manner, the lower surface of the base 1 is movably connected with the heat dissipation column 8 through a bolt, and the heat emitted by the LED chip 2 during operation can be transferred to the heat dissipation column 8 through the heat conductive adhesive 4 and the heat conductive copper column 3 through the matching arrangement among the LED chip 2, the heat conductive copper column 3, the heat conductive adhesive 4 and the heat dissipation column 8;
in order to facilitate the dissipation of the heat emitted to the heat dissipation column 8, the cavity 9 is formed inside the heat dissipation column 8, the surface of the heat dissipation column 8 is fixedly connected with a heat dissipation sheet 10, the inner wall of the heat dissipation column 8 is provided with a heat dissipation hole 11, the heat can be dissipated to the outside through the heat dissipation column 8, the cavity 9, the heat dissipation sheet 10 and the heat dissipation hole 11 through the matching arrangement among the heat dissipation column 8, the cavity 9, the heat dissipation sheet 10 and the heat dissipation hole 11, on the other hand, the heat can be dissipated to the air through the heat dissipation column 8, the cavity 9 and the heat dissipation hole 11, the circulation of the air can be promoted through the heat dissipation hole 11, so that the purpose of accelerating the heat dissipation is achieved, the service life of the LED chip 2 can be prolonged, the bottom of the heat dissipation column 8 is fixedly connected with a fixing sheet 12, the upper surface of the base 1 is fixedly connected with an, the quantity of stationary blade 12 is two, and two stationary blades 12 use the perpendicular central line of heat dissipation post 8 to be the symmetry setting as the symmetry axis, and the quantity of fin 10 is a plurality of, and a plurality of fin 10 are with the form fixed connection of annular array on the surface of heat dissipation post 8, and the material of heat dissipation post 8 and fin 10 is aluminium.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
In summary, when the LED heat dissipation bracket is used, the device can be installed through the fixing sheet 12, the fixing sheet 12 can support the heat dissipation column 8 to a certain height, increase the contact area between the heat dissipation column 8 and the air, accelerate the heat dissipation, through the matching arrangement of the LED chip 2, the heat-conducting copper column 3, the heat-conducting glue 4 and the heat-radiating column 8, the heat emitted by the LED chip 2 during working can be transmitted to the heat-radiating column 8 through the heat-conducting glue 4 and the heat-conducting copper column 3, through the matching arrangement among the heat dissipation column 8, the cavity 9, the heat dissipation fins 10 and the heat dissipation holes 11, the heat can be dissipated to the outside through the heat dissipation column 8 and the heat dissipation fins 10 on one hand, and can be dissipated to the air through the heat dissipation column 8, the cavity 9 and the heat dissipation holes 11 on the other hand, the heat dissipation holes 11 can promote the circulation of air, so that the purpose of accelerating heat dissipation is achieved, and the service life of the LED chip 2 can be prolonged.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (5)
1. The utility model provides a LED heat dissipation support, includes base (1) and LED chip (2), its characterized in that: the utility model discloses a LED lamp, including base (1), inner wall fixedly connected with heat conduction copper post (3), the last fixed surface of heat conduction copper post (3) is connected with heat conduction glue (4), the last fixed surface of heat conduction glue (4) bonds and has LED chip (2), the inside of LED chip (2) is provided with negative pole pin (5) and positive pole pin (6), the upper surface of negative pole pin (5) and positive pole pin (6) all overlaps and has electrically conductive splicing (7), the lower surface of base (1) has heat dissipation post (8) through bolt swing joint, cavity (9) have been seted up to the inside of heat dissipation post (8), the fixed surface of heat dissipation post (8) is connected with fin (10), louvre (11) have been seted up to the inner wall of heat dissipation post (8), the bottom fixedly connected with stationary blade (12) of heat dissipation post (8).
2. The LED heat sink stand of claim 1, wherein: the upper surface fixed connection of base (1) encloses frame (13), the surperficial threaded connection who encloses frame (13) has lens (14).
3. The LED heat sink stand of claim 1, wherein: both sides of the upper surface of the base (1) are movably connected with clamping pieces (15) through bolts.
4. The LED heat sink stand of claim 1, wherein: the quantity of stationary blade (12) is two, and two stationary blade (12) use the perpendicular central line of heat dissipation post (8) is the symmetry setting as the symmetry axis.
5. The LED heat sink stand of claim 1, wherein: the number of the radiating fins (10) is several, and the several radiating fins (10) are fixedly connected to the surface of the radiating column (8) in an annular array mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010295762.4A CN111380003A (en) | 2020-04-15 | 2020-04-15 | LED heat dissipation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010295762.4A CN111380003A (en) | 2020-04-15 | 2020-04-15 | LED heat dissipation support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111380003A true CN111380003A (en) | 2020-07-07 |
Family
ID=71217450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010295762.4A Withdrawn CN111380003A (en) | 2020-04-15 | 2020-04-15 | LED heat dissipation support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111380003A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112762164A (en) * | 2021-01-12 | 2021-05-07 | 三一汽车起重机械有限公司 | Heat radiation structure, power take-off mechanism and crane |
-
2020
- 2020-04-15 CN CN202010295762.4A patent/CN111380003A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112762164A (en) * | 2021-01-12 | 2021-05-07 | 三一汽车起重机械有限公司 | Heat radiation structure, power take-off mechanism and crane |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200707 |
|
| WW01 | Invention patent application withdrawn after publication |