CN220021165U

CN220021165U - Heat abstractor of high-power diode

Info

Publication number: CN220021165U
Application number: CN202321016522.1U
Authority: CN
Inventors: 杨燕梅; 蔡俊良; 谢芳芳
Original assignee: Ezkey Electronics Co ltd
Current assignee: Ezkey Electronics Co ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2023-11-14
Anticipated expiration: 2033-04-27

Abstract

The utility model relates to the technical field of diode equipment, in particular to a heat dissipating device of a high-power diode, which comprises a diode component, wherein the outer wall of the diode component is connected with the inner wall of a radiating fin in a clamping way, the outer wall of the radiating fin is connected with the outer wall of a fixing piece in a clamping way, the top of the fixing piece is fixedly connected with the bottom of the radiating piece, heat generated by an LED unit in use is transmitted back to a bearing plate, the bearing plate conducts the heat to the radiating fin, a coil is electrified, a rotating rod can rotate in the coil under electromagnetic acting force, the rotating rod drives a fan blade to rotate, and the fan blade stirs air in a radiating bin to accelerate flowing, so that the heat on the radiating fin is discharged, heat dissipation is further accelerated, the excessive high temperature in a light-transmitting cover is avoided, the radiating bin is separated from the fixing plate through taking out a fixing bolt from the radiating bin after long-time use, and then a locating plate is taken out from the radiating fin, so that the cleaning work of workers is facilitated.

Description

Heat abstractor of high-power diode

Technical Field

The utility model relates to the technical field of diode equipment, in particular to a heat dissipation device of a high-power diode.

Background

Semiconductor Light Emitting Diodes (LEDs) are widely used in the fields of electronic display screens, traffic lights, and the like. The chip surface of the light emitting diode is typically encapsulated in a light transmissive epoxy material. For the semiconductor light-emitting diode in a high-current working state, the packaging mode has high thermal resistance, so that the chip of the light-emitting diode generates high temperature rise, and the luminous efficiency, the light output power and the working life of the chip are seriously reduced.

Most of high-power diodes in the current market can generate a large amount of heat when in use, and the heat is wound in the lampshade, so that the temperature in the lampshade can be rapidly increased, the diode is caused to be hot-melt, and inconvenience is brought to the use of people.

Disclosure of Invention

The utility model aims to provide a heat dissipating device of a high-power diode, which solves the problem that the high-power diode generates a large amount of heat when being used in the background art. In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat dissipation device of a high-power diode comprises a diode component, wherein the outer wall of the diode component is connected with the inner wall of a heat dissipation fin in a clamping mode.

The outer wall of the radiating fin is connected with the outer wall of the fixing piece in a clamping mode, and the top of the fixing piece is fixedly connected with the bottom of the radiating piece.

Preferably, the diode component comprises a bearing plate, an LED unit and a light-transmitting cover, wherein the outer wall of the bearing plate is connected with the inner wall of the radiating fin in a clamping manner, the bottom of the bearing plate is fixedly connected with the top of the LED unit, the bottom of the bearing plate, which is close to the edge, is fixedly connected with the top of the light-transmitting cover, and the LED unit is arranged in the light-transmitting cover.

Preferably, the mounting includes locating plate, backplate and fixed plate, and the inside wall and the inner wall block of fin of locating plate are connected, and the lateral wall of locating plate and the inner wall fixed connection of backplate, and the inside wall of backplate and the outer wall activity butt of fin, and the top of backplate and the bottom fixed connection of fixed plate.

Preferably, the radiating piece comprises radiating bin, fixing bolt, connecting block, bearing, dwang, flabellum and coil, and radiating bin passes through fixing bolt and fixed plate fixed connection, and the inner wall side of radiating bin and the outer wall fixed connection of connecting block, and the inner wall of connecting block and the outer wall fixed connection of bearing, and the connecting block passes through the bearing and rotates with the dwang to be connected, and the one end that the dwang kept away from the bearing and the inner wall fixed connection of flabellum, and the flabellum setting is in radiating bin's inside, and the inside wall of flabellum rotates with the lateral wall of coil to be connected, and the bottom of coil and the top fixed connection of connecting block.

Preferably, the radiating fin is composed of a plurality of copper radiating fins which are radially arranged and are surrounded into a ring shape, a radiating cavity is formed in the radiating fin, a positioning groove is formed in the outer wall of the radiating fin, and the inner wall of the positioning groove is connected with the outer wall of the positioning plate in a clamping mode.

Preferably, one end of the rotating rod penetrates through the top of the coil and extends to the bottom of the coil, and the outer wall of the rotating rod at one end of the bottom of the coil is fixedly connected with the inner wall of the bearing.

Compared with the prior art, the utility model has the beneficial effects that:

in the utility model, the heat generated by the LED unit during use is returned to the bearing plate, the bearing plate conducts the heat to the radiating fins, the coil is electrified, the rotating rod can rotate in the coil under the electromagnetic acting force, the rotating rod drives the fan blades to rotate, and the fan blades stir the air in the radiating bin to accelerate the flow, so that the heat on the radiating fins is discharged, the heat radiation is further accelerated, and the overhigh temperature in the light-transmitting cover is avoided.

After the radiator is used for a long time, the fixing bolts are taken out from the radiating bin, so that the radiating bin is separated from the fixing plate, and the locating plate is taken out from the radiating fin, thereby bringing convenience to the cleaning work of staff.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a cross-sectional view of the present utility model;

fig. 3 is an exploded view of the present utility model.

In the figure: 1. a diode assembly; 101. a carrying plate; 102. an LED unit; 103. a light-transmitting cover; 2. a heat sink; 3. a fixing member; 301. a positioning plate; 302. a support plate; 303. a fixing plate; 4. a heat sink; 401. a heat dissipation bin; 402. a fixing bolt; 403. a connecting block; 404. a bearing; 405. a rotating lever; 406. a fan blade; 407. a coil.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are obtained by a worker of ordinary skill in the art without creative efforts, are within the protection scope of the present utility model based on the embodiments of the present utility model.

Referring to fig. 1 to 3, the present utility model provides a technical solution: a heat dissipating device of a high-power diode comprises a diode assembly 1, wherein the outer wall of the diode assembly 1 is connected with the inner wall of a heat sink 2 in a clamping way.

The outer wall of fin 2 is connected with the outer wall block of mounting 3, and mounting 3 top and the bottom fixed connection of radiator 4.

In this embodiment, as shown in fig. 1, 2 and 3, the diode assembly 1 is composed of a carrier plate 101, an LED unit 102 and a transparent cover 103, the outer wall of the carrier plate 101 is connected with the inner wall of the heat sink 2 in a clamping manner, the bottom of the carrier plate 101 is fixedly connected with the top of the LED unit 102, the bottom of the carrier plate 101 close to the edge is fixedly connected with the top of the transparent cover 103, the LED unit 102 is arranged in the transparent cover 103, heat generated by the LED unit 102 returns to the carrier plate 101, and the transparent cover 103 can avoid external force from directly acting on the LED unit 102, so that effective protection is provided for the LED unit.

In this embodiment, as shown in fig. 1, 2 and 3, the fixing member 3 includes a positioning plate 301, a support plate 302 and a fixing plate 303, where the inner side wall of the positioning plate 301 is connected with the inner wall of the heat sink 2 in a clamping manner, the outer side wall of the positioning plate 301 is fixedly connected with the inner wall of the support plate 302, the inner side wall of the support plate 302 is movably abutted to the outer wall of the heat sink 2, and the top of the support plate 302 is fixedly connected with the bottom of the fixing plate 303, and the positioning plate 301 can limit and fix the heat sink 2, so that displacement of the heat sink 2 is avoided.

In this embodiment, as shown in fig. 1, 2 and 3, the heat dissipation member 4 is composed of a heat dissipation bin 401, a fixing bolt 402, a connecting block 403, a bearing 404, a rotating rod 405, a fan blade 406 and a coil 407, wherein the heat dissipation bin 401 is fixedly connected with the fixing plate 303 through the fixing bolt 402, the inner wall side of the heat dissipation bin 401 is fixedly connected with the outer wall of the connecting block 403, the inner wall of the connecting block 403 is fixedly connected with the outer wall of the bearing 404, the connecting block 403 is rotatably connected with the rotating rod 405 through the bearing 404, one end of the rotating rod 405 far away from the bearing 404 is fixedly connected with the inner wall of the fan blade 406, the fan blade 406 is arranged in the heat dissipation bin 401, the inner side wall of the fan blade 406 is rotatably connected with the outer side wall of the coil 407, the bottom of the coil 407 is fixedly connected with the top of the connecting block 403, after the coil 407 is electrified, the rotating rod 405 can rotate in the coil 407, the rotating rod 405 drives the fan blade 406 to stir the air in the heat dissipation bin 401 to accelerate the flow, thereby discharging the heat on the heat dissipation fin 2, and further accelerating the heat dissipation.

In this embodiment, as shown in fig. 1, 2 and 3, the heat sink 2 is formed by a plurality of copper heat sinks, which are radially arranged and surround to form a ring, the inside of the heat sink 2 is provided with a heat dissipation cavity, the outer wall of the heat sink 2 is provided with a positioning groove, the inner wall of the positioning groove is connected with the outer wall of the positioning plate 301 in a clamping manner, the heat dissipation cavity provided by the heat sink 2 can intensively dissipate heat, and the positioning plate 301 can be inserted into the heat sink 2 to fix the heat dissipation cavity.

In this embodiment, as shown in fig. 1, 2 and 3, one end of the rotating rod 405 penetrates through the top of the coil 407 and extends to the bottom of the coil 407, and the outer wall of the rotating rod 405 at the bottom end of the coil 407 is fixedly connected with the inner wall of the bearing 404, and after the coil 407 is energized, the rotating rod 405 can rotate in the coil 407 under electromagnetic force.

The application method and the advantages of the utility model are as follows: when the heat dissipating device of the high-power diode works, the working process is as follows:

as shown in fig. 1, fig. 2 and fig. 3, heat generated by the LED unit during use is returned to the bearing plate 101, the bearing plate 101 conducts the heat to the radiating fin 2, the coil 407 is electrified, the rotating rod 405 can rotate in the coil 407 under electromagnetic acting force, the rotating rod 405 drives the fan blades 406 to rotate, the fan blades 406 stir air in the radiating bin 401 to accelerate flow, so that heat on the radiating fin 2 is discharged, heat dissipation is further accelerated, the excessive temperature in the light-transmitting cover 103 is avoided, after long-time use, the fixing bolt 402 is taken out from the radiating bin 401, the radiating bin 401 is separated from the fixing plate 303, and the positioning plate 301 is taken out from the radiating fin 2, so that convenience is brought to cleaning work of workers.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a heat abstractor of high-power diode, includes diode subassembly (1), its characterized in that: the outer wall of the diode component (1) is in clamping connection with the inner wall of the radiating fin (2);

the outer wall of the radiating fin (2) is connected with the outer wall of the fixing piece (3) in a clamping mode, and the top of the fixing piece (3) is fixedly connected with the bottom of the radiating piece (4).

2. The heat sink of a high power diode of claim 1, wherein: the LED module (1) is composed of a bearing plate (101), an LED unit (102) and a light-transmitting cover (103), the outer wall of the bearing plate (101) is connected with the inner wall of the radiating fin (2) in a clamping mode, the bottom of the bearing plate (101) is fixedly connected with the top of the LED unit (102), the bottom, close to the edge, of the bearing plate (101) is fixedly connected with the top of the light-transmitting cover (103), and the LED unit (102) is arranged in the light-transmitting cover (103).

3. The heat sink of a high power diode of claim 1, wherein: the fixing piece (3) comprises a positioning plate (301), a support plate (302) and a fixing plate (303), wherein the inner side wall of the positioning plate (301) is connected with the inner wall of the radiating fin (2) in a clamping mode, the outer side wall of the positioning plate (301) is fixedly connected with the inner wall of the support plate (302), the inner side wall of the support plate (302) is movably abutted with the outer wall of the radiating fin (2), and the top of the support plate (302) is fixedly connected with the bottom of the fixing plate (303).

4. A heat sink for a high power diode as claimed in claim 3, wherein: the heat dissipation piece (4) comprises heat dissipation storehouse (401), fixing bolt (402), connecting block (403), bearing (404), dwang (405), flabellum (406) and coil (407), and heat dissipation storehouse (401) are through fixing bolt (402) and fixed plate (303) fixed connection, and the inner wall side of heat dissipation storehouse (401) and the outer wall fixed connection of connecting block (403), and the inner wall of connecting block (403) and the outer wall fixed connection of bearing (404), and connecting block (403) pass through bearing (404) and dwang (405) rotate to be connected, and the one end that dwang (405) kept away from bearing (404) and the inner wall fixed connection of flabellum (406), and flabellum (406) set up in the inside of heat dissipation storehouse (401), and the inside wall of flabellum (406) rotates with the outer wall of coil (407), and the bottom of coil (407) and the top fixed connection of connecting block (403).

5. A heat sink for a high power diode as claimed in claim 3, wherein: the radiating fins (2) are formed by a plurality of copper radiating fins, are radially arranged and surround to form a ring shape, a radiating cavity is formed in the radiating fins (2), positioning grooves are formed in the outer walls of the radiating fins (2), and the inner walls of the positioning grooves are connected with the outer walls of the positioning plates (301) in a clamping mode.

6. The heat sink of a high power diode of claim 4, wherein: one end of the rotating rod (405) penetrates through the top of the coil (407) and extends to the bottom of the coil (407), and the outer wall of the rotating rod (405) at one end of the bottom of the coil (407) is fixedly connected with the inner wall of the bearing (404).