CN210266947U - Heat dissipation device for LED module - Google Patents

Heat dissipation device for LED module Download PDF

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Publication number
CN210266947U
CN210266947U CN201921625901.4U CN201921625901U CN210266947U CN 210266947 U CN210266947 U CN 210266947U CN 201921625901 U CN201921625901 U CN 201921625901U CN 210266947 U CN210266947 U CN 210266947U
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CN
China
Prior art keywords
base plate
heat
led module
led lamp
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921625901.4U
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Chinese (zh)
Inventor
刘焯中
罗娟华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Xinhe Photoelectric Technology Co Ltd
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Jiangxi Xinhe Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201921625901.4U priority Critical patent/CN210266947U/en
Application granted granted Critical
Publication of CN210266947U publication Critical patent/CN210266947U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a heat abstractor for in LED module, wherein: the LED lamp holder is fixedly arranged on the base plate through pins, the heat conducting fins are fixed below the LED lamp holder and are provided with heat conducting holes which are uniformly distributed, gaps are reserved between the heat conducting fins and the base plate, the motor is fixedly arranged below the other side, opposite to the pins, of the base plate, the motor main shaft penetrates through the base plate and extends out of the upper surface of the base plate, and the blades are fixedly arranged at the tail end of the motor main shaft. The utility model discloses heat dissipation problem to present LED module has provided new solution, changes into the mode at LED lamp below installation radiator fan by traditional natural cooling mode for the radiating rate improves the radiating effect, prolongs the life of LED module.

Description

Heat dissipation device for LED module
Technical Field
The utility model belongs to the technical field of the emitting diode technique and specifically relates to a heat abstractor for among LED module.
Background
LED lamps, also known as light emitting diodes, are the mainstream lighting appliances at present. The LED module is composed of a quadrilateral module integrated with a plurality of rows and a plurality of columns of light-emitting diodes, and is very widely applied. Whether the LED module works stably or not, the quality is good or bad, the LED module and the lamp body are important in heat dissipation, and natural heat dissipation is often adopted for heat dissipation of high-brightness LED modules in the market, so that the effect is not ideal. The LED module comprises an LED, a heat dissipation structure, a driver, a lens and the like, so that heat dissipation is also an important part, and if the LED cannot dissipate heat well, the service life of the LED can be seriously influenced, and the defects exist.
Disclosure of Invention
The utility model aims at designing a heat abstractor for in LED module, compare prior art, the utility model discloses heat dissipation problem to current LED module has proposed new solution, is changed into the mode at LED lamp below installation radiator fan by traditional natural cooling mode for the radiating rate improves the radiating effect, prolongs the life of LED module.
In order to achieve the above object, the utility model adopts the following technical scheme:
a heat dissipation device for an LED module comprises a substrate, an LED lamp cap, pins, heat conducting fins, heat conducting holes, a motor and blades; wherein: the LED lamp holder is fixedly arranged on the base plate through pins, the heat conducting fins are fixed below the LED lamp holder and are provided with heat conducting holes which are uniformly distributed, gaps are reserved between the heat conducting fins and the base plate, the motor is fixedly arranged below the other side, opposite to the pins, of the base plate, the motor main shaft penetrates through the base plate and extends out of the upper surface of the base plate, and the blades are fixedly arranged at the tail end of the motor main shaft.
A heat dissipation device for use in an LED module, wherein: the heat-conducting fin is made of copper.
A heat dissipation device for use in an LED module, wherein: the blade just sweeps the clearance between the heat-conducting fin and the substrate when rotating.
Compared with the prior art, the utility model discloses heat dissipation problem to present LED module has proposed new solution, is changed into the mode at LED lamp below installation radiator fan by traditional natural cooling mode for the radiating rate improves the radiating effect, prolongs the life of LED module.
Drawings
Fig. 1 is a schematic diagram of the structure of the present invention.
Fig. 2 is a schematic view of the axial structure of the blade of the present invention.
Reference numerals: the LED lamp comprises a substrate 1, an LED lamp cap 2, pins 3, heat conducting fins 4, heat conducting holes 5, a motor 6 and blades 7.
Detailed Description
The following embodiments are further described with reference to the accompanying drawings.
Embodiment 1, please refer to fig. 1 and 2, a heat dissipation device for an LED module includes a substrate 1, an LED lamp cap 2, pins 3, a heat-conducting fin 4, a heat-conducting hole 5, a motor 6, and a blade 7; wherein: the LED lamp holder comprises a substrate 1, an LED lamp holder 2 is fixedly arranged on the substrate 1 through a pin 3, a heat conducting sheet 4 is fixed below the LED lamp holder 2, heat conducting holes 5 which are uniformly distributed are formed in the heat conducting sheet 4, a gap is reserved between the heat conducting sheet 4 and the substrate 1, a motor 6 is fixedly arranged below the other side, opposite to the pin 3, of the substrate 1, a main shaft of the motor 6 penetrates through the substrate 1 and extends out of the upper surface of the substrate, and a blade 7 is fixedly arranged at the tail end of the main shaft of the motor 6.
Embodiment 2, please refer to fig. 1 and fig. 2, a heat dissipation device for an LED module, wherein: the heat conducting fins 4 are made of copper, and heat conducting and radiating efficiency is improved. The rest is the same as example 1.
Embodiment 3, please refer to fig. 1 and fig. 2, a heat dissipation device for an LED module, wherein: when the blades 7 rotate, the blades just sweep through gaps between the heat conducting fins 4 and the substrate 1, heat is rapidly taken out, and the heat dissipation efficiency is improved. The rest is the same as example 1.
The working principle is as follows: when the LED lamp cap 2 is powered on and emits light, a large amount of heat can be generated, the heat can be transmitted to the heat conducting sheet 4, at the moment, the power of the motor 6 is switched on, the motor 6 drives the blade 7 to rotate at a high speed, the blade 7 rotating at a high speed drives the surrounding air to flow, and the blade 7 just sweeps the gap between the heat conducting sheet 4 and the substrate 1 when rotating, so that the heat between the heat conducting sheet 4 and the substrate 1 can be taken out, and the purpose of heat dissipation is achieved.

Claims (3)

1. A heat dissipation device for an LED module comprises a substrate (1), an LED lamp cap (2), pins (3), heat conducting fins (4), heat conducting holes (5), a motor (6) and blades (7); the method is characterized in that: there are LED lamp holder (2) through pin (3) fixed mounting on base plate (1), LED lamp holder (2) below is fixed with conducting strip (4), be equipped with evenly distributed's heat conduction hole (5) on conducting strip (4), and leave the space between conducting strip (4) and base plate (1), below fixed mounting with the another side that pin (3) is relative has motor (6) on base plate (1), motor (6) main shaft passes base plate (1) and stretches out at the upper surface, there are blade (7) at the terminal fixed mounting of motor (6) main shaft.
2. The heat dissipation device of claim 1, wherein: the heat-conducting fin (4) is made of copper.
3. The heat dissipation device of claim 1, wherein: the blade (7) just sweeps across the gap between the heat conducting fin (4) and the substrate (1) when rotating.
CN201921625901.4U 2019-09-27 2019-09-27 Heat dissipation device for LED module Expired - Fee Related CN210266947U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921625901.4U CN210266947U (en) 2019-09-27 2019-09-27 Heat dissipation device for LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921625901.4U CN210266947U (en) 2019-09-27 2019-09-27 Heat dissipation device for LED module

Publications (1)

Publication Number Publication Date
CN210266947U true CN210266947U (en) 2020-04-07

Family

ID=70019864

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921625901.4U Expired - Fee Related CN210266947U (en) 2019-09-27 2019-09-27 Heat dissipation device for LED module

Country Status (1)

Country Link
CN (1) CN210266947U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A heat dissipation device for LED module

Effective date of registration: 20211118

Granted publication date: 20200407

Pledgee: Bank of China Limited Taihe sub branch

Pledgor: Jiangxi Xinhe Photoelectric Technology Co.,Ltd.

Registration number: Y2021980012709

PE01 Entry into force of the registration of the contract for pledge of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200407