CN216383654U - Array type combined LED module - Google Patents
Array type combined LED module Download PDFInfo
- Publication number
- CN216383654U CN216383654U CN202123158470.5U CN202123158470U CN216383654U CN 216383654 U CN216383654 U CN 216383654U CN 202123158470 U CN202123158470 U CN 202123158470U CN 216383654 U CN216383654 U CN 216383654U
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- Prior art keywords
- heat dissipation
- aluminum substrate
- plate
- fixedly arranged
- led module
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 71
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000009413 insulation Methods 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 244000309464 bull Species 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses an array type combined LED module, which comprises an aluminum substrate, wherein a plurality of LED lamps are mounted on the top surface of the aluminum substrate, a driving plate is arranged on the back surface of the aluminum substrate, mounting columns are fixedly arranged on one end surface of the driving plate, mounting plates are fixedly arranged at the other ends of the mounting columns, threaded holes are formed in the mounting plates, the mounting plates are fixed on the back surface of the aluminum substrate through the threaded holes in a matched manner by screws, and heat dissipation channels are arranged on the back surface of the aluminum substrate. Has the advantages that: the array type combined LED module of the device adopts the aluminum substrate and the heat dissipation fan blades to dissipate heat together, so that the heat is effectively dissipated, and the service life of the LED lamp is ensured.
Description
Technical Field
The utility model relates to the field of LED modules, in particular to an array type combined LED module.
Background
With the continuous development of the security industry, based on the urgent needs of market practice, the array infrared camera adopts an innovative semiconductor technology on the basis of the original LED infrared technology to arrange high-performance luminescent crystals in an array manner, and forms a high-power light-emitting diode array through special packaging. The high-power light-emitting diode array has large heat productivity, and the heat cannot be effectively dissipated through a PCB (printed circuit board) (namely a driving board), so that the service life of the camera is seriously restricted.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to an array-type combined LED module to solve the above problems.
In order to achieve the purpose, the utility model provides the following technical scheme:
the array type combined LED module comprises an aluminum substrate, wherein a plurality of LED lamps are mounted on the top surface of the aluminum substrate, a drive plate is arranged on the back surface of the aluminum substrate, an installation column is fixedly arranged on one end surface of the aluminum substrate, an installation plate is fixedly arranged at the other end of the installation column, a threaded hole is formed in the installation plate, the installation plate is fixed to the back surface of the aluminum substrate through the threaded hole and matched with screws, a heat dissipation channel is arranged on the back surface of the aluminum substrate, an air flowing area is formed between the aluminum substrate and the drive plate, an electric groove is formed in the middle of the front surface of the drive plate, a heat insulation driving power supply is fixedly arranged in the electric groove through a support, a heat dissipation disc is arranged on the heat insulation driving power supply, a plurality of heat dissipation fan blades are mounted on the heat dissipation disc, and an auxiliary heat dissipation mechanism is arranged on the aluminum substrate.
Furthermore, the number of the LED lamps is four, the LED lamps are symmetrically arranged on the aluminum substrate, the heat dissipation channels are a plurality of heat dissipation channels arranged on the back of the aluminum substrate, and copper heat dissipation fins are uniformly distributed on the inner walls of the heat dissipation channels.
Further, thermal-insulated drive power supply includes driving motor and sound-proof housing, the support with sound-proof housing fixed connection, driving motor sets up in the sound-proof housing, just driving motor's output is equipped with the bull stick, the bull stick is worn out the sound-proof housing and with heat dissipation dish fixed connection.
Further, vice heat dissipation mechanism is including seting up four flowing grooves of aluminium base plate top surface, the LED lamp is installed respectively and is corresponded in the flowing groove, the spread groove has been seted up at aluminium base plate top surface middle part, the spread groove bottom surface is solid form, spread groove top surface cooperation fix with screw is equipped with the top surface apron, the flowing groove with communicate each other through the intercommunication pipeline between the spread groove, the fixed bearing that is equipped with through the support is fixed to the spread groove inner wall, the inner circle inner wall of bearing is fixed and is equipped with the connection pole, it is fixed and is equipped with the connection pad to connect the pole top surface, the fixed a plurality of vice heat dissipation fan blade that is equipped with on the connection pad surface, the heat dissipation dish with connect through coupling mechanism between the connection pole.
Furthermore, coupling mechanism is including fixing round bar on the heat dissipation dish and the square pole of fixing on the round bar, set up on the connecting slot bottom surface and supply the circular mouth of wearing that the round bar passed, connect at the bottom of the round bar inside set up with square pole assorted square slot.
Compared with the prior art, the utility model has the following beneficial effects:
the aluminum substrate and the driving plate are installed, and the installation columns are arranged between the aluminum substrate and the driving plate, so that an air flowing interval is formed between the aluminum substrate and the driving plate after installation, and the air flowing interval is convenient for arrangement of heat dissipation blades.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a front view of an array-type assembled LED module according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a driving board of an array type combined LED module according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a heat dissipation channel of an array-type LED module according to an embodiment of the present invention;
fig. 4 is a schematic view of a connection mechanism of an array-type combined LED module according to an embodiment of the utility model.
Reference numerals:
1. an aluminum substrate; 2. an LED lamp; 3. a drive plate; 4. mounting a column; 5. mounting a plate; 6. a threaded hole; 7. an electrical slot; 8. a support; 9. a heat dissipation plate; 10. a heat dissipation fan blade; 11. a heat dissipation channel; 12. a copper heat sink; 13. a drive motor; 14. a sound-proof housing; 15. a flow channel; 16. connecting grooves; 17. a top cover plate; 18. a communicating pipe; 19. a bearing; 20. connecting the round rod; 21. a connecting disc; 22. an auxiliary heat dissipation fan blade; 23. a round bar; 24. a square rod; 25. and a square slot.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
in order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited to the specific embodiments of the present disclosure.
The first embodiment is as follows:
referring to fig. 1-4, an array type combined LED module according to an embodiment of the present invention includes an aluminum substrate 1, a plurality of LED lamps 2 are mounted on a top surface of the aluminum substrate 1, a driving plate 3 is disposed on a back surface of the aluminum substrate 1, a mounting post 4 is fixedly disposed on an end surface of the driving plate 3 on the aluminum substrate 1, a mounting plate 5 is fixedly disposed at another end of the mounting post 4, a threaded hole 6 is disposed on the mounting plate 5, the mounting plate 5 is fixed on the back surface of the aluminum substrate 1 through the threaded hole 6 in cooperation with a screw, a heat dissipation channel is disposed on the back surface of the aluminum substrate 1, an air flow area is disposed between the aluminum substrate 1 and the driving plate 3, an electrical slot 7 is disposed in a middle portion of a front surface of the driving plate 3, a heat insulation driving power supply is fixedly disposed in the electrical slot 7 through a bracket 8, and a heat dissipation plate 9 is disposed on the heat insulation driving power supply, the heat dissipation plate 9 is provided with a plurality of heat dissipation fan blades 10, and the aluminum substrate 1 is provided with an auxiliary heat dissipation mechanism.
Example two:
referring to fig. 3, the number of the LED lamps 2 is four, the LED lamps 2 are symmetrically mounted on the aluminum substrate 1, the heat dissipation channels are a plurality of heat dissipation channels 11 formed on the back surface of the aluminum substrate 1, and copper heat dissipation fins 12 are uniformly distributed on the inner walls of the heat dissipation channels 11.
Through the scheme of the utility model, the beneficial effects are as follows: the LED lamps 2 are symmetrically arranged on the aluminum substrate 1 to form all-dimensional light emission, the light is respectively blown to the back of the aluminum substrate 1 and also blown into the heat dissipation channel 11, and the designed copper heat dissipation fins 12 increase the heated area, so that the heat dissipation effect is better.
Example three:
referring to fig. 2, the heat insulation driving power supply includes a driving motor 13 and a sound-proof housing 14, the support 8 is fixedly connected to the sound-proof housing 14, the driving motor 13 is disposed in the sound-proof housing 14, and a rotating rod is disposed at an output end of the driving motor 13, and penetrates through the sound-proof housing 14 and is fixedly connected to the heat dissipation plate 9.
Through the scheme of the utility model, the beneficial effects are as follows: the driving motor 13 is connected with the heat dissipation disc 9 through the rotating rod, so that the heat dissipation fan blades 10 on the heat dissipation disc 9 are driven to rotate to generate wind energy, and the driving motor 13 is designed in the sound-proof housing 14, so that the motor is wrapped and sound-proof, and noise cannot be generated in the heat dissipation process.
Example four:
referring to fig. 1-4, the auxiliary heat dissipation mechanism includes four flow grooves 15 formed in the top surface of the aluminum substrate 1, the LED lamps 2 are respectively installed in the corresponding flow grooves 15, a connection groove 16 is formed in the middle of the top surface of the aluminum substrate 1, the bottom surface of the connection groove 16 is solid, a top surface cover plate 17 is fixedly installed on the top surface of the connection groove 16 by screws, the flow grooves 15 and the connection groove 16 are communicated with each other through a communication pipe 18, a bearing 19 is fixedly installed on the inner wall of the connection groove 16 through a bracket, a connection round rod 20 is fixedly installed on the inner ring inner wall of the bearing 19, a connection disc 21 is fixedly installed on the top surface of the connection round rod 20, a plurality of auxiliary heat dissipation blades 22 are fixedly installed on the outer surface of the connection disc 21, the heat dissipation disc 9 is connected with the connection round rod 20 through a connection mechanism, the connection mechanism includes a round rod 23 fixed on the heat dissipation disc 9 and a square rod 24 fixed on the round rod 23, a circular through opening for the round rod 23 to pass through is formed in the bottom surface of the connecting groove 16, and a square slot 25 matched with the square rod 24 is formed in the bottom of the connecting round rod 20.
Through the scheme of the utility model, the beneficial effects are as follows: note that after the aluminum substrate 1 and the driving board 3 are mounted, the round rod 23 on the designed heat dissipation plate 9 will pass through the round through hole on the bottom surface of the connecting groove 16, the round through hole is also arranged on the bottom surface of the driving board 3, the round rod 23 at this time will be inserted into the connecting groove 16, the square rod 24 on the round rod 23 needs to be inserted into the square slot 25 arranged at the bottom of the connecting round rod 20, when the connection disc 21 is inserted into the square slot 25, the connection disc 21 can be manually rotated to align the square rod 24 in the square slot 25, after the mounting, the aluminum substrate 1 and the driving board 3 are fixedly connected through the designed mounting plate 5 and the screw, then the top cover plate 17 is fixedly covered to form a cavity inside the connecting groove 16, the heat dissipation plate 9, the round rod 23, the square rod 24, the connecting round rod 20 and the connection disc 21 are connected into a whole, therefore when the motor rotates, the connecting disc 21 on the connecting round rod 20 is also driven to rotate, and finally the heat dissipation fan blade 10 and the auxiliary heat dissipation fan blade 22 can be driven to rotate together at one time;
the wind generated by the rotation of the heat dissipation fan blade 10 corresponds to the back of the aluminum substrate 1, so that the aluminum substrate 1 dissipates heat;
the auxiliary heat dissipation fan blade 22 rotates to generate wind corresponding to the connecting groove 16, then the wind can be blown to the flow groove 15 along the connecting pipeline 18, and the top surface of the flow groove 15 is in an opening shape, so that the design can perform wind blowing heat dissipation on the top surface of the aluminum substrate 1, the wind blowing heat dissipation mainly acts on the flow groove 15 on the top surface of the aluminum substrate 1, and the inner wall of the flow groove 15 can be designed with heat dissipation fins, so that the heat dissipation efficiency is further improved;
note that the secondary heat dissipation fan blades 22 are lower than the communication duct 18.
For the convenience of understanding the above technical solutions of the present invention, the following detailed description is made of the working principle or the operation mode of the present invention in the practical process:
in practical application, the aluminum substrate 1 and the driving plate 3 are installed, and the installation columns 4 are arranged between the installation, so that an air flowing interval is formed between the aluminum substrate 1 and the driving plate 3 after the installation, the air flowing interval is convenient for arrangement of the heat dissipation fan blades 10, and in the process that the heat insulation driving power supply drives the heat dissipation disc 9 to rotate, heat dissipation air is generated between the air flowing intervals and blown to the back of the aluminum substrate 1 to dissipate heat of the aluminum substrate 1.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The array type combined LED module is characterized by comprising an aluminum substrate (1), a plurality of LED lamps (2) are mounted on the top surface of the aluminum substrate (1), a driving plate (3) is arranged on the back surface of the aluminum substrate (1), a mounting column (4) is fixedly arranged on one end surface of the driving plate (3) located on the aluminum substrate (1), a mounting plate (5) is fixedly arranged at the other end of the mounting column (4), a threaded hole (6) is formed in the mounting plate (5), the mounting plate (5) is fixed on the back surface of the aluminum substrate (1) through the threaded hole (6) and a screw, a heat dissipation channel is arranged on the back surface of the aluminum substrate (1), an air flowing interval is formed between the aluminum substrate (1) and the driving plate (3), an electric tank (7) is formed in the middle of the front surface of the driving plate (3), and a heat insulation driving power supply is fixedly arranged in the electric tank (7) through a support (8), the heat insulation driving power supply is provided with a heat dissipation disc (9), the heat dissipation disc (9) is provided with a plurality of heat dissipation fan blades (10), and the aluminum substrate (1) is provided with an auxiliary heat dissipation mechanism.
2. The array type combined LED module as claimed in claim 1, wherein the number of the LED lamps (2) is four, the LED lamps (2) are symmetrically mounted on the aluminum substrate (1), the heat dissipation channels are heat dissipation channels (11) formed on the back surface of the aluminum substrate (1), and copper heat dissipation fins (12) are uniformly distributed on the inner walls of the heat dissipation channels (11).
3. The array type combined LED module according to claim 1, wherein the heat insulation driving power supply comprises a driving motor (13) and a sound insulation cover (14), the support (8) is fixedly connected with the sound insulation cover (14), the driving motor (13) is arranged in the sound insulation cover (14), a rotating rod is arranged at an output end of the driving motor (13), and the rotating rod penetrates out of the sound insulation cover (14) and is fixedly connected with the heat dissipation plate (9).
4. The array type combined LED module according to claim 1, wherein the secondary heat dissipation mechanism comprises four flow grooves (15) formed in the top surface of the aluminum substrate (1), the LED lamps (2) are respectively installed in the corresponding flow grooves (15), a connection groove (16) is formed in the middle of the top surface of the aluminum substrate (1), the bottom surface of the connection groove (16) is solid, a top cover plate (17) is fixedly arranged on the top surface of the connection groove (16) by matching with a screw, the flow grooves (15) and the connection groove (16) are mutually communicated through a communication pipeline (18), a bearing (19) is fixedly arranged on the inner wall of the connection groove (16) through a bracket, a connection round rod (20) is fixedly arranged on the inner ring inner wall of the bearing (19), a connection pad (21) is fixedly arranged on the top surface of the connection round rod (20), and a plurality of secondary heat dissipation fan blades (22) are fixedly arranged on the outer surface of the connection pad (21), the heat dissipation disc (9) is connected with the connecting round rod (20) through a connecting mechanism.
5. The array type combined LED module according to claim 4, wherein the connecting mechanism comprises a round bar (23) fixed on the heat dissipation plate (9) and a square bar (24) fixed on the round bar (23), a round through hole for the round bar (23) to pass through is opened on the bottom surface of the connecting groove (16), and a square slot (25) matched with the square bar (24) is opened inside the bottom of the connecting round bar (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123158470.5U CN216383654U (en) | 2021-12-15 | 2021-12-15 | Array type combined LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123158470.5U CN216383654U (en) | 2021-12-15 | 2021-12-15 | Array type combined LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216383654U true CN216383654U (en) | 2022-04-26 |
Family
ID=81236147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123158470.5U Expired - Fee Related CN216383654U (en) | 2021-12-15 | 2021-12-15 | Array type combined LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216383654U (en) |
-
2021
- 2021-12-15 CN CN202123158470.5U patent/CN216383654U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220426 |
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| CF01 | Termination of patent right due to non-payment of annual fee |