CN215118940U

CN215118940U - Light-emitting diode with long service life

Info

Publication number: CN215118940U
Application number: CN202121591273.XU
Authority: CN
Inventors: 王善国; 王晓磊
Original assignee: Jiangsu Yfsemi Microelectronics Co ltd
Current assignee: Jiangsu Yfsemi Microelectronics Co ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-12-10
Anticipated expiration: 2031-07-14

Abstract

The utility model discloses a long service life's emitting diode relates to diode technical field, for solving the in-process that uses at emitting diode among the prior art can produce a large amount of heats, and these heats can influence the life cycle of emitting diode wafer, lead to the problem that the emitting diode life-span reduces. Including epoxy package baotou and positive pole conducting strip, the heat conduction crown plate is installed in the outside of epoxy package baotou, and epoxy package baotou and heat conduction crown plate pass through hot melt adhesive fixed connection, the heat dissipation ring piece is installed in the outside of heat conduction crown plate, and heat conduction ring plate and heat dissipation ring piece fusion welding are connected, the inside of heat dissipation ring piece is provided with the radiating through hole, the heat conduction ring piece is installed to the inboard of heat conduction ring plate, and heat conduction ring plate and heat conduction ring piece fusion welding are connected, the connection bottom plate is installed to the below of heat conduction ring plate, and heat conduction ring plate and connection bottom plate fusion welding are connected.

Description

Light-emitting diode with long service life

Technical Field

The utility model relates to a diode technical field specifically is a long service life's emitting diode.

Background

With the continuous progress of society, the human society develops from the old civilizations to the present scientific and technological civilizations, and with the diligent study of the scientists of one generation and the next generation, our lives are convenient and fast nowadays, and the light emitting diode is a commonly used light emitting component, can efficiently convert electric energy into light energy, has wide application in the modern society, such as flat panel display, illumination, medical devices and the like, has faster reaction speed, and can be immediately lightened as long as a power supply is connected, so the light emitting diode is very convenient to use.

However, a lot of heat is generated during the use of the led, and the heat affects the life cycle of the led chip, resulting in the reduction of the life of the led; therefore, the market is urgently in need of developing a light-emitting diode with long service life to help people to solve the existing problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a long service life's emitting diode to the in-process that provides in solving above-mentioned background art and using at emitting diode can produce a large amount of heats, and these heats can influence the life cycle of emitting diode wafer, lead to the problem that the emitting diode life-span reduces.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a long service life's emitting diode, includes epoxy package baotou and positive pole conducting strip, the heat conduction crown plate is installed in the outside of epoxy package baotou, and epoxy package baotou and heat conduction crown plate pass through hot melt adhesive fixed connection, the heat dissipation ring piece is installed in the outside of heat conduction crown plate, and heat conduction crown plate and heat dissipation ring piece fusion welding are connected, the inside of heat dissipation ring piece is provided with the radiating through hole, the heat conduction ring piece is installed to the inboard of heat conduction ring plate, and heat conduction ring plate and heat conduction ring piece fusion welding are connected.

Preferably, the connection bottom plate is installed to the below of heat conduction ring board, and heat conduction ring board and connection bottom plate fusion welding are connected, the installation sleeve is installed to the below of connection bottom plate, and connects bottom plate and installation sleeve welded connection, the inside of installation sleeve is provided with connecting grooves.

Preferably, the inside of connecting groove is provided with first joint, and first joint and positive pole guide card fixed connection, the positive pole connecting rod is installed to the below of first joint, and first joint and positive pole connecting rod fixed connection.

Preferably, the inside of connecting groove is provided with the second and connects, the cathode connecting rod is installed to the below of second joint, and second joint and cathode connecting rod fixed connection, the negative pole guide vane is installed to the top of second joint, and second joint and negative pole guide vane fixed connection, the negative pole guide vane runs through installation sleeve and connecting bottom plate, and pierces into the inside of epoxy baotou.

Preferably, the top of cathode guide piece is provided with the elargol, the top of elargol is provided with the wafer, and wafer and cathode guide piece pass through elargol fixed connection, the outside of wafer is provided with the reflector, and reflector and cathode guide piece fixed connection.

Preferably, an anode gold wire is arranged above the wafer and fixedly connected with the anode gold wire, and one end of the anode gold wire, far away from the wafer, is fixedly connected with the anode guide sheet.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a setting through heat conduction ring board, wherein be provided with heat dissipation ring piece and heat conduction ring piece respectively in the both sides of heat conduction ring board, setting through heat conduction ring piece, can come out the heat fast transmission that emitting diode work produced, the setting of rethread heat dissipation ring piece, make the heat volatilize away, be provided with the heat dissipation through-hole in the inside of heat dissipation ring piece simultaneously, can increase the mobility of heat dissipation ring piece and air, make the air can more convenient pass the heat dissipation ring piece, dispel the heat, the heat-sinking capability to emitting diode has been improved, the service life of emitting diode has been increased.

2. The utility model discloses a through the setting of installation sleeve, be provided with connecting groove in installation sleeve's inside, be provided with the connector of negative and positive guide plate in connecting groove's inside, prevent to connect the position and take place the rupture, improved the protective capacities to connecting the position, increased emitting diode's installation stability.

Drawings

Fig. 1 is a schematic view of a long-life led of the present invention;

FIG. 2 is an enlarged schematic view of the part A of the present invention;

fig. 3 is a cross-sectional view of a long-life led of the present invention.

In the figure: 1. epoxy resin wrapping heads; 2. a heat conductive ring plate; 3. a heat dissipating ring sheet; 4. connecting the bottom plate; 5. installing a sleeve; 6. an anode connecting rod; 7. a cathode connecting rod; 8. a heat dissipating through hole; 9. a heat conductive ring sheet; 10. an anode lead; 11. an anode gold wire; 12. a wafer; 13. silver glue; 14. a light reflecting bowl; 15. a cathode lead; 16. a first joint; 17. a connecting groove; 18. a second joint.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, the present invention provides an embodiment: a long-life light-emitting diode, including epoxy resin Baotou 1 and positive pole conducting strip 10, the outside of the epoxy resin Baotou 1 is fitted with the heat-conducting annular plate 2, and the epoxy resin Baotou 1 is fixedly connected with heat-conducting annular plate 2 through the hot melt adhesive, the heat-conducting annular plate 2 is inserted into the inside of the epoxy resin Baotou 1, the outside of the heat-conducting annular plate 2 is fitted with the heat-dissipating annular plate 3, and the heat-conducting annular plate 2 is connected with heat-dissipating annular plate 3 by fusion welding, the arrangement of the heat-dissipating annular plate 3, can carry on the heat dissipation to the heat-conducting annular plate 2, improve the heat-dissipating capacity of the light-emitting diode, the inside of the heat-dissipating annular plate 3 is provided with the heat-dissipating through hole 8, the arrangement of the heat-dissipating through hole 8, can improve the heat-dissipating efficiency of the heat-dissipating annular plate 3, the inside of the heat-conducting annular plate 2 is fitted with the heat-conducting annular plate 9, the arrangement of the heat-conducting annular plate 9, can transmit the temperature of the light-emitting diode fast to the inside, meanwhile, the heat conducting ring plate 2, the heat radiating ring pieces 3 and the heat conducting ring pieces 9 are all made of die-casting aluminum alloy materials, and the die-casting aluminum alloy materials have good heat transfer performance, so that the heat radiating capacity of the light emitting diode can be improved.

Further, the top of negative pole guide 15 is provided with silver colloid 13, the setting of silver colloid 13 not only can be fixed wafer 12, can also conduct electricity, the top of silver colloid 13 is provided with wafer 12, and wafer 12 leads 15 with the negative pole and passes through silver colloid 13 fixed connection, the outside of wafer 12 is provided with reflector 14, and reflector 14 leads 15 fixed connection with the negative pole, reflector 14's setting can concentrate and reflect the light source of wafer 12, light emitting diode's luminance has been increased.

Further, an anode gold wire 11 is disposed above the wafer 12, and the wafer 12 is fixedly connected to the anode gold wire 11, one end of the anode gold wire 11, which is far away from the wafer 12, is fixedly connected to the anode lead 10, and the anode gold wire 11 is disposed to electrically connect the wafer 12 to the anode lead 10 for current transportation, so that the light emitting diode can normally operate.

Further, connecting bottom plate 4 is installed to the below of heat conduction ring board 2, and heat conduction ring board 2 with be connected 4 fusion welding of bottom plate and be connected, connecting bottom plate 4's setting improves the fixity that heat conduction ring board 2 is fixed, mounting sleeve 5 is installed to the below of connecting bottom plate 4, and connecting bottom plate 4 and mounting sleeve 5 welded connection, mounting sleeve 5's inside is provided with connecting groove 17, connecting groove 17's setting can protect negative pole guide 15 and negative pole connecting rod 7, positive pole guide 10 and positive pole connecting rod 6's junction.

Further, the inside of connecting groove 17 is provided with first joint 16, and first joint 16 and positive pole conducting strip 10 fixed connection, and first joint 16's setting makes positive pole conducting strip 10 and positive pole connecting rod 6 can electric connection, and positive pole connecting rod 6 is installed to the below of first joint 16, and first joint 16 and positive pole connecting rod 6 fixed connection, and the length of positive pole connecting rod 6 is longer than the length of negative pole connecting rod 7, increases the degree of distinguishing of the positive negative pole of emitting diode.

Further, a second joint 18 is arranged inside the connecting groove 17, the second joint 18 is arranged to enable the cathode lead 15 and the cathode connecting rod 7 to be electrically connected, the cathode connecting rod 7 is installed below the second joint 18, the second joint 18 and the cathode connecting rod 7 are fixedly connected, the cathode lead 15 is installed above the second joint 18, the second joint 18 and the cathode lead 15 are fixedly connected, the cathode lead 15 penetrates through the installing sleeve 5 and the connecting bottom plate 4 and penetrates into the epoxy resin ferrule 1, and the epoxy resin ferrule 1 is arranged to insulate the light emitting diode and prevent static electricity from damaging the wafer 12.

The working principle is as follows: during the use, effect through positive pole connecting rod 6 and negative pole connecting rod 7, in inserting the emitting diode into the circuit, after the intercommunication circuit, wafer 12 gives out light, effect through reflector 14, can concentrate and reflect the light source of wafer 12, emitting diode's luminance has been increased, effect through heat conduction ring piece 9, can give heat conduction ring plate 2 with the heat rapid transfer that emitting diode work produced, rethread heat dissipation ring piece 3's effect, make the heat volatilize away, reduce the inside temperature of emitting diode, simultaneously through the effect of heat dissipation through-hole 8, can increase the mobility of heat dissipation ring piece 3 and air, make the air can more convenient pass heat dissipation ring piece 3 and dispel the heat, further improve emitting diode's heat-sinking capability, emitting diode's life has been increased.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A long-life LED, including epoxy resin Baotou (1) and positive pole guide vane (10), characterized by that: heat-conducting ring board (2) are installed in the outside of epoxy baotou (1), and epoxy baotou (1) and heat-conducting ring board (2) pass through hot melt adhesive fixed connection, heat dissipation ring piece (3) are installed in the outside of heat-conducting ring board (2), and heat-conducting ring board (2) and heat dissipation ring piece (3) fusion welding are connected, the inside of heat dissipation ring piece (3) is provided with radiating hole (8), heat-conducting ring piece (9) are installed to the inboard of heat-conducting ring board (2), and heat-conducting ring board (2) and heat-conducting ring piece (9) fusion welding are connected.

2. A long-life light emitting diode according to claim 1, wherein: connecting bottom plate (4) are installed to the below of heat conduction ring board (2), and heat conduction ring board (2) with be connected bottom plate (4) fusion welding and be connected, install installing sleeve (5) below of connecting bottom plate (4), and connecting bottom plate (4) and installing sleeve (5) welded connection, the inside of installing sleeve (5) is provided with coupling groove (17).

3. A long-life light emitting diode according to claim 2, wherein: the inside of coupling groove (17) is provided with first joint (16), and first joint (16) and positive pole conducting strip (10) fixed connection, positive pole connecting rod (6) are installed to the below of first joint (16), and first joint (16) and positive pole connecting rod (6) fixed connection.

4. A long-life light emitting diode according to claim 2, wherein: the inside of coupling groove (17) is provided with second joint (18), negative pole connecting rod (7) are installed to the below of second joint (18), and second joint (18) and negative pole connecting rod (7) fixed connection, negative pole guide vane (15) are installed to the top of second joint (18), and second joint (18) and negative pole guide vane (15) fixed connection, negative pole guide vane (15) run through installation sleeve (5) and connection bottom plate (4), and wear into the inside of epoxy baotou (1).

5. The LED of claim 4, wherein: the top of negative pole guide vane (15) is provided with silver colloid (13), the top of silver colloid (13) is provided with wafer (12), and wafer (12) and negative pole guide vane (15) pass through silver colloid (13) fixed connection, the outside of wafer (12) is provided with reflector (14), and reflector (14) and negative pole guide vane (15) fixed connection.

6. A long-life LED according to claim 5, wherein: an anode gold thread (11) is arranged above the wafer (12), the wafer (12) is fixedly connected with the anode gold thread (11), and one end, far away from the wafer (12), of the anode gold thread (11) is fixedly connected with an anode guide sheet (10).