CN101943356A - Backlight module and luminous source encapsulation structure thereof - Google Patents
Backlight module and luminous source encapsulation structure thereof Download PDFInfo
- Publication number
- CN101943356A CN101943356A CN2010102307872A CN201010230787A CN101943356A CN 101943356 A CN101943356 A CN 101943356A CN 2010102307872 A CN2010102307872 A CN 2010102307872A CN 201010230787 A CN201010230787 A CN 201010230787A CN 101943356 A CN101943356 A CN 101943356A
- Authority
- CN
- China
- Prior art keywords
- column
- light emitting
- combined
- radiating seat
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses a backlight module and a luminous source encapsulation structure thereof. The luminous source encapsulation structure comprises a heat radiating seat, at least one chip and a heat radiating and fixing piece, wherein the heat radiating seat is provided with a combining hole, the heat radiating and fixing piece additionally comprises a combining post and a heat radiating fin with a butt surface, the combining post passes through a through hole of a fixing plate and is combined with the combining hole, the butt surface of the heat radiating fin is supported on the fixing plate, therefore, the heat radiating seat and the heat radiating and fixing piece can be stably combined on both sides of the fixing plate in order to ensure the tight binding relation with the fixing plate and increase assembling reliability, meanwhile, the heat radiating fin can be used for increasing the heat radiating effect of the heat radiating seat in extra, and therefore, the heat radiating fin can assuredly help the chip to reduce temperature in order to avoid the work efficiency reduction of the chip and is beneficial to ensuring that the chip stably operates and prolonging the service life.
Description
[technical field]
The invention relates to a kind of backlight module and light emitting source packaging structure thereof, particularly utilize the heat radiation fixture firm light emitting source packaging structure is combined on the fixed head relevant for a kind of, and by radiating fin with light emitting source packaging structure that dispels the heat and backlight module with described light emitting source packaging structure.
[background technology]
LCD (liquid crystal display, LCD) be to utilize the characteristic of liquid crystal material to come a kind of panel display apparatus (flat panel display of display image, FPD), it has more advantages such as frivolous, low driving voltage and low-power consumption compared to other display unit, has become the main product on the whole consumption market.Yet the liquid crystal material of LCD can't be from main light emission, must be by the external light source that provides, so be provided with backlight module in the LCD again in addition so that required light source to be provided.
Generally speaking, backlight module can be divided into side backlight module and two kinds of forms of end backlight module.Known backlight module mainly is as light source with cold cathode fluorescent tube (CCFL), thermic cathode fluorimetric pipe (HCFL) and semiconductor luminous assembly, and semiconductor luminous assembly mainly is to utilize light emitting diode (LED) to carry out luminous, it is compared to cathode fluorescent tube more power and energy saving, longer service life, and volume is more light and handy, thereby the trend that replaces cathode fluorescent tube gradually, light emitting diode are arranged will be the backlight liquid crystal display module main light source in future.
Now, light emitting diode is many to carry out semiconductor packages with the form of chip, with as the LED package structure, engages with the fixed head of backlight module more at last.Yet, the shortcoming of LED package structure is the extreme temperatures in its course of work, if the heat energy that the fixed head of backlight module can't in time produce the LED package structure is taken away, then not only can cause near the temperature of LED package structure obviously to raise, cause each viewing area deblocking temperature inequality of LCD, and near the demonstration block Yin Wendu of LCD panel that also may be LED package structure is too high and general red phenomenon occurs, so will influence the image quality of LCD.Moreover light emitting diode itself very easily influences its luminous efficiency and working stability degree because of the temperature rise of the course of work, so also may reduce its service life because of the state that is in high temperature for a long time.In addition, if the LED package structure only is simply to utilize adhesive agent to be cemented on the fixed head or only is to utilize the screw lock to pay on fixed head, then owing to be not direct hot the contact between LED package structure and the fixed head, or existed the adhesive agent of insulation or surface between the two closely not to amplexiform between the two, therefore will on certain degree, influence its radiating efficiency.In addition, be in for a long time under the state of high temperature, adhesive agent also may go bad deterioration and lose stickiness, cause the LED package structure to break away from fixed head, take away when firm and hard if the heat energy of LED package structure can't be fixed, then will there be overheated potential risk of burning in the LED package structure.
So being necessary really provides a kind of light emitting source packaging structure to the light emitting diode of backlight module, to solve the existing in prior technology heat dissipation problem.
[summary of the invention]
Main purpose of the present invention is to provide a kind of backlight module and light emitting source packaging structure thereof, comprise radiating seat, chip and heat radiation fixture, wherein radiating seat has combined hole in addition, the heat radiation fixture comprises column and the radiating fin with a bearing surface in addition, heat radiation fixture and radiating seat firmly can be combined in the both sides of the fixed head of backlight module by column and combined hole, and bearing surface can be guaranteed and fixed head between the relation of closely amplexiforming and promote the assembling reliability; Simultaneously, the heat radiation fixture also can additionally increase radiating effect by the radiating fin of heat radiation fixture in addition, therefore also can help chip to reduce temperature really, avoids chip operation efficient to reduce, so also help making the chip steady operation and increasing the service life.
Secondary objective of the present invention is to provide a kind of backlight module and light emitting source packaging structure thereof, wherein the first surface of the radiating seat of light emitting source packaging structure have combined hole, the heat radiation fixture column have screw thread or spring, the column of heat radiation fixture is fixed in the combined hole of radiating seat by screw thread or spring, helps increasing the assembling intensity of column and combined hole.
Another object of the present invention is to provide a kind of backlight module and light emitting source packaging structure thereof, wherein the combined hole of the column of the heat radiation fixture of light emitting source packaging structure and radiating seat has depression or projection respectively, and depression and projection are corresponding chimeric, help increasing the assembling intensity of column and combined hole.
For reaching aforementioned purpose of the present invention, the invention provides a kind of backlight module, described backlight module comprises: at least one light emitting source packaging structure respectively comprises: a radiating seat has a combined hole; Reach a heat radiation fixture, have a column and a radiating fin with a bearing surface; And a fixed head, have at least one through hole; The described through hole that the described column of wherein said heat radiation fixture passes described fixed head combines with described combined hole, the bearing surface of described radiating fin is connected on the described fixed head, makes described radiating seat and described heat radiation fixture firmly be combined in the both sides of described fixed head.
Moreover, the invention provides another kind of light emitting source packaging structure, described light emitting source packaging structure comprises: a support plate has an embedding hole; One radiating seat is embedded in the described embedding hole of described support plate, and described radiating seat has a first surface, a second surface and a combined hole, and wherein said combined hole is to be opened in described first surface; At least one chip is arranged at the described second surface of described radiating seat, and is electrically connected at described support plate; Reach a heat radiation fixture, be provided with a column and the radiating fin with a bearing surface, wherein said column combines with described combined hole, has an assembling spacing between described bearing surface and the described radiating seat.
In one embodiment of this invention, described at least one light emitting source packaging structure, other comprises: a support plate, have an embedding hole, wherein said radiating seat is located in the described embedding hole of described support plate; And at least one chip, be electrically connected at described support plate.
In one embodiment of this invention, the described column of described heat radiation fixture has a screw thread or a spring in addition, so that described column is combined in the combined hole of described radiating seat.
In one embodiment of this invention, the described column of described heat radiation fixture has at least one projection in addition, and described combined hole has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are chimeric mutually, so that described column is combined in the described combined hole of described radiating seat.
In one embodiment of this invention, the described combined hole of described radiating seat has at least one projection in addition, and described column has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are chimeric mutually, so that described column is combined in the described combined hole of described radiating seat.
In one embodiment of this invention, described projection is salient point, bulge loop or convex arc section, and corresponding described depression is concave point, concave ring groove or concave arc groove.
In one embodiment of this invention, described fixed head is a backboard or a light emitting source pedestal.
In one embodiment of this invention, described chip is a light-emitting diode chip for backlight unit.
In one embodiment of this invention, the described second surface of described radiating seat comprises a groove in addition, and described chip is to be arranged on the described groove.Described support plate is circuit substrate or lead frame, and described chip is electrically connected at described support plate by several lead-in wires or several projections.
Compared with prior art, backlight module of the present invention and light emitting source packaging structure thereof are to utilize the combined hole of the column of heat radiation fixture and radiating seat with stable being fixed on the described fixed head of described light emitting source packaging structure, so not only can simplify the assembling of light emitting source packaging structure and promote the assembling reliability, and radiating seat can be sent to heat energy the radiating fin of heat radiation fixture by the heat conduction, help chip cooling by radiating fin, to avoid chip overheating to cause operating efficiency to reduce, help making the chip steady operation and increase the service life.
[description of drawings]
Fig. 1 is the schematic diagram of the light emitting source packaging structure of the present invention's first preferred embodiment backlight module.
Fig. 2 is the schematic diagram of the present invention's second preferred embodiment light emitting source packaging structure.
Fig. 3 is the schematic diagram of the present invention's the 3rd preferred embodiment light emitting source packaging structure.
Fig. 4 is the schematic diagram of the present invention's the 4th preferred embodiment light emitting source packaging structure.
Fig. 5 is the schematic diagram of the present invention's the 5th preferred embodiment light emitting source packaging structure.
Fig. 6 is the schematic diagram of the present invention's the 6th preferred embodiment light emitting source packaging structure.
[specific embodiment]
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and conjunction with figs. are described in detail below.Moreover, the direction term that the present invention mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side ", " interior ", " outward ", " side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to restriction the present invention.
Please refer to shown in Figure 1, the schematic diagram of the light emitting source packaging structure of the backlight module of its announcement the present invention first preferred embodiment, wherein the backlight module 10 of the present invention's first preferred embodiment is mainly used in LCD (LCD) field, described backlight module 10 mainly comprises an at least one light emitting source packaging structure 100 and a fixed head 200, and wherein said light emitting source packaging structure 100 respectively comprises a support plate 110, a radiating seat 120, a chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160 again.The present invention will be in hereinafter describing above-mentioned each assembly in detail.
Please refer to shown in Figure 1, the backlight module 10 of the present invention's first preferred embodiment is the described at least one light emitting source packaging structure 100 of installing on the described fixed head 200 of given shape normally, described support plate 110 in the wherein said light emitting source packaging structure 100 can be circuit substrate (PCB) or lead frame (leadframe), and described support plate 110 has an embedding hole 111.Described radiating seat 120 is to be made by the material of tool thermal conductive resin, for example various metal or alloy, particularly aluminum or aluminum alloy.Described radiating seat 120 is to be embedded in the described embedding hole 111 of described support plate 110, wherein if described support plate 110 is selected from lead frame, but other fill insulant between then described embedding hole 111 and the described radiating seat 120.Moreover, described radiating seat 120 has a first surface 121, a second surface 122 and a combined hole 123 again in addition, wherein said combined hole 123 is to be opened in described first surface 121, and described at least one chip 130 is arranged on the described second surface 122, in order to send light beam according to driving signal (not illustrating).Moreover, the described second surface 122 of described radiating seat 120 comprises a groove 124 in addition, described at least one chip 130 is to be arranged on the described groove 124, and described chip 130 is light-emitting diode chip for backlight unit preferably, and described fixed head 200 preferably a backboard or a light emitting source pedestal, but be not limited to this.
Referring again to shown in Figure 1, described heat radiation fixture 140 is to be made by the material of tool thermal conductive resin, for example various metal or alloy, particularly aluminum or aluminum alloy.Described heat radiation fixture 140 has an integrated column 141 and a radiating fin 142, and described radiating fin 142 comprises several fins 1421 and a bearing surface 1422 in addition.Described fin 1421 is formed on the side of described radiating fin 142 away from described radiating seat 120, plugs in order to tight fit to be incorporated in the described combined hole 123, or increases bond strength by a spot of tackness thermal grease in addition.Simultaneously, described bearing surface 1422 is formed on the side of described radiating fin 142 near described radiating seat 120 and fixed head 200.Described at least two lead-in wire 150 usefulness are so that described support plate 110 forms electric connection with described at least one chip 130, but when described chip 130 was the light-emitting diode chip for backlight unit of flip-chip (flip chip) type, 130 of described chips were to be electrically connected at described support plate 110 with several projections (not illustrating).Described packing colloid 160 is transparent resin materials, and it is in order to coat the part that bag protects the upper surface of the second surface 122 of described chip 130, described lead-in wire 150, described radiating seat 120 and described support plate 110.On the other hand, described fixed head 200 is normally made by the material of tool thermal conductive resin, for example various metal or alloy, particularly aluminum or aluminum alloy.Described fixed head 200 has at least one through hole 201, its can for described column 141 wear by, to be combined in the described combined hole 123.There is an assembling spacing between above-mentioned bearing surface 1422 and the described radiating seat 120, establish described fixed head 200 for folder, and described bearing surface 1422 can be connected to closely on the described fixed head 200.
Please in regular turn with reference to shown in Fig. 2,3,4,5 and 6, the present invention's second to six preferred embodiment is similar in appearance to the light emitting source packaging structure 100 of the present invention's first preferred embodiment, and roughly continue to use same components title and figure number, but the difference characteristic of second to six preferred embodiment is: the light emitting source packaging structure 100 of described second to six preferred embodiment is further improved described heat radiation fixture 140, and the present invention will be in hereinafter describing in detail.
Please refer to shown in Figure 2, Fig. 2 discloses light emitting source packaging structure 100 schematic diagrames of the present invention's second preferred embodiment, the described light emitting source packaging structure 100 of second embodiment mainly comprises a support plate 110, a radiating seat 120, at least one chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160, the difference characteristic of second embodiment is: described column 141 comprises an external screw thread 1411 in addition, and described combined hole 123 comprises an internal thread 1231 in addition simultaneously.In when assembling, the described column 141 of described heat radiation fixture 140 can be established combination by the spiral shell of described external screw thread 1411 and described internal thread 1231, and the both sides that are positioned at described fixed head 200 that described heat radiation fixture 140 and described radiating seat 120 is firm.Because described column 141 is to utilize described external screw thread 1411 and described internal thread 1231 to combine closely with the combined hole 123 of described radiating seat 120, therefore can guarantee that described radiating seat 120 contacts with heat radiation the hot of fixture 140, help the thermal energy conduction that described chip 130 produces being dispelled the heat to several fin 1421 places of described radiating fin 142 via heat conducting mode.
Please refer to shown in Figure 3, Fig. 3 discloses light emitting source packaging structure 100 schematic diagrames of the present invention's the 3rd preferred embodiment, the described light emitting source packaging structure 100 of the 3rd embodiment mainly comprises a support plate 110, a radiating seat 120, at least one chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160, the difference characteristic of the 3rd embodiment is: the hole wall of described combined hole 123 is provided with at least one pair of recess (not indicating), described column 141 correspondences are provided with at least one hole simultaneously, and described heat radiation fixture 140 comprises at least one spring 143 in addition.Described spring 143 is arranged in the hole of described column 141, and the two ends of described spring 143 slightly elasticity protrude into outside the described hole.When assembling, the described column 141 of described heat radiation fixture 140 can be by the two ends clip of described at least one spring 143 in the recess of described combined hole 123, and guarantee the assembling reliability and the intensity of described column 141 and combined hole 123, and make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.Moreover, described at least one spring 143 can guarantee that equally described radiating seat 120 contacts with heat radiation the hot of fixture 140, helps via heat conducting mode the thermal energy conduction that described chip 130 produces being dispelled the heat to several fin 1421 places of described radiating fin 142.
Please refer to shown in Figure 4, Fig. 4 discloses light emitting source packaging structure 100 schematic diagrames of the present invention's the 4th preferred embodiment, the described light emitting source packaging structure 100 of the 4th embodiment mainly comprises a support plate 110, a radiating seat 120, at least one chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160, the difference characteristic of the 4th embodiment is: described column 141 comprises at least one projection 1412 in addition, and described combined hole 123 has corresponding at least one depression 1232 in addition.When assembling, described at least one projection 1412 and corresponding described at least one depression 1232 can be chimeric mutually, so that described column 141 is combined in the described combined hole 123 of described radiating seat 120, and make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.It should be noted that, described heat radiation fixture 140 can be a tubular rivet, the front end of just described column 141 has a hollow part 1413, described hollow part 1413 provides a strain space, so that when assembling, make the leading portion of the appropriate strain of described projection 1412 energy by described combined hole 123, then clip enters in the described depression 1232 again.Moreover the described at least one projection 1412 on the described column 141 is salient point, bulge loop or convex arc section preferably, and 1232 of corresponding described depressions are concave point, concave ring groove or concave arc groove, but are not limited to this.
Moreover, please refer to shown in Figure 5, Fig. 5 discloses light emitting source packaging structure 100 schematic diagrames of the present invention's the 5th preferred embodiment, the described light emitting source packaging structure 100 of the 5th embodiment mainly comprises a support plate 110, one radiating seat 120, at least one chip 130, one heat radiation fixture 140, article at least two, 150 and one packing colloid 160 goes between, the difference characteristic of the 5th embodiment is: described column 141 comprises at least one projection 1413 in addition, the described combined hole 123 of described radiating seat 120 comprises at least one depression 1233 in addition simultaneously, and described at least one projection 1413 is provided with accordingly with described at least one depression 1233.When assembling, the projection 1445 of the column 141 of described heat radiation fixture 140 is chimeric with the depression 1231 mutual clips of described combined hole 123, so that described column 141 is combined in the described combined hole 123, and make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.Projection 1413 on the described column 141 is salient point, bulge loop or convex arc section preferably, and depression 1233 corresponding preferably concave points, concave ring groove or concave arc groove on the described combined hole 123, but be not limited to this.
At last, please refer to shown in Figure 6, Fig. 6 discloses light emitting source packaging structure 100 schematic diagrames of the present invention's the 6th preferred embodiment, the described light emitting source packaging structure 100 of the 6th embodiment mainly comprises a support plate 110, one radiating seat 120, at least one chip 130, one heat radiation fixture 140, article at least two, 150 and one packing colloid 160 goes between, the difference characteristic of the 6th embodiment is: described column 141 comprises at least one depression 1413 in addition, the described combined hole 123 of described radiating seat 120 comprises at least one projection 1234 in addition, and described at least one depression 1413 is provided with accordingly with described at least one projection 1234.When assembling, the depression 1413 of the column 141 of described heat radiation fixture 140 is chimeric with the projection 1234 mutual clips of described combined hole 123, described column 141 is combined in the described combined hole 140, and makes the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.Depression 1413 on the described column 141 is projection 1234 corresponding preferably salient points, bulge loop section or the convex arc section on concave point, scrobicular ring or concave arc section, the described combined hole 123 preferably, but is not limited to this.
As Fig. 1,2,3,4, shown in 5 and 6, the advantage of the present invention's first to six above-mentioned feature of preferred embodiment is: described heat radiation fixture 140 is respectively by the tight fit combination, described screw thread 1231 and 1411, described spring 143, described projection 1412 and depression 1232, described projection 1413 and depression 1233, or combinations such as described depression 1413 and projection 1234, so that described column 141 is combined in the described combined hole 140, thereby make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120, and make described radiating seat 120 and heat radiation fixture 140 direct hot contacts.Therefore, described heat radiation fixture 140 not only can utilize described bearing surface 1422 guarantee and described fixed head 200 between the relation of closely amplexiforming to promote the assembling reliability, also can utilize described radiating fin 142 additionally to increase radiating effect in addition, and can help described chip 130 to reduce temperature really, thereby further avoid described chip 130 operating efficiencies to reduce relatively, so help making described chip 130 working stability degree increase and increase the service life.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (16)
1. backlight module, it is characterized in that: described backlight module comprises:
At least one light emitting source packaging structure respectively comprises:
One radiating seat has a combined hole; And
One heat radiation fixture is provided with a column and the radiating fin with a bearing surface; And
One fixed head has at least one through hole;
The through hole that the described column of wherein said heat radiation fixture passes described fixed head combines with described combined hole, the bearing surface of described radiating fin is connected on the described fixed head, makes described radiating seat and described heat radiation fixture firmly be combined in the both sides of described fixed head.
2. backlight module as claimed in claim 1 is characterized in that: described at least one light emitting source packaging structure, and other comprises:
One support plate has an embedding hole, and wherein said radiating seat is located in the described embedding hole of described support plate; And at least one chip, be electrically connected at described support plate.
3. backlight module as claimed in claim 1 is characterized in that: the described column of described heat radiation fixture has a screw thread or a spring in addition, so that described column is combined in the described combined hole of described radiating seat.
4. backlight module as claimed in claim 1, it is characterized in that: the described column of described heat radiation fixture has at least one projection in addition, and described combined hole has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are chimeric mutually, so that described column is combined in the described combined hole of described radiating seat.
5. backlight module as claimed in claim 1, it is characterized in that: the described combined hole of described radiating seat has at least one projection in addition, and described column has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are chimeric mutually, so that described column is combined in the described combined hole of described radiating seat.
6. as backlight module as described in claim 4 or 5, it is characterized in that: described projection is salient point, bulge loop or convex arc section, and corresponding described depression is concave point, concave ring groove or concave arc groove.
7. backlight module as claimed in claim 2 is characterized in that: described chip is a light-emitting diode chip for backlight unit.
8. backlight module as claimed in claim 1 is characterized in that: described fixed head is a backboard or a light emitting source pedestal.
9. backlight module as claimed in claim 2 is characterized in that: described support plate is circuit substrate or lead frame, and described chip is electrically connected at described support plate by several lead-in wires or several projections.
10. light emitting source packaging structure, it is characterized in that: described light emitting source packaging structure comprises:
One support plate has an embedding hole;
One radiating seat is embedded in the described embedding hole of described support plate, and described radiating seat has a first surface, a second surface and a combined hole, and wherein said combined hole is to be opened in described first surface;
At least one chip is arranged at the described second surface of described radiating seat, and is electrically connected at described support plate; And
One heat radiation fixture is provided with a column and the radiating fin with a bearing surface, and wherein said column combines with described combined hole, has an assembling spacing between described bearing surface and the described radiating seat.
11. light emitting source packaging structure as claimed in claim 10 is characterized in that: described column has a screw thread or a spring in addition, so that described column is combined in the described combined hole.
12. light emitting source packaging structure as claimed in claim 10, it is characterized in that: described column has at least one projection in addition, described combined hole has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are chimeric mutually, so that described column is combined in the described combined hole.
13. light emitting source packaging structure as claimed in claim 10, it is characterized in that: described combined hole has at least one projection in addition, described column has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are chimeric mutually, so that described column is combined in the described combined hole.
14. as claim 12 or 13 described light emitting source packaging structures, it is characterized in that: described projection is salient point, bulge loop or convex arc section, and corresponding described depression is concave point, concave ring groove or concave arc groove.
15. light emitting source packaging structure as claimed in claim 10 is characterized in that: described chip is a light-emitting diode chip for backlight unit.
16. light emitting source packaging structure as claimed in claim 10 is characterized in that: described support plate is circuit substrate or lead frame, and described chip is electrically connected at described support plate by several lead-in wires or several projections.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102307872A CN101943356B (en) | 2010-07-14 | 2010-07-14 | Backlight module and luminous source encapsulation structure thereof |
| US12/996,290 US8288782B2 (en) | 2010-07-14 | 2010-10-27 | Backlight module and light-emitting source package structure thereof |
| PCT/CN2010/078145 WO2012006834A1 (en) | 2010-07-14 | 2010-10-27 | Backlight module and luminous source encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102307872A CN101943356B (en) | 2010-07-14 | 2010-07-14 | Backlight module and luminous source encapsulation structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101943356A true CN101943356A (en) | 2011-01-12 |
| CN101943356B CN101943356B (en) | 2013-03-13 |
Family
ID=43435491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102307872A Active CN101943356B (en) | 2010-07-14 | 2010-07-14 | Backlight module and luminous source encapsulation structure thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101943356B (en) |
| WO (1) | WO2012006834A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102563459A (en) * | 2011-12-13 | 2012-07-11 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device |
| CN102563454A (en) * | 2011-10-12 | 2012-07-11 | 深圳市华星光电技术有限公司 | LED backlight module and liquid crystal display device |
| CN102606903A (en) * | 2011-01-21 | 2012-07-25 | 隆达电子股份有限公司 | Light source module |
| EP2888528A4 (en) * | 2012-08-22 | 2016-05-25 | Flex N Gate Advanced Product Dev Llc | Micro-channel heat sink for led headlamp |
| CN106151959A (en) * | 2015-01-15 | 2016-11-23 | 旭德科技股份有限公司 | Lighting device |
| WO2017059575A1 (en) * | 2015-10-09 | 2017-04-13 | 魏晓敏 | Led light emitting unit and module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1608326A (en) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | LED and LED lamp thereof |
| CN101044427A (en) * | 2004-08-18 | 2007-09-26 | 索尼株式会社 | Heat radiator and display unit |
| CN101149534A (en) * | 2007-10-26 | 2008-03-26 | 京东方科技集团股份有限公司 | Backlight |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100523601C (en) * | 2006-12-30 | 2009-08-05 | 新灯源科技有限公司 | LED lighting device |
| CN201004458Y (en) * | 2007-01-09 | 2008-01-09 | 天瑞企业股份有限公司 | Heat radiation device of LED |
| TW200903834A (en) * | 2007-07-05 | 2009-01-16 | Bright Led Electronics Corp | High heat-dissipation light emitting diode device |
| TWM345942U (en) * | 2008-05-16 | 2008-12-01 | Ledtech Electronics Corp | Customized assembling lighting module |
| CN201259194Y (en) * | 2008-10-08 | 2009-06-17 | 史杰 | LED packaged illumination circuit board of high thermal conductivity |
-
2010
- 2010-07-14 CN CN2010102307872A patent/CN101943356B/en active Active
- 2010-10-27 WO PCT/CN2010/078145 patent/WO2012006834A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1608326A (en) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | LED and LED lamp thereof |
| CN101044427A (en) * | 2004-08-18 | 2007-09-26 | 索尼株式会社 | Heat radiator and display unit |
| CN101149534A (en) * | 2007-10-26 | 2008-03-26 | 京东方科技集团股份有限公司 | Backlight |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102606903A (en) * | 2011-01-21 | 2012-07-25 | 隆达电子股份有限公司 | Light source module |
| CN102563454A (en) * | 2011-10-12 | 2012-07-11 | 深圳市华星光电技术有限公司 | LED backlight module and liquid crystal display device |
| US8593589B2 (en) | 2011-10-12 | 2013-11-26 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | LED back light module and liquid crystal display device |
| CN102563459A (en) * | 2011-12-13 | 2012-07-11 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device |
| CN102563459B (en) * | 2011-12-13 | 2014-06-11 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device |
| EP2888528A4 (en) * | 2012-08-22 | 2016-05-25 | Flex N Gate Advanced Product Dev Llc | Micro-channel heat sink for led headlamp |
| CN106151959A (en) * | 2015-01-15 | 2016-11-23 | 旭德科技股份有限公司 | Lighting device |
| CN106151959B (en) * | 2015-01-15 | 2019-02-15 | 旭德科技股份有限公司 | Lighting device |
| WO2017059575A1 (en) * | 2015-10-09 | 2017-04-13 | 魏晓敏 | Led light emitting unit and module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101943356B (en) | 2013-03-13 |
| WO2012006834A1 (en) | 2012-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101345279B (en) | Back pin design light emitting diode device, backlight module and liquid crystal display | |
| JP3175599U (en) | Heat dissipation structure of valve | |
| CN101943356B (en) | Backlight module and luminous source encapsulation structure thereof | |
| US7538356B2 (en) | Combination assembly of LED and liquid-vapor thermally dissipating device | |
| JP3173051U (en) | Light source device, backlight module, liquid crystal display | |
| JP3151331U (en) | Light-emitting diode base structure that can prevent leakage and bleeding | |
| US8833965B2 (en) | Light-emitting circuit, luminaire, and manufacturing method for the light-emitting circuit | |
| JP2005283852A (en) | Liquid crystal display device | |
| JP2005101658A (en) | Light emitting device having highly efficient heat dissipation structure | |
| US9004721B2 (en) | Light source heat dissipation structure and backlight module | |
| CN104896330A (en) | Led light source module | |
| TW200836371A (en) | A structure of a light emitting diode and a method to assemble thereof | |
| US20100044727A1 (en) | Led package structure | |
| CN101975376B (en) | Luminous source heat-dissipation structure of backlight module | |
| JP5956499B2 (en) | Light source device and display device including the light source device | |
| CN201428943Y (en) | Led lamp | |
| JP4683874B2 (en) | Light source device and liquid crystal display device | |
| JP2006222248A (en) | Semiconductor light emitting device | |
| CN102003685A (en) | Radiating structure for light-emitting source | |
| CN208348989U (en) | A kind of LED filament and the LED bulb based on the LED filament | |
| US8288782B2 (en) | Backlight module and light-emitting source package structure thereof | |
| CN201069782Y (en) | LED lead frame and LED with this frame | |
| US20120294040A1 (en) | Light-emitting diode heat-dissipation structure and backlight module | |
| CN215118940U (en) | Light-emitting diode with long service life | |
| CN210485568U (en) | LED light source substrate assembly and LED car lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Backlight module and luminous source encapsulation structure thereof Effective date of registration: 20190426 Granted publication date: 20130313 Pledgee: Bank of Beijing Limited by Share Ltd Shenzhen branch Pledgor: Shenzhen Huaxing Optoelectronic Technology Co., Ltd. Registration number: 2019440020032 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201016 Granted publication date: 20130313 Pledgee: Bank of Beijing Limited by Share Ltd. Shenzhen branch Pledgor: Shenzhen China Star Optoelectronics Technology Co.,Ltd. Registration number: 2019440020032 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |