CN210485568U - LED light source substrate assembly and LED car lamp - Google Patents

Abstract

The embodiment of the utility model discloses LED light source base plate subassembly and LED car light, this LED light source base plate subassembly includes: the LED flip chip comprises a heat dissipation positive substrate, a heat dissipation negative substrate, at least one heat dissipation connecting substrate, an insulation connecting structure and a plurality of LED flip chips, wherein the heat dissipation positive substrate, the heat dissipation connecting substrate and the heat dissipation negative substrate are fixedly connected through the insulation connecting structure, and the plurality of LED flip chips are arranged in series connection among the heat dissipation positive substrate, the heat dissipation connecting substrate and the heat dissipation negative substrate. The technical scheme of the utility model utilizes the conductivity and the heat dissipation of the substrate to realize the thermoelectric integrated LED light source design; compare the multilayer structure who adds the heat dissipation layer between two base plates of current LED car light, the LED car light that constitutes by this LED light source base plate subassembly is thinner, has better spotlight effect etc..

Description

LED light source substrate assembly and LED car lamp

Technical Field

The utility model relates to a LED technical field especially relates to a LED light source base plate subassembly and LED car light.

Background

The conventional vehicle lamps in the prior art include halogen lamps and LED lamps, wherein the halogen lamps belong to incandescent lamps, and tungsten wires inside the halogen lamps generate heat and emit light when current passes through the tungsten wires. The LED car light is a car light manufactured by using an LED package device as a light source, and generally has the characteristics of high brightness, rich color types, low power consumption, long service life and the like.

However, both of these prior art lamps have their own drawbacks. For halogen lamps, one is a relatively low intensity, typically, 55W halogen lamps have 2000 more lumens; secondly, the tungsten filament is adopted to emit heat and light, and the service life of the tungsten filament is shorter than that of an LED lamp; thirdly, the lighting speed is lower than that of the LED lamp, and as the lighting of the halogen lamp is a heating and light-emitting process, the lighting time of the halogen lamp is different according to the power and is different from several seconds to dozens of seconds; fourthly, the color temperature of the halogen lamp is warm and white, the color is yellow, and the illumination effect is poor; fifthly, the energy consumption of the halogen lamp is high, the power of the general halogen headlamp for the vehicle is about 55W, and the power of the LED headlamp is 20W.

For the existing LED car light, although some defects of the traditional halogen car light can be solved, some problems also exist, for example, although the front side and the back side can emit light, the light condensation effect is inferior to that of the halogen car light because the middle layer has a certain interval area; for another example, although the LED lamp generates heat less than a halogen lamp, a heat dissipation structure must be considered because the operating temperature of the LED lamp is not higher than 150 °, and an excessively high temperature may cause LED burnout and the like.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one problem, the utility model provides a tandem type LED light source base plate subassembly and LED car light realizes thermoelectric integration's LED light source design and LED car light through utilizing the base plate that has electrically conductive and heat radiation characteristic, can solve the spotlight effect of current LED car light poor and the big scheduling problem of power of halogen car light well.

An embodiment of the utility model provides a LED light source base plate subassembly, include: the LED flip chip comprises a heat dissipation positive substrate, a heat dissipation negative substrate, at least one heat dissipation connecting substrate, an insulation connecting structure and a plurality of LED flip chips, wherein the heat dissipation positive substrate, the heat dissipation connecting substrate and the heat dissipation negative substrate are connected in a fixed mode through the insulation connecting structure, the heat dissipation positive substrate and the heat dissipation negative substrate are arranged side by side, and the plurality of LED flip chips are arranged between the heat dissipation positive substrate, the heat dissipation connecting substrate and the heat dissipation negative substrate in a series connection mode.

Further, in the LED light source substrate assembly, the plurality of LED flip chips are all disposed on the same surface of the heat dissipation positive substrate, the at least one heat dissipation connection substrate, and the heat dissipation negative substrate, and the number of the heat dissipation connection substrates is equal to the number of the LED flip chips minus one.

Further, in the LED light source substrate assembly described above, the plurality of LED flip chips includes three LED flip chips, and the at least one heat dissipation connection substrate includes a first heat dissipation connection substrate and a second heat dissipation connection substrate;

the anode and the cathode of the first LED flip chip are respectively positioned on the heat dissipation positive substrate and the first heat dissipation connecting substrate; the anode and the cathode of the second LED flip chip are respectively positioned on the first heat dissipation connecting substrate and the second heat dissipation connecting substrate; and the anode and the cathode of the third LED flip chip are respectively positioned on the second heat dissipation connecting substrate and the heat dissipation negative substrate.

Further, in the above LED light source substrate assembly, the insulating connection structure includes a first insulating connection portion, a second insulating connection portion, and a third insulating connection portion;

the heat dissipation positive substrate and the second heat dissipation connecting substrate are connected through the first insulating connecting portion to form a first strip-shaped substrate, the first heat dissipation connecting substrate and the heat dissipation negative substrate are connected through the second insulating connecting portion to form a second strip-shaped substrate, and the first strip-shaped substrate and the second strip-shaped substrate are arranged side by side through a third insulating connecting portion.

Further, in the LED light source substrate assembly, the heat dissipation positive substrate, each of the heat dissipation connection substrates, and the heat dissipation negative substrate include respective substrate bodies, each of the substrate bodies is provided with a protruding portion, and at least one surface of each of the protruding portions is provided with a pad for connecting a positive electrode or a negative electrode of the LED flip chip.

Further, in the LED light source substrate assembly, a stopper is disposed at a position adjacent to the pad.

Further, in the LED light source substrate assembly, the heat dissipation positive substrate, the at least one heat dissipation connection substrate, and the heat dissipation negative substrate are provided with reserved areas for disposing the plurality of LED flip chips, and the insulating connection structures are disposed on the surfaces of the heat dissipation positive substrate, the heat dissipation connection substrate, and the heat dissipation negative substrate except for the reserved areas.

Further, in the LED light source substrate assembly, white oil or a white film is disposed on the surfaces of the heat dissipation positive substrate, each of the heat dissipation connection substrates, and the heat dissipation negative substrate.

Further, in the above LED light source substrate assembly, further comprising: and the bubble shell is used for packaging the heat dissipation positive substrate, each heat dissipation connecting substrate and the heat dissipation negative substrate in the shell, and heat dissipation gas is filled in the bubble shell.

Another embodiment of the utility model provides a LED car light, including foretell LED light source base plate subassembly.

The embodiment of the utility model has the following advantage:

the technical scheme of the utility model is that the LED flip chip is arranged between the substrates in series by utilizing the substrates with electric conduction and heat dissipation characteristics, thereby realizing the design of thermoelectric integrated LED light source, and compared with the design of the existing LED car lamp with two substrates and a middle heat dissipation layer structure, the thickness of the whole substrate can be greatly reduced and the better light gathering effect can be realized; in addition, a special heat dissipation device is not needed, so that the product volume and the cost can be reduced. Compared with the traditional halogen car lamp, the halogen car lamp has the characteristics of lower power, longer service life, higher lighting speed and the like.

In order to make the aforementioned and other objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 shows a first structural schematic diagram of an LED light source substrate assembly according to an embodiment of the present invention;

fig. 2 shows a second schematic structural diagram of an LED light source substrate assembly according to an embodiment of the present invention;

fig. 3 shows a third structural schematic diagram of an LED light source substrate assembly according to an embodiment of the present invention;

fig. 4 shows a fourth schematic structure diagram of the LED light source substrate assembly according to the embodiment of the present invention;

fig. 5 shows a first structural schematic diagram of an LED vehicle lamp according to an embodiment of the present invention;

fig. 6 shows a second schematic structural diagram of the LED vehicle lamp according to the embodiment of the present invention.

Description of the main element symbols:

200-LED vehicle lamps; 1-an LED light source substrate assembly; 2-a base; 3-interface; 4-a chuck; 10-a heat-dissipating positive substrate; 20-a heat-dissipating negative substrate; 30-heat dissipation connection substrate; 101-a boss; 102-a pad; 30 a-a first heat sink connection substrate; 30 b-a second heat sink connection substrate; 40-an insulated connection structure; 40 a-first insulating connection; 40 b-a second insulating connection; 40 c-a third insulating connection; 50-LED flip chip; 60-cell shell; 70-connecting end.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the templates herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example 1

Referring to fig. 1, the present embodiment provides an LED light source substrate assembly 1, which can be used in lighting devices such as LED car lamps, and the LED lamp formed by using the LED light source substrate assembly 1 can greatly reduce the thickness of the whole substrate and achieve better light-gathering effect, and can also reduce the product volume and reduce the cost because no special heat dissipation device is needed. The LED light source substrate assembly 1 will be described in detail below.

As shown in fig. 1, the LED light source substrate assembly 1 includes a heat-dissipating positive substrate 10, a heat-dissipating negative substrate 20, at least one heat-dissipating connecting substrate 30, an insulating connecting structure 40, and a plurality of LED flip-chip packages 50, wherein the heat-dissipating positive substrate 10, the at least one heat-dissipating connecting substrate 30, and the heat-dissipating negative substrate 20 are fixedly connected by the insulating connecting structure 40, and the plurality of LED flip-chip packages 50 are serially connected and disposed between the heat-dissipating positive substrate 10, the at least one heat-dissipating connecting substrate 30, and the heat-dissipating negative substrate 20.

The substrate may be made of a metal substrate material having good electrical and thermal conductivity, such as a copper substrate, and the shape of the substrate may be determined according to actual requirements, such as a strip shape, a semi-circle shape, and the like. Wherein the size of the entire substrate will be much larger than the size of the LED flip chip 50.

In this embodiment, the heat dissipation positive substrate 10 and the heat dissipation negative substrate 20 are disposed side by side, and the heat dissipation connection substrate 30 is also tiled and distributed at corresponding positions of the heat dissipation positive substrate 10 and the heat dissipation negative substrate 20, for example, it may be above, below or embedded, so that the formed whole substrate is equal to the thickness of one substrate, and compared with the existing LED lamp design in which a heat dissipation layer is added between two layers of substrates, the thickness of the whole substrate can be greatly reduced, and a better light gathering effect is achieved. It should be understood that the above-mentioned side-by-side arrangement does not require that the heat-dissipating positive substrate 10 and the heat-dissipating negative substrate 20 are of the same size and are arranged exactly opposite to each other, and for the heat-dissipating positive substrate 10 and the heat-dissipating negative substrate 20, the whole substrate is ensured to be only a single substrate in thickness by the side-by-side tiling arrangement.

In this embodiment, the at least one heat-dissipating connecting substrate 30 mainly serves as a chip connection, so that a plurality of LED flip chips 50 can be sequentially and serially disposed on the substrates. If a plurality of LED flip-chip dies 50 are disposed on the same surface of the heat dissipation positive substrate 10, the heat dissipation negative substrate 20 and the heat dissipation connection substrate 30, i.e. on a single surface, it is preferable that the number of the heat dissipation connection substrates 30 is equal to the number of the LED flip-chip dies 50 minus one. For example, 3 LED flip chips correspond to 2 heat dissipation connection substrates; the 4 LED flip chips correspond to the 3 heat dissipation connection substrates and the like.

Fig. 1 shows a schematic structural diagram of an LED light source substrate assembly 1. The LED light source substrate assembly 1 includes 3 LED flip chips 50 and 2 heat-dissipating connection substrates, which are a first LED flip chip, a second LED flip chip, a third LED flip chip, and a first heat-dissipating connection substrate 30a and a second heat-dissipating connection substrate 30b, respectively. The heat dissipation positive substrate 10 and the heat dissipation negative substrate 20 are arranged side by side left and right. The anode and the cathode of the first LED flip chip are respectively positioned on the heat dissipation positive substrate 10 and the first heat dissipation connecting substrate 30 a; the anode and the cathode of the second LED flip chip are respectively positioned on the first heat dissipation connecting substrate 30a and the second heat dissipation connecting substrate 30 b; the anode and cathode of the third LED flip chip are located on the second heat sink connecting substrate 30b and the heat sink negative substrate 20, respectively.

The position and shape of the heat-dissipating connection substrate 30 can be determined according to actual needs. For example, as shown in fig. 1, the first heat-dissipating connecting substrate 30a may be distributed above the heat-dissipating front substrate 10, and preferably, the two substrates have the same width, so that the substrate formed by the two substrates has a strip-shaped rectangular structure. For the second heat-dissipating connecting substrate 30b, the substrate is also in a strip-shaped rectangular structure by being embedded in the heat-dissipating negative substrate 20. It is understood that by disposing these heat-dissipating connection substrates 30 above, below, or embedded in the heat-dissipating positive substrate 10 and the heat-dissipating negative substrate 20, the whole substrate can be made more beautiful, and the like.

In this embodiment, the insulating connection structure 40 is mainly used for fixedly connecting the heat dissipation positive substrate 10, the heat dissipation negative substrate 20 and the heat dissipation connection substrate 30. The insulating connection structure 40 may be composed of a plurality of insulating connection portions, or may be an integral structure having a supporting function. For example, the insulating connection structure 40 may include, but is not limited to, a sealing glass, a plastic slot, etc., and may also be an insulating connection material such as terephthalic acid (PTA).

Exemplarily, as shown in fig. 1, the insulating connection structure 40 for fixedly connecting the substrates includes a first insulating connection portion 40a, a second insulating connection portion 40b and a third insulating connection portion 40c, and specifically, the heat dissipation positive substrate 10 and the second heat dissipation connection substrate 30b form a first strip-shaped substrate through the first insulating connection portion 40a, and the first heat dissipation connection substrate 30a and the heat dissipation negative substrate 20 form a second strip-shaped substrate through the second insulating connection portion 40b, and the first strip-shaped substrate and the second strip-shaped substrate are arranged side by side through the third insulating connection portion 40 c. The first insulating connection portion 40a, the second insulating connection portion 40b, and the third insulating connection portion 40c may be sealing glass or plastic slots.

Of course, the insulating connection structure 40 may also be a unitary structure. Exemplarily, as shown in fig. 2, the heat-dissipating positive substrate 10, the heat-dissipating connection substrates 30 and the heat-dissipating negative substrate 20 are provided with a reserved area for disposing the plurality of LED flip-chip devices 50, and an insulating connection structure 40 having an insulating and light-reflecting effect, such as a terephthalic acid (PTA) material, is disposed on the surfaces of the heat-dissipating positive substrate 10, the heat-dissipating connection substrates 30 and the heat-dissipating negative substrate 20 except the reserved area.

It should be understood that the above-mentioned arrangement positions of the insulating connection structures 40 on each substrate are only 2 examples, and in actual production, the positions, types, and the like of the insulating connection structures 40 may be determined according to the shape, the structure, the number, and the like of the substrates.

As an alternative, in order to further improve the light emitting effect, the surfaces of the heat dissipation positive substrate 10, the heat dissipation negative substrate 20 and each heat dissipation connection substrate 30 may be provided with white oil or white film, etc. to improve the substrate surface reflectivity, and thus, the light emitting angle, etc. may be improved. In addition, the white oil or the white film is arranged on the surface of the LED flip chip 50, so that the LED flip chip 50 can be limited to flow when the LED flip chip 50 is fixed, namely the flow of the liquid solder paste is prevented from flowing to a large area, and the LED flip chip 50 cannot deviate when the LED flip chip 50 is fixed.

As an optional scheme, the surfaces of the heat dissipation positive substrate 10, the heat dissipation negative substrate 20, and the heat dissipation connection substrate 30 are further provided with a material with good thermal conductivity, such as graphene, so as to increase the heat dissipation capability of the substrates.

In this embodiment, the heat-dissipating positive substrate 10, each heat-dissipating connection substrate 30, and the heat-dissipating negative substrate 20 include respective substrate bodies, each substrate body is provided with a protrusion 101, and at least one surface of each protrusion 101 is provided with a pad 102 for connecting a positive electrode or a negative electrode of the LED flip-chip 50, as shown in fig. 3. It will be appreciated that each bump should be disposed at the adjacent edges of the two substrate bodies, and that the two oppositely disposed bumps 101 are used to dispose the positive and negative pads, respectively, of the LED flip-chip 50.

Exemplarily, as shown in fig. 3, the substrate main board of the heat-dissipating positive substrate 10 and the substrate main board of the second heat-dissipating connecting substrate 30b are provided with a first pair of protrusions, the substrate main board of the first heat-dissipating connecting substrate 30a and the substrate main board of the second heat-dissipating connecting substrate 30b are provided with a second pair of protrusions, and the substrate main board of the first heat-dissipating connecting substrate 30a and the substrate main board of the heat-dissipating positive substrate 10 are provided with a third pair of protrusions. The three pairs of bumps will be used to dispose three LED flip-chips 50, respectively, and the three LED flip-chips 50 will form a series connection on the substrate.

In this embodiment, the number of pads is not limited. Further, alternatively, the pads may be provided on both the front and back surfaces of the heat dissipation positive substrate 10, the heat dissipation negative substrate 20, and the heat dissipation connection substrate 30. Further alternatively, for the same bump 101 on the substrate, pads are provided on both the front and back surfaces thereof. Therefore, the LED flip chip 50 can be arranged on the front side and the back side of the same protruding part 101, the series-parallel connection arrangement structure of the LED flip chip 50 is formed, and the substrate space, the manufacturing process time of the protruding parts 101 and the like are saved.

Considering that the LED flip chip 50 is fixed on the bonding pad by solder paste, it is further preferable that a position limiting portion, such as a position limiting hole or a position limiting groove, is further provided at a position adjacent to the bonding pad of the heat dissipation positive substrate 10 and the heat dissipation negative substrate 20. It will be appreciated that the limiting is mainly used to limit the flow of the liquid solder paste, i.e., prevent the solder paste from flowing to a large area, thereby avoiding the offset phenomenon when the LED flip chip 50 is mounted.

For the LED flip chip 50, flip chips in different packaging forms can be adopted, and a directly packaged surface mounted lamp bead can also be adopted as a light source. For example, a CSP flip chip in the form of a CSP package may be used, or alternatively, a conventional LED flip chip 50 may be used, and preferably, a fluorescent glue may be coated on the surface of the conventional LED flip chip 50, so that it can be used to adjust the light emitting color of the LED flip chip, and also can protect the LED flip chip 50.

In order to achieve a better light-emitting angle, a protection effect on each substrate, and the like, as shown in fig. 4, the LED light source substrate assembly 1 further includes a bulb casing 60, and the bulb casing 60 is mainly used for enclosing each substrate in the casing. For example, a transparent material having high light transmittance such as glass can be used for the bulb 60.

Preferably, the bulb 60 is also filled with a heat dissipation gas for enhancing the heat dissipation effect when the LED emits light. The heat dissipation gas may include, but is not limited to, one or more of helium, nitrogen, neon, argon, and other inert gases.

Optionally, as shown in fig. 4, the LED light source substrate assembly 1 further includes a connecting end 70 for connecting the heat dissipation positive substrate 10 and the heat dissipation negative substrate 20 to the positive lead and the negative lead respectively disposed outside the bulb 60. Illustratively, the connecting end 70 may be a metal sheet structure or the like. The two substrates can be conveniently and electrically connected with structures such as a driving power supply and the like through the two external metal wires.

The technical scheme of the utility model through utilize the heat dissipation to connect the base plate and establish ties a plurality of LED flip chip and set up between the heat dissipation positive base plate and the heat dissipation negative base plate that set up side by side, utilize the electric conductivity and the heat conductivity of metal substrate, realize thermoelectric integrated's LED light source design, no longer need special heat abstractor and walk the line, can reduce product volume and reduce cost; and, for the design of two base plates with middle heat dissipation layer structure now, can reduce whole base plate thickness greatly and realize better spotlight effect. In addition, by combining the bubble sealing technology, the large-angle light emitting of the LED light source can be realized, and the heat dissipation gas is filled in the bubble shell, so that the heat dissipation effect can be further improved.

Example 2

Referring to fig. 5, the present embodiment provides an LED vehicular lamp 200, where the LED vehicular lamp 200 includes the LED light source substrate assembly 1 and the base 2 in embodiment 1. The base 2 mainly fixes and supports the LED light source substrate assembly 1.

Preferably, a driving circuit for driving the LED light source substrate assembly is further disposed inside the base 2, and the driving circuit is connected to the heat dissipation positive substrate 10 and the heat dissipation negative substrate 20. It is understood that when the LED light source substrate assembly 1 includes the external wires as described above, the driving circuit will be connected to the external wires.

Further, the LED vehicular lamp 200 further includes: and the interface 3, wherein the interface 3 is connected with the base 2. The interface is used to access the power required by the LED light source substrate assembly 1. For example, the interface 3 may be disposed on one side of the base 2, as shown in fig. 6, such that the LED lamp 200 has an L-shaped configuration. The interface 3 may be an AC interface, a dc interface, or the like.

Further, as shown in fig. 6, the LED vehicle lamp 200 further includes: a chuck 4 for adjusting a lighting angle. Exemplarily, one end of the chuck 4 is used for connecting the LED light source substrate assembly 1, and the other end is used for connecting with the base 2. The forward lighting angle of the LED vehicle lamp 200 can be rotationally adjusted by the chuck 4.

It is understood that the LED light source substrate assembly 1 in the LED vehicle lamp 200 of the present embodiment corresponds to the LED light source substrate assembly in the above embodiment 1, and the alternatives of the above embodiment 1 are also applicable to the present embodiment, so detailed description thereof is omitted.

The LED vehicle lamp provided by the embodiment adopts a thermoelectric integrated LED light source design, and no special heat dissipation device is needed; compared with the traditional halogen car lamp, the halogen car lamp has the characteristics of lower power, longer service life, higher lighting speed and the like, and compared with the existing LED car lamp design with the structure of two substrates and a middle heat dissipation layer, the halogen car lamp can greatly reduce the thickness of the whole substrate and realize better light condensation effect and the like.

In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above-described embodiments are merely illustrative of several embodiments of the present invention, which are described in detail and specific, but not intended to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.

Claims (10)

1. An LED light source substrate assembly, comprising: the LED flip chip comprises a heat dissipation positive substrate, a heat dissipation negative substrate, at least one heat dissipation connecting substrate, an insulation connecting structure and a plurality of LED flip chips, wherein the heat dissipation positive substrate, the heat dissipation connecting substrate and the heat dissipation negative substrate are connected in a fixed mode through the insulation connecting structure, the heat dissipation positive substrate and the heat dissipation negative substrate are arranged side by side, and the plurality of LED flip chips are arranged between the heat dissipation positive substrate, the heat dissipation connecting substrate and the heat dissipation negative substrate in a series connection mode.

2. The LED light source substrate assembly of claim 1, wherein the plurality of LED flip chips are all disposed on a same surface of the heat sink positive substrate, the at least one heat sink connecting substrate, and the heat sink negative substrate, and the number of heat sink connecting substrates is equal to the number of LED flip chips minus one.

3. The LED light source substrate assembly of claim 1 or 2, wherein the plurality of LED flip chips comprises three LED flip chips, the at least one thermally dissipative connecting substrate comprising a first thermally dissipative connecting substrate and a second thermally dissipative connecting substrate;

the anode and the cathode of the first LED flip chip are respectively positioned on the heat dissipation positive substrate and the first heat dissipation connecting substrate; the anode and the cathode of the second LED flip chip are respectively positioned on the first heat dissipation connecting substrate and the second heat dissipation connecting substrate; and the anode and the cathode of the third LED flip chip are respectively positioned on the second heat dissipation connecting substrate and the heat dissipation negative substrate.

4. The LED light source substrate assembly of claim 3, wherein the insulating connection structure comprises a first insulating connection portion, a second insulating connection portion, and a third insulating connection portion;

the heat dissipation positive substrate and the second heat dissipation connecting substrate are connected through the first insulating connecting portion to form a first strip-shaped substrate, the first heat dissipation connecting substrate and the heat dissipation negative substrate are connected through the second insulating connecting portion to form a second strip-shaped substrate, and the first strip-shaped substrate and the second strip-shaped substrate are arranged side by side through a third insulating connecting portion.

5. The LED light source substrate assembly of claim 1 or 2, wherein the heat sink positive substrate, each of the heat sink connecting substrates and the heat sink negative substrate comprise respective substrate bodies, each of the substrate bodies is provided with a protrusion, and at least one surface of each of the protrusions is provided with a pad for connecting a positive electrode or a negative electrode of the LED flip chip.

6. The LED light source substrate assembly of claim 5, wherein a stop is provided adjacent to the pad.

7. The LED light source substrate assembly according to claim 1 or 2, wherein the heat-dissipating positive substrate, the at least one heat-dissipating connecting substrate, and the heat-dissipating negative substrate are provided with a reserved area for disposing the plurality of LED flip chips, and the insulating connecting structures are disposed on the surfaces of the heat-dissipating positive substrate, the heat-dissipating connecting substrate, and the heat-dissipating negative substrate except the reserved area.

8. The LED light source substrate assembly of claim 1 or 2, wherein the surfaces of the heat-dissipating positive substrate, each of the heat-dissipating connecting substrate and the heat-dissipating negative substrate are provided with white oil or white film.

9. The LED light source substrate assembly of claim 1, further comprising: and the bubble shell is used for packaging the heat dissipation positive substrate, each heat dissipation connecting substrate and the heat dissipation negative substrate in the shell, and heat dissipation gas is filled in the bubble shell.

10. An LED vehicular lamp comprising the LED light source substrate assembly according to any one of claims 1 to 9.

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