CN101943356B - Backlight module and luminous source encapsulation structure thereof - Google Patents
Backlight module and luminous source encapsulation structure thereof Download PDFInfo
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- CN101943356B CN101943356B CN2010102307872A CN201010230787A CN101943356B CN 101943356 B CN101943356 B CN 101943356B CN 2010102307872 A CN2010102307872 A CN 2010102307872A CN 201010230787 A CN201010230787 A CN 201010230787A CN 101943356 B CN101943356 B CN 101943356B
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- radiating seat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a backlight module and a luminous source encapsulation structure thereof. The luminous source encapsulation structure comprises a heat radiating seat, at least one chip and a heat radiating and fixing piece, wherein the heat radiating seat is provided with a combining hole, the dimension of the heat radiating and fixing piece is less than that of the heat radiating seat, and the heat radiating and fixing piece comprises a combining post and a heat radiating fin with a butt surface; the combining post passes through a through hole of a fixing plate and is combined with the combining hole, the butt surface of the heat radiating fin is supported on the fixing plate, therefore, the heat radiating seat and the heat radiating and fixing piece can be stably combined on both sides of the fixing plate in order to ensure the tight binding relation with the fixing plate and increase assembling reliability, meanwhile, the heat radiating fin can be used for increasing the heat radiating effect of the heat radiating seat in extra, and therefore, the heat radiating fin can assuredly help the chip to reduce temperature in order to avoid the work efficiency reduction of the chip and is beneficial to ensuring that the chip stably operates and prolonging the service life.
Description
[technical field]
The invention relates to a kind of backlight module and luminous source encapsulation structure thereof, particularly utilize heat radiation fixture firm luminous source encapsulation structure is combined on the fixed head relevant for a kind of, and by radiating fin with the luminous source encapsulation structure that dispels the heat and the backlight module with described luminous source encapsulation structure.
[background technology]
Liquid crystal display (liquid crystal display, LCD) be to utilize the characteristic of liquid crystal material to show a kind of panel display apparatus (flat panel display of image, FPD), it has more the advantages such as frivolous, low driving voltage and low-power consumption compared to other display device, has become the main product on the whole consumption market.Yet the liquid crystal material of liquid crystal display can't be from main light emission, must be by the external light source that provides, so be provided with in addition again backlight module in the liquid crystal display so that required light source to be provided.
Generally speaking, backlight module can be divided into side backlight module and two kinds of forms of end backlight module.Known backlight module mainly is as light source with cold cathode fluorescent tube (CCFL), thermic cathode fluorimetric pipe (HCFL) and semiconductor luminous assembly, and semiconductor luminous assembly mainly is to utilize light emitting diode (LED) to carry out luminous, it is compared to cathode fluorescent tube more power and energy saving, longer service life, and volume is more light and handy, thereby the trend that replaces gradually cathode fluorescent tube, light emitting diode are arranged will be the principal light source in backlight module future of liquid crystal display.
Now, light emitting diode carries out semiconductor packages mainly with the form of chip, with as encapsulation structure of LED, engages with the fixed head of backlight module more at last.Yet, the shortcoming of encapsulation structure of LED is the extreme temperatures in its course of work, if the heat energy that the fixed head of backlight module can't in time produce encapsulation structure of LED is taken away, then not only can cause near the temperature of encapsulation structure of LED obviously to raise, cause each viewing area deblocking temperature of liquid crystal display uneven, and near the demonstration block of LCD panel that also may be encapsulation structure of LED general red phenomenon occurs because of excess Temperature, therefore will affect the image quality of liquid crystal display.Moreover light emitting diode itself very easily affects its luminescence efficiency and working stability degree because of the temperature rise of the course of work, so also may reduce its serviceable life because of the state that is in for a long time high temperature.In addition, if encapsulation structure of LED only is simply to utilize adhesive agent to be cemented on the fixed head or only is to utilize screwed lock to pay on fixed head, then owing to be not direct hot the contact between encapsulation structure of LED and the fixed head, or existed the adhesive agent of insulation or surface between the two closely not to amplexiform between the two, therefore will affect its radiating efficiency in certain degree.In addition, be in for a long time under the state of high temperature, adhesive agent also may go bad deteriorated and lose stickiness, cause encapsulation structure of LED to break away from fixed head, plate is taken away in real time if the heat energy of encapsulation structure of LED can't be fixed, and then will there be overheated potential risk of burning in encapsulation structure of LED.
So really being necessary provides a kind of luminous source encapsulation structure to the light emitting diode of backlight module, to solve the existing heat dissipation problem of prior art.
[summary of the invention]
Fundamental purpose of the present invention is to provide a kind of backlight module and luminous source encapsulation structure thereof, comprise radiating seat, chip and heat radiation fixture, wherein radiating seat has combined hole in addition, the heat radiation fixture comprises column and the radiating fin with a bearing surface in addition, heat radiation fixture and radiating seat firmly can be combined in the both sides of the fixed head of backlight module by column and combined hole, and bearing surface can be guaranteed and fixed head between the relation of closely amplexiforming and promote the assembling fiduciary level; Simultaneously, the heat radiation fixture also can additionally increase radiating effect by the radiating fin of heat radiation fixture in addition, therefore also can really help chip to reduce temperature, avoids the chip operation Efficiency Decreasing, so also be conducive to make the chip steady operation and increase the service life.
Secondary objective of the present invention is to provide a kind of backlight module and luminous source encapsulation structure thereof, wherein the first surface of the radiating seat of luminous source encapsulation structure have combined hole, the heat radiation fixture column have screw thread or spring, the column of heat radiation fixture is fixed in the combined hole of radiating seat by screw thread or spring, is conducive to increase the assembling intensity of column and combined hole.
Another object of the present invention is to provide a kind of backlight module and luminous source encapsulation structure thereof, wherein the combined hole of the column of the heat radiation fixture of luminous source encapsulation structure and radiating seat has respectively depression or projection, and corresponding chimeric of depression and projection is conducive to increase the assembling intensity of column and combined hole.
For reaching aforementioned purpose of the present invention, the invention provides a kind of backlight module, described backlight module comprises: at least one luminous source encapsulation structure respectively comprises: a radiating seat, have a first surface, a second surface and a combined hole, wherein said combined hole is to be opened in described first surface; One support plate has an embedding hole, and wherein said radiating seat is located in the described embedding hole of described support plate; At least one chip is arranged at the described second surface of described radiating seat, and is electrically connected at described support plate; Article at least two, lead-in wire is used so that described support plate and described at least one chip form electric connection; One packing colloid coats the part that bag protects the upper surface of the second surface of described chip, described lead-in wire, described radiating seat and described support plate; Reach a heat radiation fixture, have a column and the radiating fin with a bearing surface, the size of described heat radiation fixture is less than the size of described radiating seat; And a fixed head, have at least one through hole; The described through hole that the described column of wherein said heat radiation fixture passes described fixed head is combined with described combined hole, the bearing surface of described radiating fin is connected on the described fixed head, makes described radiating seat and described heat radiation fixture firmly be combined in the both sides of described fixed head.
Moreover, the invention provides another kind of luminous source encapsulation structure, described luminous source encapsulation structure comprises: a support plate has an embedding hole; One radiating seat is embedded in the described embedding hole of described support plate, and described radiating seat has a first surface, a second surface and a combined hole, and wherein said combined hole is to be opened in described first surface; At least one chip is arranged at the described second surface of described radiating seat, and is electrically connected at described support plate; Article at least two, lead-in wire is used so that described support plate and described at least one chip form electric connection; One packing colloid coats the part that bag protects the upper surface of the second surface of described chip, described lead-in wire, described radiating seat and described support plate; Reach a heat radiation fixture, be provided with a column and the radiating fin with a bearing surface, the size of described heat radiation fixture is less than the size of described radiating seat, and wherein said column is combined with described combined hole, has an assembling spacing between described bearing surface and the described radiating seat.
In one embodiment of this invention, the described column of described heat radiation fixture has a screw thread or a spring in addition, so that described column is combined in the combined hole of described radiating seat.
In one embodiment of this invention, the described column of described heat radiation fixture has at least one projection in addition, and described combined hole has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are mutually chimeric, so that described column is combined in the described combined hole of described radiating seat.
In one embodiment of this invention, the described combined hole of described radiating seat has at least one projection in addition, and described column has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are mutually chimeric, so that described column is combined in the described combined hole of described radiating seat.
In one embodiment of this invention, described projection is salient point, bulge loop or convex arc section, and corresponding described depression is concave point, concave ring groove or concave arc groove.
In one embodiment of this invention, described fixed head is a backboard or a light emitting source pedestal.
In one embodiment of this invention, described chip is light-emitting diode chip for backlight unit.
In one embodiment of this invention, the described second surface of described radiating seat comprises a groove in addition, and described chip is to be arranged on the described groove.Described support plate is circuit substrate or lead frame.
Compared with prior art, backlight module of the present invention and luminous source encapsulation structure thereof are to utilize the combined hole of the column of heat radiation fixture and radiating seat with stable being fixed on the described fixed head of described luminous source encapsulation structure, so not only can simplify the assembling of luminous source encapsulation structure and promote the assembling fiduciary level, and radiating seat can be sent to heat energy by the heat conduction radiating fin of heat radiation fixture, help chip cooling by radiating fin, to avoid chip overheating to cause work efficiency to reduce, be conducive to make the chip steady operation and increase the service life.
[description of drawings]
Fig. 1 is the synoptic diagram of the luminous source encapsulation structure of the present invention's the first preferred embodiment backlight module.
Fig. 2 is the synoptic diagram of the present invention's the second preferred embodiment luminous source encapsulation structure.
Fig. 3 is the synoptic diagram of the present invention's the 3rd preferred embodiment luminous source encapsulation structure.
Fig. 4 is the synoptic diagram of the present invention's the 4th preferred embodiment luminous source encapsulation structure.
Fig. 5 is the synoptic diagram of the present invention's the 5th preferred embodiment luminous source encapsulation structure.
Fig. 6 is the synoptic diagram of the present invention's the 6th preferred embodiment luminous source encapsulation structure.
[embodiment]
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and cooperation accompanying drawing are described in detail below.Moreover, the direction term that the present invention mentions, such as " on ", D score, 'fornt', 'back', " left side ", " right side ", " interior ", " outward ", " side " etc., only be the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to limit the present invention.
Please refer to shown in Figure 1, the synoptic diagram of the luminous source encapsulation structure of the backlight module of its announcement the present invention the first preferred embodiment, wherein the backlight module 10 of the present invention's the first preferred embodiment is mainly used in liquid crystal display (LCD) field, described backlight module 10 mainly comprises at least one luminous source encapsulation structure 100 and a fixed head 200, and wherein said luminous source encapsulation structure 100 respectively comprises again a support plate 110, a radiating seat 120, a chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160.The present invention will be in hereinafter describing above-mentioned each assembly in detail.
Please refer to shown in Figure 1, the backlight module 10 of the present invention's the first preferred embodiment is normally installed described at least one luminous source encapsulation structure 100 at the described fixed head 200 of given shape, described support plate 110 in the wherein said luminous source encapsulation structure 100 can be circuit substrate (PCB) or lead frame (leadframe), and described support plate 110 has an embedding hole 111.Described radiating seat 120 is to be made by the material of tool thermal conductive resin, for example various metal or alloy, particularly aluminum or aluminum alloy.Described radiating seat 120 is to be embedded in the described embedding hole 111 of described support plate 110, if wherein described support plate 110 is selected from lead frame, but fill insulant in addition between described embedding hole 111 and the described radiating seat 120 then.Moreover, described radiating seat 120 has again a first surface 121, a second surface 122 and a combined hole 123 in addition, wherein said combined hole 123 is to be opened in described first surface 121, and described at least one chip 130 is arranged on the described second surface 122, in order to send light beam according to driving signal (not illustrating).Moreover, the described second surface 122 of described radiating seat 120 comprises a groove 124 in addition, described at least one chip 130 is to be arranged on the described groove 124, and described chip 130 is light-emitting diode chip for backlight unit preferably, and described fixed head 200 preferably a backboard or a light emitting source pedestal, but be not limited to this.
Referring again to shown in Figure 1, described heat radiation fixture 140 is to be made by the material of tool thermal conductive resin, for example various metal or alloy, particularly aluminum or aluminum alloy.Described heat radiation fixture 140 has an integrated column 141 and a radiating fin 142, and described radiating fin 142 comprises several fins 1421 and a bearing surface 1422 in addition.Described fin 1421 is formed on described radiating fin 142 away from a side of described radiating seat 120, described column 141 is formed on described radiating fin 142 near a side of described radiating seat 120, plug in order to wringing fit and to be incorporated in the described combined hole 123, or increase bond strength by a small amount of tackness thermal grease in addition.Simultaneously, described bearing surface 1422 is formed on described radiating fin 142 near a side of described radiating seat 120 and fixed head 200.Described at least two lead-in wire 150 usefulness are so that described support plate 110 forms electric connection with described at least one chip 130, but when described chip 130 was the light-emitting diode chip for backlight unit of flip-chip (flip chip) type, 130 of described chips were to be electrically connected at described support plate 110 with several projections (not illustrating).Described packing colloid 160 is transparent resin materials, and it protects the part of the upper surface of the second surface 122 of described chip 130, described lead-in wire 150, described radiating seat 120 and described support plate 110 in order to coat bag.On the other hand, described fixed head 200 is normally made by the material of tool thermal conductive resin, for example various metal or alloy, particularly aluminum or aluminum alloy.Described fixed head 200 has at least one through hole 201, its can for described column 141 wear by, to be combined in the described combined hole 123.Have an assembling spacing between above-mentioned bearing surface 1422 and the described radiating seat 120, for the described fixed head 200 of sandwiched, and described bearing surface 1422 can closely be connected on the described fixed head 200.
Please sequentially with reference to shown in Fig. 2,3,4,5 and 6, the present invention's the second to six preferred embodiment is similar in appearance to the luminous source encapsulation structure 100 of the present invention's the first preferred embodiment, and roughly continue to use same components title and figure number, but the difference characteristic of the second to six preferred embodiment is: the luminous source encapsulation structure 100 of described the second to six preferred embodiment is further improved described heat radiation fixture 140, and the present invention will be in hereinafter describing in detail.
Please refer to shown in Figure 2, Fig. 2 discloses luminous source encapsulation structure 100 synoptic diagram of the present invention's the second preferred embodiment, the described luminous source encapsulation structure 100 of the second embodiment mainly comprises a support plate 110, a radiating seat 120, at least one chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160, the difference characteristic of the second embodiment is: described column 141 comprises an external thread 1411 in addition, and described combined hole 123 comprises an internal thread 1231 in addition simultaneously.In when assembling, the described column 141 of described heat radiation fixture 140 can be established combination by the spiral shell of described external thread 1411 and described internal thread 1231, and the both sides that are positioned at described fixed head 200 that described heat radiation fixture 140 and described radiating seat 120 is firm.Because described column 141 is to utilize described external thread 1411 and described internal thread 1231 to combine closely with the combined hole 123 of described radiating seat 120, therefore can guarantee that described radiating seat 120 contacts with heat radiation the hot of fixture 140, be conducive to via heat conducting mode the thermal energy conduction that described chip 130 produces be dispelled the heat to several fin 1421 places of described radiating fin 142.
Please refer to shown in Figure 3, Fig. 3 discloses luminous source encapsulation structure 100 synoptic diagram of the present invention's the 3rd preferred embodiment, the described luminous source encapsulation structure 100 of the 3rd embodiment mainly comprises a support plate 110, one radiating seat 120, at least one chip 130, one heat radiation fixture 140, article at least two, 150 and one packing colloid 160 goes between, the difference characteristic of the 3rd embodiment is: the hole wall of described combined hole 123 is provided with at least one pair of recess (not indicating), described column 141 correspondences are provided with at least one hole simultaneously, and described heat radiation fixture 140 comprises at least one spring 143 in addition.Described spring 143 is arranged in the hole of described column 141, and the two ends of described spring 143 slightly elasticity protrude into outside the described hole.When assembling, the described column 141 of described heat radiation fixture 140 can be by the two ends clip of described at least one spring 143 in the recess of described combined hole 123, and guarantee assembling fiduciary level and the intensity of described column 141 and combined hole 123, and make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.Moreover, described at least one spring 143 can guarantee that equally described radiating seat 120 contacts with heat radiation the hot of fixture 140, is conducive to via heat conducting mode the thermal energy conduction that described chip 130 produces be dispelled the heat to several fin 1421 places of described radiating fin 142.
Please refer to shown in Figure 4, Fig. 4 discloses luminous source encapsulation structure 100 synoptic diagram of the present invention's the 4th preferred embodiment, the described luminous source encapsulation structure 100 of the 4th embodiment mainly comprises a support plate 110, a radiating seat 120, at least one chip 130, a heat radiation fixture 140, at least two lead-in wire 150 and one packing colloids 160, the difference characteristic of the 4th embodiment is: described column 141 comprises at least one projection 1412 in addition, and described combined hole 123 has corresponding at least one depression 1232 in addition.When assembling, described at least one projection 1412 and corresponding described at least one depression 1232 can be mutually chimeric, so that described column 141 is combined in the described combined hole 123 of described radiating seat 120, and make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.It should be noted that, described heat radiation fixture 140 can be tubular rivet, namely the front end of described column 141 has a hollow part 1413, described hollow part 1413 provides an elastic deformation space, so that when assembling, make the appropriate elastic deformation of described projection 1412 energy by the leading portion of described combined hole 123, then clip enters in the described depression 1232 again.Moreover the described at least one projection 1412 on the described column 141 is salient point, bulge loop or convex arc section preferably, and 1232 of corresponding described depressions are concave point, concave ring groove or concave arc groove, but are not limited to this.
Moreover, please refer to shown in Figure 5, Fig. 5 discloses luminous source encapsulation structure 100 synoptic diagram of the present invention's the 5th preferred embodiment, the described luminous source encapsulation structure 100 of the 5th embodiment mainly comprises a support plate 110, one radiating seat 120, at least one chip 130, one heat radiation fixture 140, article at least two, 150 and one packing colloid 160 goes between, the difference characteristic of the 5th embodiment is: described column 141 comprises at least one projection 1413 in addition, the described combined hole 123 of described radiating seat 120 comprises at least one depression 1233 in addition simultaneously, and described at least one projection 1413 arranges accordingly with described at least one depression 1233.When assembling, the projection 1445 of the column 141 of described heat radiation fixture 140 is chimeric with the depression 1231 mutual clips of described combined hole 123, so that described column 141 is combined in the described combined hole 123, and make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.Projection 1413 on the described column 141 is salient point, bulge loop or convex arc section preferably, and corresponding preferably concave point, concave ring groove or the concave arc groove of the depression 1233 on the described combined hole 123, but be not limited to this.
At last, please refer to shown in Figure 6, Fig. 6 discloses luminous source encapsulation structure 100 synoptic diagram of the present invention's the 6th preferred embodiment, the described luminous source encapsulation structure 100 of the 6th embodiment mainly comprises a support plate 110, one radiating seat 120, at least one chip 130, one heat radiation fixture 140, article at least two, 150 and one packing colloid 160 goes between, the difference characteristic of the 6th embodiment is: described column 141 comprises at least one depression 1413 in addition, the described combined hole 123 of described radiating seat 120 comprises at least one projection 1234 in addition, and described at least one depression 1413 arranges accordingly with described at least one projection 1234.When assembling, the depression 1413 of the column 141 of described heat radiation fixture 140 is chimeric with the projection 1234 mutual clips of described combined hole 123, described column 141 is combined in the described combined hole 140, and makes the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120.Depression 1413 on the described column 141 is corresponding preferably salient point, bulge loop section or the convex arc section of the projection on concave point, scrobicular ring or concave arc-shaped section, the described combined hole 123 1234 preferably, but is not limited to this.
Such as Fig. 1,2,3,4, shown in 5 and 6, the advantage of the present invention's the first to six above-mentioned feature of preferred embodiment is: described heat radiation fixture 140 is respectively by the wringing fit combination, described screw thread 1231 and 1411, described spring 143, described projection 1412 and depression 1232, described projection 1413 and depression 1233, or the combinations such as described depression 1413 and projection 1234, so that described column 141 is combined in the described combined hole 140, thereby make the firm both sides that are positioned at described fixed head 200 of described heat radiation fixture 140 and described radiating seat 120, and make described radiating seat 120 and heat radiation fixture 140 direct hot contacts.Therefore, described heat radiation fixture 140 not only can utilize described bearing surface 1422 guarantee and described fixed head 200 between the relation of closely amplexiforming to promote the assembling fiduciary level, also can utilize described radiating fin 142 additionally to increase radiating effect in addition, and can really help described chip 130 to reduce temperature, thereby further relatively avoid described chip 130 work efficiencies to reduce, so be conducive to make described chip 130 working stability degree to increase and increase the service life.
The present invention is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present invention.Must be pointed out that published embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in the scope of the present invention.
Claims (15)
1. backlight module, it is characterized in that: described backlight module comprises:
At least one luminous source encapsulation structure respectively comprises:
One radiating seat has a first surface, a second surface and a combined hole, and wherein said combined hole is to be opened in described first surface;
One support plate has an embedding hole, and wherein said radiating seat is located in the described embedding hole of described support plate;
At least one chip is arranged at the described second surface of described radiating seat, and is electrically connected at described support plate;
Article at least two, lead-in wire is used so that described support plate and described at least one chip form electric connection;
One packing colloid coats the part that bag protects the upper surface of the second surface of described chip, described lead-in wire, described radiating seat and described support plate; And
One heat radiation fixture is provided with a column and the radiating fin with a bearing surface, and the size of described heat radiation fixture is less than the size of described radiating seat; And
One fixed head has at least one through hole;
The through hole that the described column of wherein said heat radiation fixture passes described fixed head is combined with described combined hole, the bearing surface of described radiating fin is connected on the described fixed head, makes described radiating seat and described heat radiation fixture firmly be combined in the both sides of described fixed head.
2. backlight module as claimed in claim 1, it is characterized in that: the described column of described heat radiation fixture has a screw thread or a spring in addition, so that described column is combined in the described combined hole of described radiating seat.
3. backlight module as claimed in claim 1, it is characterized in that: the described column of described heat radiation fixture has at least one projection in addition, and described combined hole has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are mutually chimeric, so that described column is combined in the described combined hole of described radiating seat.
4. backlight module as claimed in claim 1, it is characterized in that: the described combined hole of described radiating seat has at least one projection in addition, and described column has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are mutually chimeric, so that described column is combined in the described combined hole of described radiating seat.
5. such as backlight module as described in claim 3 or 4, it is characterized in that: described projection is salient point, bulge loop or convex arc section, and corresponding described depression is concave point, concave ring groove or concave arc groove.
6. backlight module as claimed in claim 1, it is characterized in that: described chip is light-emitting diode chip for backlight unit.
7. backlight module as claimed in claim 1, it is characterized in that: described fixed head is a backboard or a light emitting source pedestal.
8. backlight module as claimed in claim 1, it is characterized in that: described support plate is circuit substrate or lead frame.
9. luminous source encapsulation structure, it is characterized in that: described luminous source encapsulation structure comprises:
One support plate has an embedding hole;
One radiating seat is embedded in the described embedding hole of described support plate, and described radiating seat has a first surface, a second surface and a combined hole, and wherein said combined hole is to be opened in described first surface;
At least one chip is arranged at the described second surface of described radiating seat, and is electrically connected at described support plate;
Article at least two, lead-in wire is used so that described support plate and described at least one chip form electric connection;
One packing colloid coats the part that bag protects the upper surface of the second surface of described chip, described lead-in wire, described radiating seat and described support plate; And
One heat radiation fixture, be provided with a column and the radiating fin with a bearing surface, the size of described heat radiation fixture is less than the size of described radiating seat, and wherein said column is combined with described combined hole, has an assembling spacing between described bearing surface and the described radiating seat.
10. luminous source encapsulation structure as claimed in claim 9, it is characterized in that: described column has a screw thread or a spring in addition, so that described column is combined in the described combined hole.
11. luminous source encapsulation structure as claimed in claim 9, it is characterized in that: described column has at least one projection in addition, described combined hole has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are mutually chimeric, so that described column is combined in the described combined hole.
12. luminous source encapsulation structure as claimed in claim 9, it is characterized in that: described combined hole has at least one projection in addition, described column has corresponding at least one depression in addition, wherein said at least one projection and corresponding described at least one depression are mutually chimeric, so that described column is combined in the described combined hole.
13. such as claim 11 or 12 described luminous source encapsulation structures, it is characterized in that: described projection is salient point, bulge loop or convex arc section, and corresponding described depression is concave point, concave ring groove or concave arc groove.
14. luminous source encapsulation structure as claimed in claim 9 is characterized in that: described chip is light-emitting diode chip for backlight unit.
15. luminous source encapsulation structure as claimed in claim 9 is characterized in that: described support plate is circuit substrate or lead frame.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102307872A CN101943356B (en) | 2010-07-14 | 2010-07-14 | Backlight module and luminous source encapsulation structure thereof |
| PCT/CN2010/078145 WO2012006834A1 (en) | 2010-07-14 | 2010-10-27 | Backlight module and luminous source encapsulation structure |
| US12/996,290 US8288782B2 (en) | 2010-07-14 | 2010-10-27 | Backlight module and light-emitting source package structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102307872A CN101943356B (en) | 2010-07-14 | 2010-07-14 | Backlight module and luminous source encapsulation structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101943356A CN101943356A (en) | 2011-01-12 |
| CN101943356B true CN101943356B (en) | 2013-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102307872A Active CN101943356B (en) | 2010-07-14 | 2010-07-14 | Backlight module and luminous source encapsulation structure thereof |
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| Country | Link |
|---|---|
| CN (1) | CN101943356B (en) |
| WO (1) | WO2012006834A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI440232B (en) * | 2011-01-21 | 2014-06-01 | Lextar Electronics Corp | Light source module |
| CN102563454B (en) * | 2011-10-12 | 2014-05-14 | 深圳市华星光电技术有限公司 | LED backlight module and liquid crystal display device |
| CN102563459B (en) * | 2011-12-13 | 2014-06-11 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display device |
| WO2014031849A2 (en) * | 2012-08-22 | 2014-02-27 | Flex-N-Gate Advanced Product Development, Llc | Micro-channel heat sink for led headlamp |
| TWI571598B (en) * | 2015-01-15 | 2017-02-21 | 旭德科技股份有限公司 | Illumination apparatus |
| WO2017059575A1 (en) * | 2015-10-09 | 2017-04-13 | 魏晓敏 | Led light emitting unit and module |
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| CN1608326A (en) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | LED and LED lamp thereof |
| CN101044427A (en) * | 2004-08-18 | 2007-09-26 | 索尼株式会社 | Heat radiator and display unit |
| CN101149534A (en) * | 2007-10-26 | 2008-03-26 | 京东方科技集团股份有限公司 | Backlight |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100523601C (en) * | 2006-12-30 | 2009-08-05 | 新灯源科技有限公司 | LED lighting device |
| CN201004458Y (en) * | 2007-01-09 | 2008-01-09 | 天瑞企业股份有限公司 | Heat radiation device of LED |
| TW200903834A (en) * | 2007-07-05 | 2009-01-16 | Bright Led Electronics Corp | High heat-dissipation light emitting diode device |
| TWM345942U (en) * | 2008-05-16 | 2008-12-01 | Ledtech Electronics Corp | Customized assembling lighting module |
| CN201259194Y (en) * | 2008-10-08 | 2009-06-17 | 史杰 | LED packaged illumination circuit board of high thermal conductivity |
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- 2010-10-27 WO PCT/CN2010/078145 patent/WO2012006834A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1608326A (en) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | LED and LED lamp thereof |
| CN101044427A (en) * | 2004-08-18 | 2007-09-26 | 索尼株式会社 | Heat radiator and display unit |
| CN101149534A (en) * | 2007-10-26 | 2008-03-26 | 京东方科技集团股份有限公司 | Backlight |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012006834A1 (en) | 2012-01-19 |
| CN101943356A (en) | 2011-01-12 |
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