JP3175599U - Heat dissipation structure of valve - Google Patents

Heat dissipation structure of valve Download PDF

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Publication number
JP3175599U
JP3175599U JP2012001139U JP2012001139U JP3175599U JP 3175599 U JP3175599 U JP 3175599U JP 2012001139 U JP2012001139 U JP 2012001139U JP 2012001139 U JP2012001139 U JP 2012001139U JP 3175599 U JP3175599 U JP 3175599U
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Prior art keywords
heat dissipation
heat
fins
dissipation structure
valve
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Expired - Fee Related
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JP2012001139U
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鎰明 陳
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鎰明 陳
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

Disclosed is a valve heat dissipation structure that speedily transmits thermal energy to the surrounding environment, accelerates the heat dissipation process, improves the overall heat dissipation mechanism and performance, and extends the service life of the valve.
A heat dissipation structure 10 of the present bulb has an effect of increasing the heat dissipation efficiency of the valve. A heat dissipation case 11 and a plurality of fins 12 are provided in the heat dissipation structure, and a light emitting source is attached to these fins. Thermal energy generated by the light emitting source is transmitted to the heat radiating case through the fins. Further, a power supply driver is installed at the bottom of these fins, and heat is radiated through the heat radiating case. As a result, the two heat sources, the light source and power supply driver, are installed separately, and heat energy is transmitted to the surrounding environment through the heat radiating case, the overall heat radiating flow is accelerated, and the light emitting performance and service life of the bulb Are all improved.
[Selection] Figure 1D

Description

  The present invention relates to a kind of valve heat dissipation structure, and more particularly to a valve heat dissipation structure capable of increasing the heat dissipation efficiency.

  Modern tungsten incandescent lamps were successfully researched and developed during the transition from the 19th century to the 20th century, and the inner light emitters were made of tungsten-made filaments. Is very high and can maintain a solid state even at high temperatures, so that the bulb can have a certain life, and the filament does not burn out in a short time and becomes unusable. Actually, the filament temperature of the lit incandescent lamp reaches 3000 degrees Celsius, and the electric lamp generates bright light by the light radiation generated by the hot filament. As a result, the human life is not hindered by the arrival at night, and the light emitted by the incandescent lamp continues many activities at night, whether at work or in life, and offers more possibilities. Expand. It can be said that the incandescent lamp invention has greatly changed the way of life of mankind, and extends the time of activities in many directions and develops it in various ways.

  With the advancement of lighting technology, lighting lamps have been developed, and in the existing lighting lamps, the efficiency of incandescent lamps is the lowest, and the portion that is converted to light energy of the consumed electric energy is reduced from 12% to 18% However, the energy conversion efficiency is quite low, the other parts are dissipated in the form of thermal energy, and most of the energy is wasted. Therefore, with the advancement of science and technology, the technology of light emitting diodes and related peripheral integrated circuit control elements and heat dissipation technologies are maturing more and more, their applications are further diversified, low-efficiency power indicator lamps and mobile phone keyboard light sources To LED backlight modules and general lighting products, it is gradually replacing traditional light sources. Compared with incandescent lamp bulbs, which have a short life and generate heat, light emitting diodes have the advantages of low power consumption, no mercury, no halides, and low carbon dioxide emissions. As people increasingly focus on the agenda for environmental protection and consider various aspects of reducing carbon dioxide and reducing the use of mercury and halides, governments set deadlines to ban the use of incandescent lamps. Promote the use of light emitting diodes.

  The light emitting characteristics of the light emitting diode are in the form of a point light source, and therefore are more elastic in design, and by dispersing the light source, the eyes are not irritating and can be concentrated on a single point or a specific area, The generated color can be made clearer, and the luminous efficiency of the white light LED is currently 70 lm / W or more, which already exceeds 15 lm / W of the incandescent lamp. At present, only 35% of the input power of the light emitting diode is converted into light, and the remaining 65% is converted into heat, and the amount of heat generated is a cause of a decrease in the light emitting efficiency of the light emitting diode. Further, the thermal energy generated by the light emitting diode is accumulated if the heat dissipation mechanism of the entire device is defective, the thermal energy is accumulated and the light emitting diode cannot derive heat, and the life of the light emitting diode is shortened. In general, the life of an LED lamp is 100,000 hours or more, but when the working temperature is 85 ° C. or more, the life is significantly shortened.

  Therefore, when using bulbs including LED bulbs, an increase in the amount of heat is an inevitable result, and heat dissipation is a means to solve this problem. The focus of related technology is how to improve the heat dissipation efficiency of each part. Whether to extend the service life. In addition to the light emission source, the power source driver also generates heat energy, and if the heat radiation of the power source driver is poor, the efficiency of the LED bulb similarly deteriorates and consequently the LED bulb cannot be started. Therefore, if the heat dissipation mechanism of these two parts is bad, and if they affect each other, the temperature will rise for that reason, and the service life of the LED bulb will be lowered, the indoor temperature will be raised, and the user will not be comfortable Therefore, the heat dissipation mechanism is here and is one of the most important issues.

  Almost all of the valve heat dissipation structures currently on the market are fin-type heat dissipation structures, and the fins of this structure extend outward from the center of the main body, hold a space in the center, and a power driver is in the space. Left unattended. However, when the power driver itself is a heating element, and the heat energy generated by the light source is transferred to the fins by heat conduction, the heat completely surrounds the power driver and the heat energy generated by the power driver. The internal temperature becomes excessively high under this effect, leading to the destruction of the electronic components in the power supply driver, for example, the electrolytic capacitor (heat-resistant temperature 105 degrees Celsius, life 8000 hours). It has a severe impact on the life of the driver, and the temperature of the light source does not decrease due to the co-heating effect, which lowers the light emission efficiency, and is therefore a problem caused by damage often formed inside the power driver. This may not be a problem of the light emission performance of the light source itself.

  The fin-type heat dissipation structure can only dissipate the heat energy generated by the light source, the heat dissipation mechanism is not perfect, and the power driver placed in it is a mechanism that dissipates the heat energy generated by it And the heat energy generated by the power supply driver induces a co-heating effect with the heat energy generated by the light source, resulting in damage to the electronic components in the power supply drive and thus affecting the life of the bulb. .

  The main object of the present invention is to provide a heat dissipation structure for a kind of valve, which uses a heat dissipation case, and a plurality of fins are provided in an annular shape in the heat dissipation case, and the heat dissipation case is in contact with air. By increasing the area, heat energy can be transmitted quickly to the surrounding environment, accelerating the heat dissipation process, improving the overall heat dissipation mechanism and performance, and extending the service life of the valve.

  The next object of the present invention is to provide a heat dissipation structure for a kind of valve, which uses a power supply connecting portion, and installs a power supply driver in the power supply connecting portion, and the power supply connecting portion includes these Installed at the bottom of the fin, effectively separating the heat radiating case from the power connection portion to maintain a certain distance, and the heat energy generated by the power supply driver in the power connection portion Shall be dissipated through.

  For the above-mentioned purpose, the present invention provides a kind of bulb heat dissipation structure, which includes a heat dissipation case and a plurality of fins, and these fins are provided in an annular shape on the inner wall of the heat dissipation case, When installed on these fins and the light source generates heat energy, the heat energy is transmitted to the heat dissipation case through the fin that the light source directly contacts, and heat dissipation is performed by the heat dissipation case. The process of heat dissipation is accelerated, the thermal energy does not continue to concentrate on the light source, and the light emission efficiency and service life of the light source are both significantly improved.

  Further, the present invention includes a power connection part, a power driver is installed in the power connection part, the power connection part is installed at the bottom of these fins, and the light source and the power connection part are isolated. The heat dissipation case can effectively dissipate heat generated by the power supply driver, thereby extending the life of the power supply driver and thereby extending the life of the valve.

  Further, the heat radiating case of the heat radiating structure further includes a plurality of heat radiating holes, and these heat radiating holes are installed on the surfaces of the heat radiating case and the power supply connecting portion, and the heat radiating efficiency is enhanced by such a structure.

  The present invention provides a kind of valve heat dissipation structure, which is applied to the heat dissipation of the valve. The heat dissipation structure of the present invention improves the shortcomings of the fin type heat dissipation structure, provides a heat dissipation method for the power supply driver, effectively solves the co-heat effect, thus extending the service life of the bulb and emitting light. The luminous efficiency of the source can be improved by improving the heat dissipation, which is safer for the user and exempts the bulb from high heat damage and subsequent problems.

1 is a top view of a heat dissipation structure according to a preferred embodiment of the present invention. 1 is a side view of a heat dissipation structure according to a preferred embodiment of the present invention. 1 is a bottom view of a heat dissipation structure according to a preferred embodiment of the present invention. 1 is a three-dimensional view of a heat dissipation structure according to a preferred embodiment of the present invention. It is a top view of the heat dissipation structure of another preferred embodiment of the present invention. It is a side view of the heat dissipation structure of another preferred embodiment of the present invention. It is a bottom view of the heat dissipation structure of another preferred embodiment of the present invention. It is a three-dimensional view of a heat dissipation structure of another preferred embodiment of the present invention. It is a combination display diagram of a light emitting source and a heat dissipation structure of another preferred embodiment of the present invention. FIG. 6 is a completed display diagram of a light emitting source and a heat dissipation structure according to another preferred embodiment of the present invention. It is a three-dimensional view using a real core in a heat dissipation structure of another preferred embodiment of the present invention.

  In order to describe in detail the technical contents, structural features, and objects to be achieved of the present invention, examples will be described below in combination with the drawings.

  The heat radiating structure of the bulb of the present invention solves the problem of the fin type heat radiating structure of the well-known technology, and it solves the problem of heat radiating failure of the light source and the co-heating effect generated by the light source and the power driver. In addition, the luminous efficiency and service life of the bulb are both improved by the heat dissipation structure of the present invention.

  See Figures 1A, 1B, 1C, 1D. These are a plan view, a side view, a bottom view, and a three-dimensional view of a heat dissipation structure of a preferred embodiment of the present invention. In the heat dissipation structure of the valve of the present invention, the heat dissipation structure 10 presented includes a heat dissipation case 11 and a plurality of fins 12. The fins 12 are provided in an annular shape on the inner wall of the heat radiating case 11, and heat energy generated by the light emitting source is transmitted to the heat radiating case 11 through the fins 12, and heat is radiated by this method. Of these, the lengths of the fins 12 may be mismatched or matched, and the conventional technology transmits heat to the fins through the cup body to dissipate the heat, and the function and structure of the cup body are the same as those of the present invention. Similar to the heat dissipation case, the heat energy generated in large quantities is absorbed first by the thin cup body, and the heat absorbed by the thin cup body is considerably limited. The heat radiation cannot be efficiently dissipated by transferring heat energy to the fins through absorption of the cup body. In the present invention, the heat energy is first absorbed by the fins 12 and further radiated by the heat radiating case 11. Since the total absorbed heat energy of the fins 12 is larger than that of the heat radiating case 11, the present invention has good heat radiation efficiency. .

  The heat dissipation case 11 of the heat dissipation structure 10 further includes a plurality of first heat dissipation holes 111. These first heat radiating holes 111 are installed on the surface of the heat radiating case 11, and these fins 12 not only transmit heat to the heat radiating case 11 after absorbing heat, but also pass through the first heat radiating holes 111. By heat convection, air is introduced from one end at a relatively low temperature, heat energy is discharged from one end that is relatively hot, and heat absorbed by these fins 12 is discharged efficiently. The present invention not only allows heat exchange between the fins 12 and the surface of the heat radiating case 11 and the outside air, but also enhances the heat convection by the first heat radiating holes 111 and improves the cooling effect. Among them, the hole diameter of the first heat radiation hole 111 gradually increases from a bottom portion where the opening is relatively narrow to an upper portion where the opening is relatively wide. However, the hole diameter arrangement of the first heat radiating holes 111 is not limited to the above-described gradual increase method, but is elastically adjusted according to actual needs, or has other hole diameter changes, The hole diameter of the present invention is not limited to this, and is only for explaining the present embodiment. Thereby, the heat dissipation efficiency of the heat dissipation case 11 is further improved.

  Further, the housing portion 13 is further included. The housing portion 13 is installed at the bottom of the fins 12 and is located inside the heat radiating case 11. The function of the housing portion 13 will be described later.

  See Figures 2A, 2B, 2C, 2D. These are a plan view, a side view, a bottom view and a three-dimensional view of a heat dissipation structure of another preferred embodiment of the present invention. In the heat dissipation structure of the valve of the present invention, the heat dissipation structure 20 presented includes a heat dissipation case 21 and a plurality of fins 22. These fins 22 are annularly provided on the inner wall of the heat radiating case 21, and these fins 22 further include an annular body 222. The ring-shaped body 222 has a hollow shape, a part of the fins 22 is stretched and placed in the center of the ring-shaped body 222, and the fins 22 and the ring-shaped body 222 can be formed as a single-piece structure. When the heat energy generated is transmitted to the heat radiating case 21, it has a good function.

  Further, the housing portion 23 is further provided. The housing portion 23 is installed at the bottom of the fins 22 and is located inside the heat radiating case 21. The function of the housing portion 23 will be described later.

  3 and 4 are an assembly display diagram and an assembly completion display diagram of a light emitting source and a heat dissipation structure according to another embodiment of the present invention. The bulb presented by the present invention includes a light emitting source 30, which is a substrate 32, which directly contacts the fins 12, and the side of the substrate 32 is the side of the heat dissipation case 11. The power supply connecting portion 34, which is tightly joined to the upper end of the inner wall and is intimately combined with the heat conductive paste or adhesive, is installed in the accommodating portion 13, and the power connecting portion 34 is When the power driver 342 has a hollow body and the power driver 342 is installed therein, and the power driver 342 is installed in the power connection part 34, a heat-conducting adhesive may be interposed, thereby the power driver 342. And the power supply connecting portion 34, in which the heat energy is quickly transmitted to the power supply connecting portion 34.

  Among them, a plurality of LED chips are installed above the substrate 32, and in order to improve the heat dissipation effect, a heat dissipation paste or a heat dissipation piece is used on the contact surface of the substrate 32 with the fins 12, Are brought into close contact with each other so that heat can be rapidly transferred to the fins 12 and the heat radiating case 11 in the substrate 32 by heat conduction.

  The light source 30 further includes a lamp cover 31. The lamp cover 31 is installed above the substrate 32. The material of the lamp cover 31 is transparent or diffused, and the light source is an LED module. Since the LED is a point light source, it does not form glare after direct viewing to form a visual incompatibility. Therefore, all the lamp covers 31 are made of an acrylic material having light diffusing particles. , Diffuse the light of the LED.

  Furthermore, since the heat dissipation case 11 of the heat dissipation structure 10 has these first heat dissipation holes 111 and these first heat dissipation holes 111 are installed on the surface of the heat dissipation case 11, the heat dissipation efficiency of the heat dissipation case 11 is The fins 12 of the heat dissipation structure 10 are further improved, and a plurality of screw holes 121 are provided in the fins 12. The substrate 32 is fixed to the screw holes 121 of the fins 12 with a plurality of screws 321. It can be made of a material with good heat conductivity, such as copper, gold, aluminum and other metal or ceramic materials with good heat conductivity.

  The substrate 32 is one of the light emitting sources, and the heat generation mechanism is different depending on each part. First, the heat energy generated on the bottom surface of the substrate 32 is transmitted to the heat radiating case 11 by the fins 12. To dissipate heat. Further, the thermal energy on the side of the substrate 32 is transmitted to the outside air by a close combination of the substrate 32 and the heat radiating case 11 to form convection, thereby achieving a heat radiation effect. Finally, the heat at the upper end of the substrate 32 is transferred directly to the fins 12 via the screws 321 and further transferred to the bottom of the heat radiating case 11 for rapid heat dissipation. Therefore, the heat dissipation mechanism of the present invention has a plurality of heat conduction routes, and the heat of the substrate 32 is discharged quickly.

  In addition, the power connection portion 34 in the light source 30 further includes a plurality of second heat radiation holes 341, and a cover plate 33 is installed above the power connection portion 34, and the cover plate 33 is formed on the substrate. The heat generated by 32 is isolated from the power connection 34. Unless isolated by this method, the power driver 342 in the power connection 34 generates a co-heat effect by the heat energy transmitted from the substrate 32, resulting in damage to electronic components. In the conventional technique, there is no heat dissipation method for the power supply driver 342, and the substrate 32 is not isolated from the power supply driver 342. It generates energy and a co-heat effect, and the generated high temperature affects both the service life and luminous efficiency of the bulb, including the life of the LED chip and the power supply driver. For this reason, the second heat radiating hole 341 and the plurality of vertical heat radiating holes 343 are provided on the side surface and the vertical surface of the power supply connecting portion 34, and the second heat radiating hole 341 and the vertical heat radiating holes 343 are provided on the heat radiating case 11. The fins 12 are not blocked and the convection air flows directly to the outside, thereby improving the heat dissipation efficiency of the power supply driver 342.

  In this embodiment, when the valve is used in the horizontal direction, the power driver 342 causes the air to enter from the bottom through the second heat radiating holes 341, and the hot air is exhausted from the top in a convection method. Discharge. When the valve is used in a vertical mode, heat energy is exchanged through the vertical heat dissipation holes 343 above and below, thereby generating the power driver 342 no matter what direction the valve is used. The heat energy that is generated is discharged by the method of thermal convection. Therefore, when the heat dissipation structure of the present invention is used for a valve, it is not limited to a single direction, and is more convenient to use.

  Please refer to FIG. It is a three-dimensional view using a heat dissipation structure of another embodiment of the present invention as a real core. The center of the ring-shaped body 222 that is installed in the illustrated heat dissipation structure 20 and connected to the fins 22 is a real core. Alternatively, the number of the ring-shaped body 222 connected to the fins 22 can be plural, and it can be adjusted as necessary, and is not limited to the shape or quantity described above.

  In summary, the present invention provides a kind of bulb heat dissipation structure, which has the effect of increasing the heat dissipation efficiency of the bulb, and has a heat dissipation case and a plurality of fins in the heat dissipation structure, and the light source is combined with these fins. The heat energy generated by the light emitting source is transmitted to the heat radiating case through these fins. Further, a power supply driver is installed at the bottom of these fins, and heat is radiated through the heat radiating case. As a result, the heat source of the light source and the power supply driver are separated and installed, and the heat radiation is transmitted to the surrounding environment by the heat radiating case, the entire heat radiation flow is accelerated, and the light emission performance and the service life of the bulb are Needless to say, it has an advantage in industrial use and household use.

  The above description is only an example of the present invention, and does not limit the scope of the present invention. Any equivalent changes and modifications that can be made based on the scope of the claims of the present invention are all described in the present invention. Shall belong to the scope covered by the rights.

DESCRIPTION OF SYMBOLS 10 Heat radiation structure 11 Heat radiation case 111 1st heat radiation hole 12 Fin 121 Screw hole 13 Housing part 20 Heat radiation structure 21 Heat radiation case 211 Heat radiation hole 22 Fin 221 Screw hole 222 Toroidal body 223 Real body 23 Housing part 30 Light emission source 31 Lamp cover 32 Substrate 321 Screw 33 Cover plate 34 Power connection portion 341 Second heat radiation hole 342 Power supply driver 343 Vertical heat radiation hole

Claims (18)

  1. In the heat dissipation structure of the valve,
    A heat dissipation case,
    A plurality of fins annularly provided on the inner wall of the heat dissipation case;
    A heat dissipation structure for a valve, characterized in that
  2.   2. The heat dissipation structure for a valve according to claim 1, further comprising a substrate screwed to the fins.
  3.   2. The heat dissipation structure for a valve according to claim 1, wherein the fin further includes an annular body, and the annular body is installed in the center of the heat dissipation case and connected to the fins. Construction.
  4.   4. The heat dissipation structure for a valve according to claim 3, wherein the annular body has a hollow shape.
  5.   4. The heat dissipation structure for a valve according to claim 3, wherein the ring-shaped body is connected to the fins, and the fins are partially extended to the center of the ring-shaped body.
  6.   4. The heat dissipation structure for a valve according to claim 3, wherein the center of the annular body is a real core.
  7.   The heat dissipation structure for a valve according to claim 1, wherein a plurality of first heat dissipation holes are provided in the heat dissipation case.
  8.   8. The heat dissipation structure for a valve according to claim 7, wherein the diameter of the first heat dissipation holes gradually increases upward from the bottom of the heat dissipation case.
  9.   2. The valve heat dissipating structure according to claim 1, wherein a plurality of screw holes are provided in the fins.
  10.   2. The heat dissipation structure for a valve according to claim 1, wherein the lengths of the fins do not completely coincide with each other.
  11.   2. The heat dissipation structure for a valve according to claim 1, wherein the heat dissipation case is integrally formed with the fins.
  12.   2. The heat dissipation structure for a valve according to claim 1, wherein a housing portion is provided at the bottom of these fins.
  13.   The heat dissipation structure for a valve according to claim 12, wherein a power supply connecting portion is provided in the housing portion, and the power supply connecting portion is a hollow body.
  14.   14. The valve heat dissipation structure according to claim 13, wherein a power supply driver is provided in the power supply connecting portion in the housing portion.
  15.   14. The heat dissipation structure for a valve according to claim 13, wherein a plurality of second heat dissipation holes are provided in the power connection portion.
  16.   The heat dissipation structure for a valve according to claim 15, wherein the heat dissipation case is provided with a plurality of first heat dissipation holes, and the first heat dissipation holes and the second heat dissipation holes are disposed to face each other. Heat dissipation structure of the valve.
  17.   14. The heat dissipation structure for a valve according to claim 13, wherein a plurality of vertical heat dissipation holes are provided at the bottom and top of the hollow body.
  18.   The heat dissipation structure for a valve according to claim 17, wherein a plurality of second heat dissipation holes are provided in the power connection portion, and the vertical heat dissipation holes and the second heat dissipation holes are disposed to face each other. Heat dissipation structure of the valve.
JP2012001139U 2011-10-13 2012-03-01 Heat dissipation structure of valve Expired - Fee Related JP3175599U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100219135U TWM423207U (en) 2011-10-13 2011-10-13 Heat-dissipation structure for light bulb
TW100219135 2011-10-13

Publications (1)

Publication Number Publication Date
JP3175599U true JP3175599U (en) 2012-05-17

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JP (1) JP3175599U (en)
TW (1) TWM423207U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013053081A1 (en) * 2011-10-13 2013-04-18 Chen I-Ming Heat dissipating structure for bulb
WO2013179865A1 (en) * 2012-05-31 2013-12-05 船井電機株式会社 Illumination device
JP2015529376A (en) * 2012-08-17 2015-10-05 コーニンクレッカ フィリップス エヌ ヴェ Heat dissipation structure with segmented chimney structure

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US20150103535A1 (en) * 2013-10-14 2015-04-16 Wen-Sung Hu Air-Cooled and Moisture-Resistant LED Lamp and Bulb
USD733959S1 (en) * 2014-08-05 2015-07-07 General Luminaire Co., Ltd. Spliceable lamp panel
USD732730S1 (en) * 2014-08-05 2015-06-23 General Luminaire Co., Ltd. Spliceable lamp panel
US9581322B2 (en) 2014-09-30 2017-02-28 Aeonovalite Technologies, Inc. Heat-sink for high bay LED device, high bay LED device and methods of use thereof
TWI570357B (en) * 2015-10-16 2017-02-11 Unity Opto Technology Co Ltd The heat lamp using LED bulb
CA2971938A1 (en) 2017-01-16 2018-07-16 Lumca Inc. Led lighting fixture

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Publication number Priority date Publication date Assignee Title
CN101363600B (en) * 2007-08-10 2011-11-09 富准精密工业(深圳)有限公司 LED lamp
CN101368719B (en) * 2007-08-13 2011-07-06 太一节能系统股份有限公司 LED lamp
US20100309662A1 (en) * 2009-06-04 2010-12-09 Jin Song Zheng LED lighting fixture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013053081A1 (en) * 2011-10-13 2013-04-18 Chen I-Ming Heat dissipating structure for bulb
WO2013179865A1 (en) * 2012-05-31 2013-12-05 船井電機株式会社 Illumination device
JP2015529376A (en) * 2012-08-17 2015-10-05 コーニンクレッカ フィリップス エヌ ヴェ Heat dissipation structure with segmented chimney structure
US10006621B2 (en) 2012-08-17 2018-06-26 Philips Lighting Holding B.V. Heat dissipation structure with splitted chimney structure

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TWM423207U (en) 2012-02-21
US20130092362A1 (en) 2013-04-18

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