JP5351259B2 - LED lamp with combined heat dissipation structure - Google Patents

Abstract

An LED lamp with combined radiator structure comprises: at least one LED chip (2) for light generation; a driving circuit for driving the LED chip (2); a first substrate (3) with radiating ribs; a second substrate (4) with radiating ribs, wherein the second substrate (4) is installed on the first substrate (3) and contacted with the radiating ribs of the first substrate (3); and a glass envelope (1) installed on the first substrate (3) and covering the second substrate (4).

Description

  The present invention relates to a light emitting diode (LED) lamp having a combined heat dissipation structure, and in particular, uses a combined heat dissipation structure to enhance the heat dissipation effect by conduction, convection, and radiation, The present invention relates to an LED lamp that can improve the light output angle and uniformity.

  With the rapid development of LED technology, LED light sources are attracting more and more attention because they have excellent features in environmental protection and energy saving. Conventional semiconductor LED lamps are small in volume and power consumption is concentrated, so high heat dissipation performance is required. The problem of how efficiently LED lamp heat can be dissipated remains a significant problem that constrains the development of LED light sources. Currently, many LED lamps sold in the market are designed to radiate heat mainly on the outer surface in order to solve the heat dissipation problem of LED lamps. Many radiators have a large volume and a relatively simple structure.

China Utility Model Patent Notice CN201005474Y

However, since the structural design for the internal structure is almost carried out, most of the LED lamps satisfy the heat radiation conditions required only for the LED lamps with low power.
Also, in the prior art, in order to reach the heat dissipation effect, the heat sink of the LED lamp is usually manufactured with a relatively large size. In this case, it becomes impossible for the LED to output uniform light. On the other hand, when the LED lamp is appropriately sized and it is intended to output uniform light, the heat dissipation condition cannot be satisfied, and thus the LED power is limited and the luminous flux density is too small. It is impossible to reach.

  In addition, all of the conventional heat dissipation techniques have the heat dissipation structure directly joined to the LED chip, and the heat dissipation structure achieves a heat dissipation effect by air convection and radiation. In this case, the connection with the glass casing made of glass cannot be balanced. Moreover, all become a plane light emission effect, and a light distribution angle becomes small. There are fewer designs for LED lamps that are not normally applicable to the illumination area and that have a glass housing.

  In view of the above problems, conventional LED lamps cannot reach a sufficient luminous flux density. In order to improve the luminous flux density, it is necessary to increase the volume of the heat dissipation part, which causes problems such as being large and heavy, and the appearance of the decoration not being beautiful. Not suitable for. In addition, light is not uniformly output, and light rays are too strong locally, causing problems such as damaging the eyes of humans, thereby affecting the life of the LED and the photoelectric performance.

  The present invention increases heat dissipation efficiency by rationally equipped with a heat dissipation device, improves the light emission angle of the LED using the heat dissipation device, and combines the light output characteristics and uniform characteristics of the LED with the glass casing. An object of the present invention is to provide an LED lamp having a combined heat dissipation structure that can greatly improve the above.

One aspect of the present invention is an LED lamp of a light-emitting diode having a combined heat dissipation structure, which includes at least one LED chip that generates light, a drive circuit for driving the LED chip, and a first for heat dissipation. A base material, a second base material provided on the first base material for dissipating heat in contact with the first base material, provided on the first base material, and the second base material. A plurality of heat dissipating pieces are provided at intervals on the second base material, and when viewed from the side of the second base material, the plurality of heat dissipating pieces are provided. intervals to provide an irregular shape der Ru LED lamp.

  According to the LED lamp of the present invention, the problem of the light output angle and the output uniformity can be well solved by improving the member structure on which the LED chip is placed and the arrangement glass housing, and the safe and secure use of the user is ensured. Lighting can be provided. In addition, the heat radiating base material connected to the inside and the outside can efficiently conduct and dissipate the heat generated by the LED lamp, thereby ensuring the performance and safety characteristics when the LED chip is operated.

  Further, the LED lamp of the present invention can use a base that is widely used at present, and its outer shape is sufficiently similar to that of an incandescent bulb, so that it can directly replace a low-efficiency incandescent bulb. . Therefore, energy can be effectively saved.

  The above and other objects and novel features of the present invention will become more fully apparent when the following description of the embodiments is read in light of the accompanying drawings as follows.

It is sectional drawing of an LED lamp provided with the combination heat dissipation structure concerning the 1st Example of this invention. It is sectional drawing of an LED lamp provided with the combination heat dissipation structure concerning the 2nd Example of this invention. It is a schematic diagram which shows the whole external appearance of the LED lamp provided with the combination heat dissipation structure concerning this invention. It is an overhead view which shows the structure of a 1st base material. It is sectional drawing of an LED lamp provided with the combination heat dissipation structure concerning the 3rd Example of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. At that time, in order to avoid confusion about understanding of the present invention, in the description of the invention, explanations of fine parts and functions unnecessary for the present invention are omitted.

The following describes preferred embodiments of the present invention with reference to the drawings.
(First embodiment)
FIG. 1 is a cross-sectional view of an LED lamp having a combined heat dissipation structure according to a first embodiment of the present invention. According to the first embodiment, an LED lamp having a combined heat dissipation structure includes a glass housing 1, an LED chip 2, a first substrate 3, and a second substrate as shown in FIG. 1. A substrate 4, a base 5, and a connection member 6 are provided. The connecting member 6 is connected to the second base 4 and the base 5 by internal and external threads. In addition, this invention is not restricted to this, The connection member 6 can also be connected with the 2nd base material 4 and the nozzle | cap | die 6 with another system. The connection member 6 is connected to the lower part of the second base material 4. Further, the first base material 3 is installed in the lower part of the second base material 4, and the heat dissipation bar of the first base material 3 surrounds the lower part of the second base material 4. In other words, the outer surface of the lower part of the second base material 4 is in contact with the heat dissipation bar of the first base material 3. The first base material 3 is installed outside the glass housing 1 and is located at the lower part of the glass housing 1. The glass casing 1 is inserted and joined to the first base material 3 and the second base material 4 by slots provided on the first base material 3 and the second base material 4. The second substrate 4 is installed inside the glass casing 1. Moreover, this invention is not restricted to the 1st base material and the 2nd base material which have the above heat dissipation pieces. For example, the first base material and the second base material may not have a heat dissipation piece. Moreover, at least one of both can also be provided with a heat dissipation piece.

  As shown in FIG. 3, according to a preferred embodiment of the present invention, the first substrate 3 can have an inverted cylindrical frustum-shaped structure. In addition, this invention is not restricted to said structure, For example, it may become a column shape or a polygonal column shape. In the first embodiment, the first base material 3 has a cylindrical upper portion and a lower truncated cone shape. In other words, the diameter of the lower surface of the truncated cone is smaller than the diameter of its upper surface. Along the circumference of the first base material, by arranging a plurality of heat dissipating strips at intervals so that two adjacent heat dissipating strips separate the space, air flow is promoted, Can be increased. The heat dissipating pieces are uniformly installed along the circumference of the first base material 3 so as to dissipate heat uniformly. The LED chip drive circuit is installed inside the first substrate 3 (not shown).

  FIG. 4 is an overhead view showing an example of the first base material. As shown in FIG. 4, a plurality of heat dissipating rod pieces 41 are installed at intervals along the circumference of the first base material 3 so that two adjacent heat dissipating rod pieces separate the space. By promoting the flow of air, the heat dissipation surface is increased. A slot 43 is installed at a portion near the outer edge of each heat dissipating bar 41. By combining the slots 43 of the heat dissipating rods 41, an annular slot into which the glass housing 1 is inserted is formed. Note that the shape of the combined slot is not limited to an annular shape, and may be any shape that matches the shape seen from the top of the first base material 3. For example, the combined slot shape may be a polygon.

  Returning to FIG. 1, the second substrate 4 may have a truncated cone shape, and the inside of the truncated cone becomes a hollow cavity. The dimensions of the cavities may vary within the frustum. For example, in the upper part of the second base material 4 having a small diameter, the dimension of the internal cavity can be made smaller than the dimension of the lower cavity having a large diameter. The inside of the bottom near the lower part of the second base 4 communicates with the outside of the connection member 6. A plurality of heat dissipating pieces are installed along the axial direction of the second base material in the cylindrical portion of the upper part of the truncated cone of the second base material 4. When viewed from the side surface of the truncated cone, these heat dissipating pieces are configured to be uneven. In other words, a space that is recessed inward is formed between adjacent heat dissipating pieces, so that the heat dissipating area is increased. When viewed from the circular cross section of the second base member 4, the heat dissipating pieces are in the form of circular pieces formed along the axial direction of the cylinder, and uniform intervals are provided between the circular piece shapes. According to the present invention, the shape of the second substrate 4 is not limited to the truncated cone shape, and may be a polygonal column shape. Any shape corresponding to the shape of the first substrate 3 may be used.

  The top of the second substrate 4 is a substrate on which the LED chip 2 is placed. In the present embodiment, the LED chip base at the top has a pyramid shape (conical shape). Since a general LED chip has a light emission angle of the chip itself, it is advantageous to maximize the light emission angle of the LED chip by installing the chip base as a pyramid. By calculating based on the different LED chips used, it is possible to obtain an inclination angle α between the slope of the chip substrate and the horizontal plane of 0 degrees to 90 degrees. This angle is changed by the LED chip and the required light output characteristics.

  One LED chip may be disposed on the chip substrate. Alternatively, in order to obtain appropriate light intensity and light uniformity, one or more LED chips may be arranged along the slope of the chip base material according to the request for light intensity. This is advantageous for lighting system design. Even when multiple chips are arranged in the same manner as described above on a relatively small number of large-angle light output LED chips or on a pyramid base with a very small angle, it is possible to achieve the best effect. is there.

  The second base material 4 is installed on the first base material 3 and is connected to the inside and outside of the first base material 3 through the heat dissipation bar of the first base material 3. Both the first base material 3 and the second base material 4 conduct the heat generated by the LED chip in the glass casing to the first base material 3 that comes into contact with air through the second base material 4. . Thereafter, the first base 3 dissipates heat by conduction to air, convection or radiation.

  The glass casing 1 is installed on the upper surface of the first base material 3 and covers the second base material 4. As a material used for manufacturing the glass casing 1, transparent glass may be adopted, or polished glass may be adopted. As a result, the harmony and aesthetics of the LED lamp can be enhanced, and a certain degree of scattering can be imparted to the light output. In particular, when a polished glass casing is used, a higher heat dissipation effect can be obtained, and at the same time, the uniform effect of light output can be enhanced.

In order to obtain a better light emission angle, the highest point of the chip base material is preferably higher than the horizontal central axis (for example, the line shown in FIG. 1) of the spherical portion of the glass housing 1.
According to the LED lamp provided with the combined heat dissipation structure according to the present embodiment, an effective heat dissipation mode is provided, and the LED chip is covered in the glass casing. The heat generated by the LED chip is first conducted on the second substrate 4. Since the heat radiation piece on the second substrate 4 effectively increased the heat radiation area, heat concentration was avoided by dispersing heat. Since the surface of the 2nd base material 4 can also conduct heat to the air in the glass housing | casing 1, there exists a one part heat dissipation effect. Next, most of the heat is directly conducted to the first base 3 through the second base 4. On the surface of the first base material 3, since the scissors-shaped heat dissipating piece is adopted so as to increase the surface area, the first base material 3 is made to reach the maximum direct action with air. Heat is dissipated into the outside air by methods such as convection, conduction and heat radiation. Therefore, the combined heat dissipation structure according to the present invention provides a stable operating temperature for the LED chip while maintaining the thermal equilibrium of the base material, and exhibits the characteristics of the LED chip safely and effectively. The efficiency of use can be increased and energy can be saved.

(Second embodiment)
Hereinafter, an LED lamp including a combined heat dissipation structure according to a second embodiment of the present invention will be described with reference to FIG. In the LED lamp according to the second embodiment, members having the same functions as those of the LED lamp according to the first embodiment are denoted by the same member numbers, and description thereof is omitted. In the LED lamp of the second embodiment, as a distinction from the LED lamp of the first embodiment, the LED chip substrate employs a flat substrate instead of a pyramid-shaped inclined substrate.

  Similarly, the planar base material of the LED chip is preferably higher than the horizontal central axis (for example, the line shown in FIG. 2) of the spherical portion of the glass housing 1. Further, in order to improve the light output effect, that is, the light distribution characteristic, and to maximize the light output angle and uniformity, a plurality of LED chips may be arranged on the planar substrate.

(Third embodiment)
FIG. 5 is a cross-sectional view of an LED lamp having a combined heat dissipation structure according to a third embodiment of the present invention. The LED lamp of the third embodiment will be described below with reference to FIG. The LED lamp according to the third embodiment is denoted by the same member number with respect to a member having the same function as the member of the LED lamp according to the first and second embodiments, and the description thereof is omitted.

In the first and second embodiments, the LED chip is disposed on the second substrate. In this case, the second base 4 can be used as the base of the LED chip 2.
In the LED lamp in the third embodiment, the LED chip 2 is not mounted directly on the second base material 4 but mounted on the third base material 7 that is not integrated with the second base material 4. This is different from the LED lamps in the first and second embodiments described above. In the third embodiment, the third base material 7 has a polyhedral shape and is installed on the second base material 4. The shape of the third substrate 7 is different from the pyramidal substrate in the first embodiment and the planar substrate in the second embodiment. FIG. 5 shows an example in which the cross-sectional shape of the third substrate 7 is a hexagon. The hexagonal surface is mounted on the top of the second substrate 4 in contact with the second substrate 4 so as to fix the third substrate 7. If it is an engineer of this area | region, it can understand that the cross-sectional shape of the 3rd base material 7 is not restricted to the hexagon shown in FIG. The cross-sectional shape may be any polygon that can increase the light emission angle of the LED chip and improve the light output effect.

  In the third embodiment, the example in which the third base material 7 is not integrated with the second base material 4 has been described. However, this is merely for the convenience of processing, and has a special feature. It is not limited. The third base material 7 having such a polyhedral shape can be integrated with the second base material 4. Here, whether or not the second base material and the third base material are integrated with each other does not particularly affect the illumination effect of the LED lamp.

  The third substrate 7 may have a horizontal dimension (horizontal width shown in FIG. 5) larger than the horizontal dimension or width of the second substrate 4. In this case, the second base material 4 can avoid blocking the light emission direction from the LED chip disposed on the third base material 7 in the obliquely downward direction.

  By installing the LED chip on the other plane of the third substrate 7, the LED chip is illuminated in more directions, a better light emission angle is obtained, and the light output effect, that is, the light distribution characteristic is improved. be able to.

  According to the first, second, and third embodiments of the present invention, the base 5 can adopt a base that has been widely used in the past, and its external shape is sufficiently similar to an incandescent bulb. Therefore, the low-efficiency incandescent bulb can be directly replaced, and energy can be efficiently saved.

  According to the present invention, the problems relating to the light output angle and the light output uniformity are successfully solved by improving the base material structure and the arrangement glass casing on which the LED chip is placed. In addition, heat dissipation base material connected from the inside to the outside is used to conduct and dissipate heat with high efficiency to the outside, and the characteristics such as the performance and safety when operating the LED chip can be guaranteed.

  So far, preferred embodiments of the present invention have been described. Those skilled in the art will recognize that various modifications, replacements and additions may be made without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should not be understood as being limited to the specific embodiments described above, but is limited only by the scope of the appended claims.

Claims (20)

A light emitting diode LED lamp having a combined heat dissipation structure,
At least one LED chip that generates light;
A drive circuit for driving the LED chip;
A first substrate for radiating heat;
A second base material provided on the first base material for dissipating heat in contact with the first base material;
A glass casing provided on the first base material and covering the second base material ;
Above the second base member has a plurality of radiating strips is installed spaced manner, the case where viewed from the side of the second substrate, the plurality of heat dissipating pieces interval to said irregularities der Rukoto LED lamp. The LED lamp according to claim 1 , wherein the drive circuit is installed inside the first base material. 2. The LED lamp according to claim 1 , wherein an LED chip base material on which the LED chip is mounted is installed on a top of the second base material. 4. The LED lamp according to claim 3 , wherein the LED chip base has a conical structure, and an inclination angle α formed by an inclined surface of the conical structure with a horizontal plane is 0 to 90 degrees. The LED lamp according to claim 2 , wherein the highest point of the LED chip base is higher than a horizontal central axis of a spherical portion of the glass casing. 4. The LED lamp according to claim 3 , wherein the highest point of the LED chip base is higher than the horizontal central axis of the spherical portion of the glass casing. The LED lamp according to claim 3 , wherein the LED chip base has a planar structure. 8. The LED lamp according to claim 7 , wherein the plane of the LED chip base is higher than the horizontal central axis of the spherical portion of the glass casing. A plurality of the LED chips, LED lamp according to any one of claims 3-8, characterized in that disposed on the LED chip substrate. 2. The LED lamp according to claim 1 , wherein a plurality of heat dissipating pieces are disposed at intervals along the circumference of the first base material so that two adjacent heat dissipating pieces are separated from each other. The LED lamp according to claim 1 or 8 , wherein the first base material has a columnar shape or a polygonal columnar shape. The LED lamp according to claim 1 , wherein the second base material has a columnar shape or a polygonal column shape. The LED lamp according to claim 1 , wherein the glass casing is made of transparent glass or polished glass. Connection members each spinneret and, LED lamp according to claim 1, characterized in that connected to the inside of the lower portion of the second substrate. 2. The LED lamp according to claim 1 , wherein an outer surface of a lower portion of the second base material is in contact with an inner side and an outer side of the heat dissipation piece of the first base material. On the second base material, a third base material for mounting the LED chip is installed,
The LED lamp according to claim 1 , wherein the third base material has a polyhedral shape. A light emitting diode LED lamp having a combined heat dissipation structure,
At least one LED chip that generates light;
A drive circuit for driving the LED chip;
A first substrate for radiating heat;
A second base material provided on the first base material for dissipating heat in contact with the first base material;
A third substrate provided on the second substrate for mounting the LED chip;
A glass housing provided on the first base material and covering the second base material, the third base material and the LED chip ;
Above the second base member has a plurality of radiating strips is installed spaced manner, the case where viewed from the side of the second substrate, the plurality of heat dissipating pieces interval to said irregularities der Rukoto LED lamp. The LED lamp according to claim 17 , wherein the third base material has a polyhedral shape. The horizontal dimension of the third substrate, LED lamp according to claim 17 or 18, characterized in that greater than the horizontal dimension of the second substrate. The LED lamp according to claim 17 or 18 , wherein the LED chip is disposed on a plurality of surfaces of the third base material.

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