JP5351259B2 - LED lamp with combined heat dissipation structure - Google Patents

LED lamp with combined heat dissipation structure Download PDF

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JP5351259B2
JP5351259B2 JP2011513846A JP2011513846A JP5351259B2 JP 5351259 B2 JP5351259 B2 JP 5351259B2 JP 2011513846 A JP2011513846 A JP 2011513846A JP 2011513846 A JP2011513846 A JP 2011513846A JP 5351259 B2 JP5351259 B2 JP 5351259B2
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base
led lamp
led
substrate
led chip
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JP2011524615A (en
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インチュン ジャン
ウェイ シェー
チンブォ スン
ハイブォ チェン
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パナソニック株式会社
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Priority to PCT/CN2009/000610 priority patent/WO2009152687A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

An LED lamp with combined radiator structure comprises: at least one LED chip (2) for light generation; a driving circuit for driving the LED chip (2); a first substrate (3) with radiating ribs; a second substrate (4) with radiating ribs, wherein the second substrate (4) is installed on the first substrate (3) and contacted with the radiating ribs of the first substrate (3); and a glass envelope (1) installed on the first substrate (3) and covering the second substrate (4).

Description

本発明は、組合せ放熱構造を備える発光ダイオード(LED:Light Emitting Diode)のランプに関するものであり、特に、組合せ的な放熱構造を利用し、伝導、対流、放射により放熱効果を高めるとともに、LEDの光出力角度及び均一性を改善できるLEDランプに関するものである。   The present invention relates to a light emitting diode (LED) lamp having a combined heat dissipation structure, and in particular, uses a combined heat dissipation structure to enhance the heat dissipation effect by conduction, convection, and radiation, The present invention relates to an LED lamp that can improve the light output angle and uniformity.
LED技術の素早い発展に伴い、LED光源は、環境保護及び省エネにおける優れた特長を有するため、ますます注目される。従来の半導体LEDランプは、体積が小さく、かつ消費電力が集中するため、高い放熱性能が求められる。LEDランプの熱をどのように高効率で発散できるかという問題は、依然としてLED光源の発展を制約する重大な問題になる。現在、市場で売られる多くのLEDランプは、LEDランプの放熱問題を解決するため、主にその外表面に対して放熱設計を行うようになる。多くの放熱体は、体積が膨大であると共に、構造が比較的に簡単である。   With the rapid development of LED technology, LED light sources are attracting more and more attention because they have excellent features in environmental protection and energy saving. Conventional semiconductor LED lamps are small in volume and power consumption is concentrated, so high heat dissipation performance is required. The problem of how efficiently LED lamp heat can be dissipated remains a significant problem that constrains the development of LED light sources. Currently, many LED lamps sold in the market are designed to radiate heat mainly on the outer surface in order to solve the heat dissipation problem of LED lamps. Many radiators have a large volume and a relatively simple structure.
中国実用新案特許公告CN201045474YChina Utility Model Patent Notice CN201005474Y
だが、内部構造に対した構造設計は、殆ど行ないため、LEDランプの大部分は、パワーの低いLEDランプのみにおいて必要とされる放熱条件が満たされる。
また、先行技術において、放熱効果に達するため、通常、LEDランプの放熱体は比較的に大きな寸法で製造される。この場合、LEDが均一的な光を出力することが不可能になる。他方、LEDランプの寸法を適切にし、均一的な光を出力させようとする場合には、放熱条件が満足できないことにより、LEDのパワーが制限され、光束密度が小さすぎるので、照明の目的を達することが不可能である。
However, since the structural design for the internal structure is almost carried out, most of the LED lamps satisfy the heat radiation conditions required only for the LED lamps with low power.
Also, in the prior art, in order to reach the heat dissipation effect, the heat sink of the LED lamp is usually manufactured with a relatively large size. In this case, it becomes impossible for the LED to output uniform light. On the other hand, when the LED lamp is appropriately sized and it is intended to output uniform light, the heat dissipation condition cannot be satisfied, and thus the LED power is limited and the luminous flux density is too small. It is impossible to reach.
また、従来の放熱技術は、いずれも放熱構造を直接にLEDチップと接合させ、放熱構造は空気の対流、輻射によって放熱効果を達することになる。この場合、ガラス製のガラス筐体との接続をつり合いが取られない。また、すべて平面光出射効果となり、配光角度が小さくなる。通常照明領域に適用できず、ガラス筐体を備えるLEDランプに対する設計は、一層少なくなる。   In addition, all of the conventional heat dissipation techniques have the heat dissipation structure directly joined to the LED chip, and the heat dissipation structure achieves a heat dissipation effect by air convection and radiation. In this case, the connection with the glass casing made of glass cannot be balanced. Moreover, all become a plane light emission effect, and a light distribution angle becomes small. There are fewer designs for LED lamps that are not normally applicable to the illumination area and that have a glass housing.
上記の問題に鑑み、従来のLEDランプは、十分な光束密度に達することができない。光束密度を向上させるには、放熱部分の体積を増大しなければならないため、大きくて重くなることや、装飾の外観が美しくないことなどの問題が生じるため、日常家庭用または事務用の照明器具に適されない。そして、光は、均一的に出力されず、局部において光線が強すぎ、人の目に傷をつけることなどの問題が生じるため、LEDの寿命及び光電の性能に影響を与えてしまう。   In view of the above problems, conventional LED lamps cannot reach a sufficient luminous flux density. In order to improve the luminous flux density, it is necessary to increase the volume of the heat dissipation part, which causes problems such as being large and heavy, and the appearance of the decoration not being beautiful. Not suitable for. In addition, light is not uniformly output, and light rays are too strong locally, causing problems such as damaging the eyes of humans, thereby affecting the life of the LED and the photoelectric performance.
本発明は、合理的に放熱装置を装備することで放熱効率を高め、放熱装置を利用してLEDの光出射角度を改善すると共に、ガラス筐体との接合によりLEDの光出力特性及び均一特性を大きく改善できる、組合せ放熱構造を備えるLEDのランプを提供することを目的としている。   The present invention increases heat dissipation efficiency by rationally equipped with a heat dissipation device, improves the light emission angle of the LED using the heat dissipation device, and combines the light output characteristics and uniform characteristics of the LED with the glass casing. An object of the present invention is to provide an LED lamp having a combined heat dissipation structure that can greatly improve the above.
本発明の一面は、組合せ放熱構造を備える発光ダイオードのLEDランプであって、光を発生する少なくとも一つのLEDチップと、上記LEDチップを駆動するための駆動回路と、放熱するための第1の基材と、上記第1の基材上に設けられ、上記第1の基材と接触する放熱するための第2の基材と、上記第1の基材上に設けられ、上記第2の基材を覆うガラス筐体とを備え、上記第2の基材には複数の放熱片が間隔的に設置されており、上記第2の基材の側面から見る場合、上記複数の放熱片が間隔的に凹凸形状であるLEDランプを提供する。 One aspect of the present invention is an LED lamp of a light-emitting diode having a combined heat dissipation structure, which includes at least one LED chip that generates light, a drive circuit for driving the LED chip, and a first for heat dissipation. A base material, a second base material provided on the first base material for dissipating heat in contact with the first base material, provided on the first base material, and the second base material. A plurality of heat dissipating pieces are provided at intervals on the second base material, and when viewed from the side of the second base material, the plurality of heat dissipating pieces are provided. intervals to provide an irregular shape der Ru LED lamp.
本発明のLEDランプによれば、LEDチップを載せる部材構造及び配置ガラス筐体を改善することにより、光出力角度及び出力均一度の問題を良く解決でき、ユーザの安全使用を守り、適切かつ均一的な照明を提供することができる。また、内外に接続する二つの放熱基材によって、LEDランプが発生する熱を、効率よく伝導して発散させ、LEDチップ作動時の性能と安全などの特性を保証できる。   According to the LED lamp of the present invention, the problem of the light output angle and the output uniformity can be well solved by improving the member structure on which the LED chip is placed and the arrangement glass housing, and the safe and secure use of the user is ensured. Lighting can be provided. In addition, the heat radiating base material connected to the inside and the outside can efficiently conduct and dissipate the heat generated by the LED lamp, thereby ensuring the performance and safety characteristics when the LED chip is operated.
また、本発明のLEDランプは、現在広く使用している口金を利用することができ、その外形は、白熱電球に十分に類似するため、低い効率の白熱電球を直接的に代替することができる。よって、エネルギーを有効的に節約することができる。   Further, the LED lamp of the present invention can use a base that is widely used at present, and its outer shape is sufficiently similar to that of an incandescent bulb, so that it can directly replace a low-efficiency incandescent bulb. . Therefore, energy can be effectively saved.
本発明の前記並びにその他の目的と新規な特徴は、以下に示す実施形態の説明を、以下のような添付図面と照らし合わせて読むと、より完全に明らかとなるであろう。   The above and other objects and novel features of the present invention will become more fully apparent when the following description of the embodiments is read in light of the accompanying drawings as follows.
本発明の第1の実施例にかかる組合せ放熱構造を備えるLEDランプの断面図である。It is sectional drawing of an LED lamp provided with the combination heat dissipation structure concerning the 1st Example of this invention. 本発明の第2の実施例にかかる組合せ放熱構造を備えるLEDランプの断面図である。It is sectional drawing of an LED lamp provided with the combination heat dissipation structure concerning the 2nd Example of this invention. 本発明にかかる、組合せ放熱構造を備えるLEDランプの全体外観を示す模式図である。It is a schematic diagram which shows the whole external appearance of the LED lamp provided with the combination heat dissipation structure concerning this invention. 第1の基材の構造を示す俯瞰図である。It is an overhead view which shows the structure of a 1st base material. 本発明の第3の実施例にかかる組合せ放熱構造を備えるLEDランプの断面図である。It is sectional drawing of an LED lamp provided with the combination heat dissipation structure concerning the 3rd Example of this invention.
以下に、図面を参照しながら、本発明の好ましい実施例について詳細に説明する。その際、本発明に対する理解の混乱を避けるため、発明の記述において、本発明にとって不必要な細かい部分及び機能についての説明を省略した。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. At that time, in order to avoid confusion about understanding of the present invention, in the description of the invention, explanations of fine parts and functions unnecessary for the present invention are omitted.
以下は、図面を参照しながら、本発明の好ましい実施例を説明する。
(第1の実施例)
図1は、本発明の第1の実施例にかかる組合せ放熱構造を備えるLEDランプの断面図である。第1の実施例によれば、組合せ放熱構造を備えるLEDランプは、図1に示すように、ガラス筐体1と、LEDチップ2と、第1の基材(Substrate)3と、第2の基材4と、口金5と、接続部材6とを備える。接続部材6は、内外のねじ山によって、それぞれ第2の基材4及び口金5と接続する。なお、本発明はこれに限らず、接続部材6は、その他の方式で第2の基材4及び口金6と接続することも可能である。接続部材6は、第2の基材4の下部と接続する。また、第1の基材3は、第2の基材4の下部に設置され、第1の基材3の放熱鰭片は、第2の基材4の下部を囲むようになる。換言すれば、第2の基材4の下部の外表面は、第1の基材3の放熱鰭片と接触する。第1の基材3は、ガラス筐体1の外部に設置され、ガラス筐体1の下部に位置する。ガラス筐体1は、第1の基材3及び第2の基材4上に設置されたスロットによって、第1の基材3及び第2の基材4と挿入接合する。第2の基材4は、ガラス筐体1の内部に設置される。また、本発明は、上記のような放熱片を有する第1の基材及び第2の基材に限るものではない。例えば、第1の基材及び第2の基材は放熱片を有しないことも可能である。また、両者のうち少なくとも一つは、放熱片を備えることも可能である。
The following describes preferred embodiments of the present invention with reference to the drawings.
(First embodiment)
FIG. 1 is a cross-sectional view of an LED lamp having a combined heat dissipation structure according to a first embodiment of the present invention. According to the first embodiment, an LED lamp having a combined heat dissipation structure includes a glass housing 1, an LED chip 2, a first substrate 3, and a second substrate as shown in FIG. 1. A substrate 4, a base 5, and a connection member 6 are provided. The connecting member 6 is connected to the second base 4 and the base 5 by internal and external threads. In addition, this invention is not restricted to this, The connection member 6 can also be connected with the 2nd base material 4 and the nozzle | cap | die 6 with another system. The connection member 6 is connected to the lower part of the second base material 4. Further, the first base material 3 is installed in the lower part of the second base material 4, and the heat dissipation bar of the first base material 3 surrounds the lower part of the second base material 4. In other words, the outer surface of the lower part of the second base material 4 is in contact with the heat dissipation bar of the first base material 3. The first base material 3 is installed outside the glass housing 1 and is located at the lower part of the glass housing 1. The glass casing 1 is inserted and joined to the first base material 3 and the second base material 4 by slots provided on the first base material 3 and the second base material 4. The second substrate 4 is installed inside the glass casing 1. Moreover, this invention is not restricted to the 1st base material and the 2nd base material which have the above heat dissipation pieces. For example, the first base material and the second base material may not have a heat dissipation piece. Moreover, at least one of both can also be provided with a heat dissipation piece.
図3に示すように、本発明の好ましい実施例によれば、第1の基材3は、逆円柱錐台形状の構造であることが可能である。なお、本発明は、上記の構造に限らず、例えば、円柱状や多角柱状になってもよい。第1の実施例において、第1の基材3は、上部が円柱状であり、その下部が逆円錐台形状である。換言すれば、円錐台の下表面の直径は、その上表面の直径より小さい。第1の基材の円周に沿って、隣接する二つの放熱鰭片が空間を隔てるように、複数の放熱鰭片を間隔的に設置することで、空気の流動を促進し、放熱面を増大させることができる。放熱鰭片は、均一的に放熱するように、第1の基材3の円周に沿って均一的に設置される。LEDチップの駆動回路は、第1の基材3の内部に設置される(図に示していない)。   As shown in FIG. 3, according to a preferred embodiment of the present invention, the first substrate 3 can have an inverted cylindrical frustum-shaped structure. In addition, this invention is not restricted to said structure, For example, it may become a column shape or a polygonal column shape. In the first embodiment, the first base material 3 has a cylindrical upper portion and a lower truncated cone shape. In other words, the diameter of the lower surface of the truncated cone is smaller than the diameter of its upper surface. Along the circumference of the first base material, by arranging a plurality of heat dissipating strips at intervals so that two adjacent heat dissipating strips separate the space, air flow is promoted, Can be increased. The heat dissipating pieces are uniformly installed along the circumference of the first base material 3 so as to dissipate heat uniformly. The LED chip drive circuit is installed inside the first substrate 3 (not shown).
図4は、第1の基材の1実例を示す俯瞰図である。図4に示すように、第1の基材3の円周に沿って、隣接する二つ放熱鰭片が空間を隔てるように、複数の放熱鰭片41を間隔的に設置し、放熱通路42を構成することで空気の流動を促進し、放熱面を増大させる。各放熱鰭片41の外側エッジに近い部分において、スロット43が設置される。各放熱鰭片41のスロット43を組み合わせることによって、ガラス筐体1が挿入するための環状スロットが形成される。なお、組み合わせたスロットの形状は、環状の形状に限らず、第1の基材3の上部から見た形状と一致する形状であればよい。例えば、組み合わせたスロット形状は、多角形であってもよい。   FIG. 4 is an overhead view showing an example of the first base material. As shown in FIG. 4, a plurality of heat dissipating rod pieces 41 are installed at intervals along the circumference of the first base material 3 so that two adjacent heat dissipating rod pieces separate the space. By promoting the flow of air, the heat dissipation surface is increased. A slot 43 is installed at a portion near the outer edge of each heat dissipating bar 41. By combining the slots 43 of the heat dissipating rods 41, an annular slot into which the glass housing 1 is inserted is formed. Note that the shape of the combined slot is not limited to an annular shape, and may be any shape that matches the shape seen from the top of the first base material 3. For example, the combined slot shape may be a polygon.
図1に戻って、第2の基材4は、円錐台形状であってもよく、円錐台の内部が中空のキャビティになる。キャビティの寸法は、円錐台の内部において、異なってもよい。例えば、直径が小さい第2の基材4の上部において、その内部のキャビティの寸法は、直径が大きい下部キャビティの寸法より小さくすることもできる。第2の基材4の下部に近い底部の内部は、接続部材6の外部と連通する。第2の基材4の円錐台上部の円柱部分において、第2の基材の軸方向に沿って複数の放熱片が設置される。円錐台の側面から見ると、これらの放熱片は、交互に凹凸となるように構成される。換言すれば、隣接する放熱片の間に、内へ窪んだ空間が形成されるため、放熱面積は増大された。第2の基材4の円形断面から見ると、放熱片は、円柱の軸方向に沿って形成された円形片形状となり、その円形片形状の間は均一的間隔を空いている。なお、本発明によると、第2の基材4の形状は円錐台状に限らず、多角柱状であってもよい。第1の基材3の形状に相応する形状であればよい。   Returning to FIG. 1, the second substrate 4 may have a truncated cone shape, and the inside of the truncated cone becomes a hollow cavity. The dimensions of the cavities may vary within the frustum. For example, in the upper part of the second base material 4 having a small diameter, the dimension of the internal cavity can be made smaller than the dimension of the lower cavity having a large diameter. The inside of the bottom near the lower part of the second base 4 communicates with the outside of the connection member 6. A plurality of heat dissipating pieces are installed along the axial direction of the second base material in the cylindrical portion of the upper part of the truncated cone of the second base material 4. When viewed from the side surface of the truncated cone, these heat dissipating pieces are configured to be uneven. In other words, a space that is recessed inward is formed between adjacent heat dissipating pieces, so that the heat dissipating area is increased. When viewed from the circular cross section of the second base member 4, the heat dissipating pieces are in the form of circular pieces formed along the axial direction of the cylinder, and uniform intervals are provided between the circular piece shapes. According to the present invention, the shape of the second substrate 4 is not limited to the truncated cone shape, and may be a polygonal column shape. Any shape corresponding to the shape of the first substrate 3 may be used.
第2の基材4のトップは、LEDチップ2を載せる基材である。本実施例において、トップにあるLEDチップ基材は、ピラミッド状(錐状)となる。一般のLEDチップは、そのチップ自身の光出射角度が制限されるため、チップ基材をピラミッド状として設置することは、LEDチップの光出射角度の最大化に有利である。使用された異なるLEDチップに基づいて計算を行うことにより、チップ基材の斜面と水平面との傾斜角度αが0度〜90度であることが得られる。この角度は、LEDチップ及び求められる光出力特性によって変更される。   The top of the second substrate 4 is a substrate on which the LED chip 2 is placed. In the present embodiment, the LED chip base at the top has a pyramid shape (conical shape). Since a general LED chip has a light emission angle of the chip itself, it is advantageous to maximize the light emission angle of the LED chip by installing the chip base as a pyramid. By calculating based on the different LED chips used, it is possible to obtain an inclination angle α between the slope of the chip substrate and the horizontal plane of 0 degrees to 90 degrees. This angle is changed by the LED chip and the required light output characteristics.
チップ基材上には、一つのLEDチップが配置されてもよい。または、適宜な光強度及び光均一性を得るため、光強度の要求に応じて、チップ基材の斜面に沿って、一つ以上の複数のLEDチップを配置してもよい。これは、照明システムの設計に有利である。現在で比較的に少ない、大角度光出力LEDチップや、角度が非常に小さい斜面のピラミッド基材に対して上記と同様に複数のチップを配置した場合も、最善の効果に達することも可能である。   One LED chip may be disposed on the chip substrate. Alternatively, in order to obtain appropriate light intensity and light uniformity, one or more LED chips may be arranged along the slope of the chip base material according to the request for light intensity. This is advantageous for lighting system design. Even when multiple chips are arranged in the same manner as described above on a relatively small number of large-angle light output LED chips or on a pyramid base with a very small angle, it is possible to achieve the best effect. is there.
第2の基材4は、第1の基材3の上に設置され、第1の基材3の放熱鰭片を介して、第1の基材3の内外と連接する。第1の基材3及び第2の基材4は、共にガラス筐体内のLEDチップにより生じる発熱量を、第2の基材4を介して空気と接触する第1の基材3に伝導する。その後、第1の基材3は、熱を、空気への伝導、対流や輻射によって発散する。   The second base material 4 is installed on the first base material 3 and is connected to the inside and outside of the first base material 3 through the heat dissipation bar of the first base material 3. Both the first base material 3 and the second base material 4 conduct the heat generated by the LED chip in the glass casing to the first base material 3 that comes into contact with air through the second base material 4. . Thereafter, the first base 3 dissipates heat by conduction to air, convection or radiation.
ガラス筐体1は、第1の基材3の上面に設置され、第2の基材4を覆うようになる。ガラス筐体1の製造に用いる材料は、透明ガラスを採用してもよいし、磨りガラスを採用することも可能である。これによって、LEDランプの外観上の調和性及び美観性を高めることができると共に、光出力にある程度の散乱性を与えることができる。特に、磨りガラス筐体を使用する場合、より高い放熱効果が得られると同時に、光出力の均一効果を高めることもできる。   The glass casing 1 is installed on the upper surface of the first base material 3 and covers the second base material 4. As a material used for manufacturing the glass casing 1, transparent glass may be adopted, or polished glass may be adopted. As a result, the harmony and aesthetics of the LED lamp can be enhanced, and a certain degree of scattering can be imparted to the light output. In particular, when a polished glass casing is used, a higher heat dissipation effect can be obtained, and at the same time, the uniform effect of light output can be enhanced.
なお、よりよい光出射角度を獲得するため、チップ基材の最高点は、ガラス筐体1の球形部分の水平中心軸線(例えば、図1に示す線)より高いことが好ましい。
本実施例にかかる組合せ放熱構造を備えるLEDランプによれば、有効的な放熱形態を提供したと共に、LEDチップはガラス筐体内に覆われる。LEDチップによって発生した熱は、まず、第2の基材4上に伝導する。第2の基材4上の放熱片は、有効的に放熱面積を増大したため、熱を分散させることによって熱の集中を避けた。第2の基材4の表面は、ガラス筐体1内の空気に熱伝導することもできるため、一部の放熱効果を奏する。次に、大部分の熱は、第2の基材4を介して第1の基材3に直接熱伝導される。第1の基材3の表面においては、表面積を増大させるように、鰭片形状の放熱片を採用するため、第1の基材3が空気との直接的作用を最大限に達するようにされ、対流、伝導や熱輻射などの方式によって熱を、外部空気中へ発散する。したがって、本発明にかかる組合せ放熱構造は、基材の熱平衡を維持することが可能でありながら、LEDチップに安定した作動温度を提供し、安全かつ有効的にLEDチップの特性を発揮すると共に光の利用効率を増大し、エネルギーを節約することができる。
In order to obtain a better light emission angle, the highest point of the chip base material is preferably higher than the horizontal central axis (for example, the line shown in FIG. 1) of the spherical portion of the glass housing 1.
According to the LED lamp provided with the combined heat dissipation structure according to the present embodiment, an effective heat dissipation mode is provided, and the LED chip is covered in the glass casing. The heat generated by the LED chip is first conducted on the second substrate 4. Since the heat radiation piece on the second substrate 4 effectively increased the heat radiation area, heat concentration was avoided by dispersing heat. Since the surface of the 2nd base material 4 can also conduct heat to the air in the glass housing | casing 1, there exists a one part heat dissipation effect. Next, most of the heat is directly conducted to the first base 3 through the second base 4. On the surface of the first base material 3, since the scissors-shaped heat dissipating piece is adopted so as to increase the surface area, the first base material 3 is made to reach the maximum direct action with air. Heat is dissipated into the outside air by methods such as convection, conduction and heat radiation. Therefore, the combined heat dissipation structure according to the present invention provides a stable operating temperature for the LED chip while maintaining the thermal equilibrium of the base material, and exhibits the characteristics of the LED chip safely and effectively. The efficiency of use can be increased and energy can be saved.
(第2の実施例)
以下は、図2を参照しながら、本発明の第2の実施例にかかる組合せ放熱構造を備えるLEDランプの説明を行う。第2の実施例にかかるLEDランプは、上記の第1の実施例にかかるLEDランプの部材と同じ機能を有する部材に対し、同じ部材番号で示し、その説明を省略する。第2の実施例のLEDランプは、上記の第1の実施例のLEDランプとの区別として、LEDチップ基材がピラミッド状の傾斜面の基材ではなく平面基材を採用する。
(Second embodiment)
Hereinafter, an LED lamp including a combined heat dissipation structure according to a second embodiment of the present invention will be described with reference to FIG. In the LED lamp according to the second embodiment, members having the same functions as those of the LED lamp according to the first embodiment are denoted by the same member numbers, and description thereof is omitted. In the LED lamp of the second embodiment, as a distinction from the LED lamp of the first embodiment, the LED chip substrate employs a flat substrate instead of a pyramid-shaped inclined substrate.
同様に、LEDチップの平面基材は、ガラス筐体1の球形部分の水平中心軸線(例えば、図2に示す線)より高いことが好ましい。また、光出力効果、すなわち配光特性を改善し、光出力角度及び均一性を最大限に向上するため、複数のLEDチップを平面基材上に配置してもよい。   Similarly, the planar base material of the LED chip is preferably higher than the horizontal central axis (for example, the line shown in FIG. 2) of the spherical portion of the glass housing 1. Further, in order to improve the light output effect, that is, the light distribution characteristic, and to maximize the light output angle and uniformity, a plurality of LED chips may be arranged on the planar substrate.
(第3の実施例)
図5は、本発明の第3の実施例にかかる組合せ放熱構造を備えるLEDランプの断面図である。以下、図5を参照して第3の実施例のLEDランプを説明する。第3の実施例にかかるLEDランプは、上述第1及び第2の実施例にかかるLEDランプの部材と同じ機能を有する部材に対して、同じ部材番号で示し、その説明を省略する。
(Third embodiment)
FIG. 5 is a cross-sectional view of an LED lamp having a combined heat dissipation structure according to a third embodiment of the present invention. The LED lamp of the third embodiment will be described below with reference to FIG. The LED lamp according to the third embodiment is denoted by the same member number with respect to a member having the same function as the member of the LED lamp according to the first and second embodiments, and the description thereof is omitted.
第1と第2の実施例において、LEDチップは第2の基材上に配置される。この場合、第2の基材4をLEDチップ2の基材とすることが可能である。
第3の実施例におけるLEDランプは、LEDチップ2が第2の基材4上に直接に実装されず、第2の基材4と一体化に構成されない第3の基材7に実装される点が、上記の第1及び第2の実施例におけるLEDランプと異なる。第3の実施例において、第3の基材7は、多面体の形状であり、第2の基材4上に設置される。第3の基材7の形状は、第1の実施例におけるピラミッド形状の基材及び第2の実施例における平面状の基材と異なる。図5は、第3の基材7の断面形状が六角形の例を示す。六角形のある面は、第3の基材7を固定するように、第2の基材4に接触して第2の基材4のトップに実装される。本領域の技術者であれば、第3の基材7の断面形状は図5に示す六角形に限らないことを理解できる。その断面形状は、LEDチップの光出射角度を増大し、光出力効果を改善できるあらゆる多角形であればよい。
In the first and second embodiments, the LED chip is disposed on the second substrate. In this case, the second base 4 can be used as the base of the LED chip 2.
In the LED lamp in the third embodiment, the LED chip 2 is not mounted directly on the second base material 4 but mounted on the third base material 7 that is not integrated with the second base material 4. This is different from the LED lamps in the first and second embodiments described above. In the third embodiment, the third base material 7 has a polyhedral shape and is installed on the second base material 4. The shape of the third substrate 7 is different from the pyramidal substrate in the first embodiment and the planar substrate in the second embodiment. FIG. 5 shows an example in which the cross-sectional shape of the third substrate 7 is a hexagon. The hexagonal surface is mounted on the top of the second substrate 4 in contact with the second substrate 4 so as to fix the third substrate 7. If it is an engineer of this area | region, it can understand that the cross-sectional shape of the 3rd base material 7 is not restricted to the hexagon shown in FIG. The cross-sectional shape may be any polygon that can increase the light emission angle of the LED chip and improve the light output effect.
なお、第3の実施例において、第3の基材7が第2の基材4と一体化に構成されない例を説明したが、これは、ただ加工の便利を図るものであって、特別な限定ではない。このような多面体の形状である第3の基材7は、第2の基材4と一体化に構成することも可能である。ここで、第2の基材と第3の基材と一体化に構成されるか否かは、LEDランプの照明効果に特別な影響を与えない。   In the third embodiment, the example in which the third base material 7 is not integrated with the second base material 4 has been described. However, this is merely for the convenience of processing, and has a special feature. It is not limited. The third base material 7 having such a polyhedral shape can be integrated with the second base material 4. Here, whether or not the second base material and the third base material are integrated with each other does not particularly affect the illumination effect of the LED lamp.
第3の基材7は、水平方向の寸法(図5に示す水平方向上の幅)が第2の基材4の水平方向の寸法または幅より大きくしてもよい。この場合、第2の基材4により、第3の基材7上に斜下方向に向けて配置されたLEDチップからの光出射方向が遮断されることを回避できる。   The third substrate 7 may have a horizontal dimension (horizontal width shown in FIG. 5) larger than the horizontal dimension or width of the second substrate 4. In this case, the second base material 4 can avoid blocking the light emission direction from the LED chip disposed on the third base material 7 in the obliquely downward direction.
第3の基材7の他の平面上にLEDチップを設置することによって、LEDチップをより多くの方向に照明させ、よりよい光出射角度を獲得し、光出力効果すなわち配光特性を改善することができる。   By installing the LED chip on the other plane of the third substrate 7, the LED chip is illuminated in more directions, a better light emission angle is obtained, and the light output effect, that is, the light distribution characteristic is improved. be able to.
本発明の第1、第2と第3の実施例によれば、口金5は、従来広く使用されている口金を採用することが可能であり、その外形は白熱電球に十分に類似しているため、低い効率の白熱電球を直接に取り代えるができ、効率よくエネルギーを節約できる。   According to the first, second, and third embodiments of the present invention, the base 5 can adopt a base that has been widely used in the past, and its external shape is sufficiently similar to an incandescent bulb. Therefore, the low-efficiency incandescent bulb can be directly replaced, and energy can be efficiently saved.
本発明によれば、LEDチップを載せる基材構造及び配置ガラス筐体を改善することにより、光出力角度及び光出力均一度に関する問題をうまく解決した。また、内から外まで接続される放熱基材を利用して、熱を高い効率で外部に伝導し発散させられ、LEDチップ作動時の性能及び安全などの特性を保証できた。   According to the present invention, the problems relating to the light output angle and the light output uniformity are successfully solved by improving the base material structure and the arrangement glass casing on which the LED chip is placed. In addition, heat dissipation base material connected from the inside to the outside is used to conduct and dissipate heat with high efficiency to the outside, and the characteristics such as the performance and safety when operating the LED chip can be guaranteed.
ここまで、本発明について好ましい実施例を合わせて説明した。当業者であれば、本発明の精神及び範囲から逸脱しない限り、様々な変更、交換及び追加を行ってもよいことが理解される。そこで、本発明の範囲は前記特定の実施例に限られるものと理解してはならず、添付した請求項の範囲によって限定されるものである。   So far, preferred embodiments of the present invention have been described. Those skilled in the art will recognize that various modifications, replacements and additions may be made without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should not be understood as being limited to the specific embodiments described above, but is limited only by the scope of the appended claims.

Claims (20)

  1. 組合せ放熱構造を備える発光ダイオードのLEDランプであって、
    光を発生する少なくとも一つのLEDチップと、
    上記LEDチップを駆動するための駆動回路と、
    放熱するための第1の基材と、
    上記第1の基材上に設けられ、上記第1の基材と接触する放熱するための第2の基材と、
    上記第1の基材上に設けられ、上記第2の基材を覆うガラス筐体とを備え
    上記第2の基材には複数の放熱片が間隔的に設置されており、上記第2の基材の側面から見る場合、上記複数の放熱片が間隔的に凹凸形状であることを特徴とするLEDランプ。
    A light emitting diode LED lamp having a combined heat dissipation structure,
    At least one LED chip that generates light;
    A drive circuit for driving the LED chip;
    A first substrate for radiating heat;
    A second base material provided on the first base material for dissipating heat in contact with the first base material;
    A glass casing provided on the first base material and covering the second base material ;
    Above the second base member has a plurality of radiating strips is installed spaced manner, the case where viewed from the side of the second substrate, the plurality of heat dissipating pieces interval to said irregularities der Rukoto LED lamp.
  2. 上記駆動回路は、上記第1の基材の内部に設置されることを特徴とする請求項に記載のLEDランプ。 The LED lamp according to claim 1 , wherein the drive circuit is installed inside the first base material.
  3. 上記LEDチップを載せるためのLEDチップ基材が、上記第2の基材のトップに設置されることを特徴とする請求項に記載のLEDランプ。 2. The LED lamp according to claim 1 , wherein an LED chip base material on which the LED chip is mounted is installed on a top of the second base material.
  4. 上記LEDチップ基材は、錐状構造であり、上記錐状構造の斜面が水平面となす傾斜角度αは、0度〜90度であることを特徴とする請求項に記載のLEDランプ。 4. The LED lamp according to claim 3 , wherein the LED chip base has a conical structure, and an inclination angle α formed by an inclined surface of the conical structure with a horizontal plane is 0 to 90 degrees.
  5. 上記LEDチップ基材の最高点は、上記ガラス筐体の球形部分の水平中心軸線より高いことを特徴とする請求項に記載のLEDランプ。 The LED lamp according to claim 2 , wherein the highest point of the LED chip base is higher than a horizontal central axis of a spherical portion of the glass casing.
  6. 上記LEDチップ基材の最高点は、上記ガラス筐体の球形部分の水平中心軸線より高いことを特徴とする請求項に記載のLEDランプ。 4. The LED lamp according to claim 3 , wherein the highest point of the LED chip base is higher than the horizontal central axis of the spherical portion of the glass casing.
  7. 上記LEDチップ基材は、平面構造であることを特徴とする請求項に記載のLEDランプ。 The LED lamp according to claim 3 , wherein the LED chip base has a planar structure.
  8. 上記LEDチップ基材の平面は、ガラス筐体の球形部分の水平中心軸線より高いことを特徴とする請求項に記載のLEDランプ。 8. The LED lamp according to claim 7 , wherein the plane of the LED chip base is higher than the horizontal central axis of the spherical portion of the glass casing.
  9. 複数の上記LEDチップが、上記LEDチップ基材上に配置されることを特徴とする請求項の何れか1項に記載のLEDランプ。 A plurality of the LED chips, LED lamp according to any one of claims 3-8, characterized in that disposed on the LED chip substrate.
  10. 隣接する二つの放熱片が空間を隔てるように、上記第1の基材の円周に沿って複数の放熱片を間隔的に設置することを特徴とする請求項に記載のLEDランプ。 2. The LED lamp according to claim 1 , wherein a plurality of heat dissipating pieces are disposed at intervals along the circumference of the first base material so that two adjacent heat dissipating pieces are separated from each other.
  11. 上記第1の基材は、円柱状または多角柱状であることを特徴とする請求項1または8に記載のLEDランプ。 The LED lamp according to claim 1 or 8 , wherein the first base material has a columnar shape or a polygonal columnar shape.
  12. 上記第2の基材は、円柱状または多角柱状であることを特徴とする請求項に記載のLEDランプ。 The LED lamp according to claim 1 , wherein the second base material has a columnar shape or a polygonal column shape.
  13. 上記ガラス筐体は、透明ガラスまたは磨りガラスにより作成されることを特徴とする請求項に記載のLEDランプ。 The LED lamp according to claim 1 , wherein the glass casing is made of transparent glass or polished glass.
  14. 接続部材は、それぞれ、口金と、上記第2の基材の下部の内側と接続することを特徴とする請求項に記載のLEDランプ。 Connection members each spinneret and, LED lamp according to claim 1, characterized in that connected to the inside of the lower portion of the second substrate.
  15. 上記第2の基材の下部の外表面が、上記第1の基材の放熱片の内外と接触することを特徴とする請求項に記載のLEDランプ。 2. The LED lamp according to claim 1 , wherein an outer surface of a lower portion of the second base material is in contact with an inner side and an outer side of the heat dissipation piece of the first base material.
  16. 上記第2の基材上に、上記LEDチップを載せるための第3の基材が設置され、
    上記第3の基材は、多面体形状であることを特徴とする請求項に記載のLEDランプ。
    On the second base material, a third base material for mounting the LED chip is installed,
    The LED lamp according to claim 1 , wherein the third base material has a polyhedral shape.
  17. 組合せ放熱構造を備える発光ダイオードのLEDランプであって、
    光を発生する少なくとも一つのLEDチップと、
    上記LEDチップを駆動するための駆動回路と、
    放熱するための第1の基材と、
    上記第1の基材上に設けられ、上記第1の基材と接触する放熱するための第2の基材と、
    上記第2の基材上に設けられ、上記LEDチップを載せるための第3の基材と、
    上記第1の基材上に設けられ、上記第2の基材、上記第3の基材及び上記LEDチップを覆うガラス筐体とを備え
    上記第2の基材には複数の放熱片が間隔的に設置されており、上記第2の基材の側面から見る場合、上記複数の放熱片が間隔的に凹凸形状であることを特徴とするLEDランプ。
    A light emitting diode LED lamp having a combined heat dissipation structure,
    At least one LED chip that generates light;
    A drive circuit for driving the LED chip;
    A first substrate for radiating heat;
    A second base material provided on the first base material for dissipating heat in contact with the first base material;
    A third substrate provided on the second substrate for mounting the LED chip;
    A glass housing provided on the first base material and covering the second base material, the third base material and the LED chip ;
    Above the second base member has a plurality of radiating strips is installed spaced manner, the case where viewed from the side of the second substrate, the plurality of heat dissipating pieces interval to said irregularities der Rukoto LED lamp.
  18. 上記第3の基材は、多面体形状であることを特徴とする請求項17に記載のLEDランプ。 The LED lamp according to claim 17 , wherein the third base material has a polyhedral shape.
  19. 上記第3の基材の水平方向の寸法は、上記第2の基材の水平方向の寸法より大きいことを特徴とする請求項17または18に記載のLEDランプ。 The horizontal dimension of the third substrate, LED lamp according to claim 17 or 18, characterized in that greater than the horizontal dimension of the second substrate.
  20. 上記LEDチップは、上記第3の基材における複数の表面上に配置されることを特徴とする請求項17または18に記載のLEDランプ。 The LED lamp according to claim 17 or 18 , wherein the LED chip is disposed on a plurality of surfaces of the third base material.
JP2011513846A 2008-06-19 2009-06-01 LED lamp with combined heat dissipation structure Expired - Fee Related JP5351259B2 (en)

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CN200810128507XA CN101608785B (en) 2008-06-19 2008-06-19 LED lamp with combination heat dissipation structure
CN200810128507.X 2008-06-19
PCT/CN2009/000610 WO2009152687A1 (en) 2008-06-19 2009-06-01 Led lamp with combined radiator structre

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