CN218296028U - Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system - Google Patents
Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system Download PDFInfo
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- CN218296028U CN218296028U CN202222039886.3U CN202222039886U CN218296028U CN 218296028 U CN218296028 U CN 218296028U CN 202222039886 U CN202222039886 U CN 202222039886U CN 218296028 U CN218296028 U CN 218296028U
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Abstract
The utility model discloses a heat transfer mechanism, electrical apparatus box, off-premises station and air conditioning system relates to air conditioning technology field, when having solved among the prior art thermal conductivity component and heat source contact, the not good and not high technical problem of heat conduction efficiency of heat conduction effect. The heat transfer mechanism of the utility model comprises a heat absorption component, a heat conduction component and a heat dissipation component, wherein the heat absorption component is contacted with the heating device, and a heat absorption part is arranged on the heat absorption component and is used for absorbing the heat generated by the heating device; the heat conduction assembly is used for connecting the heat absorption assembly and the heat dissipation assembly; the heat dissipation assembly is located in a region away from the heat generating device. The utility model discloses a heat transfer mechanism can shift the heat on device surface that generates heat to the heat-transfer component fast to release to radiator unit department through the heat-transfer component conduction, and then can improve the heat conduction effect and the heat conduction efficiency of heat absorption subassembly, improve the heat dispersion of the device that generates heat.
Description
Technical Field
The utility model relates to an air conditioning technology field especially relates to a heat transfer mechanism, electrical apparatus box, off-premises station and air conditioning system.
Background
In the field of multi-connected outdoor units, dust, small organisms, water vapor and the like outside the unit can enter the electric appliance box through the vent holes in the electric appliance box, so that dust is gathered or damp is affected on the surfaces of components in the electric appliance box, and the problems of overhigh surface temperature or short circuit and the like of the components are caused. Therefore, the comprehensive sealed electrical box is generally adopted in the industry to solve the problem, and meanwhile, the heat generated by the components cannot be dissipated through the vent holes, so that the heat is accumulated in the electrical box, and the components are damaged due to overhigh temperature.
For the problem that the heat that solves components and parts production can't be passed through the ventilation hole and effuses, prior art adopts following scheme: the fan is arranged in the electrical box, and air in the electrical box flows through the fan, so that the temperature in each part of the electrical box is uniform. The applicant has found that the solution of making the temperature uniform throughout the electrical box by means of a fan presents at least the problems of short service life of the fan, low reliability and difficulty in after-sales maintenance. Specifically, the service life of the fan is about 1 ten thousand hours generally, and under extreme working conditions, the service life of the fan is shorter, the fan needs to be replaced frequently, and the after-sale difficulty and the cost are increased; in addition, the fan has low reliability, and once the fan breaks down, the temperature in the electric appliance box rises, so that the components are continuously invalid, and the after-sale maintenance range and the maintenance difficulty are enlarged.
In addition to the heat dissipation effect of the electronic component, the conventional solution is to use a heat conduction component (e.g., a heat pipe) with better heat conduction efficiency to locally contact the heat source, and the heat conduction component is further combined with a heat dissipation component (e.g., a heat sink, a fan), so that the heat of the heat source is transmitted to a remote location by the heat conduction component and dissipated by the heat dissipation component, thereby alleviating the problem of excessive heat concentration. However, the applicant found that when the heat conducting assembly in the prior art is in contact with a heat source, the heat conducting effect is poor, the heat conducting efficiency is not high, and thus the heat dissipation performance of the electronic assembly is poor. Therefore, in order to improve the heat conduction effect and the heat conduction efficiency between the heat conduction assembly and the heat source, it is urgently required to improve the heat conduction assembly in the prior art.
SUMMERY OF THE UTILITY MODEL
One of the purposes of the utility model is to provide a heat transfer mechanism, when having solved among the prior art thermal conductivity component and heat source contact, the not good and not high technical problem of heat conduction efficiency of heat conduction effect. The technical effects that the preferred technical scheme of the utility model can produce are explained in detail in the following.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the heat transfer mechanism of the utility model comprises a heat absorption component, a heat conduction component and a heat dissipation component, wherein the heat absorption component is contacted with a heating device, and a heat absorption part is arranged on the heat absorption component and is used for absorbing heat generated by the heating device; the heat conduction assembly is used for connecting the heat absorption assembly and the heat dissipation assembly; the heat dissipation assembly is located in a region away from the heat generating device.
According to a preferred embodiment, the heat absorbing part includes a first thermal conductive adhesive layer disposed on at least one of the heat absorbing member and the heat generating device, and the first thermal conductive adhesive layer is located where the heat absorbing member and the heat generating device are in contact.
According to a preferred embodiment, the heat absorbing assembly comprises a substrate, a mounting cavity is arranged on the substrate, the mounting cavity is used for mounting the heat generating device, and the first heat conducting glue layer is arranged at the bottom of the mounting cavity.
According to a preferred embodiment, the depth of the housing cavity is such that: h 1 The thickness of the first heat-conducting glue layer is smaller than the depth of the accommodating cavity; wherein H 1 Is the depth of the placement cavity.
According to a preferred embodiment, the heat absorbing part includes a heat absorbing pillar protruding from a substrate surface of the heat absorbing member, and the heat absorbing pillar is located between two adjacent heat generating devices.
According to a preferred embodiment, a gap is formed between the heat absorption column and the heating device, a second heat-conducting adhesive layer is arranged at the gap, and two sides of the second heat-conducting adhesive layer are respectively in contact with the heat absorption column and the heating device.
According to a preferred embodiment, the width of the gap satisfies: h is not more than 0.5mm 2 Not more than 4mm, the thickness of the second heat-conducting glue layer is the same as the width of the gap, wherein H 2 Is a gap between the heat absorption column and the heating device.
According to a preferred embodiment, the heat conducting assembly comprises at least one heat conducting pipe, and a channel is arranged in the substrate of the heat absorbing assembly and used for installing the heat conducting pipe.
According to a preferred embodiment, the heat absorbing part includes a third thermal conductive adhesive layer disposed in a gap between the channel and the heat conductive pipe, and both sides of the third thermal conductive adhesive layer are respectively in contact with the channel and the heat conductive pipe.
According to a preferred embodiment, the passage is located at the center of the housing chamber of the substrate, and the number of the passages matches the number of the heat conductive pipes.
According to a preferred embodiment, the distance between the channel and the bottom surface of the housing chamber is such that: h is not less than 0 3 Less than or equal to 10mm, wherein H 3 Is the distance between the channel and the bottom surface of the mounting cavity.
The utility model provides a heat transfer mechanism has following beneficial technological effect at least:
the heat transfer mechanism of the utility model comprises a heat absorption component, a heat conduction component and a heat dissipation component, wherein the heat absorption component is contacted with a heating device, and a heat absorption part is arranged on the heat absorption component and is used for absorbing heat generated by the heating device; the heat conduction assembly is used for connecting the heat absorption assembly and the heat dissipation assembly; the heat dissipation component is positioned in the area far away from the heating device, on one hand, the heat on the surface of the heating device can be transferred to the area far away from the heating device to be released through the action of the heat absorption component, the heat conduction component and the heat dissipation component, so that the problem that the heating device is burnt due to the fact that the heat is concentrated on the surface of the heating device is avoided, and compared with the scheme that the temperature is uniform in each position in the electric appliance box by utilizing a fan in the prior art, the heat transfer mechanism has the advantages of simplicity in assembly, no need of electric drive, long service life, high reliability, convenience in after-sale maintenance and low after-sale cost when being used for dissipating heat of the heating device in the electric appliance box; on the other hand, be provided with the heat absorption portion on the heat absorption subassembly, the heat absorption portion can be used to absorb the heat that the heating device produced to can shift the heat on heating device surface to thermal module fast, and through thermal module conduction to the release of radiating module department, and then can improve the heat conduction effect and the heat conduction efficiency of heat absorption subassembly, improve the heat dispersion of the heating device, promptly the utility model discloses a heat transfer mechanism, when having solved thermal module and heat source contact among the prior art, the heat conduction effect is not good and the not high problem of heat conduction efficiency.
A second object of the present invention is to provide an electrical box.
The utility model discloses an electrical apparatus box, including electrical apparatus box main part and heat transfer mechanism, wherein, heat transfer mechanism does the utility model discloses well arbitrary technical scheme heat transfer mechanism, power device in the electrical apparatus box main part is the device that generates heat.
According to a preferred embodiment, the main body of the electrical box is a closed structure.
The utility model provides an electrical apparatus box has following beneficial technological effect at least:
the utility model discloses an electrical apparatus box, include the utility model discloses in any one of the technical scheme's heat transfer mechanism, utilize heat transfer mechanism to dispel the heat for the power device in the electrical apparatus box main part, because heat transfer mechanism has the advantage that the heat conduction effect is good and heat conduction efficiency is high to the heat that can make the power device produce shifts to the low temperature region release fast, makes the heat dispersion of power device improve, and the reliability of electrical apparatus box improves.
The third object of the utility model is to provide an outdoor machine.
The utility model discloses an outdoor unit, including outdoor unit main part and electrical apparatus box, wherein, the electrical apparatus box does the utility model discloses well arbitrary technical scheme electrical apparatus box, the electrical apparatus box install in the casing of outdoor unit main part.
The utility model provides an off-premises station has following beneficial technological effect at least:
the utility model discloses an outdoor unit, include the utility model discloses in any one technical scheme's electrical apparatus box, because electrical apparatus box's reliability improves to can make outdoor unit's reliability improve.
A fourth object of the present invention is to provide an air conditioning system.
The utility model discloses an air conditioning system, including indoor set and off-premises station, wherein, the off-premises station does any one of the utility model provides an off-premises station, the off-premises station with indoor set connection.
The utility model provides an air conditioning system has following beneficial technological effect at least:
the utility model discloses an air conditioning system, include the utility model discloses in any one technical scheme's off-premises station, because the reliability of off-premises station improves to can make air conditioning system's reliability improve.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a block diagram of a preferred embodiment of the heat transfer mechanism of the present invention;
FIG. 2 is a schematic structural view of a preferred embodiment of the heat transfer mechanism of the present invention;
FIG. 3 is a schematic view of the assembly of the heat transfer mechanism and the heat generating device of the present invention;
FIG. 4 is an enlarged view of portion A of FIG. 3;
fig. 5 is a schematic diagram of the assembly of the heat transfer mechanism and the power device in the electrical box according to the present invention.
In the figure: 10. a heat absorbing component; 101. a substrate; 1011. a first heat-conducting adhesive layer; 1012. a placement cavity; 1013. a heat absorption column; 1014. a second heat-conducting adhesive layer; 1015. a third heat-conducting adhesive layer; 1016. a fourth heat-conducting adhesive layer; 20. a heat conducting component; 201. a heat conducting pipe; 30. a heat dissipating component; 301. a heat sink; 40. and a power device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The heat transfer mechanism, the electric box, the outdoor unit, and the air conditioning system according to the present invention will be described in detail with reference to fig. 1 to 5 and embodiments 1 to 4 of the specification.
Example 1
This embodiment will explain the heat transfer mechanism of the present invention in detail.
The heat transfer mechanism of the present embodiment includes a heat absorbing component 10, a heat conducting component 20, and a heat dissipating component 30, as shown in fig. 1. Preferably, the heat absorbing assembly 10 is in contact with the heat generating device, and a heat absorbing part is arranged on the heat absorbing assembly 10 and is used for absorbing heat generated by the heat generating device; the heat conducting assembly 20 is used for connecting the heat absorbing assembly 10 and the heat dissipating assembly 30; the heat dissipation assembly 30 is located in a region away from the heat generating device as shown in fig. 2, 3 or 5. Specifically, the heat dissipation assembly 30 is located in a region far away from the heat generating device, where the temperature is relatively low, so that the heat absorbed by the heat absorption assembly 10 can be conducted to the heat dissipation assembly 30 through the heat conduction assembly 20 to be released, thereby avoiding the surface temperature of the heat generating device from being too high. More preferably, the heat sink assembly 30 includes a plurality of heat sinks 301, and the heat sinks 301 are mounted on an end of the heat conducting assembly 20 away from the heat generating device, as shown in fig. 2, 3 or 5. Through the effect of the heat sink 301, the heat on the heat conducting assembly 20 can be quickly released to the air, thereby improving the heat dissipation efficiency and the heat dissipation effect.
On one hand, the heat transfer mechanism of the embodiment can transfer the heat on the surface of the heating device to an area far away from the heating device to release through the action of the heat absorbing component 10, the heat conducting component 20 and the heat dissipation component 30, so as to avoid the problem that the heating device is burnt due to the heat concentrated on the surface of the heating device, and compared with the scheme that the temperature of each position in the electrical box is uniform by utilizing a fan in the prior art, the heat transfer mechanism of the embodiment is used for dissipating the heat of the heating device in the electrical box, and has the advantages of simple assembly, no need of electric drive, long service life, high reliability, convenience in after-sale maintenance and low after-sale cost; on the other hand, be provided with the heat absorption portion on the heat absorption subassembly 10, the heat absorption portion can be used to absorb the heat that the device that generates heat produced to can shift the heat on device surface that generates heat to thermal module 20 fast, and conduct to the release of radiating component 30 department through thermal module 20, and then can improve the heat conduction effect and the heat conduction efficiency of heat absorption subassembly 10, improve the heat dispersion of the device that generates heat, the heat transfer mechanism of this embodiment promptly, when having solved thermal module 20 and heat source contact among the prior art, the heat conduction effect is not good and the problem of heat conduction efficiency is not high.
According to a preferred embodiment, the heat absorbing part includes a first thermal conductive adhesive layer 1011, the first thermal conductive adhesive layer 1011 is disposed on at least one of the heat absorbing member 10 and the heat generating device, and the first thermal conductive adhesive layer 1011 is located where the heat absorbing member 10 and the heat generating device are in contact. Preferably, the first thermal conductive adhesive layer 1011 is formed by coating a thermal conductive adhesive in the prior art. According to the heat transfer mechanism adopting the preferred technical scheme, the first heat conducting adhesive layer 1011 is arranged at the contact position of the heat absorption assembly 10 and the heating device, and when the heat absorption assembly 10 is in contact with the heating device, heat on the surface of the heating device can be absorbed through the first heat conducting adhesive layer 1011, so that the heat conduction effect and the heat conduction efficiency of the heat absorption assembly 10 are improved, and the heat dissipation performance of the heating device is improved.
According to a preferred embodiment, the heat sink assembly 10 includes a substrate 101, as shown in fig. 2-4. Preferably, the substrate 101 is provided with a mounting cavity 1012, and the mounting cavity 1012 is used for mounting a heat generating device, as shown in fig. 2 to 4. More preferably, the first thermal adhesive layer 1011 is disposed at the bottom of the disposing chamber 1012, as shown in fig. 3 or fig. 4. The base plate 101 is a plate body with a certain thickness, the heat transfer mechanism of the preferred technical scheme of the embodiment is provided with the mounting cavity 1012 on the base plate 101, the mounting cavity 1012 can be clamped with the heating device, and the stability of assembly between the base plate 101 and the heating device can be ensured by clamping the mounting cavity 1012 and the heating device, so that the heat absorption effect of the heat absorption component 10 is ensured. On the other hand, the heat transfer mechanism of the preferred technical scheme of this embodiment, first heat-conducting glue layer 1011 sets up in settling chamber 1012 bottom, when will settling chamber 1012 and the device joint that generates heat, first heat-conducting glue layer 1011 can contact with the device that generates heat to the heat on device surface that generates heat is absorbed to first heat-conducting glue layer 1011 of accessible, with the heat conduction effect and the heat conduction efficiency that improve heat absorption assembly 10, the heat dispersion of the device that generates heat is improved.
Preferably, the shape of the mounting chamber 1012 matches the shape of the heat generating device, as shown in fig. 3 or 4. The shape of the seating cavity 1012 is, for example, circular, square, or otherwise irregular. In the heat transfer mechanism of the preferred technical scheme of this embodiment, the shape of the installation cavity 1012 is matched with the shape of the heating device, so that the stability of the assembly between the substrate 101 and the heating device can be ensured, and the heat absorption effect of the heat absorption assembly 10 can be ensured.
According to a preferred embodiment, the depth of the seating cavity 1012 is such that: h 1 The thickness of the first heat-conducting adhesive layer 1011 is larger than or equal to 1mm, and is smaller than the depth of the accommodating cavity 1012; wherein H 1 To set the depth of the cavity 1012. H 1 As shown in fig. 4. In the heat transfer mechanism of the preferred technical solution of this embodiment, the depth of the installation cavity 1012 satisfies: h 1 The thickness of the first heat-conducting adhesive layer 1011 is smaller than the depth of the placement cavity 1012, so that the heat-conducting effect and the heat-conducting efficiency of the heat-absorbing component 10 are optimal, the placement cavity 1012 is clamped with the heating device, the assembling stability between the substrate 101 and the heating device is ensured, and the heat-absorbing effect of the heat-absorbing component 10 is further ensured.
According to a preferred embodiment, the heat absorbing part further comprises a heat absorbing pillar 1013, the heat absorbing pillar 1013 protrudes from the surface of the substrate 101 of the heat absorbing assembly 10, and the heat absorbing pillar 1013 is located between two adjacent heat generating devices, as shown in fig. 2 to 4. In the heat transfer mechanism adopting the preferred technical scheme of the embodiment, because the heat absorption column 1013 protrudes from the surface of the substrate 101, the contact area between the heat absorption assembly 10 and the heat generating device can be increased by the heat absorption column 1013, so that the heat conduction effect and the heat conduction efficiency of the heat absorption assembly 10 can be further improved, and the heat dissipation performance of the heat generating device can be improved; further, the heat absorbing column 1013 is located between two adjacent heat generating devices, so that the heat absorbing column 1013 can absorb heat generated by at least two heat generating devices at the same time, thereby further improving the heat conducting effect and the heat conducting efficiency of the heat absorbing assembly 10 and improving the heat dissipating performance of the heat generating devices.
According to a preferred embodiment, there is a gap between the heat absorbing column 1013 and the heat generating device, and a second thermal conductive adhesive layer 1014 is disposed at the gap, and both sides of the second thermal conductive adhesive layer 1014 are in contact with the heat absorbing column 1013 and the heat generating device, respectively, as shown in fig. 3 or 4. Preferably, the width of the gap satisfies: h is not less than 0.5mm 2 Not more than 4mm, the thickness of the second heat-conducting glue layer 1014 is the same as the width of the gap, wherein H 2 Is a gap between the heat absorbing column 1013 and the heat generating device. H 2 As shown in fig. 4. The second thermal conductive adhesive layer 1014 is formed by coating a thermal conductive adhesive in the prior art. The heat transfer mechanism of the preferred technical scheme of this embodiment is provided with the second heat-conducting adhesive layer 1014 in the clearance, and the both sides of the second heat-conducting adhesive layer 1014 respectively contact with the heat absorption column 1013 and the heating device, so that the heat on the surface of the heating device can be absorbed by the second heat-conducting adhesive layer 1014, and the absorbed heat is conducted to the heat absorption column 1013, thereby further improving the heat conduction effect and the heat conduction efficiency of the heat absorption assembly 10, and further improving the heat radiation performance of the heating device. Further, the width of the gap satisfies: h is not less than 0.5mm 2 Is less than or equal to 4mm, the thickness of the second heat-conducting glue layer 1014 is the same as the width of the gap, so that the heat-conducting effect and the heat-conducting efficiency of the heat-absorbing component 10 can be optimal.
When the length of the heat absorbing column 1013 is short, specifically, less than the thickness of the heat generating devices, a fourth thermal conductive adhesive layer 1016 may be disposed at the gap between two adjacent heat generating devices, and the fourth thermal conductive adhesive layer 1016 is located at the end of the heat absorbing column 1013, as shown in fig. 3. The fourth thermal adhesive layer 1016 is formed by coating a thermal adhesive according to the prior art. Preferably, both ends of the fourth thermal conductive adhesive layer 1016 are respectively in contact with the heat absorbing column 1013 and the mounting plate of the heat generating device, so that the heat generated by the heat generating device can be absorbed by the fourth thermal conductive adhesive layer 1016 and the absorbed heat can be conducted to the heat absorbing column 1013, thereby further improving the heat conduction effect and the heat conduction efficiency of the heat absorbing assembly 10 and further improving the heat dissipation performance of the heat generating device.
According to a preferred embodiment, the heat conducting assembly 20 comprises at least one heat conducting pipe 201, and the substrate 101 of the heat absorbing assembly 10 is provided with a channel therein for mounting the heat conducting pipe 201, as shown in fig. 2 to 5. Preferably, the shape of the passage may be the same as or different from the shape of the heat transfer pipe 201. Preferably, the heat absorbing part further includes a third thermal conductive adhesive layer 1015 disposed in a gap between the channel and the heat conductive pipe 201, and both sides of the third thermal conductive adhesive layer 1015 are respectively in contact with the channel and the heat conductive pipe 201, as shown in fig. 3 or fig. 4. The third thermal conductive adhesive layer 1015 is formed by coating thermal conductive adhesive in the prior art. According to the heat transfer mechanism of the preferred technical scheme of the embodiment, the third heat-conducting adhesive layer 1015 is arranged in the gap between the channel and the heat-conducting pipe 201, and two sides of the third heat-conducting adhesive layer 1015 are respectively contacted with the channel and the heat-conducting pipe 201, so that the heat of the substrate 101 can be absorbed by the third heat-conducting adhesive layer 1015, and the absorbed heat can be conducted to the heat-conducting pipe 201, thereby further improving the heat conduction effect and the heat conduction efficiency of the heat absorption assembly 10, and further improving the heat radiation performance of the heating device. On the other hand, the third thermal adhesive layer 1015 is disposed in the gap between the channel and the heat pipe 201, so that the through hole in the channel is equal to the outer diameter of the heat pipe 201, thereby preventing the heat pipe 201 from moving in the channel, and further ensuring the heat conduction effect of the heat pipe 201.
According to a preferred embodiment, the number of channels, which is matched to the number of heat conductive pipes 201, is located at the center of the placement chamber 1012 of the substrate 101, as shown in fig. 2 to 4. In the heat transfer mechanism of the preferred technical solution of this embodiment, the channel is located at the center of the placement cavity 1012, so that the path of the heat conducting pipe 201 is also located at the center of the placement cavity 1012, thereby improving the heat conducting effect of the heat conducting pipe 201, and further improving the heat dissipation performance of the heat generating device.
According to a preferred embodiment, the distance between the channel and the bottom surface of the mounting chamber 1012 is such that: h is more than or equal to 0 3 Less than or equal to 10mm, wherein, H 3 Is the distance between the channel and the bottom surface of the seating chamber 1012. H 3 As shown in fig. 4. In the heat transfer mechanism of the preferred technical solution of this embodiment, the distance between the channel and the bottom surface of the placing cavity 1012 satisfies: h is not less than 0 3 Less than or equal to 10mm, and the heat conduction effect and the heat conduction efficiency of the heat absorption component 10 can be optimized.
Without being limited thereto, the heat conducting component 20 of the present embodiment may be a micro channel, and the heat dissipating component 30 may be a phase change material module, specifically, under a low temperature condition (a non-operating state of the heat generating device), the phase change material is in a solidified state; the ambient temperature rises (the device that generates heat works), and phase change material can absorb heat and melt, because the phase change material solidifies and the temperature is unchangeable when melting for there is the difference in temperature all the time between phase change material and the heat conduction subassembly 20, thereby makes the heat that heat absorption subassembly 10 absorbs obtain the release, avoids the heat to concentrate on the device surface that generates heat and leads to the device that generates heat to be burnt out.
Example 2
This embodiment is right the utility model discloses an electrical apparatus box carries out the detailed description.
The electrical box of this embodiment includes electrical box main part and heat transfer mechanism. Preferably, the heat transfer mechanism is the heat transfer mechanism according to any one of the technical solutions of embodiment 1, and the power device 40 in the main body of the electrical box is a heat generating device, as shown in fig. 5. The electrical box of this embodiment, including the heat transfer mechanism of any one of technical scheme in embodiment 1, utilize heat transfer mechanism to dispel the heat for power device 40 in the electrical box main part, because heat transfer mechanism has the advantage that the heat conduction effect is good and heat conduction efficiency is high to can make the heat that power device 40 produced shift to the regional release of low temperature fast, make the heat dispersion of power device 40 improve, the reliability of electrical box improves.
According to a preferred embodiment, the main body of the electrical box is of a closed structure. The electrical apparatus box of the preferred technical scheme of this embodiment, electrical apparatus box main part are airtight structure to make the electrical apparatus box of the preferred technical scheme of this embodiment be airtight electrical apparatus box. In the non-sealed electrical box, the power device 40 is affected by damp or dust, which affects the heat absorption efficiency and the heat transfer efficiency of the heat transfer mechanism in any one of the technical solutions of embodiment 1, thereby affecting the heat dissipation effect of the power device 40.
Example 3
This embodiment is right the utility model discloses an off-premises station explains in detail.
The outdoor unit of the present embodiment includes an outdoor unit main body and an electrical box. Preferably, the electrical box according to any one of embodiments 2 is mounted in a casing of the outdoor unit main body. Preferably, the outdoor unit main body is a multi-connected outdoor unit, and the structure of the outdoor unit main body is the same as that of the prior art and is not described herein again.
The outdoor unit of the present embodiment, including the electric box according to any one of embodiments 2, can improve reliability of the outdoor unit because reliability of the electric box is improved.
Example 4
This embodiment is right the utility model discloses an air conditioning system explains in detail.
The air conditioning system of the embodiment comprises an indoor unit and an outdoor unit. Preferably, the outdoor unit is the outdoor unit according to any one of embodiments 3, and the outdoor unit is connected to the indoor unit. Preferably, the structure of the indoor unit is the same as that of the prior art, and is not described herein again.
The air conditioning system of the present embodiment, including the outdoor unit according to any one of embodiments 3, can improve the reliability of the air conditioning system by improving the reliability of the outdoor unit.
In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as the case may be, by those of ordinary skill in the art.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (15)
1. A heat transfer mechanism is characterized by comprising a heat absorption component (10), a heat conduction component (20) and a heat dissipation component (30), wherein the heat absorption component (10) is in contact with a heat generating device, and a heat absorption part is arranged on the heat absorption component (10) and is used for absorbing heat generated by the heat generating device; the heat conducting component (20) is used for connecting the heat absorbing component (10) and the heat radiating component (30); the heat dissipation assembly (30) is located in a region away from the heat generating device.
2. The heat transfer mechanism according to claim 1, wherein the heat absorbing portion includes a first heat conductive adhesive layer (1011), the first heat conductive adhesive layer (1011) is provided on at least one of the heat absorbing component (10) and the heat generating device, and the first heat conductive adhesive layer (1011) is located where the heat absorbing component (10) and the heat generating device are in contact.
3. A heat transfer mechanism according to claim 2, wherein the heat absorbing assembly (10) comprises a base plate (101), a mounting cavity (1012) is provided on the base plate (101), the mounting cavity (1012) is used for mounting the heat generating device, and the first thermal conductive adhesive layer (1011) is provided at the bottom of the mounting cavity (1012).
4. A heat transfer mechanism as recited in claim 3, wherein the depth of the seating cavity (1012) is such that: h 1 The thickness of the first heat-conducting glue layer (1011) is more than or equal to 1mm, and the depth of the mounting cavity (1012) is less than that of the first heat-conducting glue layer; wherein H 1 Is the depth of the seating cavity (1012).
5. The heat transfer mechanism according to any one of claims 1 to 4, wherein the heat absorbing part includes a heat absorbing column (1013), the heat absorbing column (1013) protrudes from a surface of the substrate (101) of the heat absorbing assembly (10), and the heat absorbing column (1013) is located between two adjacent heat generating devices.
6. The heat transfer mechanism according to claim 5, wherein a gap is provided between the heat absorbing column (1013) and the heat generating device, a second heat conductive adhesive layer (1014) is disposed at the gap, and both sides of the second heat conductive adhesive layer (1014) are respectively in contact with the heat absorbing column (1013) and the heat generating device.
7. A heat transfer mechanism as recited in claim 6 wherein said gap has a width such that: h is not less than 0.5mm 2 4mm or less, the thickness of the second heat-conducting glue layer (1014) is the same as the width of the gap,
wherein H 2 Is a gap between the heat absorbing column (1013) and the heat generating device.
8. A heat transfer mechanism according to claim 1, wherein the heat conducting assembly (20) comprises at least one heat conducting pipe (201), and wherein the base plate (101) of the heat absorbing assembly (10) is provided with channels for mounting the heat conducting pipe (201).
9. A heat transfer mechanism according to claim 8, wherein the heat absorbing portion comprises a third layer (1015) of heat conductive adhesive disposed in a gap between the channel and the heat conductive pipe (201), both sides of the third layer (1015) of heat conductive adhesive being in contact with the channel and the heat conductive pipe (201), respectively.
10. A heat transfer mechanism according to claim 9, wherein the passage is located at the center of the housing chamber (1012) of the base plate (101) and the number of the passages matches the number of the heat conductive pipes (201).
11. A heat transfer mechanism as recited in claim 10, wherein the distance between said channel and the floor of said placement chamber (1012) is such that: h is not less than 0 3 ≤10mm，
Wherein H 3 Is the distance between the channel and the bottom surface of the mounting cavity (1012).
12. An electrical box, characterized in that, includes electrical box main part and heat transfer mechanism, wherein, the heat transfer mechanism is the heat transfer mechanism of any one of claims 1 to 11, power device (40) in the electrical box main part is the heating device.
13. The appliance box of claim 12, wherein the appliance box body is of a closed construction.
14. An outdoor unit comprising an outdoor unit main body and an electric box according to claim 12 or 13, wherein the electric box is installed in a casing of the outdoor unit main body.
15. An air conditioning system comprising an indoor unit and an outdoor unit, wherein the outdoor unit is the outdoor unit of claim 14, and the outdoor unit is connected to the indoor unit.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222039886.3U CN218296028U (en) | 2022-08-03 | 2022-08-03 | Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222039886.3U CN218296028U (en) | 2022-08-03 | 2022-08-03 | Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system |
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| Publication Number | Publication Date |
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| CN218296028U true CN218296028U (en) | 2023-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222039886.3U Active CN218296028U (en) | 2022-08-03 | 2022-08-03 | Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system |
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| Country | Link |
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| CN (1) | CN218296028U (en) |
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