CN210610157U - Combined radiator for UPS - Google Patents
Combined radiator for UPS Download PDFInfo
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- CN210610157U CN210610157U CN201921345567.7U CN201921345567U CN210610157U CN 210610157 U CN210610157 U CN 210610157U CN 201921345567 U CN201921345567 U CN 201921345567U CN 210610157 U CN210610157 U CN 210610157U
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Abstract
The utility model discloses a combined radiator for UPS, which comprises a UPS body, a radiating box, a dustproof net, a radiating fan and a radiating unit; a heat dissipation box: the heat dissipation box is fixed at the bottom of the UPS body; a heat dissipation unit: the heat dissipation unit comprises a heat dissipation sheet and semiconductor refrigeration sheets, the heat dissipation sheet and the semiconductor refrigeration sheets are both distributed on the inner side of the heat dissipation box, the semiconductor refrigeration sheets are mounted at the bottom of the UPS body, and the heat dissipation sheet is uniformly distributed at the bottom of the hot end of each semiconductor refrigeration sheet; a heat dissipation fan: the heat dissipation fan is arranged on the heat dissipation box; a dust screen: the dust screen is connected with the heat dissipation box through the connecting mechanism, the dust screen is arranged corresponding to the air exhaust position of the heat dissipation fan, the heat dissipation effect is good, continuous work can be achieved, the service life is long, and the heat dissipation efficiency is high.
Description
Technical Field
The utility model relates to a radiator technical field specifically is a UPS is with combination formula radiator.
Background
UPS is uninterrupted power source, be connected the battery (mostly lead acid non-maintaining battery) with the host computer, module circuit such as through host computer dc-to-ac converter is with the system equipment of direct current conversion city commercial power, mainly used is for the single computer, computer network system or other power electronic equipment are like the solenoid valve, pressure transmitter etc. provide stable, incessant power supply, UPS can produce a large amount of heats at the course of the work, if the heat can not in time discharge, will influence its power supply efficiency greatly, current heat abstractor to UPS, its radiating effect is poor, can not satisfy the user demand.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a UPS with combination formula radiator, the radiating effect is good, but continuous operation, long service life, the radiating efficiency is high, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a combined radiator for UPS comprises a UPS body, a radiating box, a dustproof net, a radiating fan and a radiating unit; a heat dissipation box: the heat dissipation box is fixed at the bottom of the UPS body; a heat dissipation unit: the heat dissipation unit comprises a heat dissipation sheet and semiconductor refrigeration sheets, the heat dissipation sheet and the semiconductor refrigeration sheets are both distributed on the inner side of the heat dissipation box, the semiconductor refrigeration sheets are mounted at the bottom of the UPS body, and the heat dissipation sheet is uniformly distributed at the bottom of the hot end of each semiconductor refrigeration sheet; a heat dissipation fan: the heat dissipation fan is arranged on the heat dissipation box; a dust screen: the dustproof net is connected with the heat dissipation box through a connecting mechanism and is arranged corresponding to the air exhaust position of the heat dissipation fan; the heat dissipation fan is electrically connected with the output end of the external controller together with the input end of the semiconductor refrigeration piece.
Further, still include heat conduction silica gel piece, the laminating of heat conduction silica gel piece is in the junction of semiconductor refrigeration piece and UPS body and the junction of fin and semiconductor refrigeration piece, and the heat conduction silica gel piece can reduce the thermal contact resistance that produces between heat source surface and the heat abstractor contact surface, and the clearance of the packing contact surface that the heat conduction silica gel piece can be fine, because the air is hot bad conductor, can seriously obstruct the transmission of heat between the contact surface, and install the heat conduction silica gel piece additional between source and the radiator and can extrude the contact surface with the air, has improved radiating efficiency.
Further, still include the shock pad, the shock pad is installed in the junction of heat dissipation fan and heat dissipation case, and the shock pad is one of Faraday motor shock pad and JF type rubber shock pad, and the shock pad eliminates the bad vibrations of heat dissipation fan production at the course of the work through elastic deformation, has reduced the noise at work of heat dissipation fan.
Furthermore, the heat dissipation fan is arranged corresponding to the cooling fins, the air outlet direction of the heat dissipation fan is the same as the direction of a channel formed between adjacent cooling fins, and the heat on the cooling fins is taken away quickly by the air flowing caused by the heat dissipation fan, so that the heat dissipation efficiency is improved.
Further, coupling mechanism includes the magnetic stripe and adsorbs the ironbar, adsorbs the ironbar and fixes on the dust screen, the magnetic stripe is fixed on the heat dissipation case, adsorbs the ironbar and is connected with magnetic stripe magnetism, is connected the dust screen and is connected with the heat dissipation case through adsorbing ironbar and magnetic stripe magnetism, and its installation is dismantled conveniently, is convenient for clean the dust screen.
Compared with the prior art, the beneficial effects of the utility model are that: this combined type radiator for UPS has following benefit:
1. the heat dissipation unit utilizes the Peltier effect of the semiconductor material to refrigerate and cool the UPS body, does not need any refrigerant, can continuously work, does not have a pollution source and a rotating part, does not generate a rotation effect, does not have a sliding part, is a solid piece, does not have vibration and noise during working, has long service life and is easy to install;
2. the heat in the heat dissipation box is extracted to the outside through the heat dissipation fan, so that the heat dissipation effect on the UPS body is further improved, the dustproof net is used for preventing external dust from attaching to fan blades of the heat dissipation fan to influence the normal use of the heat dissipation fan, the service life of the heat dissipation fan is prolonged, the dustproof net is connected with the heat dissipation box through the connecting mechanism, the installation and the disassembly are convenient, and the dustproof net is convenient to clean;
3. the heat-conducting silica gel piece is laminated at the junction of semiconductor refrigeration piece and UPS body and the junction of fin and semiconductor refrigeration piece, the heat-conducting silica gel piece can reduce the thermal contact resistance that produces between heat source surface and the heat abstractor contact surface, the heat-conducting silica gel piece can be fine fill the clearance of contact surface, because the air is hot bad conductor, can seriously hinder the transmission of heat between the contact surface, and install the heat-conducting silica gel piece additional between heating source and radiator and can extrude the contact surface with the air, radiating efficiency has been improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a sectional view of the structure of the present invention.
In the figure: the UPS comprises a UPS body 1, a heat dissipation box 2, a connecting mechanism 3, a magnetic stripe 31, an adsorption iron bar 32, a dustproof net 4, a heat dissipation fan 5, a heat dissipation unit 6, a heat dissipation sheet 61, a semiconductor refrigeration sheet 62, a shock absorption pad 7 and a heat conduction silica gel sheet 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a combined radiator for UPS comprises a UPS body 1, a radiating box 2, a dustproof net 4, a radiating fan 5 and a radiating unit 6; and (3) a heat dissipation box 2: the heat dissipation box 2 is fixed at the bottom of the UPS body 1; the heat dissipation unit 6: the heat dissipation unit 6 comprises a heat dissipation sheet 61 and semiconductor refrigeration sheets 62, the heat dissipation sheet 61 and the semiconductor refrigeration sheets 62 are both distributed on the inner side of the heat dissipation box 2, the semiconductor refrigeration sheets 62 are installed at the bottom of the UPS body 1, and the heat dissipation sheet 61 is uniformly distributed at the bottom of the hot end of the semiconductor refrigeration sheets 62; the semiconductor refrigeration piece 62 utilizes the Peltier effect of the semiconductor material to refrigerate and cool the UPS body 1, the heat at the hot end of the semiconductor refrigeration piece 62 is gathered on the radiating fin 61 and is diffused into the radiating box 2 through the radiating fin 61, no refrigerant is needed, the continuous operation can be realized, no pollution source and no rotating part exist, the rotation effect cannot be generated, no sliding part is a solid piece, no vibration and noise exist during the operation, the service life is long, and the installation is easy.
The heat dissipation fan 5: the heat dissipation fan 5 is arranged on the heat dissipation box 2;
the heat in the heat dissipation box 2 is extracted from the outside through the heat dissipation fan 5, and the heat dissipation effect on the UPS body 1 is further improved.
And (4) a dust screen: the dustproof net 4 is connected with the heat dissipation box 2 through the connecting mechanism 3, and the dustproof net 4 is arranged corresponding to the air exhaust position of the heat dissipation fan 5; the dustproof net 4 is used for preventing external dust from attaching to the fan blades of the heat dissipation fan 5 to influence the normal use of the heat dissipation fan, and the service life of the heat dissipation fan 5 is prolonged.
Wherein, the input ends of the heat radiation fan 5 and the semiconductor refrigeration piece 62 are electrically connected with the output end of the external controller.
Still include heat conduction silica gel piece 8, the laminating of heat conduction silica gel piece 8 is in the junction of semiconductor refrigeration piece 62 and UPS body 1 and the junction of fin 61 and semiconductor refrigeration piece 62, heat conduction silica gel piece 8 can reduce the thermal contact resistance that produces between heat source surface and the heat abstractor contact surface, the clearance of the packing contact surface that heat conduction silica gel piece 8 can be fine, because the air is hot bad conductor, can seriously obstruct the transmission of heat between the contact surface, and install heat conduction silica gel piece 8 additional between heating source and radiator and can extrude the contact surface with the air, radiating efficiency has been improved.
Still include shock pad 7, shock pad 7 is installed in the junction of heat dissipation fan 5 and radiator box 2, and shock pad 7 is one of Faraday motor shock pad and JF type rubber shock pad, and shock pad 7 eliminates the bad vibrations of heat dissipation fan 5 production at the course of the work through elastic deformation, has reduced the noise at work of heat dissipation fan 5.
The heat dissipation fan 5 is arranged corresponding to the heat dissipation fins 61, the air outlet direction of the heat dissipation fan 5 is the same as the channel direction formed between the adjacent heat dissipation fins 61, and the heat on the heat dissipation fins 61 is taken away quickly by the air flowing caused by the heat dissipation fan 5, so that the heat dissipation efficiency is improved.
Coupling mechanism 3 includes magnetic stripe 31 and adsorbs ironbar 32, adsorbs ironbar 32 to fix on dust screen 4, and magnetic stripe 31 is fixed on heat dissipation case 2, adsorbs ironbar 32 to be connected with magnetic stripe 31 magnetism, is connected dust screen 4 and heat dissipation case 2 through adsorbing ironbar 32 and magnetic stripe 31 magnetism, and its installation is dismantled conveniently, is convenient for clean dust screen 4.
When in use: the semiconductor refrigeration piece 62 utilizes the Peltier effect of the semiconductor material to refrigerate and cool the UPS body 1, and the heat at the hot end of the semiconductor refrigeration piece 62 is collected on the heat dissipation fin 61 and diffused into the heat dissipation box 2 through the heat dissipation fin 61.
The heat in the heat dissipation case 2 is extracted to the outside by the heat dissipation fan 5.
The dust screen 4 is used to prevent external dust from adhering to the fan blades of the heat dissipation fan 5 and affecting the normal use of the heat dissipation fan.
The heat-conducting silica gel sheet 8 can reduce the thermal contact resistance generated between the surface of a heat source and the contact surface of a heat dissipation device, the heat-conducting silica gel sheet 8 can well fill the gap of the contact surface, the air is a hot poor conductor, the heat can be seriously hindered from being transferred between the contact surfaces, the heat-conducting silica gel sheet 8 is additionally arranged between a heating source and a heat radiator, the contact surface can be extruded by the air, and the heat dissipation efficiency is improved.
The shock-absorbing pad 7 eliminates undesirable vibration generated by the heat-radiating fan 5 during operation by elastic deformation.
The dust screen 4 and the heat dissipation box 2 are connected through the magnetic connection of the adsorption iron strip 32 and the magnetic strip 31.
It is worth noting that: the heat dissipation fan 5 and the semiconductor chilling plate 62 are both configured according to the actual application environment.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A combined radiator for UPS is characterized in that: the UPS comprises a UPS body (1), a heat dissipation box (2), a dust screen (4), a heat dissipation fan (5) and a heat dissipation unit (6); heat dissipation case (2): the heat dissipation box (2) is fixed at the bottom of the UPS body (1); heat dissipation unit (6): the heat dissipation unit (6) comprises heat dissipation fins (61) and semiconductor refrigeration pieces (62), the heat dissipation fins (61) and the semiconductor refrigeration pieces (62) are distributed on the inner side of the heat dissipation box (2), the semiconductor refrigeration pieces (62) are installed at the bottom of the UPS body (1), and the heat dissipation fins (61) are uniformly distributed at the bottoms of the hot ends of the semiconductor refrigeration pieces (62);
heat dissipation fan (5): the heat dissipation fan (5) is arranged on the heat dissipation box (2); dust screen (4): the dustproof net (4) is connected with the heat dissipation box (2) through the connecting mechanism (3), and the dustproof net (4) is arranged corresponding to the air exhaust position of the heat dissipation fan (5); the input ends of the heat dissipation fan (5) and the semiconductor refrigeration sheet (62) are electrically connected with the output end of an external controller.
2. The modular heat sink of claim 1, wherein: still include heat conduction silica gel piece (8), heat conduction silica gel piece (8) laminating is in the junction of semiconductor refrigeration piece (62) and UPS body (1) and the junction of fin (61) and semiconductor refrigeration piece (62).
3. The modular heat sink of claim 1, wherein: still include shock pad (7), shock pad (7) are installed in the junction of heat dissipation fan (5) and radiating case (2), and shock pad (7) are one of Faraday motor shock pad and JF type rubber shock pad.
4. The modular heat sink of claim 1, wherein: the heat dissipation fan (5) is arranged corresponding to the heat dissipation fins (61), and the air outlet direction of the heat dissipation fan (5) is the same as the channel direction formed between the adjacent heat dissipation fins (61).
5. The modular heat sink of claim 1, wherein: coupling mechanism (3) include magnetic stripe (31) and adsorb ironbar (32), adsorb ironbar (32) and fix on dust screen (4), magnetic stripe (31) are fixed on heat dissipation case (2), adsorb ironbar (32) and are connected with magnetic stripe (31) magnetism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921345567.7U CN210610157U (en) | 2019-08-19 | 2019-08-19 | Combined radiator for UPS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921345567.7U CN210610157U (en) | 2019-08-19 | 2019-08-19 | Combined radiator for UPS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210610157U true CN210610157U (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921345567.7U Active CN210610157U (en) | 2019-08-19 | 2019-08-19 | Combined radiator for UPS |
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| CN (1) | CN210610157U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113659469A (en) * | 2021-07-20 | 2021-11-16 | 上海卡邦电气东台有限公司 | Control cabinet with positive pressure and using method thereof |
-
2019
- 2019-08-19 CN CN201921345567.7U patent/CN210610157U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113659469A (en) * | 2021-07-20 | 2021-11-16 | 上海卡邦电气东台有限公司 | Control cabinet with positive pressure and using method thereof |
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Address after: 030032 floor 3, building 5, incubation base, No. 77, Tanghuai Road, Tanghuai Park, Shanxi comprehensive reform demonstration zone, Taiyuan, Shanxi Province Patentee after: Fanshi Technology Development Co.,Ltd. Address before: 030000 No. 39, nanneihuan street, Yingze District, Taiyuan City, Shanxi Province (Yuantai building) Patentee before: FANSHI TECHNOLOGY DEVELOPMENT CO.,LTD. |