CN209897519U - Novel heat dissipation of electron electrical equipment device - Google Patents
Novel heat dissipation of electron electrical equipment device Download PDFInfo
- Publication number
- CN209897519U CN209897519U CN201920323543.5U CN201920323543U CN209897519U CN 209897519 U CN209897519 U CN 209897519U CN 201920323543 U CN201920323543 U CN 201920323543U CN 209897519 U CN209897519 U CN 209897519U
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- heat dissipation
- heat
- semiconductor refrigeration
- electrical equipment
- water pump
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Abstract
The utility model discloses a novel heat dissipation device of electronic and electrical equipment, which comprises a shell, wherein a heat dissipation block is arranged in the shell, a main heat dissipation fan is fixed at the top of the heat dissipation block, a top dust screen is arranged at the top of the main heat dissipation fan, both sides of the heat dissipation block are provided with heat insulation plates, one side of each heat insulation plate is provided with a power supply, one side of the other heat insulation plate is provided with a water tank, a semiconductor refrigeration piece B is laminated on the side surface of the water tank, an auxiliary heat dissipation fan is arranged on one side of the semiconductor refrigeration piece B, and a water pump A and a water pump B are arranged; the utility model has the advantages of reasonable design, convenient to use, the adjustability is strong, satisfies the not electron electrical equipment of equidimension, can cool down for electron electrical equipment, adopts water-cooling, semiconductor refrigeration and the triple cooling mode of forced air cooling, has good radiating efficiency, reduces the produced heat of electron electrical equipment to very big degree to avoid the heat to gather in electron electrical equipment, improve electron electrical equipment's life.
Description
Technical Field
The utility model relates to an equipment heat dissipation technical field specifically is a novel electron electrical equipment's heat dissipation device.
Background
Electronic and electrical equipment's kind is various, these equipment can produce a large amount of heats under operating condition, if electronic and electrical equipment does not install heat abstractor additional, then can lead to the heat constantly to gather, the heat accumulates the work efficiency that can influence equipment for a long time, and can reduce the life of equipment, need heat abstractor to dispel the heat the cooling to equipment for this reason, let equipment can normal operating, but present heat abstractor most all adopts forced air cooling or water-cooled mode, can't satisfy some heats and give off great equipment already.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a novel electron electrical equipment's heat abstractor has advantages such as simple structure, thermal diffusivity are strong, has solved current heat abstractor radiating efficiency low, has used inconvenient scheduling problem.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a heat sink for electronic and electric equipment is composed of a casing with heat radiating block, the top of the heat dissipation block is fixed with a main heat dissipation fan, the top of the main heat dissipation fan is provided with a top dust screen, both sides of the heat dissipation block are provided with heat insulation plates, one side of each heat insulation plate is provided with a power supply, one side of the other heat insulation plate is provided with a water tank, a semiconductor refrigerating sheet B is attached to the side surface of the water tank, an auxiliary radiating fan is arranged on one side of the semiconductor refrigerating sheet B, a water pump A and a water pump B are arranged above the water tank, the water pump A and the water pump B are both communicated with the water tank, the bottom of the heat dissipation block is provided with a fixed frame which is fixed with the shell through four fixed screws, the semiconductor refrigeration piece A is fixed in the fixing frame, sliding rails are arranged on two sides of the shell, sliding rods are sleeved on the sliding rails, and the sliding rods are fixed with the sliding rails through fastening screws.
Preferably, the slide bar is bent, a side cooling fan is fixed on the slide bar, and a rubber pad is attached to a frame of the side cooling fan.
Preferably, the water pump a, the water pump B, the semiconductor refrigeration piece a, the semiconductor refrigeration piece B, the main heat dissipation fan, the side heat dissipation fan, the auxiliary heat dissipation fan are electrically connected with the power supply.
Preferably, the radiating block consists of a radiating plate and radiating fins, the radiating plate is made of copper materials, the radiating plate is hollow inside and is communicated with the water pump A and the water pump B through a water return pipe and a water inlet pipe respectively, and the water return pipe and the water inlet pipe penetrate through the radiating fins.
Preferably, the heat release end of the semiconductor refrigeration piece A faces the heat dissipation block, and silicone grease is coated on the surface of the heat absorption end of the semiconductor refrigeration piece A.
Preferably, the heat absorption end of the semiconductor refrigeration piece B faces the water tank.
Preferably, the water tank is made of copper materials.
Preferably, the heat insulation plates are made of rock wool materials.
Preferably, the rubber pad is made of silicon rubber.
(III) advantageous effects
Compared with the prior art, the utility model provides a novel electron electrical equipment's heat dissipation device possesses following beneficial effect:
1. this kind of novel electronic and electrical equipment's heat abstractor, structural design is reasonable, convenient to use, the adjustability is strong, and the design of slide bar satisfies the electronic and electrical equipment of equidimension not, can cool down for electronic and electrical equipment, adopts water-cooling, semiconductor refrigeration and the triple cooling mode of forced air cooling, has good radiating efficiency, reduces the produced heat of electronic and electrical equipment in the very big degree to avoid the heat to gather in electronic and electrical equipment, improve electronic and electrical equipment's life.
2. This kind of novel electronic and electrical equipment's heat abstractor, the radiating block comprises heating panel and radiating fin, and wet return and inlet tube pass from radiating fin, and water can carry out the forced air cooling heat dissipation through main radiator fan when inlet tube and return intraductal circulation for the radiating rate of water has also improved holistic heat exchange efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
FIG. 3 is an enlarged view of the structure at the position A of the present invention;
fig. 4 is a side view of the present invention.
In the figure: 1. a housing; 2. a main heat radiation fan; 3. a dust screen is arranged on the top; 4. a heat dissipating block; 5. a thermal insulation plate; 6. a power source; 7. fastening screws; 8. a slide bar; 9. a side heat radiation fan; 10. a rubber pad; 11. a slide rail; 12. a water return pipe; 13. a water inlet pipe; 14. a semiconductor refrigerating sheet A; 15. silicone grease; 16. fixing screws; 17. a water pump A; 18. a water pump B; 19. a water tank; 20. a semiconductor refrigerating plate B; 21. an auxiliary heat radiation fan; 22. a fixing frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a novel heat dissipation device of electronic and electrical equipment comprises a shell 1, wherein a heat dissipation block 4 is arranged in the shell 1, a main heat dissipation fan 2 is fixed at the top of the heat dissipation block 4, a top dust screen 3 is arranged at the top of the main heat dissipation fan 2, heat insulation plates 5 are arranged on two sides of the heat dissipation block 4, a power supply 6 is arranged on one side of each heat insulation plate 5, a water tank 19 is arranged on one side of the other heat insulation plate 5, a semiconductor refrigeration sheet B20 is attached to the side surface of the water tank 19, an auxiliary heat dissipation fan 21 is arranged on one side of a semiconductor refrigeration sheet B20, a water pump A17 and a water pump B18 are arranged above the water tank 19, the water pump A17 and the water pump B18 are communicated with the water tank 19, a fixing frame 22 is arranged at the bottom of the heat dissipation block 4, the fixing frame 22 is fixed with the shell 1 through four fixing screws 16, a semiconductor refrigeration sheet A14, slide bars 8 are sleeved on the slide rails 11, and the slide bars 8 are fixed with the slide rails 11 through fastening screws 7.
In a further improvement, the sliding rod 8 is bent, a side heat dissipation fan 9 is fixed on the sliding rod 8, a rubber pad 10 is attached to a frame of the side heat dissipation fan, and the sliding rod 8 is used for clamping the heat dissipation device on the electronic and electrical equipment.
In a further improvement, the water pump a17, the water pump B18, the semiconductor refrigeration sheet a14, the semiconductor refrigeration sheet B20, the main cooling fan 2, the side cooling fan 9, the auxiliary cooling fan 21 and the power supply 6 are electrically connected.
In a further improvement, the heat dissipation block 4 is composed of a heat dissipation plate and heat dissipation fins, the heat dissipation plate is made of copper materials, the interior of the heat dissipation plate is hollow, the heat dissipation plate is communicated with the water pump A17 and the water pump B18 through a water return pipe 12 and a water inlet pipe 13 respectively, and the water return pipe 12 and the water inlet pipe 13 penetrate through the heat dissipation fins.
In a further improvement, the heat release end of the semiconductor refrigeration piece A14 faces the heat dissipation block 4, and silicone grease 15 is coated on the surface of the heat absorption end of the semiconductor refrigeration piece A14 and can fill the gap between the semiconductor refrigeration piece A14 and the contact surface of the electrical equipment.
In a further improvement, the heat absorption end of the semiconductor refrigeration piece B20 faces the water tank 19.
In a further improvement, the water tank 19 is made of copper, and the copper has superior thermal conductivity, so that the heat transfer efficiency is improved.
In a further improvement, the heat insulation plates 5 are made of rock wool, and the rock wool has strong heat insulation property.
In a further improvement, the rubber pad 10 is made of silicon rubber, and the heat resistance of the silicon rubber is high.
The working principle is as follows: when the semiconductor refrigeration device is used, the semiconductor refrigeration piece A14 faces to the electrical equipment and is attached to the electrical equipment, the electrical equipment is clamped through the sliding rods 8 on the two sides, the fastening screw 7 is rotated subsequently, the sliding rods 8 and the sliding rail 11 are clamped and fixed, the heat dissipation device is fixed on the electrical equipment, the heat dissipation device can also be fixed on the electrical equipment through additional screws, and the rubber pad 10 on the sliding rods 8 has certain elasticity, so that protection can be provided for the shell 1 of the electrical equipment, and the shell 1 is prevented from being damaged. After fixed the completion, the air conditioning that produces through the heat-absorbing surface of semiconductor refrigeration piece A14 cools down electrical equipment, and simultaneously, side radiator fan 9 on the slide bar 8 of both sides can blow away electrical equipment and the heat of semiconductor refrigeration piece A14 contact surface department, play supplementary radiating effect, and the heat that the end produced is released heat to semiconductor refrigeration piece A14 opposite side transmits to radiating block 4 with the mode of heat transfer on, and on transmitting the radiating fin from radiating block 4, the radiating fin on the radiating block 4 has increased the area of contact with the air, let the heat refine more, cooperation main radiator fan 2, thereby discharge the heat. The water pump A17 and the water pump B18 are turned on, the water pump B18 pumps the water in the water tank 19 into the heat radiation block 4 from the water inlet pipe 13, the water entering the heat radiation block 4 is sucked into the water tank 19 again from the water return pipe 12 through the water pump A17, so that the heat on the heat radiation block 4 is taken away through the water cooling mode, in this process, because inlet tube 13 and wet return 12 all set up in the middle of the radiating fin of radiating block 4, cooperate 4 top main radiator fan 2 of radiating block, water can carry out the forced air cooling heat dissipation through main radiator fan 2 when inlet tube 13 and wet return 12 inner loop, the water that circulates in the water tank 19 is cooled down through the refrigeration of semiconductor refrigeration piece B20 once more, assist radiator fan 21 then with the heat discharge of the hot face of semiconductor refrigeration piece B20, guarantee that the heat of water tank 19 water-logging can give off fast, thereby accomplish the water-cooling, the forced air cooling, three kinds of radiating mode of semiconductor refrigeration.
To sum up, the utility model has the advantages that the structure design is reasonable, the adjustability is strong, the design of the slide bar meets the electronic and electrical equipment with different sizes, the electronic and electrical equipment can be cooled, the triple cooling modes of water cooling, semiconductor cooling and air cooling are adopted, the heat dissipation efficiency is good, the heat generated by the electronic and electrical equipment is reduced to a great extent, the heat is prevented from accumulating in the electronic and electrical equipment, and the service life of the electronic and electrical equipment is prolonged; the radiating block comprises heating panel and radiating fin, and wet return and inlet tube pass from radiating fin, and water can carry out the forced air cooling heat dissipation through main radiator fan when inlet tube and wet return inner loop for the radiating rate of water has also improved holistic heat exchange efficiency.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a novel electron electrical equipment's heat dissipation device, includes shell (1), its characterized in that: the heat dissipation device is characterized in that a heat dissipation block (4) is arranged in the shell (1), a main heat dissipation fan (2) is fixed to the top of the heat dissipation block (4), a top dust screen (3) is arranged at the top of the main heat dissipation fan (2), heat insulation plates (5) are arranged on two sides of the heat dissipation block (4), a power source (6) is arranged on one side of each heat insulation plate (5), a water tank (19) is arranged on one side of each other heat insulation plate (5), a semiconductor refrigeration sheet B (20) is attached to the side face of the water tank (19), an auxiliary heat dissipation fan (21) is arranged on one side of each semiconductor refrigeration sheet B (20), a water pump A (17) and a water pump B (18) are arranged above the water tank (19), the water pump A (17) and the water pump B (18) are communicated with the water tank (19), a fixing frame (22) is arranged at the bottom of the heat dissipation block (4), and, the semiconductor refrigeration piece A (14) is fixed in the fixing frame (22), sliding rails (11) are arranged on two sides of the shell (1), sliding rods (8) are sleeved on the sliding rails (11), and the sliding rods (8) are fixed with the sliding rails (11) through fastening screws (7).
2. The heat dissipating device for a novel electronic and electrical device as claimed in claim 1, wherein: the sliding rod (8) is bent, a side heat dissipation fan (9) is fixed on the sliding rod (8), and a rubber pad (10) is attached to the frame of the side heat dissipation fan (9).
3. The heat dissipating device for a novel electronic and electrical device as claimed in claim 2, wherein: the water pump A (17), the water pump B (18), the semiconductor refrigeration piece A (14), the semiconductor refrigeration piece B (20), the main cooling fan (2), the side cooling fan (9), the auxiliary cooling fan (21) and the power supply (6) are electrically connected.
4. The heat dissipating device for a novel electronic and electrical device as claimed in claim 1, wherein: the radiating block (4) is composed of a radiating plate and radiating fins, the radiating plate is made of copper materials, the radiating plate is hollow inside and is communicated with a water pump A (17) and a water pump B (18) through a water return pipe (12) and a water inlet pipe (13), and the water return pipe (12) and the water inlet pipe (13) penetrate through the radiating fins.
5. The heat dissipating device for a novel electronic and electrical device as claimed in claim 1, wherein: the heat release end of the semiconductor refrigeration piece A (14) faces the heat dissipation block (4), and silicone grease (15) is coated on the surface of the heat absorption end of the semiconductor refrigeration piece A (14).
6. The heat dissipating device for a novel electronic and electrical device as claimed in claim 1, wherein: the heat absorption end of the semiconductor refrigeration piece B (20) faces the water tank (19).
7. The heat dissipating device for a novel electronic and electrical device as claimed in claim 1, wherein: the water tank (19) is made of copper materials.
8. The heat dissipating device for a novel electronic and electrical device as claimed in claim 1, wherein: the heat insulation plates (5) are made of rock wool materials.
9. The heat dissipating device for a novel electronic and electrical device as claimed in claim 2, wherein: the rubber pad (10) is made of silicon rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920323543.5U CN209897519U (en) | 2019-03-14 | 2019-03-14 | Novel heat dissipation of electron electrical equipment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920323543.5U CN209897519U (en) | 2019-03-14 | 2019-03-14 | Novel heat dissipation of electron electrical equipment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209897519U true CN209897519U (en) | 2020-01-03 |
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ID=68997300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920323543.5U Expired - Fee Related CN209897519U (en) | 2019-03-14 | 2019-03-14 | Novel heat dissipation of electron electrical equipment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209897519U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333992A (en) * | 2020-11-23 | 2021-02-05 | Oppo广东移动通信有限公司 | Electronic device |
| CN113193704A (en) * | 2021-05-10 | 2021-07-30 | 安徽德科电气科技有限公司 | Generator cooling device |
| CN113532002A (en) * | 2021-06-29 | 2021-10-22 | 马鞍山市麦克英孚机械科技有限公司 | High-temperature-resistant roller integrating water collection and cold air cooling |
-
2019
- 2019-03-14 CN CN201920323543.5U patent/CN209897519U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333992A (en) * | 2020-11-23 | 2021-02-05 | Oppo广东移动通信有限公司 | Electronic device |
| CN112333992B (en) * | 2020-11-23 | 2023-07-14 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN113193704A (en) * | 2021-05-10 | 2021-07-30 | 安徽德科电气科技有限公司 | Generator cooling device |
| CN113532002A (en) * | 2021-06-29 | 2021-10-22 | 马鞍山市麦克英孚机械科技有限公司 | High-temperature-resistant roller integrating water collection and cold air cooling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 Termination date: 20210314 |