CN219800863U - Packaging support for photoelectric device - Google Patents
Packaging support for photoelectric device Download PDFInfo
- Publication number
- CN219800863U CN219800863U CN202321303462.1U CN202321303462U CN219800863U CN 219800863 U CN219800863 U CN 219800863U CN 202321303462 U CN202321303462 U CN 202321303462U CN 219800863 U CN219800863 U CN 219800863U
- Authority
- CN
- China
- Prior art keywords
- assembly base
- photoelectric device
- packaging
- fixing
- optoelectronic device
- Prior art date
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 230000005693 optoelectronics Effects 0.000 claims description 21
- 239000012943 hotmelt Substances 0.000 claims description 8
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000001965 increasing effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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Abstract
The utility model relates to a packaging bracket of a photoelectric device, which comprises an assembly base, a fixing piece and a heat dissipation plate; the assembly base is made of high heat conduction materials and is used for supporting and fixing the photoelectric device; the fixing piece is arranged on the assembly base and is used for increasing the contact area between the photoelectric device and the assembly base and improving the heat conduction efficiency; the radiating plate is arranged at one end of the assembly base far away from the fixing piece and used for radiating heat generated by the photoelectric device, so that the problem of poor heat radiation of the photoelectric device is solved.
Description
Technical Field
The utility model relates to the field of packaging supports, in particular to a packaging support for photoelectric devices.
Background
The photoelectric devices are devices with photoelectric effect, can convert optical signals into electric signals or electric signals into optical signals, and are widely applied to the fields of communication, optical imaging, medical equipment, security control, environment monitoring and the like. Common optoelectronic devices include photodiodes, photoresistors, optoelectronic phase shifting devices, lasers, receivers, transmitters, and the like, are widely used.
In the current technical means, a packaging shell made of plastic or metal materials is adopted to cover the photoelectric device, so that the effect of protecting the photoelectric device from the external environment is achieved.
For the technical scheme, although the modern conventional scheme protects the photoelectric device to a certain extent, the heat dissipation performance of the photoelectric device is still insufficient to meet the requirements of the photoelectric device, and a large amount of heat can be generated by the photoelectric device in the working process, so that the service life and the stability of the photoelectric device are influenced if the photoelectric device cannot dissipate heat effectively.
Disclosure of Invention
In order to solve the problem of poor heat dissipation of the photoelectric device, the utility model provides a packaging support of the photoelectric device.
The utility model provides a packaging bracket of a photoelectric device, which adopts the following technical scheme.
The package support of a kind of photoelectric device, including assembling the base, fixing piece and cooling plate; the fixing piece is arranged at one end of the assembly base; the radiating plate is arranged at one end of the assembling base far away from the fixing piece, and radiating fins are arranged at one end of the radiating plate far away from the assembling base so as to increase radiating surface area.
Preferably, the assembly base is provided with a pin groove for assembling the photoelectric device.
Preferably, the assembly base is provided with a fixing groove for fixing the optoelectronic device.
As a preferable scheme, the radiating plate is provided with a sol groove at one end far away from the assembly base, so that hot melt plastic flows into the radiating plate to fix the photoelectric device during packaging.
As a preferable scheme, one side of the sol groove is provided with a flow channel groove, and the flow channel groove is communicated with the sol groove, so that hot melt plastic can flow during packaging conveniently.
Preferably, the fixing piece comprises an extending lug, and the extending lug abuts against the inner wall of the assembly base.
Preferably, the fixing member is made of elastic material.
In summary, the present utility model includes at least one of the following beneficial technical effects:
1. and the heat dissipation is convenient. The heating panel sets up the one end at the assembly base for the heat that gives off photoelectric device and produce, the assembly base is made by high heat conduction material, and the mounting sets up the one end of keeping away from the heating panel at the assembly base, increases the area of contact between photoelectric device and the assembly base, improves heat conduction efficiency, improves the poor problem of photoelectric device heat dissipation through the mode that heating panel, assembly base and mounting combined together.
2. The structure is stable. In order to ensure that the photoelectric device is kept stable on the fixing plate in the thermal expansion and contraction process, the fixing piece is further provided with an extension protruding block, the extension protruding block is abutted against the inner wall of the bottom of the assembly base, the photoelectric device is arranged in the extension protruding block of the fixing piece, and the elastic characteristic of the fixing piece is favorable for keeping stable contact of the photoelectric device in the thermal expansion and contraction process, so that the stability of the photoelectric device on the assembly base is further enhanced.
3. And the packaging is convenient. A sol groove and a flow channel groove are formed in one end of the heat dissipation plate, which is far away from the assembly base; when in packaging, after the hot melt plastic is melted, the hot melt plastic can flow into the sol groove through the runner groove to enter the fixing groove of the assembly base, so that the photoelectric device is fixed on the assembly base.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a package support of an optoelectronic device according to an embodiment of the present utility model;
fig. 2 is an exploded view of a package support for an optoelectronic device according to an embodiment of the present utility model.
Reference numerals illustrate:
1. assembling a base; 11. a pin slot; 12. a fixing groove; 2. a fixing member; 21. an extension bump; 3. a heat dissipation plate; 31. a sol tank; 32. a flow channel groove; 33. a heat sink.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present utility model, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present utility model and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.
The implementation of the present utility model will be described in detail below with reference to specific embodiments.
Referring to fig. 1 and 2, a package support of an optoelectronic device includes an assembly base 1 for fixing the optoelectronic device, a fixing member 2 for increasing a contact area between the optoelectronic device and the assembly base 1, and a heat dissipation plate 3 for dissipating heat of the optoelectronic device; the assembly base 1 is made of a high heat conduction material, such as copper, aluminum or graphene, and is used for supporting and fixing the photoelectric device; the bottom of the assembly base 1 is also provided with a fixing groove 12 for fixing the photoelectric device and a pin groove 11 for assembling the lead of the photoelectric device, so that the photoelectric device is ensured to be in close contact with the assembly base 1, and the photoelectric device is stably arranged on the assembly base 1.
Referring to fig. 1 and 2, the fixing member 2 is provided on the assembly base 1 and is made of an elastic material, such as a silicone or an elastic metal, having good elasticity; the fixing piece 2 is also provided with an extension lug 21, the extension lug 21 is abutted against the inner wall of the bottom of the assembly base 1, and the photoelectric device is arranged in the extension lug 21 of the fixing piece 2, so that the contact area between the photoelectric device and the assembly base 1 is increased, and the heat conduction efficiency is improved; at the same time, the elastic properties of the fixing member 2 help to maintain stable contact of the optoelectronic device during thermal expansion and contraction, further enhancing stability of the optoelectronic device on the assembly base 1.
Referring to fig. 1 and 2, a heat dissipation plate 3 is provided at one end of the assembly base 1 away from the fixing member 2 for dissipating heat generated from the optoelectronic device, and the heat dissipation plate 3 is provided with a plurality of heat dissipation fins 33 to increase the surface area of the heat dissipation fins 33, thereby improving heat dissipation efficiency; in other embodiments, the heat dissipation plate 3 may be replaced by an existing heat dissipation device, such as a fan radiator or a heat dissipation tube.
Referring to fig. 1 and 2, one end of the heat dissipation plate 3, which is far away from the assembly base 1, is further provided with a sol groove 31 and a flow channel groove 32, so that the subsequent encapsulation of the photoelectric device is facilitated, when the hot melt plastic is melted, the hot melt plastic flows into the sol groove 31 through the flow channel groove 32 and then enters the fixing groove 12 of the assembly base 1, the photoelectric device is fixed on the assembly base 1, and the problem that the heat dissipation plate 3 interferes with the subsequent encapsulation process is solved; by adopting the assembly base 1, the elastic fixing member 2 and the heat dissipation plate 3 having the plurality of heat dissipation fins 33 of the high heat conduction material, the life span and stability of the photoelectric device are improved.
The implementation principle of the encapsulation bracket of the photoelectric device in the embodiment of the utility model is as follows: the photoelectric device is supported and fixed by the assembly base, and the fixing piece is arranged at the upper end of the assembly base and used for increasing the contact area between the photoelectric device and the assembly base and improving the heat conduction efficiency; the heat dissipation plate is arranged at the lower end of the assembly base and used for dissipating heat generated by the photoelectric device, so that the problem of poor heat dissipation of the photoelectric device is solved.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (7)
1. The packaging support of the photoelectric device is characterized by comprising an assembly base (1), a fixing piece (2) and a heat dissipation plate (3); the fixing piece (2) is arranged at one end of the assembly base (1); the radiating plate (3) is arranged at one end of the assembling base (1) far away from the fixing piece (2), and radiating fins (33) are arranged at one end of the radiating plate (3) far away from the assembling base (1) so as to increase radiating surface area.
2. The packaging holder of an optoelectronic device according to claim 1, characterized in that the mounting base (1) is provided with pin slots (11) for mounting the optoelectronic device.
3. The packaging holder of an optoelectronic device according to claim 1, characterized in that the mounting base (1) is provided with a fixing recess (12) for fixing the optoelectronic device.
4. The packaging bracket of the optoelectronic device according to claim 1, wherein the end of the heat dissipation plate (3) far away from the assembly base (1) is provided with a sol groove (31) so as to facilitate the inflow of hot melt plastic during packaging to fix the optoelectronic device.
5. The packaging bracket of an optoelectronic device according to claim 4, wherein a runner groove (32) is arranged at one side of the sol groove (31), and the runner groove (32) is communicated with the sol groove (31) so as to facilitate the flow of hot melt plastic during packaging.
6. The packaging support for optoelectronic devices according to claim 1, characterized in that the fixing element (2) comprises an extension projection (21), said extension projection (21) being in abutment with the inner wall of the assembly base (1).
7. The packaging support for optoelectronic devices according to claim 1, characterized in that the fixing element (2) is made of an elastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321303462.1U CN219800863U (en) | 2023-05-25 | 2023-05-25 | Packaging support for photoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321303462.1U CN219800863U (en) | 2023-05-25 | 2023-05-25 | Packaging support for photoelectric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219800863U true CN219800863U (en) | 2023-10-03 |
Family
ID=88177001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321303462.1U Active CN219800863U (en) | 2023-05-25 | 2023-05-25 | Packaging support for photoelectric device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219800863U (en) |
-
2023
- 2023-05-25 CN CN202321303462.1U patent/CN219800863U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |