CN215453149U - High heat dissipating STB - Google Patents
High heat dissipating STB Download PDFInfo
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- CN215453149U CN215453149U CN202121984566.4U CN202121984566U CN215453149U CN 215453149 U CN215453149 U CN 215453149U CN 202121984566 U CN202121984566 U CN 202121984566U CN 215453149 U CN215453149 U CN 215453149U
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Abstract
The utility model relates to a high-heat-dissipation set top box, which comprises a box body, a base, a circuit board and a heat dissipation assembly, wherein the base is arranged on the box body; the box body is buckled and connected with the base, a cavity is formed at the inner side of the box body connected with the base, and the circuit board is arranged in the cavity; the heat dissipation assembly comprises a semiconductor refrigeration sheet, a heat dissipation plate and a heat dissipation fan, the semiconductor refrigeration sheet is provided with a heat absorption surface and a heat conduction surface, the heat absorption surface is arranged opposite to the heat conduction surface, the heat absorption surface is connected with one surface of the box body, which is opposite to the base, the heat conduction surface is connected with one surface of the heat dissipation plate, the other surface of the heat dissipation plate is connected with the heat dissipation fan, the heat absorption surface of the semiconductor refrigeration sheet can absorb the heat of the base and cool the base, the heat dissipation plate and the heat dissipation fan can rapidly dissipate the heat of the heat conduction surface to the air, rapid cooling of the set top box is achieved, and heat dissipation performance is good. In addition, the heat radiation structure of this application not only can realize the rapid cooling to the STB, and can avoid in a large amount of dusts get into the STB, and is dustproof effectual.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a set top box with high heat dissipation performance.
Background
A set-top box is a device that connects a television set to an external signal source, and can convert compressed digital signals into television content and display it on the television set.
The set-top box in the current market is characterized in that the circuit board is arranged in the box body, so that heat generated by the set-top box after a long time cannot be dissipated timely, faults are easy to occur, and the service life of the set-top box is shortened.
SUMMERY OF THE UTILITY MODEL
Based on this, it is necessary to provide a high heat dissipation set-top box.
The technical scheme for solving the technical problems is as follows: a high heat dissipation set top box comprising: the heat dissipation device comprises a box body, a base, a circuit board and a heat dissipation assembly;
the box body is buckled and connected with the base, a cavity is formed at the inner side of the box body connected with the base, and the circuit board is arranged in the cavity;
the heat dissipation assembly comprises a semiconductor refrigeration piece, a heat dissipation plate and a heat dissipation fan, the semiconductor refrigeration piece is provided with a heat absorption surface and a heat conduction surface, the heat absorption surface is opposite to the heat conduction surface, the heat absorption surface is back to the base and is connected with one surface of the box body, the heat conduction surface is connected with one surface of the heat dissipation plate, and the other surface of the heat dissipation plate is connected with the heat dissipation fan.
In one embodiment, the heat sink further comprises a heat sink, and the heat absorption surface is connected with the surface of the base, which faces away from the box body, through the heat sink.
In one embodiment, the box body further comprises a heat-conducting silica gel sheet, and the heat radiating fin is connected with one surface of the base, which faces away from the box body, through the heat-conducting silica gel sheet.
In one embodiment, the heat sink further comprises a thermally conductive coating, and the heat sink is connected to the heat absorbing surface through the thermally conductive coating.
In one embodiment, the heat dissipation plate includes a substrate and at least one fin, one surface of the substrate is connected to the heat conduction surface, the fins are uniformly distributed on a surface of the substrate facing away from the heat conduction surface, and a part of the fins are connected to the heat dissipation fan.
In one embodiment, the heat sink comprises a metal heat sink.
In one embodiment, the cooling device further comprises a support frame, wherein the support frame is provided with a through groove, the cooling fan is arranged in the through groove, and the cooling fan is connected with the side wall of the through groove.
In one embodiment, the cross section of the support frame is trapezoidal, and the support frame is provided with an inclined surface, and the inclined surface is provided with the through groove.
In one embodiment, the heat dissipation assembly further comprises a cover body, the cover body is provided with a through cavity, the first end of the cover body is connected with one surface of the base, which faces away from the box body, in a buckling manner, and the cover body is used for covering the heat dissipation assembly.
In one embodiment, the refrigerator further comprises a temperature sensor and a controller, wherein the temperature sensor is arranged on one surface of the base, which faces away from the box body, the temperature sensor is connected with the controller, and the controller is used for controlling the semiconductor refrigeration piece and the cooling fan to be turned on or turned off.
The utility model has the beneficial effects that: the utility model provides a high-heat-dissipation set top box, wherein a semiconductor refrigerating sheet is oppositely provided with a heat absorbing surface and a heat conducting surface, so that two surfaces of the semiconductor refrigerating sheet can form temperature difference, namely a cold end and a hot end are formed to realize the refrigerating effect, the heat absorbing surface of the semiconductor refrigerating sheet is connected with one surface of a base, which is back to a box body, so that when a user powers on the semiconductor refrigerating sheet, the heat absorbing surface of the semiconductor refrigerating sheet can absorb the heat of the base and cool the base, then the heat can be transferred to the heat conducting surface from the heat absorbing surface of the semiconductor refrigerating sheet, then the heat is further dissipated to a heat dissipating fan by a heat dissipating plate connected with the heat conducting surface, and then the heat is dissipated to the outside air by the heat dissipating fan, thereby the heat dissipation speed among the base, the heat absorbing surface, the heat conducting surface and the heat dissipating plate is accelerated, and the heat dissipation speed of the base, the box body and a circuit board in the box body is accelerated, the set top box is cooled quickly, the heat dissipation performance is good, the number of times of faults of the set top box with high heat dissipation performance is effectively reduced, and the service life of the set top box with high heat dissipation performance is prolonged. In addition, the heat radiation structure of this application not only can realize the rapid cooling to the STB, and can avoid in a large amount of dusts get into the STB, and is dustproof effectual, has ensured the operational environment in the STB, has improved the life of STB.
Drawings
Fig. 1 is a schematic structural diagram of a high heat dissipation set-top box according to an embodiment;
FIG. 2 is an exploded perspective view of an embodiment of a heat dissipation assembly and a support bracket;
fig. 3 is a partial perspective exploded view of an exemplary high heat dissipation set-top box.
In the figure, 10, a high heat dissipation set top box; 100. a box body; 110. a socket region; 200. a base; 300. a circuit board; 400. a heat dissipating component; 410. a semiconductor refrigeration sheet; 411. a heat absorbing surface; 412. a heat conducting surface; 420. a heat dissipation plate; 421. a substrate; 422. a fin; 430. a heat radiation fan; 440. a heat sink; 450. a heat-conducting silica gel sheet; 460. a thermally conductive coating; 500. a support frame; 510. a first support plate; 520. a second support plate; 530. a third support plate; 540. a through groove; 550. a second engaging groove; 600. a cover body; 610. a cavity is communicated; 620. a first end; 621. a first engaging block; 630. a second end; 631. a second engaging block; 700. a temperature sensor; 800. and a controller.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The technical solutions of the present invention will be further described below with reference to the accompanying drawings of the embodiments of the present invention, and the present invention is not limited to the following specific embodiments.
It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar parts. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings, it is only for convenience of description and simplicity of description, but does not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limiting the patent, and the specific meanings of the terms will be understood by those skilled in the art according to specific situations.
As shown in fig. 1 to 3, in one embodiment, a high heat dissipation set top box 10 includes a box body 100, a base 200, a circuit board 300, and a heat dissipation assembly 400; the box body 100 is connected with the base 200 in a buckling manner, a cavity is formed at the inner side of the connection between the box body 100 and the base 200, and the circuit board 300 is arranged in the cavity; the heat dissipation assembly 400 includes a semiconductor cooling plate 410, a heat dissipation plate 420 and a heat dissipation fan 430, the semiconductor cooling plate 410 has a heat absorption surface 411 and a heat conduction surface 412, the heat absorption surface 411 and the heat conduction surface 412 are oppositely disposed, the heat absorption surface 411 is connected with one surface of the base 200, which faces away from the box 100, the heat conduction surface 412 is connected with one surface of the heat dissipation plate 420, and the other surface of the heat dissipation plate 420 is connected with the heat dissipation fan 430.
In this embodiment, the cavity formed by the buckling connection of the box body 100 and the base 200 can be used for installing the circuit board 300, so that the box body 100 and the base 200 can effectively block the invasion of dust, the problem that the operation of the high-heat-dissipation set top box 10 is affected by the adhesion of dust to the circuit board 300 in long-term use is avoided, and the dustproof effect is good; the box body 100 is provided with a socket area 110, the socket area 110 is used for inserting various interfaces, thereby realizing signal connection between the high heat dissipation set top box 10 and external equipment, the semiconductor chilling plate 410 is oppositely provided with a heat absorption surface 411 and a heat conduction surface 412, so that temperature difference can be formed between the two surfaces of the semiconductor chilling plate 410, namely a cold and hot end is formed, thereby realizing refrigeration effect, when a user powers on the semiconductor chilling plate 410, when the heat absorption surface 411 of the semiconductor chilling plate 410 is in fit connection with the surface of the base 200 opposite to the box body 100, the fit connection can fix the semiconductor chilling plate 410 on the surface of the base 200 opposite to the box body 100 through a glue layer, the heat absorption surface 411 of the semiconductor chilling plate 410 can absorb heat of the base 200 and cool the heat, then the heat can be transferred from the heat absorption surface 411 of the semiconductor chilling plate 410 to the heat conduction surface 412, and then the heat is further dissipated to the heat dissipation fan 430 through the heat dissipation plate 420 connected by the heat conduction surface 412, the heat is dissipated to the outside air by the heat dissipating fan 430, so that the heat dissipating speed between the base 200, the heat absorbing surface 411, the heat conducting surface 412 and the heat dissipating plate 420 is increased, the heat dissipating speed between the base 200 and the box body 100 and between the base 200 and the circuit board 300 in the box body 100 is increased, the high heat dissipating set top box 10 is rapidly cooled, the heat dissipating performance is good, the number of times of faults of the high heat dissipating set top box 10 is effectively reduced, and the service life of the high heat dissipating set top box 10 is prolonged. In addition, the heat dissipation structure of the application not only can realize the rapid cooling of the high heat dissipation set top box 10, but also can prevent a large amount of dust from entering the high heat dissipation set top box 10, has a good dustproof effect, ensures the working environment running in the high heat dissipation set top box 10, and prolongs the service life of the high heat dissipation set top box 10.
In order to increase the heat conduction speed between the base 200 and the heat absorbing surface 411, in one embodiment, as shown in fig. 2, a heat sink 440 is further included, and the heat absorbing surface 411 is connected to a surface of the base 200 facing away from the case 100 through the heat sink 440. Specifically, the heat sink 440 is disposed on the heat absorbing surface 411 and a surface of the base 200 facing away from the case 100, and the heat sink 440 may be a metal heat sink 440, so that when the heat sink 440 is attached to the surface of the base 200 facing away from the case 100, the heat sink 440 can rapidly transfer heat of the base 200 to the heat absorbing surface 411 of the semiconductor chilling plate 410, thereby increasing a heat conduction speed between the base 200 and the heat absorbing surface 411.
In order to increase the heat conduction speed between the base 200 and the heat sink 440, in an embodiment, as shown in fig. 2, a heat conductive silicone sheet 450 is further included, and the heat sink 440 is connected to a surface of the base 200 facing away from the box 100 through the heat conductive silicone sheet 450. Specifically, the heat-conducting silicone sheet 450 is arranged between the heat sink 440 and the surface of the base 200 opposite to the box body 100, and the heat-conducting silicone sheet 450 can well attach the heat sink 440 to the base 200, so that the contact gap between the heat sink 440 and the base 200 is reduced, the contact area between the heat sink 440 and the base 200 is ensured, and the heat-conducting silicone sheet 450 can rapidly transfer the heat of the base 200 to the heat sink 440 by utilizing the good heat-conducting performance of the heat-conducting silicone sheet 450, thereby improving the heat-conducting speed between the base 200 and the heat sink 440.
In order to increase the heat conduction speed between the heat sink 440 and the heat absorbing surface 411 of the semiconductor chilling plate 410, in one embodiment, as shown in fig. 2, a heat conductive coating 460 is further included, and the heat sink 440 is connected with the heat absorbing surface 411 through the heat conductive coating 460. Specifically, the heat conducting coating 460 is coated between the heat absorbing surface 411 of the semiconductor chilling plate 410 and the heat sink 440, and the heat conducting coating 460 can be a heat conducting auxiliary agent or a heat conducting material, such as heat conducting silicone, so that the heat conducting coating 460 can better attach the heat sink 440 to the heat absorbing surface 411 of the semiconductor chilling plate 410, the contact area between the heat sink 440 and the heat absorbing surface 411 is ensured, and the heat conducting speed between the heat sink 440 and the heat absorbing surface 411 of the semiconductor chilling plate 410 is increased.
In order to increase the heat dissipation speed between the semiconductor cooling plate 410 and the heat dissipation fan 430, in one embodiment, as shown in fig. 2, the heat dissipation plate 420 includes a substrate 421 and at least one fin 422, one surface of the substrate 421 is connected to the heat conduction surface 412, the fins 422 are uniformly distributed on a surface of the substrate 421 opposite to the heat conduction surface 412, and a portion of the fins 422 is connected to the heat dissipation fan 430. Specifically, the plurality of fins 422 are disposed on the heat dissipation plate 420, so that heat on the heat conduction surface 412 of the semiconductor chilling plate 410 can be dispersed to the plurality of fins 422 through the substrate 421, the fins 422 are disposed at intervals, and heat dissipation air channels are formed between adjacent fins 422, when the heat dissipation fan 430 works, the heat on the substrate 421 can enter the heat dissipation fan 430 through the plurality of heat dissipation air channels, and then the heat is dissipated to the outside air by the heat dissipation fan 430, thereby increasing the heat dissipation speed between the semiconductor chilling plate 410 and the heat dissipation fan 430. Further, in an embodiment, the heat dissipation plate 420 includes a metal heat dissipation plate, so that the heat of the semiconductor upper heat conduction surface 412 can be better transferred to the heat dissipation fan 430 by utilizing the good heat dissipation performance of metal, thereby further increasing the heat dissipation speed between the semiconductor cooling plate 410 and the heat dissipation fan 430.
In order to make the operation of the high heat dissipating set-top box 10 more stable, in one embodiment, as shown in fig. 1 and 2, the set-top box further includes a support frame 500, the support frame 500 is opened with a through slot 540, the heat dissipating fan 430 is disposed in the through slot 540, and the heat dissipating fan 430 is connected to a side wall of the through slot 540. Specifically, the heat dissipation fan 430 is installed in the through groove 540 of the support frame 500, so that the support frame 500 can provide stable support for the high heat dissipation set-top box 10 and the component assemblies, and the high heat dissipation set-top box 10 is more stable in operation.
In order to increase the heat dissipation speed of the high heat dissipation set-top box 10, in one embodiment, as shown in fig. 2, the cross section of the supporting frame 500 is trapezoidal, and the supporting frame 500 has an inclined surface, and the inclined surface is provided with the through groove 540. Specifically, the support frame 500 includes a first support plate 510, a second support plate 520 and a third support plate 530, one end of the first support plate 510 is connected with the second support plate 520, the other end of the first support plate 510 is connected with the third support plate 530, the first support plate 510 is obliquely arranged on the third support plate 530, so that the cross section of the support frame 500 is trapezoidal and has an inclined plane, when the support frame 500 is installed on the wall, the high-heat-dissipation set top box 10 can be obliquely installed on the wall, the phenomenon that the high-heat-dissipation set top box 10 is tightly attached to the wall to affect heat dissipation is avoided, the circulation of gas in the heat dissipation assembly 400 is facilitated, and the heat dissipation speed of the high-heat-dissipation set top box 10 is increased.
In order to prevent the heat dissipation assembly 400 from falling off, in an embodiment, as shown in fig. 2, the heat dissipation assembly further includes a cover 600, the cover 600 defines a through cavity 610, a first end 620 of the cover 600 is connected to a surface of the base 200 facing away from the box 100 in a snap-fit manner, and the cover 600 is used for covering the heat dissipation assembly 400. Specifically, the first end 620 of the cover body 600 is provided with at least one first engaging block, one surface of the base 200, which faces away from the cover body 600, is provided with at least one first engaging groove, and each first engaging block 621 and each first engaging groove are arranged in a one-to-one correspondence manner, so that the cover body 600 and the base 200 are fixedly connected, and the cover body 600 can provide a covering function for the heat dissipation assembly 400, and can effectively prevent the heat dissipation assembly 400 from falling off; further, the cover body 600 can also effectively block dust from invading, thereby ensuring the working environment of the heat dissipation assembly 400 and further improving the service life of the heat dissipation assembly 400.
In order to improve the firmness of the connection between the cover 600 and the base 200, in an embodiment, as shown in fig. 2, each of the first engaging blocks 621 faces to the protruding cross-shaped fixing block provided at one end of the base 200, the base 200 faces away from the one side of the box 100 and is provided with at least one corresponding cross-shaped groove, and each of the engaging blocks is engaged with one of the cross-shaped grooves. Specifically, through setting up a plurality of cross fixed blocks for a plurality of cross fixed blocks can set up with a plurality of cross recess one-to-ones, make the cross fixed block can firmly fix cover body 600 on base 200, thereby improved the fastness that cover body 600 and base 200 are connected.
To achieve the fixed connection between the cover 600 and the supporting frame 500, in one embodiment, as shown in fig. 2, the second end 630 of the cover 600 is snap-fit connected to the supporting frame 500. Specifically, at least one second engaging block 631 is disposed at the second end 630 of the cover 600, at least one second engaging groove 550 is disposed on the first support plate 510 of the support frame 500, and each second engaging block 631 is engaged with one second engaging groove 550, so that the cover 600 and the support frame 500 are fixedly connected. Further, in this application, the fixing blocks and the fixing grooves are meniscus-shaped, so as to further enhance the fixing connection between the cover body 600 and the supporting frame 500.
In order to increase the heat dissipation speed of the high heat dissipation set top box 10, in one embodiment, the housing 600 is a metal housing 600. Specifically, by arranging the cover 600 as a metal cover 600, the heat dissipation path between the base 200 and the heat dissipation assembly 400 is increased, and the heat dissipation speed of the high-heat-dissipation set-top box 10 is increased.
In order to ensure the normal operation of the high heat dissipating set-top box 10, in one embodiment, as shown in fig. 2 and 3, the set-top box further comprises a temperature sensor 700 and a controller 800, the temperature sensor 700 is disposed on a side of the base 200 facing away from the box 100, the temperature sensor 700 is connected to the controller 800, and the controller 800 is configured to control the semiconductor cooling fins 410 and the heat dissipating fan 430 to be turned on or off. Specifically, by arranging the temperature sensor 700 and the controller 800, the temperature sensor 700 can monitor the temperature of the base 200 in real time, and transmit the real-time monitored temperature to the controller 800, and then the controller 800 controls the semiconductor cooling plate 410 and the cooling fan 430 to be turned on or off according to the temperature actually measured by the temperature sensor 700, thereby ensuring the normal operation of the high-heat-dissipation set-top box 10.
In order to reduce the noise generated by the operation of the heat dissipation fan 430, in one embodiment, the heat dissipation fan 430 includes a silent heat dissipation fan 430. Specifically, by setting the cooling fan 430 as the mute cooling fan 430, noise generated by the operation of the cooling fan 430 can be effectively reduced, and the noise is prevented from interfering the user to watch the television. The experience of watching television by the user is ensured.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A high heat dissipation set-top box, comprising: the heat dissipation device comprises a box body, a base, a circuit board and a heat dissipation assembly;
the box body is buckled and connected with the base, a cavity is formed at the inner side of the box body connected with the base, and the circuit board is arranged in the cavity;
the heat dissipation assembly comprises a semiconductor refrigeration piece, a heat dissipation plate and a heat dissipation fan, the semiconductor refrigeration piece is provided with a heat absorption surface and a heat conduction surface, the heat absorption surface is opposite to the heat conduction surface, the heat absorption surface is back to the base and is connected with one surface of the box body, the heat conduction surface is connected with one surface of the heat dissipation plate, and the other surface of the heat dissipation plate is connected with the heat dissipation fan.
2. The set top box of claim 1, further comprising a heat sink, wherein the heat absorbing surface is connected to a surface of the base opposite to the box body through the heat sink.
3. The set top box with high heat dissipation performance according to claim 2, further comprising a heat conductive silicone sheet, wherein the heat sink is connected to a surface of the base opposite to the box body through the heat conductive silicone sheet.
4. The set top box of claim 2, further comprising a thermally conductive coating, wherein the heat sink is coupled to the heat sink surface through the thermally conductive coating.
5. The set top box of claim 1, wherein the heat spreader comprises a substrate and at least one fin, wherein one side of the substrate is connected to the heat conducting surface, the fins are uniformly distributed on a side of the substrate opposite to the heat conducting surface, and a portion of the fins are connected to the heat spreader fan.
6. The set top box of claim 1, wherein the heat sink comprises a metal heat sink.
7. The set top box with high heat dissipation performance according to claim 1, further comprising a support frame, wherein the support frame is provided with a through slot, the heat dissipation fan is disposed in the through slot, and the heat dissipation fan is connected to a side wall of the through slot.
8. The set top box with high heat dissipation performance as recited in claim 7, wherein the cross section of the support frame is trapezoidal, and the support frame has an inclined surface, and the inclined surface defines the through slot.
9. The set top box with high heat dissipation performance according to claim 1, further comprising a cover body, wherein the cover body defines a through cavity, a first end of the cover body is connected to a surface of the base opposite to the box body in a snap-fit manner, and the cover body is used for covering the heat dissipation assembly.
10. The set top box with high heat dissipation performance according to any one of claims 1 to 9, further comprising a temperature sensor and a controller, wherein the temperature sensor is disposed on a surface of the base opposite to the box body, the temperature sensor is connected to the controller, and the controller is configured to control the semiconductor cooling sheet and the heat dissipation fan to be turned on or off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121984566.4U CN215453149U (en) | 2021-08-23 | 2021-08-23 | High heat dissipating STB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121984566.4U CN215453149U (en) | 2021-08-23 | 2021-08-23 | High heat dissipating STB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215453149U true CN215453149U (en) | 2022-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121984566.4U Active CN215453149U (en) | 2021-08-23 | 2021-08-23 | High heat dissipating STB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215453149U (en) |
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2021
- 2021-08-23 CN CN202121984566.4U patent/CN215453149U/en active Active
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